EastMoney, CapitalWhale, ElecFans: Yet another China-based image sensor company prepares an IPO at Shanghai Stock Exchange - Brigates (Chinese name - Ruixinwei or Ruixin Micro-Tech Innovation or Kunshan Ruixin.)"The IPO of the Science and Technology Innovation Board intends to raise 1.

MDPI paper "3D Photon-to-Digital Converter for Radiation Instrumentation: Motivation and Future Works" by Jean-François Pratte, Frédéric Nolet, Samuel Parent, Frédéric Vachon, Nicolas Roy, Tommy Rossignol, Keven Deslandes, Henri Dautet, Réjean Fontaine, and Serge A.

Chronoptics announces its ToF noise filter and ToF camera based on Melexis VGA sensor: Opnous publishes a datasheet of its OPNCAM8508 QVGA ToF camera based on the company's imager:Opnous also unveils OPN6001 ToF ISP chip:Opnous OPNM8518A VGA camera module consumes 500mW typ and has a...

Trieye presents the recent progress with its low-cost SWIR sensor, including DMS application: Orbbec presents its first ToF camera with VGA resolution: Wuhan Guide Sensmart Tech Co, a subsidiary of Guide Infrared, presents its compact thermal imaging modules for smartphones:Sense Photonics p...

Japan National Institute of Informatics provides a protection from fingerprint recognition from camera images:AIStorm presents its sensors without saying much about the underlying technology: Innovusion shows its long range Jaguar 100 and 65 LiDARs:BrightWay Vision presents its VISDOM automotive gat...

MDPI paper "High-Linearity High-Resolution Time-of-Flight Linear-Array Digital Image Sensor Using Time-Domain Feedback" by Juyeong Kim, Keita Yasutomi, Keiichiro Kagawa, and Shoji Kawahito from Shizuoka University, Japan, presents a sigma-delta feedback approach to linearize a ToF sensor response:"T...

BusinessWire: Intel-Mobileye CTO Amnon Shashua shows the company FMCW LiDAR named EyeC.  Its mass production is expected to start in 2025:"Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip.

IFNews quotes Omdia reports that 5MP and 8M CIS for low-end and mid-range smartphones are in short supply now. As a result, Samsung has increased the prices by 40% starting December 2020, while other CIS suppliers have increased their prices by ~20%.

Richard Crisp, VP of New Product Development for Etron, continues his image sensor tutorial series.

Intel unveils Realsense ID 3D camera F450 based on active stereo approach:

Arxiv.

BusinessWire: OmniVision announces the OV32B sensor, featuring a 0.702um pixel to provide 32 MP resolution in a 1/3” optical format. The OV32B also supports 2- and 3-exposure HDR timing for up to 8MP video modes and still previews.

Businesswire: OmniVision announces the OAX8000 AI-enabled, automotive ASIC for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB).

Elsevier Radiation Measurements Journal publishes a paper "History and future of radiation imaging with single quantum processing pixel detectors" by Erik H.M. Heijne from Czech Technical University in Prague.

 ON Semi Director of Business Development of SensL Division Bahman Hadji publishes a video "Which Wavelength Will Prevail for Automotive LiDAR – The Great Debate.

As 2020 nears its end, there was a number of image sensor companies acquisitions:Smartsens acquired Allchip (automotive image sensors)Nordson acquired vivaMOS (X-Ray sensors)GE Health acquired Prismatic Sensors (X-Ray sensors)Goodix acquired Dreamchip (digital design services team)TE Connectivity ac...

I missed this announcement in June 2020. Chinese ToF sensor company Silicon Integrated raised a RMB180M ($25.28M) series B round of financing led by CTC Capital.Silicon Integrated develops ToF sensor chips and 3D vision solutions, and has already launched mature products.

Luminar publishes its presentations at CES2021.

It appears that Federal Circuit decision to transfer an ownership of a number of Hamamatsu patents to SiOnyx has attracted quite a lot of attention from lawyers.

BusinessWire: Samsung introduces its latest 108MP mobile sensor, the 0.8um 1/1.33-inch ISOCELL HM3. This is the 4th 108MP sensor in the company's lineup after HMX, HM1, and HM2.

MIPI publishes an article talking about the A-PHY standard gears. The scaling is quite impressive: speeds up to 16Gbps per lane with PAM4, 8, and 16(!) modulation schemes.

Youtube channel Reliability Matters publishes "Episode 59: A Conversation with CMOS Image Sensor Inventor Dr. Eric Fossum.

Arxiv.org paper "An Ultra Fast Low Power Convolutional Neural Network Image Sensor with Pixel-level Computing" by Ruibing Song, Kejie Huang, Zongsheng Wang, Haibin Shen from Zhejiang University, China, is also published in IEEE Transactions on Circuits and Systems in December 2020.

BusinessWire: Intel-Mobileye CTO Amnon Shashua shows the company FMCW LiDAR named EyeC.  Its mass production is expected to start in 2025:"Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip.

Smartsens launches a 9MP Global Shutter sensor product for Intelligent Transportation System (ITS) applications, the SC910GS. Also, the previously launched 4MP SC410GS targets the same market.

Emberion publishes a product page for its graphene-based VGA imager and camera:Very wide-spectrum VIS-SWIR Camera Core:Based on Emberion’s VGA-resolution VIS-SWIR image sensor: spectral response range spanning from 400 nm up to 2000 nmFully functional camera core ready for vision system integratio...

BusinessWire: Xpeng, a Chinese electric vehicle company, is to deploy Livox automotive-grade lidar technology in Xpeng’s new production model in 2021. Livox is Xpeng’s first partner in lidar technology.

BusinessWire: OmniVision announces the OS04C10, a 1.998um pixel, 4 MP  sensor for both IoT and home security cameras.

Teledyne and FLIR jointly announce that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion.“At the core of both our companies is proprietary sensor technologies.

The Canon RF 24-105mm f4-7.1 STM is a compact, light and affordable general-purpose zoom for the full-frame EOS R mirrorless system.

MIT publishes a PhD Thesis "Algorithms and systems for low power time-of-flight imaging" by James Noraky."Time-of-flight (ToF) cameras are appealing depth sensors because they obtain dense depth maps with minimal latency.

 ON Semi Director of Business Development of SensL Division Bahman Hadji publishes a video "Which Wavelength Will Prevail for Automotive LiDAR – The Great Debate.

Halo Finance, DayDayNews: Will Semiconductor chairman and Omnivision CEO Renrong Yu is the richest man in China semiconductor industry. Will Semi is a mother company of Omnivision, Superpix, and Celepixel.This year, Renrong Yu is ranked 65th on the Forbes China Rich List with a wealth of 51.

Global TCAD Solutions GmbH, a spin-off from Vienna University of Technology (TU Wien), Austria, presents its tools for CIS pixel simulations:One common type of APS cell consists of a Pinned Photodiode (PPD) with four NMOS transistors.

Hong Kong University publishes a video presentation "Compact Modeling of Current-Assisted Photonic Demodulator for Time-of-Flight CMOS Image Sensor" by Cristine Jin Delos Santos.

Counterpoint Research says that iPhone 12 cameras cost $3.

Intel posted two videos with demos of its recently announced Realsense ID and  L515 MEMS LiDAR:

The FE 35mm f1.4 G Master is a high-end wide-angle prime lens for Sony’s e-mount mirrorless system and one that’s corrected for full-frame bodies. It’s Sony’s fourth 35 in the native e-mount, but the first to join the flagship G-Master series.

BusinessWire: OmniVision announces the OS02H10, a 2.9um, 1080p image sensor adding the NIR and low light performance of its Nyxel and PureCel Plus technologies to mainstream surveillance cameras. This sensor also offers multiple HDR options at 60 fps.

BusinessWire: Intel-Mobileye CTO Amnon Shashua shows the company FMCW LiDAR named EyeC.  Its mass production is expected to start in 2025:"Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip.

BusinessWire: OmniVision announced the OX03F10 automotive  sensor.

Yole Developpement publishes its webcast "Thermal imaging: The rise of fever detection – global market applications and evolution" held on Dec. 8, 2020.

Arxiv.org paper "Billion-pixel X-ray camera (BiPC-X)" by Zhehui Wang, Kaitlin Anagnost, Cris W. Barnes, D. M. Dattelbaum, Eric R. Fossum, Eldred Lee, Jifeng Liu, J. J. Ma, W. Z. Meijer, Wanyi Nie, C. M. Sweeney, Audrey C.

BusinessWire: OmniVision announces the OV40A, a 40MP, 1.008um pixel sensor that features super high gain and de-noise technologies in the 1/1.7” optical format. This sensor also offers multiple HDR options and supports 1080p slow-motion and high-speed video captures at 240 fps with PDAF.

I love cooking and wanted to increase the number of vegetarian dishes for everyday family meals.

Springer Machine Vision and Applications Journal publishes a paper "Classification of materials using a pulsed time-of-flight camera" by ShiNan Lang, Jizhong Zhang, Yiheng Cai, Xiaoqing Zhu, and Qiang Wu from Beijing University of Technology, China.

Archives of Preventive Medicine publishes a paper "Analysis of current and future technologies of capsule endoscopy: A mini review" by Alexander P Brown and Ahalapitiya H Jayatissa from the University of Toledo, OH, USA.

Eindhoven University of Technology publishes an Arxiv.org paper "Millimeter Wave Sensing: A Review of Application Pipelines and Building Blocks" by Bram van Berlo, Amany Elkelany, Tanir Ozcelebi, and Nirvana Meratnia.

JoongAng Ibo: Samsung VP  Yong-in Park has been recently promoted from HR to the System LSI Division Strategic Marketing Manager. One of his first decisions was to convert the remaining DRAM capacity on Line 11 to image sensor manufacturing.

I missed this announcement in June 2020. Chinese ToF sensor company Silicon Integrated raised a RMB180M ($25.28M) series B round of financing led by CTC Capital.Silicon Integrated develops ToF sensor chips and 3D vision solutions, and has already launched mature products.