PRNewswire: California-based startup AIStorm AI-in-Sensor (AIS) technology that enables real-time processing of sensor data at the edge, without digitization wins Frost & Sullivan's 2019 Technology Innovation Award.

A paper "1/f Noise Modelling and Characterization for CMOS Quanta Image Sensors" by Wei Deng and Eric R. Fossum, Dartmouth College belongs to MDPI Special issue on the 2019 International Image Sensor Workshop (IISW2019).

ALA News: Isorg will demonstrate its full-screen Fingerprint-on-Display (FoD) module for improved multi-finger smartphone authentication at CES 2020. It supports up to four fingers simultaneously touching a smartphone display.

SMPTE publishes NHK presentation "8K Camera Recorder using Organic-photoconductive CMOS Image Sensor & High-quality Codec" by Shingo Sato:

SonyAlphaRumors: Sony presents 2x2 On-Chip Lens (OCL) technology for high-speed focus, high-resolution, high-sensitivity, and HDR:"In conventional technologies, the variance in sensitivity per pixel caused by the structure (described below), which places an on-chip lens that spans four pixels, was a...

Yole Development report "Disposable image sensors: a revolution for microscopy and next-generation sequencing" states the image sensor market for microscopy & NGS will show an impressive growth: +18% CAGR between 2018-2024 (in volume).

IFNews quotes Mynavi review of Sony invited presentation at 2019 AEC/APC Symposium Asia on "The manufacturing and future of Sony CMOS Image Sensor.""Sony aims to become a smart factory and is working on the following seven projects.

Brookman publishes a demo video captured by its High Sensitivity BT200C CMOS sensor evaluation board.

PMD and Infineon are going to unveil their 5um ToF pixel sensor at CES 2020:"Our new VGA 3D imager IRS2877C is the highest resolution, most flexible and robust depth sensor we have ever developed.

ISSCC 2020 to be held in San Francisco on Feb. 16-20 publishes its agenda with heavy emphasis on ToF imaging. The biggest surprise is a joint Prophesee and Sony paper on event-based sensor:A 240×192Pixel 10fps 70klux 225m-Range Automotive LiDAR SoC Using a 40ch 0.

Smartsens presentation at China Public Security Expo (CPSE 2019) held in Shenzhen, China at the end of October has a part about its future products:CMOS Sensors with LED Flicker Suppression (LFS) enabled by SmartSens QCell technology for ADAS and Autonomous Vehicles (AV) applicationsAutomotive HDR s...

Lucid Vision Labs publishes EMVA1288 data of its Atlas 10 camera based on 24MP Sony IMX530 sensor with 2.

II-VI presentation on 3D sensing compares different approaches and spectral bands:

A preprint paper "Deep Demosaicing using ResNet-Bottleneck Architecture" by Divakar Verma, Manish Kumar, and Srinivas Eregala from Samsung R&D Institute Bengaluru, India, proposes CNN network to reduce demisaicing artifacts:"Demosaicing is a fundamental step in a camera pipeline to construct a f...

Israel-based Voyage 81 startup presentation discusses CFA approaches for low-light imaging (video is here):

As a part of the first ever Sony Technology Day held at Sony City Osaki in Tokyo, Japan, on Sept. 18, 2019, the company announced SOE Awards. SOE stands for Sony Outstanding Engineer, the highest form of individual recognition for Sony Group engineers.

The Cameralabs Cafe podcast returns! In Episode Four, Gordon and Doug talk about how to choose the best camera for vlogging - and video in general - before recommending a selection of models at various price points! So grab a drink and join us in the Cameralabs Cafe!… The post Cameralabs Cafe ...

EETimes publishes Junko Yoshida's article on Omnivision's new 8.

A paper "Modeling and Analysis of a Direct Time-of-Flight Sensor Architecture for LiDAR Applications" by Preethi Padmanabhan, Chao Zhang, and Edoardo Charbon, EPFL and TU Delft, belongs to MDPI Special issue on the 2019 International Image Sensor Workshop.

China Money Network: "As reported previously, the current CIS is mainly divided into mobile phones and security. Among them, mobile phones are basically manufactured using a 12-inch 55nm process, and security chips are manufactured using a 0.11um eight-inch process.

Digitimes reports that TSMC received CIS orders from Sony "and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan." TSMC has placed equipment orders for additional 40nm process capacity at the fab to fulfill CIS Sony's orders.

As mentioned in comments, Zurich-based event-based sensor startup Insightness is a part of Sony Semiconductor Solutions Group now:Few slides about Insightness:

PRNewswire: OmniVision announced the first two members of its new automotive sensor platform—the 8MP, front-view OX08A and OX08B.

Tech2 publishes photos from Qualcomm Summit held on Dec. 3-5, 2019 in Maui, Hawaii.

Paxnet publishes Samsung business overview with interesting data on the company's image sensor operation (DDI stands for Display Driver IC, AP - Application Processor):Samsung's Non-Memory Division revenue breakdown by product: Foundry 41%, CIS 19%, DDI 15%, AP 23%Cumulative growth since 2010: Found...

ON Semi reports that it has won the Innovative Product of the Year award in the sensor category of the World Electronics Achievement Awards (WEAA) 2019 for its recently announced ARX3A0 CMOS sensor.The 0.

Samsung publishes a half-year report listing its recent achievements:

PRNewswire: Smartsens presentation at China Public Security Expo (CPSE 2019) held in Shenzhen, China at the end of October has a part about its future products:CMOS Sensors with LED Flicker Suppression (LFS) enabled by SmartSens QCell technology for ADAS and Autonomous Vehicles (AV) applicationsAuto...

Reuters: Panasonic announces the selling of its loss-making semiconductor unit to Taiwan’s Nuvoton, a part of Winbond Group, for $250M. The sale includes image sensor business and Tower-Panasonic JV fabs. The transaction is expected to close by June 2020.Panasonic says, "...

IFNews quotes Laoyaoba report that VGA, 2MP, and 5MP image sensor prices went up by 20-40% due to the recent shortages.

PRNewswire: Actlight presents vital signs monitoring sensor based on its Dynamic Photo Diode. Despite ultra small detector area (less than 0.2mm2) and minimal LED power (less than 1uW/Hz), the sensor is said to deliver higher than 70dB SNR.

European Photonics Industry Consortium (EPIC) Meeting on LiDAR held at Eindhoven, The Netherlands on October 30-31, 2019, publishes many of its presentations.

SET, Smart Equipment Technology announces the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). NEO HB is suitable for direct hybrid bonding processes.

IC Insights Research Bulletin says that Sony is the best performing semiconductor company: "The largest move upward in the ranking is forecast to come from Sony, which is expected to move up four spots to the 11th position on the strength of extremely strong image sensor sales.

Blickfeld publishes an article explaining challenges of automotive MEMS LiDAR:"In order to capture as much light as possible, a large aperture, i.e. as large a mirror as possible, is required.

Intel announces the RealSense lidar camera L515 able to generate 23M depth points per second with mm accuracy. The LiDAR Camera L515 has a focus on indoor applications that require depth data at high resolution and high accuracy.

TSMC, French Atomique Energie Commission, and Institut supérieur de l’aéronautique et de l’espace, Toulouse, publish a joint MDPI paper "Random Telegraph Noises from the Source Follower, the Photodiode Dark Current, and the Gate-Induced Sense Node Leakage in CMOS Image Sensors" by Calvin Yi-Pi...

Digitimes reports that TSMC received CIS orders from Sony "and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan." TSMC has placed equipment orders for additional 40nm process capacity at the fab to fulfill CIS Sony's orders.

CnTechPost noticed Xiaomi patent application US20190369422 "Display Structure and Electronic Equipment" by Zhihui Zeng, Anyu Liu, Lei Tang, Zhongsheng Jiang, Shaoxing Hu, and Chengfang Sun."...

IFNews quotes Sigmaintell forecast saying that mobile CIS market starts to shrink after the peaking in 2021:"With the continuous innovation and upgrading of technology and the promotion of 5G networks, multi-camera 2020 will increase the function of video shooting.

US Army Combat Capabilities Development Command's Army Research Laboratory and Polaris Sensor Technologies propose to use polarization sensitive thermal camera to find targets camouflaged in natural clutter.

Qualcomm announces Snapdragon 865 mobile platform with upgraded camera features:"Gigapixel Speed ISP: The Snapdragon 865’s ISP operates at staggering speeds of up to 2 gigapixels per second and provides brand-new camera features and capabilities.

Gpixel announces a NIR-enhanced version of its GMAX0505 sensor, a 26MP global shutter CMOS sensor in a square 1.1” optical format. The GMAX0505 and the new NIR-enhanced GMAX0505RF are part of Gpixel’s 2.

MarketWatch: Quanergy CEO says that Elon Musk's criticism of Lidar 'makes no sense':Innoviz decided to put its non-automotive qualified InnovizPro LiDAR into production. The automotive qualified version named InnovizOne is expected to start sampling next year.

Nature paper "Non-contact acquisition of brain function using a time-extracted compact camera" by Takamasa Ando, Tatsuya Nakamura, Toshiya Fujii, Teruhiro Shiono, Tasuku Nakamura, Masato Suzuki, Naomi Anzue-Satoi, Kenji Narumi, Hisashi Watanabe, Tsuguhiro Korenaga, Eiji Okada & Yasunori Inoue fr...

Esporos November Newsletter promotes the company's ToF power and noise calculation spreadsheet:

EurekaAlert reports that Korean POSTECH University developed a photodiode with increased absorption of the NIR light by using the hourglass-shaped silicon nanowire array. The research team was led by Prof. Chang-Ki Baek and consisted of Kihyun Kim, Myunghae Seo, and Sol Yoon.

GlobeNewswire: STMicroelectronics announces the shipment of its 1 billionth ToF module. ST’s ToF sensors utilize SPADs manufactured at ST’s 300mm front-end fab in Crolles, France.

European Photonics Industry Consortium (EPIC) Meeting on LiDAR held at Eindhoven, The Netherlands on October 30-31, 2019, publishes many of its presentations.

Espros distributors Pacer (UK) and Aprizes (China) publish Espros application notes on ToF camera calibration.