Archives for September 2026

Singular Photonics releases SPAD sensor with in-pixel processing

Image Sensors World        Go to the original article...

Singular Photonics launches world-first SPAD-based image sensor

Litavis offers programmable multi-modal capabilities on-chip, accelerating time-to-market for imaging applications.

Edinburgh, UK – September 10, 2026 – Singular Photonics, an innovator in single-photon imaging, today announced the launch of its most advanced image sensor to date. Litavis is the world's first single-photon avalanche diode (SPAD) sensor using in-pixel processing to unify imaging, timing, histogramming and photon statistics on a single chip.

Designed to bring unprecedented flexibility and intelligence to imaging applications, Litavis introduces a software-configurable sensing architecture capable of combining photon-counting imaging, programmable time gating, and advanced photon timing within a scalable SPAD array platform.

Litavis is also the first SPAD-based sensor to enable simultaneous intensity, timing and histogramming modes. The system also enables users to dynamically adapt sensor parameters in software without requiring new hardware designs.

By processing photon events directly on-chip, Litavis significantly reduces the amount of raw data that must be transferred and processed externally. This enables more scalable real-time imaging systems through lower latency, improved power efficiency and faster decision-making.

Litavis supports a broad suite of configurable operating modes, including:

  •  Multiple TCSPC and high throughput TDC configurations using internal or external clocks
  •  High-dynamic-range photon counting modes with selectable resolution
  •  Windowed and coincidence-based detection for advanced temporal analysis
  •  Combined timestamping and imaging modes


Developers can reconfigure the same hardware platform for different applications with minimal redesign effort, accelerating development cycles and reducing system complexity. The sensor is suitable for a broad range of applications including machine vision, robotics, physical AI, depth sensing, spectroscopy, scientific imaging, medical imaging, quantum technologies and industrial automation.

“Litavis combines the sensitivity advantages of SPAD technology with the adaptability and scalability increasingly required by modern multimodal imaging,” said Shahida Imani, CEO of Singular Photonics. “It condenses these into one intelligent sensor, enabling a new generation of imaging systems built on a single, configurable platform. We designed Litavis to serve multiple applications and markets, and we've already received significant pre-order volumes from companies and institutions around the world.”
As with Singular’s other products, Litavis is named after an ancient Celtic deity, an earth goddess, whose name means “the broad one” – reflecting the extensive capabilities of the new sensor.

Litavis will be demonstrated at SPIE Sensors + Imaging in Edinburgh next week, and at VISION, the world's largest machine vision tradeshow in Stuttgart in October.

Technical details
Litavis is a CMOS SPAD-based imaging sensor platform built on an architecture that combines single-photon sensitivity with integrated digital photon processing directly on-chip and in-pixel. This enables precise capture of spatial and temporal information, while reducing reliance on external processing hardware, allowing the sensor to extract additional scene information including depth, timing and event characteristics.

Litavis delivers continuous 256 × 256-pixel photon-counting imaging under low-light conditions. In parallel, time-stamped photon events are generated at a lower rate on a 64 × 64 macropixel grid, providing picosecond-resolution photon timing alongside full-resolution photon counting.

The sensor also supports multi-event timing, allowing multiple detected photons per excitation cycle to be individually time-binned, and in-pixel histogramming. These capabilities provide access to temporal statistics beyond conventional intensity measurements. This supports applications such as fluorescence lifetime imaging, dynamic light scattering, and quantum sensing.

Litavis integrates configurable acquisition and timing capabilities directly within the pixel array. This allows developers and system integrators to rapidly prototype, evaluate and deploy advanced imaging solutions using a single adaptable platform.

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More coverage of Sony TSMC collab

Image Sensors World        Go to the original article...

Link: https://www.techtimes.com/articles/323736/20260810/sony-splits-sensor-manufacturing-tsmc-63b-deal-capture-physical-ai-market.htm

Some excerpts below. 

Sony Splits Sensor Manufacturing With TSMC in $6.3B Deal to Capture Physical AI Market
Joint Venture Keeps Pixel IP at Sony While TSMC Supplies Logic Process for Cars and Robots
 

Sony Group and Taiwan Semiconductor Manufacturing Co. announced Monday that they plan to invest approximately ¥1 trillion (approximately $6.3 billion USD) in a joint venture to manufacture next-generation image sensors at Sony's Koshi City fab in Kumamoto Prefecture, with commercial production targeted for 2029, according to the Japan Times. The investment is not an incremental expansion of Sony's existing manufacturing footprint — it is an acknowledgment that the sensors required to power robots, autonomous vehicles, and AI-driven industrial systems operate on fundamentally different technical principles from the smartphone sensors that built Sony's 43% market lead, and that meeting those requirements demands a manufacturing partnership Sony cannot replicate alone.

Why Sony Could No Longer Do This Alone

[...] the sensors required for physical AI applications — cameras inside self-driving cars, robotic manufacturing lines, and industrial inspection systems — are a categorically different product from the sensors inside a smartphone, and building the manufacturing infrastructure to produce them at scale requires both the capital and the process technology that Sony's in-house fabs cannot provide on their own.

[The difference is threefold.]

The first is the global shutter. [...]

The second is dynamic range. [...]

The third is temperature tolerance and functional safety certification. [...]


What the Fab-Light Model Actually Splits

[...] Sony will not share [the pixel layer] manufacturing process with TSMC under the joint venture[...]. Sony retains full control of the pixel wafer.

The second wafer is the logic layer [which will benefit] enormously from advanced logic process technology [from] TSMC's logic process expertise, specifically its ability to manufacture the logic die at nodes Sony cannot match in-house [...].

The two wafers are then bonded using copper-to-copper hybrid bonding — a technique Sony pioneered for commercial image sensor production around 2016 [...].


The Sony-TSMC sensor joint venture supplies the perception layer that physical AI systems require. Whatever a robot or autonomous vehicle is doing with its AI model, it is perceiving the world through an image sensor first. 


Sony's IP Bet and the Competitive Clock

The joint venture is also, implicitly, a response to a competitive clock [...] Apple confirmed in August 2025 that it was working with Samsung at the latter's Austin, Texas facility [...].


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