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10th International Smart Sensor Technology Exhibition - 2-4 July 2025 - Goyang, South Korea - Website

26th International Workshop on Radiation Detectors - 6-10 July 2025 - Bratislava, Slovakia - Website

IEEE Sensors Applications Symposium - 8-10 July 2025 - Newcastle Upon Tyne, United Kingdom - Website

Ninth International Conference on Imaging, Signal Processing and Communications - 11-13 July 2025 - Osaka, Japan - Website

Optica Sensing Congress - 20-24 July 2025 - Long Beach, California, USA - Website

American Association of Physicists in Medicine 67th Annual Meeting and Exhibition - 27-30 July 2025 - Washington, D.C., USA - Website

The 2nd International Conference on AI Sensors and Transducers - 29 July–3 August 2025 - Kuala Lumpur, Malaysia - Website

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PARIS, France and OBERSULM, Germany – March 5, 2025 - IDS Imaging Development Systems GmbH,  market leader in industrial machine vision, and Prophesee SA, inventor of the most advanced neuromorphic vision systems, today announced that IDS’ new uEye EVS camera line incorporates the high-speed, dynamic range and data efficiency of the Prophesee-Sony IMX636HD event-based vision sensor to offer new capabilities for industrial machine vision applications.

The result of extensive collaboration between the two companies, the solution features Prophesee’s proven neuromorphic approach to capturing fast-moving objects with significantly less data processing, power and blur than traditional frame-based methods. With these capabilities, the uEye EVS camera is the ideal solution for applications that require real-time machine vision processing at very high speed, such as optical monitoring of vibrations or high-speed motion analysis.

The camera benefits from Prophesee’s event-based vision’s ability to capture only relevant events in a scene. In contrast to conventional image sensors, it does not capture every image completely at regular intervals (frames) but only reacts to changes within a scene. It transmits events depending on when and where the brightness in its field of view changes - for each individual sensor pixel. The temporal resolution, i.e. the minimum measurable time difference between two successive changes in brightness, can be less than 100 microseconds.

The sensor is supported by Metavision SDK, a seamlessly integrated suite of software tools and models, APIs, and other training and development resources from Prophesee for efficient evaluation, visualization, and customization.

"This partnership combines our mutual areas of expertise to realize the benefits of event-based vision, including remarkable temporal resolution which make the cameras optimised for analysing highly dynamic scenes. It enables best conditions for capturing fast object movements without loss of information, comparable to an image-based frame rate of more than 10,000 images per second," explains Patrick Schick, Product Owner 3D & Vision Software. “At the same time, the sensor ignores all motionless areas of its field of view and thus generates 10 to 1000 times less data than image-based variants. This saves memory and computing time.”

“IDS cameras are well known to address the toughest machine vision use cases and with the incorporation of Prophesee event-based vision technologies, it strengthens its offering to provide far more performance, power efficiency and accuracy, even in the most challenging conditions,” says Luca Verre, CEO and co-founder of Prophesee. “We are excited to see how the efforts of this tight collaboration have resulted in the new uEye EVS camera which leverages the potential of our sensors and development environment to deliver new value to its customers.”

About IDS Imaging Development Systems GmbH:
IDS Imaging Development Systems GmbH is a leading manufacturer of industrial cameras and pioneer in industrial image processing. The owner-managed, environmentally certified company develops high-performance and versatile 2D and 3D cameras as well as models with artificial intelligence (AI) or with streaming/event recording feature. The almost unlimited range of applications covers multiple non-industrial and industrial sectors of equipment, plant and mechanical engineering.
Since its foundation in 1997 as a two-man company, IDS has developed into an independent, ISO and environmental-friendly certified family business with around 320 employees. The headquarters in Obersulm, Germany, is both a development and production site. With subsidiaries in the USA, Japan, South Korea and the UK, as well as further representative offices in France, Benelux and India, the technology company has a global presence.

About Prophesee
Prophesee is the inventor of the world’s most advanced neuromorphic vision systems. Prophesee’s patented sensors and AI algorithms, introduce a new computer vision paradigm based on how the human eye and brain work. Like the human vision, it sees events: essential, motion information in the scene, not a succession of conventional images. This breakthrough method allows for unprecedented speed (>10 000fps time resolution equivalent), dynamic range (>120dB), data volume (10x to 1000x less) and power efficiency (<10 mW). Prophesee bio-inspired revolution opens a new path to absolute efficiency and safety in autonomous driving, IoT and Industry 4.0. Prophesee reveals the invisible.   For more information, please visit www.prophesee.ai.

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Various news agencies reporting that SK hynix is exiting the CIS business to focus on AI.

https://www.trendforce.com/news/2025/03/06/news-sk-hynix-reportedly-exits-cis-to-focus-on-ai-memory-amid-weak-demand-and-fierce-china-competition/

Amid the AI-driven HBM boom, SK hynix is exiting its non-core CMOS image sensor (CIS) business, according to ZDNet and Edaily.

The ZDNet report suggests that SK hynix used to supply CMOS sensors for Samsung’s Galaxy Z3 and Chinese smartphones, but struggled to expand due to weak market demand and rising competition from Chinese newcomers.

According to SK hynix, its CIS division, launched in 2007, gained expertise in logic semiconductors beyond memory. However, the company decided to shift resources from CIS to AI memory to strengthen its AI-focused strategy, as per ZDNet.

Another report from fnews notes that SK hynix entered the image sensor market in 2008 by acquiring Silicon File. In 2019, it established a CIS R&D center in Japan and launched the “Black Pearl” sensor brand.

However, while trailing behind Sony and Samsung on the CIS business, SK hynix has been gradually downsizing the division, according to Edaily.

In late 2024, the company placed its CIS development team under the Future Technology Research Institute amid ongoing discussions about the business’s declining profitability, the Edaily report indicates.

https://www.thelec.net/news/articleView.html?idxno=5177 

SK Hynix is existing the CMOS image sensor (CIS) business, TheElec has learned.

The company will instead focus fully on AI memory products. Those working at its CIS business unit will be transferred to teams working on high-bandwidth memory (HBM).

In a recent internal communication event with employees, SK Hynix said the AI era has come and that the company has achieved “great results” in the AI memory sector.

The company was in the middle of a “great transition” to become a core AI company, SK Hynix told employees.

Technology and expertise that its CIS business unit will be crucial in solidifying its position as a global AI company, SK Hynix added.

SK Hynix started its CIS business in 2007 and since then attempted to expand its market share in the mobile market. But the unit continued to mark low profitability and its existence was always questioned.

In its year’s end reshuffle lats year, the business unit was moved to be under the supervision of the Future Technology Lab. These teams are more research oriented than teams under the supervision of the CEO.
SK Hynix CEO Kwak Noh-jung was also known to be strongly in favor of continuing the CIS business unit prior to the exit.

The company, during the vent, also said it plans to become a full stack AI memory provider.

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Low-Temperature Detectors Conference - 1-6 June 2025 - Santa Fe, New Mexico, USA - Website

International Image Sensor Workshop - 2-5 June 2025 - Hyogo, Japan - Website

Symposium on VLSI Technology and Circuits - 8-12 June 2025 - Kyoto, Japan - Website

AutoSens USA 2025 - 10-12 June 2025 - Detroit, Michigan, USA - Website

Photonics for Quantum - 16-19 June 2025 - Waterloo, Ontario, Canada - Website

Smart Sensing - 18-20 June 2025 - Tokyo, Japan - Website

Sensors and Sensing Technology - 19-21 June 2025 - Zurich, Switzerland - Website

Sensors Converge - 24-26 June - Santa Clara, California, USA - Website

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CLEO - Congress on Lasers and Electro-Optics - 4-9 May 2025 - Long Beach, California, USA - Website

17th Optatec - 5-7 May 2025 - Frankfurt, Germany - Website

Sensor+Test - 6-8 May 2025 - Nuremberg, Germany - Website

Automate - 12-15 May 2025 - Detroit, Michigan, USA - Website

Quantum Photonics Conference, Networking and Trade Exhibition - 13-14 May 2025 - Erfurt, Germany - Website

AllSensors 2025 - 18-22 May 2025 - Nice, France - Website

Biosensors 2025 - 19-22 May 2025 - Lisbon, Portugal - Website

Embedded Vision Summit - 20-22 May 2025 - Santa Clara, California, USA - Website

5th International Electronic Conference on Biosensors - 26-28 May 2025 - Online - Website

LOPS 2025 - Fort Lauderdale, Florida, USA -31 May-2 June 2025 - Website

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ICCP is the premier annual conference on computational imaging. The conference brings together researchers with interests broadly related to advancing computational imaging, from theory to systems to applications, including sensors, optics, algorithms, machine intelligence, vision science and perception.
ICCP 2025 will be an in-person event at the University of Toronto in Toronto, Canada, from July 21 – 23, 2025.

ICCP 2025 seeks novel and high-quality submissions in all areas of computational imaging—from theory to systems to applications, including sensors, optics, algorithms, machine intelligence, vision science, and perception—as well as the following topics of interest.

•  High-performance imaging
•  Computational cameras, illumination, and displays
•  Advanced image and video processing
•  Integration of imaging, physics, and machine learning
•  Organizing and exploiting photo/video collections
•  Structured light and time-of-flight imaging
•  Appearance, shape, and illumination capture
•  Computational optics (wavefront coding, digital holography, compressive sensing, etc.)
•  Sensor and illumination hardware
•  Imaging models and limits
•  Physics-based rendering, neural rendering, and differentiable rendering
•  Applications: imaging on mobile platforms, scientific imaging, medicine and biology, user interfaces, AR/VR systems

1.  The PAMI special issue: for papers that describe entirely novel work (i.e., not extensions of published conference papers) and are also of archival quality with comprehensive evaluation and analysis.
2.  The ICCP Proceedings: for papers that meet traditional conference criteria for quality and novelty but do not meet the criteria for (1) above.

Reviewing will be double-blind, and authors will be allowed a rebuttal after initial reviews. After review, the program chairs will inform the authors of accepted papers whether their paper has been selected for the special issue or the conference proceedings (see the Review and Decision Process section below for further details). Both sets of accepted papers will be presented as talks at the conference.

Please visit this page for more details and submission link: https://iccp2025.iccp-conference.org/#callforpapers

Paper submission deadline (firm, no extensions)     April 9, 2025 at 2359h Pacific Time.

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The Future of Image Sensors, John McCarten

John McCarten presented a talk as part of the Society for Imaging Science and Technology (IS&T) Rochester NY chapter seminar series on 22 Jan. 2025.

John McCarten studied Physics at Cornell University and currently works for L3Harris. Since 2001, John’s focus has been on image sensors and cameras. He has worked with semiconductor foundries on four continents. He has over 30 patents and has been the technical lead on development projects that have brought in over a billion dollars in sales.

00:00 - Introduction
00:45 - Future of Image Sensors
50:22 - Discussion

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New! IISW25 Technical Program (preliminary): Link

Venue: Awaji Yumebutai Int. Conf. Center, Hyogo, Japan.
Date: 2–5 June, 2025
 
New! Pre-registration information: Link

Authors can find the Paper Numbers or Poster Numbers in the Program to complete the required pre-registration.

After collecting all the camera-ready files, the final Program with timetables will be posted here.

New! IISW25 Right to Publish Form: Link

Authors need to download, sign, print to PDF, and submit it along with the camera-ready 4-page paper by 03/22/25.

Submit files to the same CMT site where you submitted the abstracts : https://cmt3.research.microsoft.com/IISW2025
 
 
General Workshop Co-Chairs
Yusuke Oike – Sony (Japan)
Shoji Kawahito – Shizuoka University and SUiCTE
Technical Program Chairs
Calvin Chao – TSMC
Rihito Kuroda – Tohoku University
IISS Board of Directors
Calvin Chao – TSMC
Boyd Fowler – OmniVision
Robert Henderson – The University of Edinburgh
Vladimir Koifman – Analog Value
Rihito Kuroda – Tohoku University
Guy Meynants – Photolitics
Junichi Nakamura – Brillnics
Shouleh Niksad – Jet Propulsion Lab.
Yusuke Oike – Sony (Japan)
Johannes Solhusvik – Sony (Norway)
Daniel Van Blerkom – Forza Silicon-Ametek
Yibing Michelle Wang – Samsung Semiconductor

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A recent article in IEEE Spectrum discusses three approaches to improve color throughput in low-light settings: nano-prisms, light pillars, and color splitters.

Link: https://spectrum.ieee.org/smartphone-camera-sensors-next-gen/nano-light-pillars-bring-low-light-images-into-focus

“Nano-pillars” are a light channeling form of a metasurface that, a little like Imec's color splitter, also direct specific wavelengths of light to the detector pixels best suited to receive the light. (VisEra Technologies)

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TLDR; Register as soon as possible starting February 17, as the number of attendees is limited! 

IISW 2025 Announcement of Pre-registration
 
The 2025 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is the tradition, the 2025 workshop will emphasize an open exchange of information among participants in an informal, secluded setting on the Awaji Island in Hyōgo, Japan.
 
The pre-registration, along with the workshop program, will be open from February 17th, 2025. Details about pre-registration have been made available in advance at:
 
https://imagesensors.org/2025-international-image-sensor-workshop/
 
Priority seating will be given to presenters of accepted papers, resulting in a limited number of seats available for other attendees. Registration will generally be on a first-come, first-served basis. However, in line with the workshop’s commitment to fostering diverse and lively discussions, the organizers reserve the right to adjust allocations to ensure a balanced representation of affiliations.

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Link: https://thinklucid.com/tech-briefs/triton2-evs-explained-optimizing-event-based-imaging/

Lucid Vision Labs has published an in-depth article on their analysis of the bias and threshold features of Sony's IMX636 and IMX637 event-based sensors. The report goes into details on how the sensor can be controlled so that users can tweak and tune the event based data.

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Link: https://www.vision-systems.com/cameras-accessories/image-sensors/article/55264400/gpixel-launches-new-large-format-image-sensor

Gpixel Launches New Large Format Image Sensor

Sensor especially designed for physical science, astronomy vision applications.

Gpixel has launched a new large format monochrome CMOS image sensor, the GSENSE1517BSI. This backside illuminated sensor has 4116 x 4100, 16.8 MPixel resolution with 15 x 15 µm pixel size, 61.74 x 61.5 imaging area, and 4 fps frame rate. It has 92% peak QE and minimum read noise of 1.2e. It has both dual gain HDR and 14-bit ADC, which enables a wide variety of imaging modes. It can achieve up to 95.3db dynamic range. It has an operating temperature range of -60°C to 50° C.

This sensor is especially designed for scientific applications such astronomy related vision tasks, including space situational awareness, and orbital object tracking.

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LYNRED Eyesential SW, VGA 10 µm pitch SWIR imaging sensor, provides leading-edge performance in sensitivity, low noise and ease-of-use for machine vision, scientific imaging and spectroscopy, where delivering affordability is key

Teledyne/FLIR Webinar on Sony's 4th Gen Pregius

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More than 250 key stakeholders from across the image sensors industry will convene in London 18-19^th March for the 19^th edition of Smithers’ renowned Image Sensors Europe conference.

Since 2007, this premier event has become the annual cornerstone for technical and business discussions in the image sensors sector. Each year, this ever-evolving market continuously prompts new and exciting opportunities for the entire supply chain. Image Sensors Europe provides a platform for leading industry representatives from across the digital imaging supply chain to engage in high caliber discussions and unrivalled face-to-face networking opportunities.

Guided by insights from an Advisory Board representing the full value chain, the conference agenda promises a comprehensive exploration of market trends, business updates, manufacturing advancements, breakthrough technologies, and ongoing technical challenges. Attendees can look forward to an impressive roster of speakers, including representatives from TechInsights, Sony Semiconductor Solutions, X-FAB, Canon, Hamamatsu Ventures Europe, Meta, Harvest Imaging, Forza Silicon (Ametek Inc.), STMicroelectronics, and Gpixel, among others.

“Attending this conference is mandatory when working in the image sensor market. Great technology, great people, great conference.” – Teradyne

This year's program takes place over two days, comprising 7 key areas of focus to highlight all the latest topics and trends including:

Session 1: Market Trends & CMOS Sensor Updates

Session 2: Automotive Applications

Session 3: SWIR

Session 4: SPAD

Session 5: Depth Sensing

Session 6: Consumer & Scientific Applications

Session 7: Image Processing

“Excellent event with outstanding speakers and plenty of opportunities for networking.” – Siemens Healthineers

Already confirmed to attend the event includes representatives from SONY, Amazon, SICK IVP, Intuitive Surgical, Photon Force, Framos, SynSense AG, Taiwan Semiconductor Manufacturing Company, Nordson many more.

Tickets are priced starting at just £1,579 + VAT for full access to the two-day event.

For more information, please visit www.image-sensors.com/image-sensors-europe

An online live workshop with industry expert Albert Theuwissen will take place on 6^h March 2025. Join for just £479 + VAT to discover the recent developments in the CIS world over the last 12 months.

About Smithers

Smithers is a global leader providing B2B information services, including leading conferences and events, market reports and intelligence and strategic consulting services. Smithers also offer testing in a variety of industries, including electronics, components, tires, rubber, elastomers and polymers. For more information about Smithers, please visit www.smithers.com.

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Compound Semiconductor International Conference - 7-9 April 2025 - Brussels. Belgium - Website

SPIE Optics + Optoelectronics - 7-10 April 2025 - Prague, Czech Republic - Website

IEEE Custom Integrated Circuits Conference - 13-17 April 2025 - Boston, Massachusetts, USA - Website

SPIE Defense + Commercial Sensing - 13-17 April 2025 - Orlando, Florida, USA - Website

IEEE Silicon Photonics Conference - 14-17 April 2025 - London, England, UK - Website

Optics and Photonics International Congress - 21-25 April 2025 - Yokohama, Japan - Website

Robotics Summit and Expo - 30 April-1 May 2025 - Boston, Massachusetts, USA - Website

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Link: https://appleinsider.com/articles/25/01/09/apple-fights-patent-lawsuit-over-iphone-15-camera-tech

In September, Apple was the target of a patent infringement lawsuit from SiOnyx, for allegedly encroaching on patents for full-color night vision imaging sensors.

At the time, it was claimed that Apple had infringed on the patents, referred to as "Pixel Isolation Elements, Devices, and Associated Methods," discussing improvements to photosensitive devices. By using silicon-based photonics, the complaint said that companies could create smaller, lower-cost, and higher-performance photonic devices for imaging purposes.

In December, SiOnyx amended the complaint to include that Apple had pre-suit knowledge of three patents, reports Law.com. Apple also connected in May 2014 to talk about technical developments.

In an August 2017 meeting over trench isolation structures and black silicon technology, as mentioned in the patents, SiOnyx also shared a presentation with Apple employees.

On January 8, Apple responded to the complaint by filing a motion to strike some of the new allegations. Working for Apple, attorney Michael D. Strapp of DLA Piper wanted for some of the case to be dismissed, because SiOnyx failed to state a claim.

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Source: https://sifted.eu/articles/startups-went-bust-2024
 

French deeptech Prophesee developed advanced ‘neuromorphic’ computer vision technology — meaning that it aimed to imitate the structure and function of the human brain and eye. In May 2024, it announced that its technology, which is mostly intended for smartphone cameras, was available in US tech giant AMD’s products. However, in October [2024], the company, which had raised €126m in total, filed for insolvency and entered judicial recovery. It told French publication Les Echos that its next round of fundraising had taken longer than expected.

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10xEngineers invites the Imaging and Vision community to attend a Short Course on Infinite-ISP, the open-source hardware image signal processor development package at Electronic Imaging 2025.

Date: February 6, 2025 PST

Start Time: 8:30 am - 12:45 pm Pacific Time

Duration: 4 hours

The participants of the course will be taken through the entire ISP development process using the open source Infinite-ISP package. The hands-on course touches topics such as:
a.    translating a custom algorithm written in floating-point into the hardware ISP pipeline
b.    Porting a new image sensor to the hardware ISP and tuning for a new sensor
c.    utilizing the ISP to process an available dataset for Vision or AI/ Deep Learning application

Program link: https://www.imaging.org/IST/iCore/Events/Function_Display.aspx?EventKey=E25&FunctionKey=E25/SC17

Registration: https://www.imaging.org/IST/Events/EI-Registration/SignIn.aspx

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21st Annual Device Packaging Conference - 3-6 March 2025 - Phoenix, Arizona, USA - Website

Laser World of Photonics China - 11-13 March 2025 - Shanghai, China - Website

Image Sensors Europe - 18-19 March 2025 - London, UK - Website

MEMS & Sensors Technical Conference - 26-27 March 2025 - Atlanta, Georgia, USA - Website

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Press release: https://global.canon/en/news/2025/20250122.html

Canon develops CMOS sensor with 410 megapixels, the largest number of pixels ever achieved in a 35 mm full-frame sensor

TOKYO, January 22, 2025— Canon Inc. announced today that it has developed a CMOS sensor with 410 megapixels (24,592 x 16,704 pixels), which is the largest number1 of pixels ever achieved in a 35 mm full-frame sensor. This sensor is expected to be used in applications that demand extreme resolution in various markets including surveillance, medicine, and industry.

The newly developed CMOS sensor features a resolution equivalent to 24K (198 times greater than Full HD, and 12 times greater than 8K). This enables users to crop any part of the image captured by this sensor and enlarge it significantly while maintaining high resolution. While many CMOS sensors with a super-high pixel count are medium-format or larger, this extreme resolution sensor is compacted into a 35 mm full-frame format. This allows it to be used in combination with lenses for full-frame sensors, and it is expected to contribute to the miniaturization of shooting equipment. As data readout of a CMOS sensor tends to take longer as the number of pixels increases, achieving a CMOS sensor with a super-high pixel count requires advanced signal processing technology. The newly developed sensor employs a back-illuminated stacked formation in which the pixel segment and signal processing segment are interlayered and also includes a redesigned circuitry pattern. As a result, the sensor is capable of achieving a super-high readout speed of 3,280 megapixels per second, delivering video at 8 frames per second2.

This sensor3 also features a “four-pixel binning” function that virtually treats four adjoining pixels as one, thereby improving sensitivity and making it possible to capture brighter images. When this function is in use, the sensor can capture 100-megapixel video at 24 frames per second.

By leveraging the technology it has accumulated over many years as a leading imaging company, Canon has developed breakthrough products including CMOS sensors with super-high pixel count and ultra-sensitivity, and SPAD sensors, which detect faint traces of light even in dark areas. Canon will continue to advance its technology and contribute to the transformation and further development of society.

Additional information
The sensor is scheduled to be displayed at the Canon booth at SPIE Photonics West, a leading global conference for optics and photonics held in San Francisco from January 28-30, 2025.
 1 As of January 21, 2025 (According to a survey by Canon).
 2 Applies to both color and monochrome sensors
 3 Monochrome sensor only

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Press release: https://singularphotonics.com/singular-photonics-emerges-from-stealth-with-portfolio-of-spad-based-image-sensors/

Startup introduces range of sensors with layers of advanced computation to extract valuable information from images.

Edinburgh, UK – January 23, 2025 – Singular Photonics emerged from stealth mode today, launching a new generation of image sensors based on single photon avalanche diodes (SPADs). A spin-out from the University of Edinburgh lab of digital imaging pioneer Professor Robert Henderson, Singular is one of the first companies to bring advanced computation to SPAD-based image sensing, enabling in-pixel and cross-pixel storage and computations at the lowest light levels to reveal previously invisible details of the material world and its photon events.

The company will showcase its products for the first time at next week’s SPIE Photonics West event in San Francisco.

SPADs use the “avalanche” effect in semiconductors to convert light directly into an electrical current, without the need for cooling or amplification. While most commercial SPAD-based image sensors have been limited to time-resolved counting of photons, Singular’s core innovation lies in complex layers of computation beneath 3D-stacked SPAD sensors, comparable to the way FPGAs and GPUs revolutionized parallel computing by conducting high-speed, localized processing.

Prof Henderson leads the University of Edinburgh’s CMOS Sensors and Systems Group. In 2005, he designed one of the first SPAD image sensors in nanometer CMOS technologies, leading to the first time-of-flight sensors in 2013, which today perform an autofocus-assist feature in more than a billion smartphones worldwide.

“There can be no doubt that SPAD sensors are the future of digital imaging, but their use to date in commercial devices hasn’t extended much beyond time-resolved counting of photons,” said Prof Henderson. “Computational cleverness can be the difference. We are building next-generation imaging sensors, where the computation is done digitally at the pixel level – exactly where the photons arrive.”
Simultaneously capturing depth and temporal dimensions to generate 4D images that provide deep, data-rich insights, Singular’s noiseless sensors enable more information to be extracted from light, supporting applications ranging from consumer and automotive electronics to the scientific and medical fields. The company’s approach transforms SPAD sensors into 3D stacked computational engines capable of performing a wide range of sophisticated tasks, such as real-time photon counting, timing, and advanced processing techniques, including in-pixel histograms, statistical analysis and autocorrelation.

Singular is launching with two sensors, both of which are available today:
 
Andarta, developed in collaboration with tech giant Meta, has a miniature form factor combined with high sensitivity, and is optimized for use in a number of medical imaging modalities. The sensor supports multiple modes of operation including in-pixel autocorrelation measurements, and represents a significant step closer to SPAD integration in the wearables space. For example, Andarta enables monitoring of the rate of cerebral blood flow, monitoring rapid fluctuations in light as it passes through tissue, at depths not currently possible with current sensors.

 Sirona, the company’s first product, is a 512 pixel SPAD-based line sensor capable of time-correlated single photon counting (TCSPC) and enabling Raman spectroscopy, fluorescence lifetime imaging microscopy (FLIM), time-of-flight, and quantum applications. With on-chip histogramming and time binning capability, the sensor has the potential to revolutionize spectroscopy applications.
Singular has already inked multiple deals for its sensors with some of the world’s leading instrumentation companies, and expects to announce more collaborations in 2025.

 “We are in a unique position where we already have commercially available products and are generating revenue in our first year of incorporation,” said Shahida Imani, CEO of Singular Photonics. “With new, even more advanced sensors coming to the market in 2025, we are well positioned to lead the SPAD-driven imaging revolution.”

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Prof. Eric Fossum received the National Medal of Technology and Innovation at the White House on Jan 3, 2025, receiving the highest honor for technological achievement in the US.

The press briefing is no longer available [as of Jan 23, 2025, 12:00am Eastern Time]: https://www.whitehouse.gov/briefing-room/statements-releases/2025/01/03/president-biden-honors-nations-leading-scientists-technologists-and-innovators/

An archived version from Wayback Machine is available here: https://web.archive.org/web/20250104020214/https://www.whitehouse.gov/briefing-room/statements-releases/2025/01/03/president-biden-honors-nations-leading-scientists-technologists-and-innovators/

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