X-FAB annonces BSI process for next gen image sensors

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Link: https://www.xfab.com/news/details/article/x-fab-enhances-image-sensor-performance-through-back-side-illumination

X-FAB Enhances Image Sensor Performance Through Back-Side Illumination

NEWS – Tessenderlo, Belgium – Apr 03, 2024

Presenting a foundry route to medical, automotive and industrial customers that combines boosted sensitivity, larger pixel size and more extensive sensor area

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has just announced a major addition to its optical sensor offering. Aimed at use in next generation image sensor fabrication, the company is now able to provide a back-side illumination (BSI) capability in relation to its popular XS018 180nm CMOS semiconductor process.

Through BSI, imaging devices’ performance characteristics can be significantly enhanced. It means that the back-end process metal layers do not block the incident light from reaching the pixels, increasing fill factors by up to 100%. This is highly beneficial in situations of low-level illumination – as higher pixel light sensitivity can be achieved. BSI also offers the added advantage of significantly reducing the crosstalk between neighboring pixels, due to shorter light paths, leading to better image quality. Though small-pixel BSI solutions for 300mm wafers with high-volume consumer usage are commonplace, there are very few options available for image sensors with stitched large-pixel arrangements for 200mm wafers, especially when additional customizations are required. The new X-FAB BSI capability brings new possibilities, allowing customers with even the most demanding application expectations to be served - such as those involved in X-Ray diagnostic equipment, industrial automation systems, astronomical research, robotic navigation, vehicle front cameras, etc.

Leveraging the XS018 platform, which offers high readout speeds and exhibits low dark currents, image sensors with multiple epi options will be produced. An ARC layer can be added and then tuned in accordance with particular customer requirements. The accompanying X-FAB support package covers a full workflow from initial design through to the shipment of engineering samples, with a comprehensive PDK included.

“BSI technology has become increasingly prevalent in modern imaging devices, thanks to its ability to boost image quality by placing light-sensitive elements closer to the light source and avoiding unwanted circuitry obstructions. This is proving very useful in environments where light is limited,” states Heming Wei, Technical Marketing Manager for Optical Sensors at X-FAB. “Though much of this uptake has been within the consumer electronics sector, there are now numerous opportunities emerging in the industrial, automotive and medical markets. Via access to X-FAB’s BSI foundry solution, it will now be possible for these to be properly attended to, with a compelling offering being provided that brings together heightened sensitivity, enlarged image sensor dimensions and bigger pixel capacities too.”



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Sony news and videos

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From https://www.sony-semicon.com/en/news/2024/2024032801.html

New Fab Expansion at Sony Device Technology (Thailand) Co., Ltd.

Atsugi, Japan — Sony Semiconductor Solutions Corporation today announced that, starting in February 2024, it has begun the operations with several production lines at the new fab built on the premises of Sony Device Technology (Thailand) Co., Ltd. (“SDT”), a production center responsible for assembly processes of semiconductors. The opening ceremony was held today, officiated by top executives from Sony Semiconductor Solutions Group led by Terushi Shimizu, President and CEO of Sony Semiconductor Solutions and Yoshihiro Yamaguchi, President of Sony Semiconductor Manufacturing, SDT Managing Director Takeshi Matsuda. It was witnessed by guests including Japan’s Ambassador to Thailand, Mr. Masato Otaka, Mr. Wirat Tatsaringkansakul, BOI Deputy Secretary General and other VIPs. 

SDT serves as a production center for the assembly of the main product line within Sony’s Imaging & Sensing Solutions business. The new fab, dubbed “Building 4,” will be utilized for the assembly of image sensors for automotive applications and display devices as well as the mass production of laser diodes for data center application.

Going forward, SDT plans to expand production facilities at Building 4 in line with market trends, while also planning to create approximately 2,000 new jobs with this new operation, thereby contributing to local employment and expanding the semiconductor industry in Thailand.

In addition, SDT has been operating its facilities on 100% renewable energy since fiscal year 2021. In the clean room of Building 4, the air conditioning system controls cleanliness, temperature and humidity by focusing on areas of need, and recycling technology for waste heat and hot water has also been adopted. Furthermore, SDT plans to cover the roof area of Building 4 with solar panels, with operations scheduled by the end of 2024 (calendar year). By accelerating the initiatives to reduce energy consumption and adoption of renewable energy, SDT will continue to run on 100% renewable energy even after Building 4 goes into full operation.

“With the completion of Building 4, we are very pleased to be able to deliver to more customers, a product line-up whose market is expected to expand over the medium to long term,” said Takeshi Matsuda, Managing Director of Sony Device Technology (Thailand) Co., Ltd. “As an overseas manufacturing site of Sony Semiconductor Solutions Group, SDT will contribute to the sustainable evolution of Sony’s business as well as society.”

-----------------------------

Two new videos about IMX900 sensor on YouTube:


This video presents Sony's 1/3.1" global shutter image sensor IMX900 with approx. 3.2 effective megapixels that is compact, high-resolution, and has improved near-infrared sensitivity. Here are its three features.



This video presents Sony's IMX900 global shutter image sensor, which is ideal for industrial applications such as barcode reading, picking robot, and AMR (autonomous mobile robots).  Here are the three functions that support optimal imaging for different scenarios.

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Sony Cyber-shot F828 retro review

Cameralabs        Go to the original article...

Back in 2003, Sony launched the Cyber-shot F828 the fifth model in the series to use an L-shaped design with a twisting body. It built on the earlier F717 and later gained cult status for its infra-red capabilities. Find out how it performs 21 years later in my retro review!…

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Job Postings – Week of 7 April 2024

Image Sensors World        Go to the original article...

California Institute of Technology  SRL

Instrument Scientist

Pasadena, California, USA

Link

ERC Centre de Nanosciences et de Nanotechnologies

PhD position :Integrated electro optical modulators and photodetectors in the mid-IR spectral range.

Palaiseau, France

Link

Omnivision

Product Marketing Manager

Santa Clara, California, USA

Link

University of Edinburgh

Research Associate in Short Wave Infrared LIDAR Sensors

Edinburgh, Scotland, UK

Link

United Imaging America

Laparoscope Image Signal Processing Expert

Houston, Texas, USA

Link

ETH Zurich

DMAPS Detector Development (DRD3 Collaboration)

Zurich, Switzerland

Link

Leonardo DRS

Principal Electro-Optical Engineer

San Diego, California, USA

Link

NASA Goddard SFC

Far-Infrared Detectors for Space-Based Low-Background Astronomy

Greenbelt, Maryland, USA

Link

KLA

Senior / Staff Electrical R&D Engineer (Hardware)

Singapore

Link

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STMicroelectronics has an opening in Paris

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 STMicroelectronics

Expert in image processing algorithms for optical sensors (or)            Paris, France      Link
Expert en algorithmes de traitement d'image pour capteurs optiques    

       

 

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CIS shipments for smartphones shrank in 2022 and 2023

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Available: a Ph.D. Scholarship under Prof. Guy Meynants

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KU Leuven

PhD on temporal noise reduction in CMOS image sensors     Geel, Belgium     Link

 

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Toppan shifts image sensor production to China

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From Nikkei Asia news: https://asia.nikkei.com/Business/Tech/Semiconductors/Japan-s-Toppan-shifts-image-sensor-component-production-to-China

Japan's Toppan shifts image sensor component production to China

TOKYO -- Japan's Toppan Holdings has moved production of components for CMOS image sensors from Japan to China, aiming to boost local production 40% as Beijing looks to bolster its supply chains for related technologies.

CMOS -- complementary metal-oxide semiconductor -- sensors convert light captured by camera lenses into electrical signals. Among CMOS components, Toppan produces on-chip color filters (OCF) that colorize captured images and microlenses that increase light-gathering power. Without OCF, CMOS can only detect differences in light level.

Toppan brought related equipment from its plant in Japan's Kumamoto prefecture to a facility in Shanghai and increased production lines from five to seven. They do not fall under U.S. export restrictions targeting China for advanced chipmaking equipment.

The Kumamoto plant will be used for research and development and its approximately 370 employees will be maintained.

The global CMOS market in 2022 was around $21.2 billion, according to French research firm Yole Intelligence. Sony Group leads with a 42% market share, followed by Samsung Electronics with 19% and U.S.-based Omnivision with 11%.

China's presence among top companies is limited to seventh-place GalaxyCore with 4% and eighth-place SmartSens with 2%. While Sony and Samsung manufacture OCF in-house, Chinese manufacturers mainly procure from outside sources.
In China, demand is increasing for CMOS related to automobiles, smartphones, surveillance cameras and other fields. Toppan will strengthen sales to local CMOS sensor manufacturers by producing near areas of demand.

Toppan's move comes as Beijing is spending more than $1.75 billion a year on subsidies to boost domestic semiconductor production, according to the South China Morning Post.
The U.S. has placed restrictions on the export of chipmaking equipment to China out of concerns the technology could be diverted for military purposes, making it difficult for the country to produce advanced chips.

Among chips in practical use, the most advanced level is currently said to be 3 nanometers. In general, the smaller the nanometer level for a logic chip, the more powerful it is.

Amid U.S. restrictions, China is focusing on CMOS, which differ from logic chips in manufacturing method and the definition of advanced products. Most CMOS can be manufactured using mature technology of 28 nm or greater, with the production equipment falling outside of the U.S. restrictions.
China's share based on production capacity of all 28-nm or greater so-called legacy chips is expected to reach 33% of the world's total in 2027, up 4 percentage points from 2023, according to Taiwan research firm TrendForce.

Beijing announced its "Made in China 2025" high-tech industry development plan in 2015, choosing semiconductors as a priority area. Two large government funds have been set up so far to help boost the domestic chip industry.

Plans for a third phase have recently emerged. Bloomberg reported this month that China was raising more than $27 billion from local governments and state-owned enterprises for a chip fund, the biggest of its kind.

Investment in mature technology other than CMOS is also increasing in China, and Japanese and U.S. manufacturing equipment makers are increasing sales in this field as well.
    
The value of chipmaking equipment shipments to China reached a record high of over $30 billion in 2023, up 6% from 2022 and putting the country first ahead of Taiwan and South Korea in imports, according to industry group SEMI.

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STMicroelectronics and CEA LETI develop microlenses for SPADs

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In a preprint titled "Metasurface-based planar microlenses for SPAD pixels", J. Vaillant et al. of STMicroelectronics and CEA LETI write:

In this paper we present two design generations of metasurface-based planar microlenses implemented on Front-Side Illumination SPAD pixels. This kind of microlens is an alternative to conventional reflow microlens. It offers more degrees of freedom in term of design, especially the capability to design off-axis microlens to gather light around the SPAD photodiode. The two generations of microlenses have been fabricated on STMicroelectronics SPAD and characterized. We validated the sensitivity improvement offered by extended metasurface-based microlens. We also confirmed the impact of lithography capability on metasurface performances, highlighting the need have access to advance deep-UV lithography.




 

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Job Postings – Week of 31 March 2024

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Microsoft

Hardware Test Engineer - Hololens

Fort Collins, Colorado, USA

Link

Vanderbilt University

Postdoctoral Candidate - The Caldwell Infrared Nanophotonic Materials and Devices Laboratory

Nashville, Tennessee, USA

Link

Cisco Meraki

MV Hardware Engineer

San Francisco, California, USA

Link

National University of Singapore

Research Fellow (Integrated photonics)

Kent Ridge, Singapore

Link

RTX - Raytheon

Advanced Materials - Associate Director, Engineering

Andover, Massachusetts, USA

Link

NASA-JPL

Advanced Technology Development for Future UV Missions

Pasadena, California, USA

Link

Prime Robotics

SLAM Engineer

Lakewood, Colorado, USA

Link

Oxa

Sensor Engineer

Oxford, England, UK

Link

European XFEL

Detector Support Scientist

Schenefeld, Germany

Link

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Two jobs in Italy submitted by Sony EUTDC

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Sony Semiconductor Solutions Europe

Senior Top AMS Verification Engineer     Trento, Italy     Link

Senior Digital Physical Implementation Engineer      Trento, Italy     Link

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Paper on SPADs at the NATO Science & Technology organization meeting

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A paper titled "SPAD Image Sensors for Quantum and Classical Imaging" by Prof. Edoardo Charbon was published in the STO Meetings proceedings in January 2024.

Paper link: https://www.sto.nato.int/publications/STO%20Meeting%20Proceedings/STO-MP-IST-SET-198/MP-IST-SET-198-C1-03.pdf

Abstract:
Single-photon avalanche diodes (SPADs) have been demonstrated on a variety of CMOS technologies since the early 2000s. While initially inferior to their counterparts implemented dedicated technologies, modern CMOS SPADs have recently matched them in sensitivity, noise, and timing jitter. Indeed, high time resolution, enabled by low jitter, has helped demonstrate the most impressive developments in fields of imaging and detection, including fluorescence lifetime imaging microscopy (FLIM), Förster resonance energy transfer (FRET), fluorescence correlation spectroscopy (FCS), time-of-flight positron emission tomography (TOF-PET), and light detection and ranging (LiDAR), just to name a few. The SPAD’s power of detecting single photons in pixels that can be replicated in great numbers, typically in the millions, is currently having a major impact in computational imaging and quantum imaging. These two emerging
disciplines stand to take advantage of larger and larger SPAD image sensors with increasingly low jitter and noise, and high sensitivity. Finally, due to the computational power required at pixel level, power consumption must be reduced; we thus advocate the use of in situ computational engines, which, thanks of CMOS’ economy of scale and 3D-stacking, enable vast computation density. Some examples of this trend are given, along with a general perspective on SPAD image sensors. 



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11 Canon printing products earn EPEAT Climate+ designation for meeting rigorous evaluation criteria for climate change initiatives

Newsroom | Canon Global        Go to the original article...

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Fujifilm instax mini 99 review

Cameralabs        Go to the original article...

The instax mini 99 is an instant camera designed for Fujifilm’s instax mini film. It’s aimed at anyone who wants more control than a budget model, like the Mini 12, while remaining a fully analogue camera. Here's my review!…

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Nikon Z 28-400mm f4-8 VR review so far

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The Nikon Z 28-400mm f4-8 VR boasts a huge 14.3x zoom range but weighs only 725g. It should be a versatile lens for travel and nature photography. See how its features compare in our preview.…

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Canon Publishes Annual Report for the Year Ended December 31, 2023

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Sony releases 247MP sensors

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Sony recently released a new 247MP rolling shutter CIS available in monochrome and color variants: IMX811-AAMR and IMX811-AAQR.







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Canon U.S.A., Inc. Named a 2024 ENERGY STAR® Partner of the Year for Sustained Excellence by the EPA

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Canon U.S.A., Inc. Named a 2024 ENERGY STAR® Partner of the Year for Sustained Excellence by the EPA

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Sigma 50mm f1.2 DG DN Art review

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The Sigma 50mm f1.2 DG DN Art is a standard prime lens with a bright aperture for Sony E and Leica L mount cameras. See why it's one of the best 50's to date in my review!…

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Job Postings – Week of 24 March 2024

Image Sensors World        Go to the original article...

CEA-IRIG

Permanent Researcher in Ultra-Wide-Bandgap Semiconductors

Grenoble, France

Link

Apple

Camera Electrical Engineer - Camera Hardware

Cupertino, California, USA

Link

University of Hawaii

Advanced detector development – Postdoc

Honolulu, Hawaii, USA

Link

Samsung Semiconductor

Senior Program Manager, Image Sensors

San Jose, California, USA

Link

CERN

Applied Physicist for Pixel-Detector Hybridisation and Testing

Geneva, Switzerland

Link

General Motors

Design Release Engineer - Image Quality

Detroit, Michigan, USA

Link

NASA

Far-Infrared Detectors for Space-Based Low-Background Astronomy – Postdoc

Greenbelt, Maryland, USA

Link

Lockheed Martin

Systems Integration Test Engineer/Infrared Testing

Goleta, California, USA

Link

Sony

Automotive Image Sensor Account Manager

Novi, Michigan, USA

Link

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Four new videos about the industry

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Here are few new videos from image sensor companies.

Two about new hardware built around image sensors:

  • Trinamix-ST under-OLED face recognition camera

 


  • Prophesee AR glassses demo

 


One about new facilities:

  • An official opening of TSMC-Sony plant in Kumamoto where Sony will manufacture its new image sensors:

 


And one about a new sensor series:

  • Omnivision presents its new generation of automotive HDR sensors:

 

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A Job Opening with Euresys

Image Sensors World        Go to the original article...

Euresys

Sales Manager - Europe            Liège, Belgium or Schongau, Germany           Link

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A Job Opening with Euresys

Image Sensors World        Go to the original article...

Euresys

Sales Manager - Europe            Liège, Belgium or Schongau, Germany           Link

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Artilux announces room temperature GeSi SPAD

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HSINCHU, Feb. 22, 2024 /PRNewswire/ -- Artilux, the renowned leader of GeSi (germanium-silicon) photonics technology for CMOS (complementary metal-oxide-semiconductor) based SWIR (short-wavelength infrared) sensing and imaging, announced today that the research team at Artilux has made a breakthrough in advancing SWIR GeSi SPAD (single-photon avalanche diode) technology, which has been recognized and published by Nature, one of the world's most prestigious scientific journals. The paper, titled "Room temperature operation of germanium-silicon single-photon avalanche diode," presented the Geiger-mode operation of a high-performing GeSi avalanche photodiode at room temperature, which in the past was limited to operation at a low temperature below at least 200 Kelvin. Nature's rigorous peer-review process ensures that only research of the highest caliber and broadest interest is published, and the acceptance and publication of the paper in Nature is another pivotal mark in exemplifying Artilux's leadership in CMOS-based SWIR sensing and imaging.

The research work, led by Dr. Neil Na, CTO of Artilux, has unveiled a CMOS-compatible GeSi SPAD operated at room temperature and elevated temperatures, featuring a noise-equivalent power improvement over previously demonstrated Ge-based SPADs by several orders of magnitude. The paper showcases key parameters of the GeSi SPAD, including dark count rate, single-photon detection probability at SWIR spectrum, timing jitter, after-pulsing characteristic time, and after-pulsing probability, at a low breakdown voltage and a small excess bias. As a proof of concept, three-dimensional point-cloud images were captured with TOF (direct time-of-flight) technique using the GeSi SPAD. "When we started the project, there were overwhelming evidence in the literature indicating that a room-temperature operation of GeSi SPAD is simply not possible," said Dr. Na, "and I am proud of our team turning the scientific research into a commercial reality against all odds."

The findings set a new milestone in CMOS photonics. The potential deployment of single-photon sensitive SWIR sensors, imagers, and photonic integrated circuits shall unlock critical applications in TOF sensors and imagers, LiDAR (light detection and ranging), bio-photonics, quantum computing and communication, artificial intelligence, robotics, and more. Artilux is committed to continuing its leadership in CMOS photonics technology, aiming to further contribute to the scientific community and photonics industry.

Abstract of article in Nature (Feb 2024): https://www.nature.com/articles/s41586-024-07076-x
The ability to detect single photons has led to the advancement of numerous research fields. Although various types of single-photon detector have been developed, because of two main factors—that is, (1) the need for operating at cryogenic temperature and (2) the incompatibility with complementary metal–oxide–semiconductor (CMOS) fabrication processes—so far, to our knowledge, only Si-based single-photon avalanche diode (SPAD) has gained mainstream success and has been used in consumer electronics. With the growing demand to shift the operation wavelength from near-infrared to short-wavelength infrared (SWIR) for better safety and performance, an alternative solution is required because Si has negligible optical absorption for wavelengths beyond 1 µm. Here we report a CMOS-compatible, high-performing germanium–silicon SPAD operated at room temperature, featuring a noise-equivalent power improvement over the previous Ge-based SPADs by 2–3.5 orders of magnitude. Key parameters such as dark count rate, single-photon detection probability at 1,310 nm, timing jitter, after-pulsing characteristic time and after-pulsing probability are, respectively, measured as 19 kHz µm−2, 12%, 188 ps, ~90 ns and <1%, with a low breakdown voltage of 10.26 V and a small excess bias of 0.75 V. Three-dimensional point-cloud images are captured with direct time-of-flight technique as proof of concept. This work paves the way towards using single-photon-sensitive SWIR sensors, imagers and photonic integrated circuits in everyday life.


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Nikon to acquire RED.com

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From Nikon newsroom: https://www.nikon.com/company/news/2024/0307_01.html

Nikon to Acquire US Cinema Camera Manufacturer RED.com, LLC

March 7, 2024

TOKYO - Nikon Corporation (Nikon) hereby announces its entry into an agreement to acquire 100% of the outstanding membership interests of RED.com, LLC (RED) whereby RED will become a wholly-owned subsidiary of Nikon, pursuant to a Membership Interest Purchase Agreement with Mr. James Jannard, its founder, and Mr. Jarred Land, its current President, subject to the satisfaction of certain closing conditions thereunder.

Since its establishment in 2005, RED has been at the forefront of digital cinema cameras, introducing industry-defining products such as the original RED ONE 4K to the cutting-edge V-RAPTOR [X] with its proprietary RAW compression technology. RED's contributions to the film industry have not only earned it an Academy Award but have also made it the camera of choice for numerous Hollywood productions, celebrated by directors and cinematographers worldwide for its commitment to innovation and image quality optimized for the highest levels of filmmaking and video production.

This agreement was reached as a result of the mutual desires of Nikon and RED to meet the customers’ needs and offer exceptional user experiences that exceed expectations, merging the strengths of both companies. Nikon's expertise in product development, exceptional reliability, and know-how in image processing, as well as optical technology and user interface along with RED’s knowledge in cinema cameras, including unique image compression technology and color science, will enable the development of distinctive products in the professional digital cinema camera market.

Nikon will leverage this acquisition to expand the fast-growing professional digital cinema camera market, building on both companies' business foundations and networks, promising an exciting future of product development that will continue to push the boundaries of what is possible in film and video production.

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Job Postings – Week of 17 March 2024

Image Sensors World        Go to the original article...

WeRide

Camera Sensor Engineer

San Jose, California, USA

Link

ISDI

Image Sensor Engineer

London, England, UK

Link

HRL Laboratories

Focal Plane Engineer

Camarillo, California, USA

Link

HRL Laboratories

Senior Infrared Detector Research Scientist

Camarillo, California, USA

Link

Paul Scherrer Institute

Postdoctoral Fellow in detector development

Villigen, Switzerland

Link

Kappa Optronics

Engineer for image sensor and camera technology

Göttingen, Germany

Link

Caeleste

Characterization Engineer

Mechelen, Belgium

Link

University of Amsterdam - NIKHEF

Postdoc position in ALICE and Detector R&D for Experimental Particle Physics

Amsterdam, Netherlands

Link

GE Healthcare

Detector Mechanical Engineer

Hino, Tokyo, Japan

Link

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Three New Videos from Photonis

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Photonis has released new videos describing the latest improvements in its image intensifiers.  

A little background might be useful to those with little exposure to image intensifiers.

First, Photonis itself. Those of you who are interested in the whole complex story can find it here. The original Photonis was a renamed spinoff of Philips that subsequently acquired a few other companies including Burle, the renamed spinoff of RCA's vacuum tube operation. Recently, the Photonis Group renamed itself Exosens but still uses Photonis as the brand for its image intensifiers.

Image intensifiers are vacuum tubes that have at one end a surface that emits electrons on receipt of photons, some sort of acceleration and electron multiplication mechanism and a phosphor at the other end to produce a brighter visible image. As new developments have been applied to intensifiers, various generations have been assigned.

Gen 0 - See this (somewhat irreverent) link. (Not real, of course.) Sometimes the first low-gain tubes are called Gen 0.

Gen 1 - Light hitting an alkali photocathode produces electrons that are accelerated and electrostatically focused by a metal cone on to a curved phosphor. These invert the image, which is reverted by the optics - 1930s - 1960s.

Gen 2 - Proximity-focused electrons from the photocathode hit a microchannel plate in which they are multiplied. The electron output is proximity-focused on a flat phosphor. Some of these still have the focusing cone to provide image inversion. 1970s

Gen 3 - The alkali photocathode is replaced by a cesium-coated gallium arsenide membrane. 1970s-1990s

Gen 4 - Photocathode improvements of various types and, typically, electronic gating. Strictly speaking, these are still Gen 3. 2000s+

The videos showing tubes Photonis characterizes as Gen 4+:

1 - Demonstration of electronic gating

2 - Demonstration of performance

3 - Demonstration of halo improvements





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IEEE ICCP 2024 Call for Papers, Submission Deadline March 22, 2024

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Call for Papers: IEEE International Conference on Computational Photography (ICCP) 2024
https://iccp-conference.org/iccp2024/call-for-papers/
Submission Deadline: March 22, 2024 @ 23:59 CET

ICCP is an international venue for disseminating and discussing new scholarly work in computational photography, novel imaging, sensors and optics techniques. This year, ICCP will take place in EPFL, Lausanne Switzerland, on July 22-24th!

As in previous years, ICCP is coordinating with the IEEE Transactions on Pattern Analysis and Machine Intelligence (PAMI) for a special issue on Computational Photography to be published after the conference.

 ICCP 2024 seeks novel and high-quality submissions in all areas of computational photography, including, but not limited to:

  •  High-performance imaging.
  •  Computational cameras, illumination, and displays.
  •  Advanced image and video processing.
  •  Integration of imaging, physics, and machine learning.
  •  Organizing and exploiting photo / video collections.
  •  Structured light and time-of-flight imaging.
  •  Appearance, shape, and illumination capture.
  •  Computational optics (wavefront coding, digital holography, compressive sensing, etc.).
  •  Sensor and illumination hardware.
  •  Imaging models and limits
  •  Physics-based rendering, neural rendering, and differentiable rendering.
  •  Applications: imaging on mobile platforms, scientific imaging, medicine and biology, user interfaces, AR/VR systems.

Learn more on the ICCP 2024 website, and submit your latest advancements by Friday, 22nd March, 2024.

The call for posters and demo will be published soon with a deadline end of April. It will also be a great opportunity to advertise your work.

 



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Sigma 500mm f5.6 DG DN Sports review

Cameralabs        Go to the original article...

The Sigma 500mm f5.6 DG DN OS Sports is a light and compact super-telephoto prime lens aimed at sports, wildlife and aviation photographers. Here's my full review!…

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