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International Image Sensor Society (IISS) has opened a LinkedIn page. Please feel free to follow to be updated about the latest events and announcements:12-ps Resolution Vernier Time-to-Digital Converter for SPAD Sensor
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MDPI paper "A 13-Bit, 12-ps Resolution Vernier Time-to-Digital Converter Based on Dual Delay-Rings for SPAD Image Sensor" by Zunkai Huang, Jinglin Huang, Li Tian,Ning Wang, Yongxin Zhu, Hui Wang, and Songlin Feng from Shanghai Advanced Research Institute, Chinese Academy of Sciences, presents a fairly complex pixel.WDR Sensor with Binary Image Feature
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IET Electronics Letters publishes a paper "CMOS image sensor for wide dynamic range feature extraction in machine vision" by Hyeon‐June Kim from Kangwon National University, Korea.Smartsens Released More than 30 Tapeouts in 2020
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Smartsens reports that it has released more than 30 tapeouts in 2020 or one tapeout every 12 days, on average. The company also won the "Unicorn Enterprise of the Year Award" from 2021 China Semiconductor Investment Alliance Annual Conference and China IC Billboard:CMOS Sensors Design with Synopsys Custom Compiler
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While most of analog design in the industry is done with Cadence EDA tools, Imasenic CTO Adria Bofill Petit presents an alternative path with Synopsys Custom Compiler:Call for Papers for Special Issue of 2022 IEEE TED on Solid-State Image Sensors
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- sub-micron pixels,
- high dynamic range sensors for automotive and machine vision,
- time-of- flight sensors for 3D imaging,
- 3-dimensional integration (wafer level stacking) for small and efficient imaging systems on a chip,
- sub-electron read noise pixels and avalanche photodetectors for single-photon imaging,
- detector structures for non-cooled infrared imaging,
- and many others.
- Topics of interest include, but are not limited to:
- Pixel device physics (New devices and structures, Advanced materials, Improved models and scaling, Advanced pixel circuits, Performance enhancement for QE, Dark current, Noise, Charge Multiplication Devices, etc.)
- Image sensor design and performance (New architectures, Small pixels and Large format arrays, High dynamic range, 3D range capture, Low voltage, Low power, High frame rate readout, Scientific-grade, Single-Photon Sensitivity)
- Image-sensor-specific peripheral circuits (ADCs and readout electronics, Color and image processing, Smart sensors and computational sensors, System on a chip)
- Non-visible “image” sensors (Enhanced spectral response e.g., UV, NIR, High energy photon and particle detectors e.g., electrons, X-rays, Ions, Hybrid detectors, THz imagers)
- Stacked image sensor architectures, fabrication, packaging and manufacturing (two or more tiers, back-side illuminated devices)
- Miscellaneous topics related to image sensor technology
GEO Semi Reports the 250 Automotive OEM Design Win Milestone
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BusinessWire: GEO Semiconductor announces surpassing a major milestone for the company, 250 Automotive OEM design wins. These camera video processor (CVP) design wins represent engagements with over 30 different Tier 1 suppliers, and over a dozen of the world’s top automotive OEMs.Bucket-Brigade Device Inventor Kees Teer Passed Away at the Age of 95
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ED: A former Philips Research Labs head Kees Teer passed away at the age of 95. Kees was the inventor of a bucket-brigate device, the predecessor of the CCD.Smartsens Claims #1 Spot in CIS Volume for Machine Vision Applications
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Smartsens publishes a promotional video on global shutter advantages where it claims to be #1 in terms of machine vision image sensors shipment volume:Samsung Aims to Take a Lead on Automotive CIS Market
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PulseNews reports that, currently, Samsung market share in automotive image sensors is only 2%, after ON Semi, Omnivision, and Sony. Samsung intends to increase it and take a lead in automotive sensors.ams’ NanEye Endoscopic Camera Reverse Engineering
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SystemPlus publishes a reverse engineering of ams’ NanEye endoscopic camera:f-stop Guru UL backpack review
Samsung CIS Capacity Expansion Chart
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IFNews quotes HSBC report showing Samsung CIS capacity expanison chart:SPAD Super-Resolution Sensing
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Nature publishes a joint paper of Bonn University, Germany, and Glasgow University, UK, "Super-resolution time-resolved imaging using computational sensor fusion" by C. Callenberg, A. Lyons, D. den Brok, A. Fatima, A. Turpin, V. Zickus, L. Machesky, J. Whitelaw, D. Faccio, and M. B. Hullin.Brigates Prepares $207M IPO at Shanghai Stock Exchange
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EastMoney, CapitalWhale, ElecFans: Yet another China-based image sensor company prepares an IPO at Shanghai Stock Exchange - Brigates (Chinese name - Ruixinwei or Ruixin Micro-Tech Innovation or Kunshan Ruixin.)Luminar CES Presentation Compares LiDAR Approaches
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Luminar publishes its presentations at CES2021. The first one done by Matt Weed compares the LiDAR technologies:Modeling of Current-Assisted Photonic Demodulator for ToF Sensor
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Hong Kong University publishes a video presentation "Compact Modeling of Current-Assisted Photonic Demodulator for Time-of-Flight CMOS Image Sensor" by Cristine Jin Delos Santos. The work has won Best Student Paper Award at IEEE Student Symposium on Electron Devices and Solid-State Circuits (s-EDSSC) in October 2020.Review of SPAD Photon-to-Digital Converters
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MDPI paper "3D Photon-to-Digital Converter for Radiation Instrumentation: Motivation and Future Works" by Jean-François Pratte, Frédéric Nolet, Samuel Parent, Frédéric Vachon, Nicolas Roy, Tommy Rossignol, Keven Deslandes, Henri Dautet, Réjean Fontaine, and Serge A. Charlebois from Université de Sherbrooke, Canada, reviews the new opportunities coming from SPAD stacked chip integration.Comments on Hamamatsu Patents Ownership Transfer to Sionyx
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It appears that Federal Circuit decision to transfer an ownership of a number of Hamamatsu patents to SiOnyx has attracted quite a lot of attention from lawyers.Apple iPhone 12 Cameras are Cheaper than iPhone 11’s
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Counterpoint Research says that iPhone 12 cameras cost $3.6 less than iPhone 11's:ToF News: Chronoptics, Opnous, Microsoft
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Chronoptics announces its ToF noise filter and ToF camera based on Melexis VGA sensor:Samsung Adds 4th Sensor to its 108MP Lineup
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BusinessWire: Samsung introduces its latest 108MP mobile sensor, the 0.8um 1/1.33-inch ISOCELL HM3. This is the 4th 108MP sensor in the company's lineup after HMX, HM1, and HM2.CES News: Intel Demos Realsense ID and MEMS LiDAR
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Intel posted two videos with demos of its recently announced Realsense ID and L515 MEMS LiDAR:CES News: Trieye, Orbbeck, Guide Sensmart, Sense Photonics, Innolux, Nuralogix, Opsys, Pioneer, Ibeo
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Trieye presents the recent progress with its low-cost SWIR sensor, including DMS application:Wuhan Guide Sensmart Tech Co, a subsidiary of Guide Infrared, presents its compact thermal imaging modules for smartphones:
MIPI A-PHY Gears
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MIPI publishes an article talking about the A-PHY standard gears. The scaling is quite impressive: speeds up to 16Gbps per lane with PAM4, 8, and 16(!) modulation schemes. The symbol rate stays at 4Gs/s, apparently limited by the long physical link bandwidth:Sony FE 35mm f1.4 GM review
CES News: NII, AIStorm, Innovusion, Brightway, Mcnex
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Japan National Institute of Informatics provides a protection from fingerprint recognition from camera images:A Conversation with Eric Fossum
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Youtube channel Reliability Matters publishes "Episode 59: A Conversation with CMOS Image Sensor Inventor Dr. Eric Fossum."Omnivision Unveils 1080p60 Sensor for Mainstream Security Cameras
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BusinessWire: OmniVision announces the OS02H10, a 2.9um, 1080p image sensor adding the NIR and low light performance of its Nyxel and PureCel Plus technologies to mainstream surveillance cameras. This sensor also offers multiple HDR options at 60 fps. Additionally, when paired with the designer’s selected platform, the OS02H10 can enable a system ultra low power mode for battery-powered cameras with AI functionality.ToF Sensor with Delta-Sigma Feedback
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MDPI paper "High-Linearity High-Resolution Time-of-Flight Linear-Array Digital Image Sensor Using Time-Domain Feedback" by Juyeong Kim, Keita Yasutomi, Keiichiro Kagawa, and Shoji Kawahito from Shizuoka University, Japan, presents a sigma-delta feedback approach to linearize a ToF sensor response:
"This paper presents a high-linearity high-resolution time-of-flight (ToF) linear-array digital image sensor using a time-domain negative feedback technique. A coarse ToF measurement loop uses a 5-bit digital-to-time converter (DTC) and a delayed gating-pulse generator for time-domain feedback to find the zero of the difference between ToF and the digital estimate of the gating-pulse delay while maintaining a constant operating point of the analog readout circuits. A fine ToF measurement uses a delta-sigma modulation (DSM) loop using the time-domain feedback with a bit-stream signal form. Because of the self-contained property of the DSM for low distortion and noise exploited by the oversampling signal processing, the proposed technique provides high-linearity and high-range resolution in the fine ToF measurement. A prototype ToF sensor of 16.8 × 16.8 μm2 two-tap pixels and fabricated in a 0.11 μm (1P4M) CMOS image sensors (CIS) process achieves +0.9%/−0.47% maximum nonlinearity error and a resolution of 0.24 mm (median) for the measurement range of 0–1.05 m. The ToF sensor produces an 11-bit fully digital output with a ToF measurement time of 22.4 ms."