Automotive News: ON Semi, BWV, Toshiba, ADI

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Mynavi: ON Semi has held an press event in Japan presenting its recent progress in SPAD-based LiDAR and HDR imaging. The LiDAR is said to be able to reach 3m distance in flash mode or 100m with 1D MEMS scanning (with no word on ambient light and target reflectivity):


The HDR sensor AR0233 with LED flicker mitigation has entered mass production:


ON Semi says that its automotive sensors have the industry's best manufacturing quality. The company's goal is to reach 1 ppb (part per billion) defect rate. The defect rate of 55ppb in 2015 has been reduced to around 30ppb in 2018. So far, the company has shipped 110b sensors since 2010:


PRNewswire: Israeli gated imaging startup BrightWay Vision (BWV) raises $25M in round B. Koito has joined this round as a strategic investor.

BrightWay Vision’s CEO & Co-Founder Ofer David, said: "We are extremely pleased with the investment of Koito and Magenta and the value they bring. The cooperation and investment of KOITO, a leading global manufacturer of automotive equipment, demonstrates the solid relationship and the trust in our solution and paves the way for market penetration within a short time. The funding will be used for commercialization of our unique technology and enable us to expand research and development activities."


BusinessWire: Toshiba reports that its Visconti 4 vision processor is a part of Toyota new ADAS system that recorded industry-leading scores in the 2018 Japan New Car Assessment Program (JNCAP), the government program that assesses the road safety of new vehicles. The Toyota Alphard/Vellfire was declared the winner of the Grand Prix Award for preventive safety performance, and the Toyota Crown and Corolla Sport were both evaluated as ASV +++, the highest level for advanced safety vehicles. Toshiba supplies Visconti 4 to the Toyota vehicles as an integral part of DENSO Front-Camera-Based Active Safety System.

It's not clear whether Toyota keeps using Mobileye processors or completely switches over to Toshiba.


Analog Devices publishes its view on car future "Driver Assistance to Driver Replacement: The Cognitive Vehicle Is Built Upon Foundational, High Integrity Sensor Data" showing a large number of different sensors, primarily those that manufactured by the company:

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Sony Semi Acquires Midokura Startup

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Sony Semiconductor Solutions has acquired the network virtualization Swiss-Spanish startup Mido Holdings by signing a share transfer agreement with the shareholders of Mido Holdings and completing the transfer of shares. Consequently, Mido Holdings has become a wholly-owned subsidiary of Sony Semiconductor Solutions.

Virtualization technologies include virtual network technology, which uses software to reconfigure networks without altering the physical infrastructure of communication devices such as routers and switches, and technologies that virtually integrate and control multiple servers and storage devices. These technologies are used to build cloud computing systems and other such highly flexible systems.

The acquisition of Mido Holdings is said to enable Sony Semiconductor to utilize virtualization technologies together with its image sensor technology, making it possible to configure a virtual environment that integrates multiple edge devices equipped with image sensors. This, in turn, will allow the company to provide a new edge computing environment that can be linked with cloud systems.

This acquisition will have only a minor impact on Sony Corporation's consolidated financial results for the fiscal year ending March 31, 2020.

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2nd International Workshop on Event-based Vision and Smart Cameras

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Second International Workshop on Event-based Vision and Smart Cameras held in Long Beach (CA) on June 17th, 2019 publishes its video presentations.

Prephesee video talks about event-based camera potential advantages in machine learning:



CelePixel presents its approach to event-based camera image processing:



ETH Zurich talks about event-based cameras challenges and opportunities:



iniVation talks about SW, HW and applications of event cameras:



Insightness presents event-based cameras for AR applications:



Manchester University presents its vision sensor with pixel-parallel SIMD processor array:

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Yole CIS Market Tracking Predicts Slowdown After 2024

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Yole Developpement starts quarterly CIS market monitor service throwing in a lot of interesting data:

"CIS is an analogic variant of the CMOS process commonly used for memory and logic circuits, and has become a key segment in semiconductor, reaching $15.5B in 2018 and exceeding 3% of total semiconductor sales.

In 2019, the overall attachment rate for CIS cameras per phone is moving towards in average of 2.5 units per phone, and the growth rate for CIS attachment will rise from 6.5% to 7.8% from 2019 – 2021. Amidst stagnant smartphone volume, CIS attachment rate is a central, successful strategy for main smartphone OEMs like Apple, Huawei, and Samsung. As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.

Alongside mobile, which is the main application market (representing 70% of all CIS sales), security and automotive are experiencing double-digit growth and have grown into billion-dollar CIS segments. Again, the attachment rate per endsystem is the key metric to monitor.

2019 looks slightly different than 2018. With a low Q1, the CIS market faces a slowly eroding ASP since most players can now match Sony’s proposition. Nevertheless, the market remains constrained in terms of capacity, with capex the main limiting factor since customers always want more CIS cameras. The outlook though remains very positive – in the range of 10% YoY in 2019 and 8% over the long-term – CIS is heading for $24B in 2024.

New increases in resolution (16Mp and beyond 20Mp) are linked to new progress in pixel size, but momentum is slow in the 0.8um pixel size range. The consequence is increased die size and silicon. CIS wafer volumes are approaching 250kWpm and will climb to 350kWpm before 2024, necessitating more CIS manufacturing lines to be created or converted from regular CMOS lines.
"

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ON Semi on Image Sensor Cleaning

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ON Semi application note "Image Sensor Handling and Best Practices" describes best practices of image sensor cover glass cleaning:

Do not touch the cover glass with fingers or anything other than a cleaning paper as required in this section. Finger grease can etch optical coatings and cause permanent damage. The gloves should be static and powder free. Gloves should be static dissipative Nitrile gloves.

Materials:
  • Clean compressed nitrogen
  • Ultra−clean DI water (4−6 megaohms/centimeters deionized water that has been filtered)
  • High-grade IPA (solvent grade/100% pure lab purity grade)
  • ESD protective Wipe:
    ♦ For CCD sensors: Berkshire DurX 670
    ♦ For CMOS sensors: Puritech Puritech S1091PRT or RTMKC002
  • ESD protective gloves for example: Nitrile Glove, required Ansell 93−401/402 or NiProTect CC529

Method A: Blow Off
This method is applicable for loose particle contamination. This is the only method that guarantees no residues such as drying spots.
  • Remove particles from the glass by blowing with an ionized-N2 gun.
  • Do not blow towards the other parts. If you work under a flow box, try to blow out of the box.

Method B: High-Grade IPA Clean or Ultra−Clean DI Water
  • Apply cleaning solvent using a separate lab−ware quality polypropylene squeeze bottle (Nalgene trade name), not the original bottle
  • Use a lint free wipe in one direction, with even pressure across the glass surface.
  • Never wipe the cover glass with a dry cloth. The cleaning solvent should be applied directly to the cleaning wipe and never directly on the cover glass.
  • The ESD protective wipe should not be saturated, only dampened with the cleaning agent.
  • After each wipe, either start with a fresh wipe or fold the wipe to provide a fresh surface for glass cleaning

Note: High grade IPA or ultra-clean DI water are acceptable for cleaning both plain glass and AR coated glass.

Note: Method A and B are acceptable methods to clean the CCD image sensor cover glass with the following exception. DI Water or IPA is not recommended for cleaning the CCD image sensor cover glass. Instead, 100% ethanol is required as the cleaning agent for CCD image sensor cover glass.

Caution on Cleaning Agents:
  • Use high-grade IPA only to clean the image sensor lid glass. Other solvents can contaminate the glass, attack the resin and sealant, and degrade reliability of the package.
  • Do not use acetone because it attacks the resin that glues the cover glass to the package.
  • Do not use methanol due to its toxicity and low quality cleaning properties.
  • Do not use sodium hydroxide (NaOh) because it degrades the AR coating on the glass.
  • Do not use highly alkaline (pH > 8) cleaning chemistries.
  • Do not use any solvents commonly used in paint strippers: toluene, benzene, methyl-ethyl ketones, ester solvents, acetone or methyl chloride, freons, terpens, anionic surfactants and multi−hydroxyl ethers.

If the surface is not clean, repeat these procedures. If the contaminant is not removed in two or three wipes, it is possible that the cover glass is permanently damaged. Inspect the device in optical microscope for permanent damage.

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Harvest Imaging Forum 2019

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Albert Theuwissen announces 2019 Harvest Imaging Forum agenda:

After the Harvest Imaging forums during the last 6 years, a seventh one will be organized in December 2019, in Delft, the Netherlands.

The 2019 Harvest Imaging forum will deal with two subjects (both in the field of smart cameras) and two speakers. Both speakers are world-level experts in their own fields.

"On-Chip Feature Extraction for Range-Finding and Recognition Applications"
Makoto IKEDA (Tokyo University, Japan)



"Direct ToF 3D Imaging : from the Basics to the System"
Matteo PERENZONI (FBK, Trento, Italy)


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ams and SmartSens Partner on 3D and NIR Sensors

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BusinessWire: ams has signed a formal letter of intent to collaborate in the field of image sensors with SmartSens . This collaboration complements ams’ strategic approach to further broaden its portfolio for all three 3D technologies – Active Stereo Vision (ASV), Time-of-Flight (ToF) and Structured Light (SL). To quickly meet an expected increasing demand for 3D sensing solutions in mobile devices, the partnership’s initial focus will be on 3D NIR sensors for facial recognition and applications requiring a high QE in the NIR (2D and 3D).

To speed up the time to market for customers, the companies will collaborate on the development of a 3D ASV reference design to support the planned future launch of a 1.3MP Stacked BSI Global Shutter Image Sensor with state of the art QE up to 40% at 940nm. This NIR sensor is a perfect addition to ams’ 3D illumination offerings, extending ams’ 3D portfolio and optimizing overall system performance. The reference design will enable high performance depth maps for payment, face recognition and AR/VR applications at a highly competitive total system cost.

This collaboration with SmartSens in Image Sensors brings customers the benefit of a faster time to market for 3D Active Stereo Vision and Structured Light applications in mobile phones and other devices including IoT applications, based on ams’ industry leading 3D technology and core IP on Voltage-Domain Global Shutter. The collaboration will also help accelerate time to market for exciting new automotive applications such as in-cabin 2D and 3D sensing,” said Stéphane Curral, EVP for the Division Image Sensor Solutions at ams.

We are pleased to partner with ams to combine our expertise in Image Sensors and NIR technology with ams’ 3D expertise and core Image Sensing IP. We believe this combination of robust technology and channel to market will provide an optimal solution to meet customer demand,” said Chris Yiu, CMO, SmartSens Technology.

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Sony Announces Two 4K Sensors

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Sony adds two more 4K sensors to its 4K lineup: IMX485LQJ and IMX415-AAQR.

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ST ToF for PC Applications

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GlobeNewswire: STMicroelectronics announces its user presence detection where the output from ST’s FlightSense ToF ranging sensor is used by Intel Context Sensing to improve PC data security while reducing power consumption. ST’s FlightSense ToF sensor, hidden behind a cover glass in the bezel of a laptop, monitors the user’s presence in front of their PC. When the user leaves, the ToF sensor detects their absence and immediately locks the system and directs it into the Windows Modern-Stand-by low-power state, improving security and reducing power consumption. The ToF sensor then enters a low-power autonomous mode, scanning the scene for the user returning while keeping the PC asleep to save power. When the user returns, the ToF sensor wakes the PC and automatically enables facial recognition to log in without waiting for a key press or mouse movement.

The ST patented algorithm used in the system can distinguish an immobile person sitting in front of a PC from an inanimate object, such as a chair, without relying on video analytics from the power-hungry and potentially intrusive webcam.

By leveraging ST’s market-leading FlightSense Time-of-Flight ranging technology, the development of user presence detection brings extended battery life, improved data protection, and increased convenience to PC users,” said Eric Aussedat, EVP and GM Imaging, STMicroelectronics.

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Isorg and Sumitomo Announce Collaboration

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ALA News: Isorg and Sumitomo Chemical announce their agreement to develop new organic photodetectors (OPDs) for use as smartphone fingerprint sensors and hybrid organic CMOS image sensors. The fingerprint sensors can be incorporated beneath the entirety of a smartphone display, allowing fingerprint recognition from any point or position on that display. The hybrid organic CMOS image sensors are intended for use in cameras, including those designed for near infrared capabilities. Sumitomo Chemical and Isorg anticipate that these sensors will meet the performance and quality standards necessary for application in the security, automotive, diagnostics and consumer electronics markets.

This agreement expands the existing collaboration between Sumitomo Chemical and Isorg that began in 2013. Isorg will license its technology processes to its OEMs, while Sumitomo Chemical will manufacture the dedicated organic semiconductor material, as well as support Isorg in terms of production technology and marketing.

Partnering with Isorg will allow us to fill a void in the market for difficult-to-manufacture, but affordable, full-size fingerprint and CMOS image sensors that are suitable for demanding applications in smartphone displays and hybrid visible and near infrared cameras,” said Hiroshi Ueda, EVP at Sumitomo Chemical. “Sumitomo Chemical is leveraging its materials platform to seize new opportunities for growth in the imager arena.

Isorg is honored to collaborate with Sumitomo Chemical in providing OEMs with what we believe will be the leading solution for fingerprint sensors and hybrid organic CMOS image cameras, and which offer significant performance advantages,” said Jean-Yves Gomez, CEO and co-founder of Isorg. “With the strong backing of Sumitomo Chemical, and its industrial leadership, global footprint and drive for excellence, Isorg’s customers will have added assurances in our ability to deliver quality products. We look forward to engaging with customers on the designs and applications of these products.

Going forward, Sumitomo Chemical and Isorg will work jointly on commercialization of the products to promptly meet the needs of customers.



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IISW 2019 Awards

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Hidekazu Takahashi from Canon Inc. kindly sent me pictures that he shot on his EOS 5D Mark4 DSLR on the Awards ceremony at IISW 2019 in Snowbird, UT, last week:

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VKANSEE Under-Display Lens Turns Any Image Sensor into Fingerprint One

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PRWeb: Beijing, China-based VKANSEE launches its Matrix Pinhole Image Sensing (MAPIS). MAPIS is "integrated into an OLED panel, effectively turning the entire display into a high-resolution fingerprint lens and allowing simple installation of the CMOS sensor anywhere under the display screen. Unlike other sensors that are obscured by the high density of OLED driver circuits which yield low resolution when placed fully under the OLED display, the MAPIS integrated OLED solution captures high-resolution fingerprint details of 800 PPI to better recognize challenging cold and dry fingers. The sensor captures high-resolution and high contrast, exposing 3rd level fingerprint features to achieve excellent performance even under strong ambient light. For the user, a fingerprint icon lights up on the display, which could be located anywhere, to guide the user and disappears upon authentication."

The first company to integrate the new design is OLED display maker BOE Technology, announced a year ago. The second partnership with Tianma has been announced but quickly pulled back from the company website. It still can be found in Google cache.

We are focused on bringing our novel MAPIS optical fingerprinting technology to users across the globe to improve security and convenience, and hope to make MAPIS optics as a standard design of OLED,” stated Jason Chaikin, President of VKANSEE. “In partnership with Egis, we’re confident this will happen in the near future. We believe integrating the MAPIS optics into the OLED screen will greatly change the fingerprint sensor industry similar to the history of integrating touch sensing into the OLED screen.

Google patent search reveals a number of different VKANSEE lens designs. It's not clear which one is used in the actual product:

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HDR Pixel with Charge Splitting

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MDPI publishes a paper "A Wide Dynamic Range CMOS Image Sensor with a Charge Splitting Gate and Two Storage Diodes" by Minho Lee, Min-Woong Seo, Juyeong Kim, Keita Yasutomi, Keiichiro Kagawa, Jang-kyoo Shin, and Shoji Kawahito from Shizuoka University, Japan, and Kyungpook National University, Korea.

"In this paper, a wide dynamic range (WDR) CMOS image sensor (CIS) with a charge splitting gate (SG) and two storage diodes (SDs) is presented. By using single-gate on/off control with the SG, photocurrent path to the first (SD1) or second storage diodes (SD2) is switched alternatively and periodically during exposure and signal electrons generated in a photodiode (PD) are transferred to and accumulated in the SD1 or SD2. By setting a large ratio of the off-time to on-time of the SG, two different sensitivity signals, which are originated by the same photodiode, are generated and a WDR image signal is obtained. This technique has a distinct advantage on mitigating the problem of motion artifact in WDR imaging with high and low sensitivity signals and flexible dynamic control of the dynamic range. An experimental WDR CMOS image sensor with 280 (H) × 406 (V)-pixel array consisting of 14 sub-arrays, each of which have 20 (H) × 406 (V) pixels, was implemented and tested. For the SG on/off-time ratio of 30 and 279, the DR of 93 dB and 104 dB, respectively, was demonstrated. The effect of the proposed WDR imaging operation on the reduced motion artifact was experimentally confirmed."

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Leica DG 10-25mm f1.7 review

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The Leica DG 10-25mm f1.7 is a high-end zoom with a fast f1.7 focal ratio for Micro Four Thirds. Mounted on a Panasonic or Olympus M43 body, it delivers equivalent coverage of 20-50mm, providing a flexible general-purpose range from wide to standard. Highly compelling for photographers and especially videographers, check out my in-depth review!…

The post Leica DG 10-25mm f1.7 review appeared first on Cameralabs.

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Albert Theuwissen Reviews Day 4 of IISW

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Albert Theuwissen publishes his report about the last day of IISW 2019. This part talks about rad-hard image sensors and global shutter session. The report wraps up:

"The IISW2019 was again a big success, many excellent presentations, all high quality papers, good atmosphere, perfect organization. The interest of the participants can be best judged by the amount of people that are willing to stay till the very last paper is presented."

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Peter Centen Awarded by Order of the Netherlands Lion

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Grass Valley congratulates Peter Centen on being awarded by the Order of the Netherlands Lion for his significant contributions to Dutch society and the broadcast industry. The Order is given on behalf of King Willem-Alexander of the Netherlands to only a limited amount of people each year who have distinguished themselves by exceptional artistic achievement, scientific performance, technical innovation or inventive entrepreneurship.

Centen played a major role in transitioning camera technology from CCD imagers to CMOS sensors — which enabled present-day HD, 4K UHD and HDR imaging. Centen invented HD-DPM technology and has been recognized worldwide for his work in imaging.

"This recognition is incredibly well deserved. Peter is a visionary and was a major asset to us at Grass Valley and the industry as a whole," said Marcel Koutstaal, GM and VP cameras, Grass Valley. "It is incredible to see him being honored for his impactful work, his passion for people and significant contributions to the industry over the last 34 years."

Centen has published over 65 international journal and conference articles on image sensor technologies and cameras.


Update: One more pictures from live.production.tv:

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SPAD Thesis

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Delft University publishes a PhD thesis "CMOS SPAD Sensors for 3D Time-of-Flight Imaging, LiDAR and Ultra-High Speed Cameras" by Chao Zhang. This quite an extensive work over viewing different SPAD design techniques, ways to improve PDP and reduce DCR, photon counting electronics, etc. There is also a nice comparison between different ToF approaches:

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Canon Zoemini S IVY Cliq+ review

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The Canon Zoemini S, or IVY CLIQ+, is a pocketable instant camera that captures 8 Megapixel images and outputs them as 2x3in instant prints one minute after taking the shot. You can also save images onto an SD card or print from your phone via Bluetooth. Find out how Canon’s debut instant camera measures-up in my review!…

The post Canon Zoemini S IVY Cliq+ review appeared first on Cameralabs.

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Albert Theuwissen on Third Day of IISW

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Albert Theuwissen posts his impressions from the Day 3 of IISW 2019 in Snowbird:

"Although the amount of paper submissions for this 2019 workshop was lower than in 2017, the quality of the presentations is most probably the best ever."

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Oppo Demos its Hidden Under-Display Selfie Camera

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Engadget quotes its colleagues from China visiting Oppo under-display camera demo at MWC at Shanghai:

"When the camera is idle, the screen works just as normal. However, when you look up close, the area above the camera appears to be more pixelated. According to Oppo, this zoned-out area features a highly-transparent material plus a redesigned pixel structure for improved light transmittance. In other words, this camera tech requires a customized display panel, because existing ones won't do the job -- their transparency properties are only good enough for in-display fingerprint readers, but not conventional cameras.

The under-screen camera itself also packs a larger sensor with bigger pixels, along with a larger aperture to get as much light as possible.

...based on our quick comparison, there's certainly room for improvement in terms of clarity and color accuracy.
"


Here is an example of selfie image quality of the Oppo camera (right) in comparison with a regular selfie camera (left):

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AutoSens Brussels Agenda

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Autosens Brussels scheduled for September 17-19, 2019 publishes its agenda with quite a lot of image sensor-related presentations:

  • Recent Developments in the CIS Auto World, 3 hour 15 min lecture by Albert Theuwissen, IISS
  • Overview of the challenges and requirements for state-of-the-art sensors across the major sensor types, Geoff Ballew, ON Semi
  • Panel Discussion: Who will be the winners and losers in AV and automotive sensors?
  • Snow-aware ADAS with Active Hyperspectral Sensing, Raul Bravo,
  • The race to a low-cost LIDAR system, Dexin Chen, IHS Markit
  • ShortWave Infrared Breaking the Status Quo - Identifying Hazards on the Road and Solving the Low Visibility Challenge, Uriel Levy, Trieye
  • The New Generation of MEMS LiDAR for Automotive Applications, Florian Petit, Blickfeld
  • A novel CCD LiDAR imager, Beat de Coi, Espros
  • Invisible integration of solid-state LIDAR to make beautiful self-driving cars, Filip Geuens, Xenomatix
  • Hybridization - To do, or not to do? An Update of use of Hybrid Lenses for Automotive ADAS Applications, Ingo Flodvari, Sunex
  • The evolution of automotive lighting, and considerations for the integration of illuminators and sensors into headlamps, Paul Lyon, Varroc Lighting Systems
  • Detectivity – Ranking Cameras for Machine Vision Tasks, Robin Jenkin, Nvidia
  • Testing automotive camera modules - the difference between theory and reality, Uwe Artmann, Image Engineering

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Sony to Release Two 4K Sensors for Security Cameras

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Sony announces the upcoming release of two new CMOS sensors: the IMX415 type 1/2.8 4K-resolution stacked one, the smallest 4K security sensor in the world (1.45um pixels), and the IMX485 type 1/1.2 4K-resolution BSI sensor with 3.3x low-light performance of previous generation IMX334 type 1/1.8 sensor. Sony has designed these two new sensors for security applications.

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Postcard from IISW at Snowbird

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Here is a group photo of IISW 2019 attendees (the full resolution picture can be downloaded here):


Thanks to EF for the picture!

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Albert Theuwissen Reviews IISW – Day 2

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Albert Theuwissen posted his review of the second day of the presentations. The big story of the day is ST pixel design with no photodiode implants.

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Espros Unveils TOF>cam 635

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ESPROS rolled out the first series production modules of the new 3D camera, TOF>cam 635. This module is based on ESPORS' ToF chip epc635 with 160 x 60 pixels and improved ambient light suppression up to 100Klux. The cameras firmware controls image acquisition and processing to provide a calibrated and filtered 3D point cloud. It also delivers a grayscale image. This combined with sophisticated algorithms allows interference and motion blur detection and suppression. The cost is said to be very low.

ESPROS also offers a full custom module design & manufacturing service.

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Albert Theuwissen Reviews IISW – Day 1

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Albert Theuwissen posts a short overview of Day 1 in International Image Sensor Workshop being held these days in Snowbird, UT. There were talks about small pixels, noise, and dark current.

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Lucid Vision Labs Explains Sony ToF Sensor Operation

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Lucid Vision Labs publishes a very nice animated explanation of how Sony IMX586 ToF sensor works inside Lucid's Helios camera:

"The IMX556 utilizes a current assisted photonic demodulator (CAPD) pixel structure that samples incoming light synchronously with emitted light modulation. CAPD allows for an alternating voltage inside each pixel’s photodiode, creating drift fields that divide and pull electrons to alternating detector junctions."

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Interview with TowerJazz SVP of Image Sensor Business

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Charbax publishes an interview with Avi Strum responsible for TowerJazz image sensor business:

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Apple Stops Working on Quantum Dot Imager with Nanoco

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iClarified quotes Telegraph.co.uk report that Apple stops working on Quantum Dot image sensor and does not extend a contract with Manchester, UK-based Nanoco supplying the QD materials. Apple "has now informed Nanoco that the project will not continue beyond the current contract, for reasons wholly unconnected to the performance of our materials and our service delivery."

Apple was expected to use the QD technology in a future iPhone image sensor that could have debuted as early as this year.

Thanks to JB for the pointer!

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Panasonic Lumix S Pro 50mm f1.4 review so far

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The Lumix S PRO 50mm f1.4 is a high-end prime lens for full-frame mirrorless cameras using the L-mount. 50mm is an ideal general-purpose length while the fast f1.4 focal ratio allows shallow depth-of-field effects. Leica’s optical design delivers excellent results, albeit at a correspondingly ambitious price. Check out my sample images and bokeh tests in my Lumix S PRO 50mm f1.4 review so far!…

The post Panasonic Lumix S Pro 50mm f1.4 review so far appeared first on Cameralabs.

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