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OmniVision announces two new additions to its family of global shutter sensors—the OG02B1B/OG02B10 and the OV9285. These new sensors are aimed to be cost-effective solutions for consumer and industrial machine vision applications.

“Machine vision applications are experiencing strong growth, fueled by increased demand for industrial automation and new use cases such as augmented reality and virtual reality. Meanwhile, computer vision algorithms are becoming more and more sophisticated, which in turn drives up the performance requirements of image sensors,” said Sanjay Kumar, senior marketing manager at OmniVision. “We are excited to offer these high-resolution and high-performance global shutter image sensors to the machine vision community, enabling new applications and new use cases.”

The 2-megapixel OG02B1B (monochrome) and the OG02B10 (color) image sensors provide 1600 x 1300 resolution in a 1/2.9-inch optical format and a 15-degree CRA to support wide field-of-view lens designs. This combination of color imaging and CRA is excellent for applications such as agricultural drones that must capture high-resolution color images for crop and field monitoring.

The OV9285 provides an even more cost-effective option, with a 1.48-megapixel or 1328 x 1120 resolution, the ability to capture video at 90 fps and an optical format of 1/3.4-inch with a CRA of 9 degrees.

Both sensors are built on 3um OmniPixel3-GS pixel technology. It provides high QE and NIR sensitivity at 850nm and 940nm, which reduces power consumption and extends device battery life.

The OG02B1B, OG02B10 and OV9285 image sensors are available now.

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University of Toronto repo publishes a Nature paper from January 2017 "Solution-processed semiconductors for next-generation photodetectors" by F. Pelayo García de Arquer, Ardalan Armin, Paul Meredith, and Edward H. Sargent.

"Efficient light detection is central to modern science and technology. Current photodetectors mainly use photodiodes based on crystalline inorganic elemental semiconductors, such as silicon, or compounds such as III–V semiconductors. Photodetectors made of solution-processed semiconductors — which include organic materials, metal-halide perovskites and quantum dots — have recently emerged as candidates for next-generation light sensing. They combine ease of processing, tailorable optoelectronic properties, facile integration with complementary metal–oxide–semiconductors, compatibility with flexible substrates and good performance. Here, we review the recent advances and the open challenges in the field of solution-processed photodetectors, examining the topic from both the materials and the device perspective and highlighting the potential of the synergistic combination of materials and device engineering. We explore hybrid phototransistors and their potential to overcome trade-offs in noise, gain and speed, as well as the rapid advances in metal-halide perovskite photodiodes and their recent application in narrowband filterless photodetection."

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Autosens announces its 2018 Awards in a number of categories:

Most Engaging Content:

• First place: Junko Yoshida, EE Times
• Silver award: Marco Jacobs, videantis
• Silver award: Stephan Giesler, 2025AD

Hardware Innovation:

• First place: Robert Bosch
• Silver award: Renesas Electronics
• Silver award: OmniVision Technologies

Software Innovation:

• First place: Algolux
• Silver award: Brodmann17
• Silver award: Prophesee

Most Exciting Start-Up:

• First place: AEye Inc
• Silver award: Metamoto
• Silver award: Arbe Robotics

Game Changer:

• First place: Marc Geese, Robert Bosch
• Silver award: Intel Corporation
• Silver award: NVIDIA & Continental Partnership

Greatest Exploration:

• First place: Prof Alexander Braun of the University of Applied Sciences Düsseldorf
• Silver award: Ding Zhao of University of Michigan
• Silver award: Prof Philip Koopman of Carnegie Mellon University

Best Outreach Project:

• First place: Udacity
• Silver award: North West Advanced Programming Workshop Programme (NWAPW)
• Silver award: Detroit Autonomous Vehicle Group

AutoSens Inspiration Award:

• Winner: North West Advanced Programming Workshop Programme (NWAPW)

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PRNewswire: ActLight, a Swiss technology startup developing Dynamic PhotoDiodes (DPDs), announces that the results of its internal tests performed on its most recent technology developments show a device sensitivity that reached the single photon level.

Moreover, the tests confirmed that the sensitivity of the DPD is tunable (i.e. at 2, 3, 5 or 7 photons) with very positive impact on the dynamic range of the device. Important to note is that the brilliant results were achieved at 1.5V bias voltage and with devices manufactured using a standard CMOS 180nm technology.

"It's great that today we are among a selected few innovative technologies to have a talk at the Imaging & Sensors Summit, a great opportunity to present our recent developments in the low voltage single photon sensitivity," said Serguei Okhonin, ActLight Co-Founder and CEO. "And we strongly believe that our DPDs can inspire innovation and enhance user experience in main stream applications such as smartphones and others."

In another presentation, ActLight announces a ToF sensor prototype based on its DPD (see demo video here):

"In current 3D camera sensors, pixel scaling is limited due to complex analog circuits. The DPD's simple digital front-end allows decreasing pixel size below 5 um. Moreover, the DPD and its read-out front-end circuit are implemented on the same substrate in standard low-cost CMOS technology and do not require high voltage for its operation."

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Gpixel announces the GMAX3265, a 65MP image sensor with 3.2µm charge domain global shutter pixel. “GMAX3265 is defined in close collaboration with leading industry partners in inspection vision systems, as such are we confident that the unique features of GMAX3265 will meet the most demanding requirements for industrial inspection, machine vision and metrology applications”, said Wim Wuyts, Chief Commercial Officer of Gpixel.

GMAX3265 offers 9344 (H) x 7000 (V) charge global shutter pixels with read noise of less than 2e-, higher than 70dB DR, and 1e-/p/s dark current at room temperature. Due to the light pipe technology, the sensor exhibits excellent shutter efficiency of 1/30,000 and large angular response.

Consisting of 56 pairs sub-LVDS data output channel and each running at maximum 1.08 Gbit/s, GMAX3265 delivers 85 fps at 10bit output or 53 fps at 12bit output. The high resolution and fast frame rate significantly increases the system throughput for industrial inspection applications, such as semiconductor, PCB, AOI or display inspection.

“We understand short time-to-market is essential in today’s competing environment, and at Gpixel, we put a lot of effort in technical and logistic support to enable customers a fast go to market timing. This combined with our long term commitment and product strategy is essential for the success of our growing customer base and Gpixel.”, said Wim.

GMAX3265 will begin sampling in early Q4 2018, with mass production scheduled in end of Q1 2019 for both color and mono version.

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Dartmouth College publishes an article about its spin-off Gigajot:

"Gigajot Technology, based in Pasadena, California, aims to bring a variety of products to market using the Quanta Image Sensor (QIS) which makes it possible to produce sharp images in extremely low light. They intend to target high-end scientific research and medical imaging markets at first, but could eventually compete in much larger consumer markets.

“QIS is a platform technology,” says Gigajot CEO Saleh Masoodian, a 2017 Dartmouth engineering PhD graduate who cofounded the company with Fossum and fellow Thayer alum and Gigajot CTO Jiaju Ma Th'17. “Down the road, there are additional markets we can serve, such as security, automotive, and other niche applications.”

“Not only can our imager capture the photons in a very dim scene, but also it can resolve the number of photons and give you a much better quality picture,” says Masoodian, adding that the sensors can be manufactured using current CMOS processes, which he says translates to a high production yield at lower costs.

Masoodian says he hopes to see the company launch its first product-ready QIS camera for use in these niche markets within the next two to three years."

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OSA Optica publishes a paper "Super-resolution quantum imaging at the Heisenberg limit" by Manuel Unternährer, Bänz Bessire, Leonardo Gasparini, Matteo Perenzoni, and André Stefanov from University of Bern and Fondazione Bruno Kessler FBK.

"The Abbe–Rayleigh diffraction limit constrains spatial resolution for classical imaging methods. Quantum imaging exploits correlations between photons to reproduce structures with higher resolution. Quantum-correlated 𝑁-photon states were shown to potentially surpass the classical limit by a factor of 1/𝑁, corresponding to the Heisenberg limit, using a method known as optical centroid measurement (OCM). In this work, the theory of OCM is reformulated for its application in imaging. Using entangled photon pairs and a recently developed integrated time-resolving detector array, OCM is implemented in a proof-of-principle experiment that demonstrates the expected enhancement. Those results show the relevance of entanglement for imaging at the Heisenberg limit."

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TI video promotes its ToF solution:

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French Space Agency (CNES) announces Call for Abstracts for 2 workshops to be held in Toulouse:

Radiation effects on solid state optoelectronic detectors on November 27-28, 2018
Ultra-Violet Detectors and Instruments on November 28-29, 2018

"The goal is to bring together all the community to discuss the challenges to develop such sensors and instruments, to discuss previous mission lessons and to share about future projects.

Although the workshop is mostly oriented to space applications, this event is fully open to researchers/user working within other applications. Developers working on non-space applications dealing with the same topics (e;g; Astronomy, Medical Imaging, photolithography…) are equally welcome to participate to this Workshop."

The workshops also features 45min tutorials.

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Trioptics publishes a Youtube video showing its ProCam active alighnemt system:

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ON Semi publishes its first sensor for LiDARs, possibly coming from SensL acquisition:

"The RA−Series 16−pixel linear array from ON Semiconductor has been designed for automotive LiDAR applications. The array is a single monolithic sensor featuring 16 of ON Semicondcutor’s industry−leading silicon photomultiplier (SiPM) pixels. The SiPM is a single−photon sensitive, high internal gain sensor that has a responsivity of >30 kA/W at 905 nm and operates at a low bias of  less than 50 V."

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Image Sensors Americas 2018 is to be held on October 11-12 in San Francisco, CA. The final agenda includes much many image sensor presentations than has been announced initially:

• Key Challenges of Image Sensors for ADAS and ADS
  Ronald Mueller | CEO of Vision Markets of Associate Consultant of Smithers Apex
• NASA Keynote Presentation | Image Sensors for Aerospace
  Shouleh Nikzad | Senior Research Scientist of NASA
• The M&A and Funding Landscape for Image Sensor Companies
  Rudy Burger | Managing Partner of Woodside Capital Partners
• State of the Art Uncooled InGaAs Short Wave Infrared Sensors
  Martin H. Ettenberg | President of Princeton Infrared Technologies
• Super-Wide-Angle Cameras- The Next Smartphone Frontier Enabled by Miniature Lens Design and the Latest Sensors
  Patrice Roulet Fontani | Vice President,Technology and Co-Founder of ImmerVision
• Integrated Photonics Technology: Driving the Evolution of Novel Image Sensors for LiDAR and THz imaging
  Bert Gyselinckx | Vice President & General Manager of Imec
• SPAD vs. CMOS Image Sensor Design Challenges – Jitter vs. Noise
  Daniel Van Blerkom | CTO & Co-Founder of Forza Silicon
• sCMOS Technology: The Most Versatile Imaging Tool in Science
  Scott Metzler | PCO Tech
• Toward Monolithic Image Perception Devices (MIPD).
  Guy Paillet | co-Founder & CEO of General Vision Inc.
• From The Outside In
  Richard Neumann | CEO of Sub2R
• Using Depth Sensing Cameras for 3D Eye Tracking Sensing
  Kenneth Funes Mora | CEO and Co-founder of Eyeware
• SPAD Arrays for LiDAR Applications
  Wade Appelman | VP of Sales and Marketing of SensL Technologies
• Super High Sensitivity CMOS Image Sensors Technologies
  Eiichi Funatsu | Senior Director of OmniVision
• Future Image Sensors for SLAM and Indoor 3D Mapping
  Vitaliy Goncharuk | CEO/Founder of Augmented Pixels
• How to Keep Your Next Winning Sensor Design From Being Stifled By Your Test Strategy: Bench Testing v Automated Test Equipment
  Lauren Guajardo | Field Applications Engineering Leader of Teradyne
• Future Trends in Imaging Beyond the Mobile Market
  Amos Fenigstein | Senior Director of R&D for Image Sensors of TowerJazz
• Photon-Counting Imaging with Quanta Image Sensor for Scientific and Consumer Applications
  Jiaju Ma | CTO of Gigajot

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FranchiseIndia, IndiaTimes, BusinessStandard: SYSKA Group (India), Biometronic Pte. (Singapore), and Suyin Optronics Corp. (Taiwan) partner to set up India’s first camera module factory in Noida. The total investment for the facility is $30m. The factory will have a clean room for production capacity of 5 million pieces per month.

The new factory will manufacture camera modules for mobile phones, automotive industry (Rear view camera), medical, security industry, and defense industry (Drones). Syska Group has 49% stake in the company whereas Biometronic has 41% stake and Suyin Optronics has 10% stake in the new entity.

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ON Semi explains its X-Class image sensor platform approach:

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EMVA informs that Arnaud Darmont, one of the main contributors to EMVA1288 camera characterization standars, has suffered a fatal accident during a trip in the US. Other than his major contribution to EMVA 1288 standard, Arnaud was a Chair of Image Sensors and Imaging Systems conference, and the owner of HDR imaging and EMVA-compliant measuring instruments company Aphesa.

Arnaud Darmont is the author of 2014 book on HDR imaging "High Dynamic Range Imaging: Sensors and Architectures" and delivered a number of courses on HDR around the world.

Reportedly, Arnaud had visited the White Sand National Monument in New Mexico. He died in the dune field due to severe sunstroke. Rangers found his body at the closure of the park last Wednesday.

Here is a Youtube video with Arnaud's interview in 2015:



Update: There are obituaries from SPIE, IMVE, and Photonics.

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Russian KB VITA kindly sent me a video of its camera that uses GSENSE400BSI sensor. The video was shot at moonless night, hence no shadows there. The camera has f0.95 lens and set at 22fps and 40ms exposure time:

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ULTIMA 2018 forum held on Sept 11-14 at Argonne National Laboratory was devoted to ultrafast imaging and particle tracking, novel data collection schemes through sparse sensing, hardware performance enhanced by computational and other novel methods, megahertz and gigahertz electronics, and their applications. Most of the presentations are available on-line.

Here is just a small sample of the interesting presentations:

• Nanosecond, burst mode X-ray imager development at Sandia National Laboratories
  Claus Liam (Sandia)
• Flat Optics
  Federico Capasso (Harvard)
• Capturing Flying Light with a Silicon Image Sensor - A Step toward the Temporal Resolution Limit
  Takeharu Etoh (Ritsumeikan University)
• An overview of recent novel focal-plane array development at Sandia National Laboratories
  Gideon Robertson (Sandia National Laboratory)
• Diamond detectors for fast timing applications
  John Smedley (Brookhaven National Laboratory)
• Development of monolithic sensors for high energy physics in commercial CMOS technologies
  Walter Snoeys (CERN)
• Fast imagers with time stamping of optical photons
  Andrei Nomerotski (Brookhaven National Laboratory)
• CMOS imaging sensors and prospects for high-speed applications
  Eric Fossum (Dartmouth University)

Thanks to EF for the link!

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ULITIMA 2018 forum held on Sept 11-14 at Argonne National Laboratory, IL, was devoted to ultrafast imaging and particle tracking, novel data collection schemes through sparse sensing, hardware performance enhanced by computational and other novel methods, megahertz and gigahertz electronics, and their applications. Most of the presentations are available on-line.

Here is just a small sample of the interesting presentations:

• Nanosecond, burst mode X-ray imager development at Sandia National Laboratories
  Claus Liam (Sandia)
• Flat Optics
  Federico Capasso (Harvard)
• Capturing Flying Light with a Silicon Image Sensor - A Step toward the Temporal Resolution Limit
  Takeharu Etoh (Ritsumeikan University)
• An overview of recent novel focal-plane array development at Sandia National Laboratories
  Gideon Robertson (Sandia National Laboratory)
• Diamond detectors for fast timing applications
  John Smedley (Brookhaven National Laboratory)
• Development of monolithic sensors for high energy physics in commercial CMOS technologies
  Walter Snoeys (CERN)
• Fast imagers with time stamping of optical photons
  Andrei Nomerotski (Brookhaven National Laboratory)
• CMOS imaging sensors and prospects for high-speed applications
  Eric Fossum (Dartmouth University)

Thanks to EF for the link!

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Macrumors and Appleinsider quote KGI Securities analyst Ming-Chi Kuo saying in its investor note that 2019 iPhones will not include a rear ToF camera:

"First, the distance and depth information provided by rear-side ToF is currently insufficient for creating the "revolutionary AR experience" that Apple ultimately wants to develop.

Second, the addition of rear-side ToF would do little to improve the iPhone's photo-taking capabilities, because the current dual-camera setup is already capable of capturing or simulating enough distance/depth information to make photo-features like Portrait Mode a reality."

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MDPI publishes a joint paper by Vietnam National University, Hanoi University of Science and Technology, Imec, Ritsumeikan University, and Kindai University "An Image Signal Accumulation Multi-Collection-Gate Image Sensor Operating at 25 Mfps with 32 × 32 Pixels and 1220 In-Pixel Frame Memory" by Vu Truong Son Dao, Nguyen Ngo, Anh Quang Nguyen, Kazuhiro Morimoto, Kazuhiro Shimonomura, Paul Goetschalckx, Luc Haspeslagh, Piet De Moor, Kohsei Takehara, and Takeharu Goji Etoh.

"The paper presents an ultra-high-speed image sensor for motion pictures of reproducible events emitting very weak light. The sensor is backside-illuminated. Each pixel is equipped with multiple collection gates (MCG) at the center of the front side. Each collection gate is connected to an in-pixel large memory unit, which can accumulate image signals captured by repetitive imaging. The combination of the backside illumination, image signal accumulation, and slow readout from the in-pixel signal storage after an image capturing operation offers a very high sensitivity. Pipeline signal transfer from the the multiple collection gates (MCG) to the in-pixel memory units enables the sensor to achieve a large frame count and a very high frame rate at the same time. A test sensor was fabricated with a pixel count of 32 × 32 pixels. Each pixel is equipped with four collection gates, each connected to a memory unit with 305 elements; thus, with a total frame count of 1220 (305 × 4) frames. The test camera achieved 25 Mfps, while the sensor was designed to operate at 50 Mfps."

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Yole Developpement article "Image sensors have hugely benefited from Apple’s avant-garde strategy" by Pierre Cambou overviews image sensing history and possible future trends:

"We are now in the middle of a golden age for the CIS industry.

As the smartphone industry itself reaches a plateau, it is the perfect time for Apple to bring to market a new user interface based on 3D sensing CIS. It’s therefore not a surprise if this year’s keynote expands on the ideas presented in the iPhone X one year ago.

The future is definitely in the 3D touchless interactions demonstrated last year, first for biometric identifications, but not just that. Animojis, avatars and augmented reality filters are at the center of the new experience. All other smartphone producers are racing to match the functionality, and it will probably take another year before they do. Announcements from Xiomi, Oppo and Vivo have all indicated that the Chinese companies are particularly keen to join Apple on the 3D sensing strategy.

We are entering a new cycle of interactive devices. Smartphones are just one aspect to it. At Yole Développement we expect it will have deep impacts on the electronic industry more generally. It will give a new boost to consumer markets for smart assistants, smart home devices and consumer robotics, and possibly wearables. More importantly, the technology will have also deep implications in the security and automotive industries. This is part of the new paradigm shift toward sensing, and it is interesting to notice that Apple was the innovator in both previous shifts."

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Arxiv.org: University of Exeterm UK, publishes a review paper "Graphene-based light sensing: fabrication, characterisation, physical properties and performance" by Adolfo De Sanctis, Jake D. Mehew, Monica F. Craciun, and Saverio Russo.

"Graphene and graphene-based materials exhibit exceptional optical and electrical properties with great promise for novel applications in light detection. However, several challenges prevent the full exploitation of these properties in commercial devices. Such challenges include the limited linear dynamic range (LDR) of graphene-based photodetectors, the lack of efficient generation and extraction of photoexcited charges, the smearing of photoactive junctions due to hot-carriers effects, large-scale fabrication and ultimately the environmental stability of the constituent materials. In order to overcome the aforementioned limits, different approaches to tune the properties of graphene have been explored. A new class of graphene-based devices has emerged where chemical functionalisation, hybridisation with light-sensitising materials and the formation of heterostructures with other 2D materials have led to improved performance, stability or versatility. For example, intercalation of graphene with FeCl3 is highly stable in ambient conditions and can be used to define photo-active junctions characterized by an unprecedented LDR while graphene oxide (GO) is a very scalable and versatile material which supports the photodetection from UV to THz frequencies. Nanoparticles and quantum dots have been used to enhance the absorption of pristine graphene and to enable high gain thanks to the photogating effect. In the same way, hybrid detectors made from stacked sequences of graphene and layered transition-metal dichalcogenides enabled a class of detectors with high gain and responsivity. In this work we will review the performance and advances in functionalised graphene and hybrid photodetectors, with particular focus on the physical mechanisms governing the photoresponse in these materials, their performance and possible future paths of investigation."

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Yole Developpement releases "Status of the CMOS Image Sensor Industry 2018" report:

"2017 saw aggregated CIS industry revenue of $13.9B. We now forecast a 9.4% compound annual growth rate (CAGR) for the next five years. Year-on-year (YoY) growth hit a peak at 20% due to the exceptional increase in image sensor value, across almost all markets, but primarily in the mobile sector.

The market has benefited from the operational recovery of leading CIS player Sony, which captured 42% market share. The CIS industry is able to grow at the speed of the global semiconductor industry, which also had a record year, mainly due to DRAM revenue growth.

The key takeaway from 2017 has been the rapid deployment of dual camera approaches in the mobile sector. The market has quickly adopted dual cameras on the rear of the phones, serving photography either to improve resolution and low light performance or to provide optical zoom capabilities. Dual camera approaches have also been deployed on the front side, mostly serving biometric face or iris recognition, but also 3D sensing in the Apple iPhone X. Competition and differentiation between mobile device manufacturers is deeply linked to CIS implementation. CIS has therefore benefited from ever-increasing dollar content per smartphone, compensating for the mobile market slowdown.

Security is now one of the most active markets, tightly connected to Chinese involvement in the industry. Hikvision and Dahua are the two new leading OEM manufacturers, having capitalized very quickly on internet protocol (IP) camera technology, cloud computing and artificial intelligence. The number of cameras per security system isn’t limited by human monitoring any more, which is a paradigm shift for surveillance. In automotive the same is occurring, as rear back-up cameras have become mandatory in the US.

Sony is the unchallenged industry leader market and technology-wise. It benefited from the operational recovery of the Kuamoto foundry after the major earthquake of 2016. This helped Sony’s market share increase, on top of the CIS market’s rapid growth. Samsung is also maintaining its growth, and is now able to match most of Sony’s technology advancements in 3D stacking. This mostly serves Samsung’s handset division, but it’s increasingly supporting Chinese OEMs in a constrained environment for high-end Mobile CIS. Omnivision seems to have completed its transition toward continental China, with HLMC now producing one third of its products, and is capturing good revenue in automotive. The next logical step would be to expand its early successes in the near-infrared (NIR) Global Shutter device designed into the Intel Realsense products, which unfortunately suffered from shrinking computing business.

STMicroelectronics stole the show at the end of 2017 by capturing the slot in the newly released iPhone X with an innovative NIR Global shutter based on a silicon-on-insulator (SOI) substrate. ON Semiconductor has become the key player in automotive despite growing competition from Sony and Samsung. Growth in its Industrial division helped mitigate decreasing volumes of action and drone camera products. On the CIS foundry side, HLMC has benefited from the production transfer from Omnivision and TPSCo similarly from ON Semiconductor. Hynix is apparently locked in a conundrum prioritizing DRAM over CIS. SMIC similarly has to invest in the next generation technology and is in transition. Probably the last key aspect of this year’s status of CIS is China’s positive progress. Having built a consistent ecosystem incorporating CIS foundries, CIS vendors and high growth system manufacturers, China CIS ecosystem will become more important in the future."

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SEMI publishes a video its webinar "Catching up on European MEMS, Sensors & Imaging Trends and Technology." Few slides from imaging part of the presentation:

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Oslo Bors stock exchange reports that poLight ASA announces its intention to launch an IPO of its shares and to apply for a listing on Oslo Børs, alternatively Oslo Axess.

The company's TLens technology is said to offer considerable benefits, such as extremely fast focus, compact xy-dimension, no electromagnetic interference, low power consumption, and constant field of view.

Currently the Company has three ongoing proof-of-concept ("PoC") projects related to smartphones. One of the ongoing PoC projects is with a Tier 1 mobile OEM testing the TLens for use in a high-end front camera, while
the other two PoC projects are with Tier 2 and Tier 3 OEMs also testing the TLens for front camera applications. The Company believes more PoC projects with smartphone OEMs will be initiated in the coming months.

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Digitimes: Packaging house Kingpak will complete the first phase of its capacity expansion by the end of 2018 to satisfy growing demand for automotive image sensors, according to newspaper's sources. Kingpak orders for auto CIS packaging from Sony ramp up fast. The orders from Sony are expected to boost Kingpak's sales generated from the auto sector to 70% as a proportion of company revenues in 2018, the sources said.

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Cnet: Apple event has a number of camera news in the oncoming iPhone models, including a dedicated depth engine that allows various depth calculations with the rear dual camera:

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OSA Optics Express publishes Shizuoka University paper "Multi-band plasmonic color filters for visible-to-near-infrared image sensors" by Atsutaka Miyamichi, Atsushi Ono, Hiroki Kamehama, Keiichiro Kagawa, Keita Yasutomi, and Shoji Kawahito.

"We propose a plasmonic color filter consisting of a single aperture surrounded by concentric periodic corrugations for simultaneous imaging of a spectral range from the visible to the near-infrared. The incident light coupled with surface plasmons propagates through the sub-wavelength aperture as beaming light. The beaming light transmission is able to suppress the spatial color cross-talk between the pixels in an image sensor. We analyzed the transmission characteristics of a plasmonic color filter with periodic corrugations in a silver thin film by using the finite-difference time-domain algorithm. We demonstrated a multi-band transmission wavelength selectivity, of about 100 nm, for the spectral bandwidth ranging from visible to near-infrared. The simultaneous discrimination of visible and near-infrared light with a high color purity by the plasmonic color filter achieves both improved image recognition and smaller system-size compared with conventional systems, which is particularly important for applications such as vehicle-mounted cameras, security, and biological tissue engineering."

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Autosens publishes "Global M&A in the ADAS and Autonomous technology space" presentation by Rudy Burger, Managing Partner, Woodside Capital. One of the claims is that there are too many LiDAR companies and too much investment in LiDAR technology:


Newsight Imaging is presenting its Enhanced Time-Of-Flight (eToF) LiDAR:

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AutoSens Detroit publishes Aeye VP of Engineering, Barry Behnken, presentation of the adaptive scanning iDAR. Aeye says that in SNR-starved environment, it does not make sense to spend the precious laser photons on "uninteresting" objects, such as sky, empty road, top floors of buildings, etc. Rather, the company proposes to concentrate them on the object that a regular 2D camera points as "interesting." The 2D camera info can be combined with other sources of info, such as radar, ultrasonic sensors, GPS, etc.

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