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Singular Photonics launches world-first SPAD-based image sensor

Litavis offers programmable multi-modal capabilities on-chip, accelerating time-to-market for imaging applications.

Edinburgh, UK – September 10, 2026 – Singular Photonics, an innovator in single-photon imaging, today announced the launch of its most advanced image sensor to date. Litavis is the world's first single-photon avalanche diode (SPAD) sensor using in-pixel processing to unify imaging, timing, histogramming and photon statistics on a single chip.

Designed to bring unprecedented flexibility and intelligence to imaging applications, Litavis introduces a software-configurable sensing architecture capable of combining photon-counting imaging, programmable time gating, and advanced photon timing within a scalable SPAD array platform.

Litavis is also the first SPAD-based sensor to enable simultaneous intensity, timing and histogramming modes. The system also enables users to dynamically adapt sensor parameters in software without requiring new hardware designs.

By processing photon events directly on-chip, Litavis significantly reduces the amount of raw data that must be transferred and processed externally. This enables more scalable real-time imaging systems through lower latency, improved power efficiency and faster decision-making.

Litavis supports a broad suite of configurable operating modes, including:

•  Multiple TCSPC and high throughput TDC configurations using internal or external clocks
•  High-dynamic-range photon counting modes with selectable resolution
•  Windowed and coincidence-based detection for advanced temporal analysis
•  Combined timestamping and imaging modes

Developers can reconfigure the same hardware platform for different applications with minimal redesign effort, accelerating development cycles and reducing system complexity. The sensor is suitable for a broad range of applications including machine vision, robotics, physical AI, depth sensing, spectroscopy, scientific imaging, medical imaging, quantum technologies and industrial automation.

“Litavis combines the sensitivity advantages of SPAD technology with the adaptability and scalability increasingly required by modern multimodal imaging,” said Shahida Imani, CEO of Singular Photonics. “It condenses these into one intelligent sensor, enabling a new generation of imaging systems built on a single, configurable platform. We designed Litavis to serve multiple applications and markets, and we've already received significant pre-order volumes from companies and institutions around the world.”
As with Singular’s other products, Litavis is named after an ancient Celtic deity, an earth goddess, whose name means “the broad one” – reflecting the extensive capabilities of the new sensor.

Litavis will be demonstrated at SPIE Sensors + Imaging in Edinburgh next week, and at VISION, the world's largest machine vision tradeshow in Stuttgart in October.

Technical details
Litavis is a CMOS SPAD-based imaging sensor platform built on an architecture that combines single-photon sensitivity with integrated digital photon processing directly on-chip and in-pixel. This enables precise capture of spatial and temporal information, while reducing reliance on external processing hardware, allowing the sensor to extract additional scene information including depth, timing and event characteristics.

Litavis delivers continuous 256 × 256-pixel photon-counting imaging under low-light conditions. In parallel, time-stamped photon events are generated at a lower rate on a 64 × 64 macropixel grid, providing picosecond-resolution photon timing alongside full-resolution photon counting.

The sensor also supports multi-event timing, allowing multiple detected photons per excitation cycle to be individually time-binned, and in-pixel histogramming. These capabilities provide access to temporal statistics beyond conventional intensity measurements. This supports applications such as fluorescence lifetime imaging, dynamic light scattering, and quantum sensing.

Litavis integrates configurable acquisition and timing capabilities directly within the pixel array. This allows developers and system integrators to rapidly prototype, evaluate and deploy advanced imaging solutions using a single adaptable platform.

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Link: https://www.techtimes.com/articles/323736/20260810/sony-splits-sensor-manufacturing-tsmc-63b-deal-capture-physical-ai-market.htm

Some excerpts below. 

Sony Splits Sensor Manufacturing With TSMC in $6.3B Deal to Capture Physical AI Market
Joint Venture Keeps Pixel IP at Sony While TSMC Supplies Logic Process for Cars and Robots 

Sony Group and Taiwan Semiconductor Manufacturing Co. announced Monday that they plan to invest approximately ¥1 trillion (approximately $6.3 billion USD) in a joint venture to manufacture next-generation image sensors at Sony's Koshi City fab in Kumamoto Prefecture, with commercial production targeted for 2029, according to the Japan Times. The investment is not an incremental expansion of Sony's existing manufacturing footprint — it is an acknowledgment that the sensors required to power robots, autonomous vehicles, and AI-driven industrial systems operate on fundamentally different technical principles from the smartphone sensors that built Sony's 43% market lead, and that meeting those requirements demands a manufacturing partnership Sony cannot replicate alone.

Why Sony Could No Longer Do This Alone

[...] the sensors required for physical AI applications — cameras inside self-driving cars, robotic manufacturing lines, and industrial inspection systems — are a categorically different product from the sensors inside a smartphone, and building the manufacturing infrastructure to produce them at scale requires both the capital and the process technology that Sony's in-house fabs cannot provide on their own.

[The difference is threefold.]

The first is the global shutter. [...]

The second is dynamic range. [...]

The third is temperature tolerance and functional safety certification. [...]

What the Fab-Light Model Actually Splits

[...] Sony will not share [the pixel layer] manufacturing process with TSMC under the joint venture[...]. Sony retains full control of the pixel wafer.

The second wafer is the logic layer [which will benefit] enormously from advanced logic process technology [from] TSMC's logic process expertise, specifically its ability to manufacture the logic die at nodes Sony cannot match in-house [...].

The two wafers are then bonded using copper-to-copper hybrid bonding — a technique Sony pioneered for commercial image sensor production around 2016 [...].


The Sony-TSMC sensor joint venture supplies the perception layer that physical AI systems require. Whatever a robot or autonomous vehicle is doing with its AI model, it is perceiving the world through an image sensor first. 

Sony's IP Bet and the Competitive Clock

The joint venture is also, implicitly, a response to a competitive clock [...] Apple confirmed in August 2025 that it was working with Samsung at the latter's Austin, Texas facility [...].

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Open access paper link: https://www.cell.com/iscience/fulltext/S2589-0042(26)02211-X

Yoon et al., "Angle- and polarization-adaptive aperiodic-anisotropic metasurfaces for broadband reflectance suppression" iScience (2026)

Optical reflectance at the air-silicon interface degrades CMOS image sensor (CIS) performance, causing signal loss and image artifacts. Conventional single-layer anti-reflective coatings (1-ARCs) offer CMOS-compatible simplicity, but their isotropic nature and limited spatial tunability make them poorly suited to handle angle- and polarization-dependent characteristics of incident light, particularly where the chief-ray angle varies across the sensor surface. Here, we present an aperiodic-anisotropic metasurface (AAM) composed of subwavelength TiO2 nanodisks with spatially varying geometric anisotropy, enabling broadband, angle- and polarization-resolved impedance matching tailored to local incidence conditions. Its performance was verified through unit-cell-level optimization and further validated by full-area simulations on a 20 × 20 μm2 Si substrate under Gaussian beam illumination, where the AAM achieved ∼1.40% average reflectance across 400–700 nm for both polarizations, outperforming conventional 1-ARC and double-layer anti-reflective coating (2-ARC). This offers a practical solution for CIS and other systems such as LiDAR (light detection and ranging) receivers under spatially varying illumination. 

 

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https://www.sony-semicon.com/en/news/2026/2026072201.html

Mitsubishi Electric and Sony Semiconductor Solutions Agree to Establish a Joint Venture to Build AI Vision Sensor Solutions for Manufacturing Applications
To Enhance Recognition, Decision-Making and Control in Manufacturing and Contribute to Labor Savings and Unmanned Operations 

Mitsubishi Electric Corporation (“Mitsubishi Electric”) and Sony Semiconductor Solutions Corporation (“Sony”) have entered into a definitive agreement on a strategic partnership aimed at accelerating the automation and advancement of manufacturing equipment and manual operations in the manufacturing industry. Under the partnership, the two companies will establish a newly formed joint venture (“JV”), Advanced Vision Solutions Co., Ltd., which is scheduled to begin operations in October 2026, subject to the receipt of necessary approvals and clearances from relevant authorities.

Going forward, through the JV, the companies will develop and offer vision-sensor*1  solutions leveraging cutting-edge technologies that enable AI-based analysis of visual data directly on image sensors. The solutions will precisely capture conditions and changes across a broad range of manufacturing sites that have traditionally been difficult to visualize, and connect them to decision-making and control. They will support automation and autonomous operation of a wide range of manufacturing equipment, contributing to labor savings and unmanned operations.

This partnership will enable the two companies to integrate Sony’s industry-leading image sensors and edge AI technologies with Mitsubishi Electric’s extensive expertise in FA control systems cultivated over many years. The solutions will precisely capture conditions at manufacturing sites, product quality, equipment operations, and maintenance-related information that were previously difficult to fully understand and utilize. Furthermore, it will efficiently extract the necessary information from the acquired data and connect it to appropriate decision-making and subsequent control, enabling timely and autonomous improvements tailored to equipment and operational conditions with minimal manual intervention. 
In addition to vision data, the solutions will integrate with a variety of data from manufacturing sites, contributing to the development of multimodal production systems capable of detecting changes, early signs and other conditions that cannot be fully identified from a single type of data alone. Through this initiative, the companies aim to drive the deployment of physical AI in the FA domain and provide solutions that can be used without specialized expertise in optics or AI, across broad industries seeking labor savings, autonomous operations, quality improvement, and more advanced maintenance in production environments.

*1 Vision sensor: A high-precision sensor that captures images of products and parts on manufacturing lines using a camera and detects the condition and positional information of target objects in real time. By working in conjunction with factory automation (FA) equipment, it enables automation at manufacturing sites.

“Mitsubishi Electric has long provided a wide range of FA equipment to customers, primarily in the manufacturing sector,” said Takayuki Tsuzuki, Executive Officer (Associate); Group President, Factory Automation Systems at Mitsubishi Electric Corporation. “Today, the need for labor-saving, unmanned systems and autonomous optimization at production sites is greater than ever. Through this partnership with Sony Semiconductor Solutions, we will develop AI vision sensors as a new core component and build a new FA digital solutions business by integrating vision data with our digital platform, ‘Serendie™*2.’ Furthermore, by realizing advanced autonomous control with physical AI and other applications, we aim to provide new value to customers and address social challenges such as labor shortages.”

“Sony has contributed to solving challenges and creating new value across a wide range of industries by accurately capturing real-world information through edge‑AI sensing technologies centered on image sensors,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation. “Image sensors, which serve as the ‘eyes’ that generate vision data, play an important role in enabling AI to understand on-site conditions and connect them to decision-making and control. Through this partnership with Mitsubishi Electric, which has deep expertise and a strong customer base in the FA domain, we will bring solutions that leverage our sensing technologies to the market, create value across an even broader range of industries, and further accelerate the evolution of our sensing technologies.”

Company name: Advanced Vision Solutions Co., Ltd.
Business description: Development of AI-powered vision sensors and vision-sensor solutions for factory automation (FA)
Shareholding ratio: Mitsubishi Electric 60%, Sony Semiconductor Solutions 40% 

 

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Elio: https://www.eliolabs.com/technology 

News Link: https://www.businesswire.com/news/home/20260723118244/en/Elio-Raises-%2421M-to-Build-Sensing-for-the-AI-Era

SILICON VALLEY, Calif.--(BUSINESS WIRE)--Elio, a company building sensors designed for artificial intelligence rather than the human eye, today announced a $21 million funding round led by Innovation Endeavors and Xora, with participation from Kevin Weil and Scribble VC. Existing investors UpWest and Resolute Ventures, who led the company's previous round, are continuing their support.

Today's sensors capture one fixed view of the world, decided in advance, shaped by what the human eye can see rather than what a machine needs. Elio is changing that: its sensors let AI decide what to capture, in real time, based on what it is trying to figure out - delivering exactly the information needed, when it's needed, instead of a fixed picture to interpret after the fact.

The technology puts computation inside the optics itself. Before light reaches the sensor, dynamic optical layers of micromirrors process it directly - acting more like a neural network than a lens - pulling out signals a conventional lens would flatten and lose. AI learns how the optics behave and corrects them live, reading objects and materials by their physical signature, not just their pixels.

As a result, a single module can do the job of many, and it keeps gaining new abilities after it's already shipped. Sensing starts to behave like software: the same unit gets more capable over time, instead of becoming outdated.

Elio can be used in any context where sensing is required. In microscopy, Elio lets researchers watch living cells respond to a drug over time without staining or fixing the sample, work that today requires destroying the sample for a single datapoint. In semiconductors, Elio enables engineers to see through a chip's stacked layers to catch buried defects without cutting the wafer apart. In robotics, Elio gives machines multiple senses in one module that self-calibrates and switches as the scene changes. In defense, Elio can detect small, fast-moving threats like drones at long range across conditions such as darkness or haze that challenge even the best conventional sensors. Across every application, Elio is expanding the universe of what sensors are meant to do - building dynamic, real-time, label-free methods that capture the complexity of the real world and allow AI to find the patterns that matter.

Elio is led by Founder and CEO Nadav Grossinger and Chief Technology Officer Nitay Romano, who have worked at the intersection of optics and AI for more than 20 years. The two previously co-built Pebbles Interfaces, acquired by Meta, then spent seven years leading the physical-sensing stack behind Meta's AR and VR headsets. Grossinger's earlier ventures include ColoRight, acquired by L'Oréal. Romano, a leading figure in diffractive optics, previously served as Chief Optical Scientist at Holo/Or, the science underpinning Elio's core technology. 

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Link: https://novoviz.com/variable-frame-rate-spad-camera/

The NVx5VFR-HW variable frame rate camera was developed for applications requiring high sensitivity and/or frame rate but with reduced output bandwidth. The camera combines the benefits of a SPAD camera, namely the single-photon resolution and fast operating speeds, with those of an event camera—low output data rates. 

Features: 

• 480 x 320 or 256 x 192 SPAD pixels
• Event-based readout
• Adjustable event threshold
• 20ns global shutter
• On-chip pixel binning
• USB 3.0  

Event camera emulation
[...] because there is a single sensor and a single acquisition, the two modalities are inherently synchronized in time and space, without genlocking, cross-sensor calibration, or timestamp drift. The SPAD sensor thus functions as a flexible substrate that can be reprocessed into multiple imaging modalities entirely in software. 

HDR Imaging
[...] photon-counting approach lets each pixel build its own exposure curve, avoiding the clipping and noise floor issues that limit standard CMOS or CCD imaging. 

Instantaneous adaptation to lighting variation
[...] photon-counting approach lets the sensor adapt instantly to drastic lighting shifts, with no exposure recalibration, no motion blur, and no saturation, capturing both the bright and near-dark scenes with equal clarity in the same brief 2ms window. 

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Singular Photonics Lands Funding to Launch Next-Generation Image Sensors as Commercial Traction Grows

Fabless semiconductor startup appoints former Arm CTO to Board as demand for SPAD-based image sensors accelerates.

Edinburgh, UK – August 19, 2026 – Singular Photonics, a developer of SPAD-based image sensors, today announced it has closed an oversubscribed $2.15 million funding round, led by ACF Investors, with participation from Wren Capital, Cambridge Angels, Scottish Enterprise, Quantum Exponential and Old College Capital. The new capital will accelerate development of a new generation of sensors, expanding the company's product roadmap in response to demand from its growing customer base.
Singular has already doubled its full-year 2025 sales in 2026 to date, driven by customer engagements spanning multiple sectors, including a recent collaboration with instrumentation leader Renishaw. The investment will be used to scale engineering capacity and speed time-to-market for new image sensors capable of advancing new applications in markets ranging from machine vision, industrial automation and physical AI to scientific discovery and medical imaging.
 
“This has been a phenomenal year for Singular Photonics,” said CEO Shahida Imani. “We've already doubled our 2025 sales, we're approaching break-even, and our customers are telling us exactly what they want from future products. This oversubscribed round means we can respond faster – expanding our sensor portfolio and bringing new features to market on our customers’ timelines, not just our own.”
 
“Singular Photonics is an exciting addition to our portfolio, combining world-leading sensor science with genuine commercial promise,” said Tim Mills, Managing Partner at ACF Investors. “The industry is moving from capturing images to generating actionable insights directly from light itself, and Singular has both the technology and the team to lead that shift. We're delighted to back them into their next phase of growth.”
 
“Scottish Enterprise has supported Singular Photonics ambition to develop SPAD-based image sensors over several years,” said Derek Shaw, Director of Company Funding & Investment at Scottish Enterprise. “The Photonics, Quantum, Sensing and Connectivity and Semi-conductors Sector is a key opportunity area for growth for Scotland. Companies such as Singular Photonics can play a vital role in transforming our economy by scaling-up, creating high value jobs and competing internationally.” 
 
“In a strong signal of confidence in Singular’s trajectory, existing shareholders followed the new investors into the round, meeting or exceeding their pre-emption rights,” said Singular Photonics Chairman Pete Hutton. “Combined with the appetite shown by new investors, the round was met with robust demand – a clear vote of confidence in the team, the technology and the commercial momentum the company has built.”

Dipesh Patel joins Board
Singular also announced that Dipesh Patel, the former CTO of global semiconductor giant Arm, has joined the company’s board of directors. During his 25 years at Arm, Dr. Patel held a number of general and technical management positions culminating in his role as CTO where he was responsible for the Research and Digital IT functions.
 
“Singular Photonics is transforming image sensors from passive imaging devices into intelligent sensing platforms,” said Dr. Patel. “SPADs have long been viewed as highly sensitive photon-counting devices, but Singular is showing the world that a far greater opportunity is now emerging, and I’m looking forward to helping the company capitalise on that opportunity.”
 
Powering the SPAD revolution
Every digital camera, industrial vision system and scientific imaging instrument depends on image sensors to capture light and convert it into useful information. Over the decades, these sensors have improved, but they are now approaching the limits of how much information can be captured. The arrival of sensors based on single-photon avalanche diodes (SPADs) is changing that.
Unlike conventional image sensors, which essentially measure the intensity of light, SPAD sensors can precisely detect and time individual photons (the smallest units of light). This opens the door to an entirely new generation of imaging systems that can capture information that conventional cameras simply cannot see.
 
Singular Photonics is pioneering the development of SPAD-based image sensors that also integrate advanced on-chip computation. This allows information to be analysed at the point where light is first detected, making the company’s sensors capable of extracting meaningful information in real time. As sensors become increasingly capable of understanding the information they capture, they can enable smaller, faster and more efficient systems that meet the growing demands of edge computing and AI-driven applications.

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Link: https://www.sony-semicon.com/en/news/2026/2026081101.html

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors

Atsugi, Japan and HSINCHU, Taiwan, R.O.C., August 11, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan. The JV will serve as a core hub for the development and manufacturing activities required for the volume production of image sensors for smartphones utilizing advanced manufacturing process technology. The JV is expected to commence volume production in 2029.

Sony will be the sole controlling shareholder and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation. The Representative Director of the JV is planned to be appointed by Sony.

Pursuant to the definitive agreement, Sony plans to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets* through a company split. TSMC plans to make cash contributions of approximately 282 billion yen. These capital contributions are expected to be made in phases based on market demand and other relevant business conditions. In addition to these capital contributions by Sony and TSMC, investments required to realize the production capacity planned by the JV are being considered on the premise that they would receive support from the Japanese government.

Under the strategic partnership, Sony intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design. The JV plans to leverage TSMC’s advanced process technology and manufacturing expertise to drive development and manufacturing activities required for the volume production. Through this collaboration, the companies intend to accelerate the commercialization of image sensor products driven by customer needs while advancing technological innovation and strengthening manufacturing capacity.

The establishment of the JV and completion of the transaction are subject to the receipt of required regulatory approvals and the satisfaction of other customary closing conditions. 

All other aspects of the partnership remain unchanged from the announcement by Sony and TSMC titled “Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026. 

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Link: https://www.sony-semicon.com/en/news/2026/2026081101.html

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation Image Sensors

Atsugi, Japan and HSINCHU, Taiwan, R.O.C., August 11, 2026 - Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan. The JV will serve as a core hub for the development and manufacturing activities required for the volume production of image sensors for smartphones utilizing advanced manufacturing process technology. The JV is expected to commence volume production in 2029.

Sony will be the sole controlling shareholder and the JV is planned to operate as a consolidated subsidiary of Sony Group Corporation. The Representative Director of the JV is planned to be appointed by Sony.

Pursuant to the definitive agreement, Sony plans to contribute approximately 465 billion yen to the JV through a combination of cash contributions and the transfer of its assets* through a company split. TSMC plans to make cash contributions of approximately 282 billion yen. These capital contributions are expected to be made in phases based on market demand and other relevant business conditions. In addition to these capital contributions by Sony and TSMC, investments required to realize the production capacity planned by the JV are being considered on the premise that they would receive support from the Japanese government.

Under the strategic partnership, Sony intends to take a leading role in the development of core image sensor technologies, as well as product planning and product design. The JV plans to leverage TSMC’s advanced process technology and manufacturing expertise to drive development and manufacturing activities required for the volume production. Through this collaboration, the companies intend to accelerate the commercialization of image sensor products driven by customer needs while advancing technological innovation and strengthening manufacturing capacity.

The establishment of the JV and completion of the transaction are subject to the receipt of required regulatory approvals and the satisfaction of other customary closing conditions. 

All other aspects of the partnership remain unchanged from the announcement by Sony and TSMC titled “Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership” issued on May 8, 2026. 

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Call for 2027 IISS award nominations is now open. 

IISS AWARD NOMINATIONS:

    Walter Kosonocky Award: call for nomination and nomination form (Due Jan 15, 2027)
    IISS Awards: call for nomination and nomination form (Due Nov 30, 2026)

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See also IEEE blogpost: https://standards.ieee.org/beyond-standards/how-good-is-the-camera-ieee-4001-gives-answers/ 

How good is your camera, actually? This question is addressed by the new IEEE 4001 standard, developed by a large group of people from the hyperspectral imaging community, recognizing that an improvement over current practice in this field is needed. This standard defines a set of performance characteristics that are directly comparable between cameras. It can be seen as an analog to the EMVA 1288 for image sensors, by defining a similarly comprehensive specification for complete cameras. To serve this purpose, some new characteristics have been developed for IEEE 4001. The standard also defines camera-related metadata that quantify the effects imprinted by the camera on an image. The formal scope of the standard is hyperspectral imaging, but it can be readily adapted to other imaging modalities where it also has potential to be useful. The standard can be downloaded from the IEEE XPLORE site (for free with library access, or through a $133 paywall). Here is an excerpt from the IEEE press release:


Comprehensive, yet minimal, camera characteristics

IEEE 4001 incorporates many conventional camera characteristics, but also some newly developed performance metrics, in order to arrive at a minimal (necessary and sufficient) set that includes parameters of a complete signal model, as well as measures of actual resolution and various nonidealities. Many aspects of camera performance are covered:

Spectral: Spectral range, Number of bands, Spectral peak width, Spectral sampling interval, Equivalent Band Count

Spatial: Pixel format, Field of view, Geometrical pixel field of view, Peak width, Equivalent Pixel Count, Effective spatial fill factor, Spatial distortion, Object distance

Radiometric: Effective throughput, Response nonuniformity, Read noise, Normalized read noise, Dark current, NESR at the noise floor, Saturation capacity, Linearity error, Signal to noise ratio, Dynamic range, Dark correction

Temporal: Maximum frame rate, Integration time range, Synchronization between bands, Dead time

Coregistration: Spatial coregistration error, Spectral coregistration error

Stray light: Stray light apparent reflectance

Data output: Output data level, Real time capability, Synchronization capability, Invalid data flagging

Calibration: Statement of radiometric, spectral, and geometrical accuracy

Other characteristics: Bad pixels, Polarization dependence, Detector type/temperature

Metadata enhancing image exploitation

IEEE 4001 also defines camera-related metadata describing the influence of camera properties on a given image. With IEEE 4001-compliant metadata, it is for example possible to estimate the signal-dependent physical noise amplitude in all pixels and all bands, and to estimate the local magnitude of artifacts due to coregistration error. This can enable more accurate extraction of information from imagery.

 

 

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STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance

VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Designed to meet the evolving needs of customers and partners across diverse industries, including robotics, industrial automation, smart buildings, AR/VR, and healthcare.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today [June 23, 2026] announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.

“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”

“3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption,” said Anas Chalak, Market & Technology Analyst at Yole Group.

ST FlightSense™ VL53L9 is designed for multiple industry use cases:

– Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation.

– Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management.

– Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy.

– AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences.

– Healthcare: fall detection and monitoring solutions for eldercare and patient safety.

Enhancing 3D sensing with precision and efficiency

The VL53L9 offers an unprecedented 2,268 resolution zones (54×42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second.

All-in-one sensing data for edge AI and easy integration

The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity.

Compact form factor

Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users.

Availability

ST FlightSense™ VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally. For more information, visit the VL53L9 product page: https://www.st.com/en/imaging-and-photonics-solutions/vl53l9cx.html 

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Abstracts from the recently concluded SPW2026 in Naples, Italy are now available online:

https://spw2026.org/programme

https://spw2026.org/poster-session-1

https://spw2026.org/poster-session-2 

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Link: https://www.businesswire.com/news/home/20260511959181/en/indie-to-Acquire-CMOS-Image-Sensor-Product-Line-from-ams-OSRAM

indie to Acquire CMOS Image Sensor Product Line from ams OSRAM 

ALISO VIEJO, Calif.--(BUSINESS WIRE)--indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has announced the signing of a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for a total consideration of 40 million euros.

With primary operations in Belgium and Portugal, this product line includes intelligent, high‑performance CMOS image sensors for a broad range of industrial, automation, and physical artificial intelligence (AI) applications. This portfolio of products, IP, and designs aligns with indie’s automotive ADAS sensing solutions and further strengthens the Company’s multimodal sensing capabilities across radar, vision, LiDAR, and ultrasonic.

“By integrating ams’ CMOS imagers with our sensor‑fusion hardware and perception software, we’re able to deliver unparalleled sensing systems for next‑generation autonomous machines, including emerging applications such as humanoid robots, cobots, and AMRs,” said Mark Tyndall, executive vice president of corporate development and investor relations at indie. “This unique carve-out extends our position in sensor‑fusion technology and significantly expands our portfolio of GaN SLED light‑source solutions. Together, these technologies broaden our offerings, opens new customer opportunities, and positions indie to capture a larger share of the rapidly emerging physical AI market.”

Image sensors are a key component of sensor-rich platforms within high-performance visual applications such as humanoids, cobots, and industrial automation. As noted by Research and Markets, the image sensor market is forecasted to grow to over $40 billion by 2030. This market growth is being driven by rising autonomy, safety regulations, and increased adoption of AI-based vision ADAS systems, as well as applications that require multimodal sensing, low-latency, and high-resolution.

The consideration includes a cash payment of 35 million euros paid at closing, and a 5 million euros vendor debt note provided by ams OSRAM. The transaction is subject to customary closing conditions, including regulatory approvals. It is expected to close in the third quarter of 2026 and be immediately accretive.  

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Yahoo news July 28, 2026 

https://www.yahoo.com/news/world/articles/sony-fujifilm-plants-evacuate-7-160448320.html

Sony, Fujifilm plants evacuate as 7.1-magnitude earthquake hits Japan's image sensor hub 

Sony press release July 31, 2026
 
https://www.sony-semicon.com/en/info/2026/2026073101.html

Status of Sony Semiconductor Solutions Group Manufacturing Operations Affected by 2026 Kumamoto Earthquakes (Second Update) 

The current status of the impact on our operations from the earthquake that occurred in the Kumamoto region on July 28, 2026, is as follows:

Sony Semiconductor Manufacturing Corporation's Kumamoto Technology Center (located in Kikuyo-machi, Kumamoto Prefecture), which temporarily was halted after the earthquake, has completed safety inspections of its buildings and facilities, and has been carrying out recovery work. As a result, the site is scheduled to resume operations in stages beginning August 4, 2026. The Kumamoto Technology Center is expected to return to its pre-earthquake operating level by mid-August 2026.

Further updates will be provided promptly should any new information become available.

Digital Camera World July 31, 2026 

https://www.digitalcameraworld.com/cameras/an-earthquake-has-halted-production-at-the-worlds-largest-camera-sensor-hub-sony-confirms-could-camera-shipments-be-delayed

The largest image sensor plant from Sony – the world’s biggest manufacturer of image sensors – has halted production after an earthquake hit Japan’s Kumamoto Prefecture on July 28. As of July 31, production still has not resumed, Sony said during an earnings report. 

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200MP camera sensors are everywhere on modern smartphones, but are all 200MP cameras the same?

In this video, we explain why smartphone manufacturers keep adopting 200MP sensors, then run blind camera tests featuring Samsung HP3, HP5, HP9 series, Sony LYTIA 901 and SmartSens SCC80XS. We compare official specifications with real-world daylight and low-light lab samples to reveal how sensor hardware, ISP tuning and optical modules affect image quality.

A larger sensor does not always produce better photos. Final imaging performance depends on the entire camera system instead of sensor specs alone. Let’s check the actual gaps between these mainstream 200MP sensors.

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iDS published a YouTube video on CMOS image sensor basics:

 

This video provides a comprehensive introduction to modern CMOS sensor technology and explains how hardware innovations have transformed image quality, efficiency, and performance. You’ll learn why pixel sizes continue to shrink, how this impacts imaging results, and which techniques manufacturers use to compensate for these limitations.

The presentation covers key advancements such as microlenses, backside illumination, deep trench isolation, wafer stacking, and smart features like event‑based imaging and sensor‑level AI (Artifcial Intelligence). You’ll also gain insights into image pipelines, FPGA (Field  Programmable Gate Array) versus ISP (Internet Service Provider) (Image Signal Processor) processing, and why system‑level design decisions matter for real‑world machine vision applications. This is essential knowledge for anyone evaluating sensor performance or designing imaging systems that require reliability, speed, and high‑quality results.

Topics covered

    Trends driving pixel size reduction and sensor scaling
    Hardware innovations such as BSI, micro lenses, and deep trench isolation
    Improvements in quantum efficiency and dynamic range
    Image pipelines with FPGA, ISP, and host‑based processing
    Smart sensor features including event‑based imaging and AI at the edge
    Cost, yield, and design considerations for modern CMOS sensors

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[News from May 2026]

https://eyeo-imaging.com/knowledge/news/eyeo-raises-e40-million-to-fix-the-flaw-that-has-kept-every-camera-70-blind/ 

eyeo raises €40 million to fix the flaw that has kept every camera 70% blind

 Eindhoven (Netherlands), May 11, 2026 – eyeo today announced it has raised €40 million in Series A funding, bringing eyeo’s total funding to €55 million. The round is led by Innovation Industries, with participation from existing investors imec.xpand, Invest-NL Deep Tech Fund, QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM).

eyeo has developed the world’s most advanced nanophotonic color-splitting technology, redefining imaging for consumer, industrial, XR, smart city and mobile applications with color-splitting photonics technology that triples light sensitivity and breaks sensor resolution limits, delivering unprecedented picture quality, color accuracy and resolution.

The fresh funding will accelerate eyeo’s sensor design capabilities, deepen its OEM partner ecosystem, and drive commercial deployment across a $30 billion global imaging market.

A new era for imaging

All seven billion image sensors sold each year, across smartphones, autonomous vehicles, XR devices, industrial machines, smart cities and more, share a fundamental flaw: color filters work by rejection, blocking red, green and blue light in turn and discarding 70% of the light in the process.

eyeo’s Nanophotonic Color Splitting (NCOS®) technology platform works differently. Instead of filtering light, it splits it: separating light into its colors and guiding every photon directly to the pixel where it belongs. Backed by 26 patents, the NCOS® platform triples light sensitivity and breaks resolution limits. This breakthrough approach unlocks picture quality, color accuracy, resolution, and cost efficiency, which was never-before possible.

Compatible with existing CMOS sensor platforms, eyeo’s technology unlocks sub-micron pixels with 3x the light for ultra-compact, high-performance imaging, removing the trade-off between image quality and sensor size that has constrained product design for decades.

From breakthrough science to production-ready sensors

This Series A round marks a decisive step forward in eyeo’s commercialization journey. Building on the foundation established and proven at imec over the last seven years, multiple tier one customer engagements, and successful process integration at a commercial foundry, eyeo is now investing in the full in-house engineering capability required to deliver sensors to customers at volume scale. The funding will be deployed across three strategic priorities:

•     Building a world-class IC and system architecture design team at the Antwerp sensor design center opened earlier this year
•     Developing and releasing next-generation color-splitting image sensors in 3D-stacked CMOS technology
•     Growing sensor sales and commercial partnerships with OEM customers across smart city, industrial, XR and mobile markets worldwide

 

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Transforming Infrared Imaging with Emberion’s Cutting-Edge Sensors 

 

 

 Galaxycore: What Is LOFIC? The HDR Technology Behind Advanced Image Sensors  

 

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Link: https://www.prophesee.ai/2026/06/15/prophesee-launches-mantara-event-based-drone-detection/

Prophesee raises €20 million and launches Mantara, the first fully integrated drone detection system built on event-based vision and AI 

PARIS, June 15, 2026 – As Eurosatory and Vivatech open their doors this week in Paris, Prophesee – inventor and world leader in event-based perception – announces the launch of Mantara®: the first integrated system built natively event-based for drone detection and tracking. Mantara runs on Hearth®, a new software platform with built-in AI processing.

Field-validated in June 2026, Mantara is powered by Hearth, the platform succeeding OpenEB and the Metavision SDK. These announcements coincide with a €20 million capital raise led by French fund Critical Path Ventures, with participation from existing shareholders. Prophesee is now held by a substantial majority of French shareholders.

Mantara is a camera whose performance rests on integrated sensors that do not capture images but motion and events. Each pixel responds independently, in microseconds, the instant movement occurs. Fast, erratic targets that blur or vanish between frames on a conventional camera remain perfectly visible and fully characterizable by Mantara: in low light, in backlit conditions, against cluttered backgrounds. Low latency is the heart of its edge: in the time a conventional system takes to capture, transfer, and process a single frame, Mantara has already detected a drone, characterized it, and triggered a response or initiated tracking.

This capability is rooted in a bio-mimetic design inspired by the human visual system. The eye does not record the world in full. Instead, it captures sparse, essential signals, and the brain reconstructs and interprets what matters. If Mantara is the eye, Hearth is the brain.

Hearth is built with cybersecurity requirements, GDPR compliance, and AI governance standards baked in. It enables sensor fusion and will ensure backward compatibility across successive generations of Prophesee sensors. Applications built on Metavision and OpenEB will migrate to Hearth seamlessly.

Recent conflicts have put drones at the center of modern warfare, and the threat is moving fast beyond the battlefield: airports, power plants, critical infrastructure, public gatherings. Drones fly low, change direction sharply, and increasingly carry a near-zero signature: minimal electromagnetic emissions, little acoustic output, little thermal trace. They arrive faster, and in greater numbers, with coordinated swarms capable of overwhelming defenses built to track a single target.

Mantara emits nothing. It cannot be detected or jammed. And it learns: Hearth delivers regular updates that allow every deployed unit to adapt to shifts in threat behavior. Ukraine has made this clear: tactics evolve far faster than traditional development cycles can follow.
 

Civil and Military Missions

Mantara serves both civil and defense use cases. Airports, stadiums, energy and industrial sites, prisons, and ports can integrate it into existing security infrastructure for continuous, automated airspace monitoring. Governments and defense organizations have access to the same system for force protection and counter-UAS operations.

For civil operators, Mantara also offers a compelling privacy advantage: because the sensors detect motion events rather than recording images, Mantara can track moving objects without ever producing footage that could identify individuals. This is a decisive asset for deployment over public spaces and for GDPR compliance.

Hearth: the Reference Platform for the Event-based Ecosystem

Mantara is part of a broader strategic shift encompassing Prophesee’s entire product line.

Hearth will give the event-based ecosystem a trusted reference environment for building scalable, production-grade modules and applications. It will manage sensor updates, backward compatibility, and unlock capabilities that were previously out of reach for developers and integrators working with Prophesee’s patented technology.

As part of this transition, Prophesee announces the end of life of OpenEB, its open-source framework, and of the standalone Metavision SDK. Hearth is the path forward for the developer community. Prophesee will support the migration.

Prophesee’s partners and customers have built a wide range of applications – from eye trackers and ADAS (Advanced Driver Assistance Systems) to ultra-fast cameras for smartphones, ping-pong playing robots, industrial inspection systems, and drone and satellite tracking and targeting solutions. Event-based vision is reaching an inflection point. The market is maturing rapidly and demanding solutions that are robust, secure, and production-ready. With around a hundred patents and multiple sensors to its name, Prophesee has industrialized event-based technology and now intends to structure the broader application ecosystem by making Hearth widely available.

Built with a Network of European Industrial Partners

Mantara benefits from Prophesee’s partnership with IDS Imaging Development Systems GmbH, a leading industrial camera manufacturer. Building on the commercial success of the IDS uEye EVS camera line – based on Prophesee sensors – the two companies expanded their partnership in March 2026 with an agreement signed at Embedded World in Nuremberg to co-develop next-generation industrial vision systems.

Prophesee and Exosens have entered an MoU, paving the way for a long-term partnership to extend bio-mimetic technology beyond the visible spectrum, combining Prophesee’s event-based vision with Exosens’ detection and imaging technologies.

A €20 Million Raise to Anchor Prophesee in France

Prophesee announces a €20 million capital raise led by Critical Path Ventures, a new investor. The team has been reinforced with talent from Google, Microsoft, BCG, Thales, and companies working in drone, robotics, and quantum technologies, as well as from the armed forces. The funds will support the commercial scale-up of Mantara, the development of embedded intelligence within sensors, and the launch of Hearth. 

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"Ultraviolet Photon Detection in CMOS Single-Photon Avalanche Diodes: A Review" by Wang et al. in IEEE Sensors Journal (vol 26 no 12 June 2026)

DOI: 10.1109/JSEN.2026.3690120 

Abstract
Ultraviolet (UV) imaging is enabling a growing range of applications in industrial inspection, biomedicine, and aerospace. Single-photon avalanche diodes (SPADs), known for their exceptional sensitivity and fast timing resolution, have achieved remarkable success in visible and near-infrared (NIR) applications, e.g., in light detection and ranging (LiDAR). However, there remains a significant gap
in the development and deployment of UV SPAD detectors. This review presents the latest progress, challenges, and application potential of SPAD technologies in deep-UV (DUV) and near-UV (NUV) ranges. It reviews the challenges in UV detection and the currently reported NUV SPADs, including wide bandgap semiconductors (WBSs), avalanche photodiodes (APDs), silicon-based SPADs with front-side illumination (FSI) and back-side illumination (BSI), and silicon photomultipliers (SiPMs). By linking UV
imaging with single-photon detection, this review aims to support future silicon-based complementary metal-oxide-semiconductor (CMOS) high-speed, large-format UV SPAD arrays, and their integration into next-generation imaging systems. 

 

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Press release (April 2026): https://www.hesaitech.com/hesai-unveils-picasso-6d-full-color-spad-soc-next-gen-etx-and-innovations-in-spatial-intelligence-and-physical-ai/

Hesai Unveils Picasso 6D Full-Color SPAD-SoC, Next-Gen ETX, and Innovations in Spatial Intelligence and Physical AI

Hesai Technology (Nasdaq: HSAI; HKEX: 2525), a global leader in intelligent technology and 3D perception, hosted its 2026 Technology Open Day on April 17, showcasing its latest generation of lidar technologies spanning full-color perception, ultra-high-resolution imaging, and spatial intelligence applications.

A key highlight was Picasso, the world’s first 6D full-color ultra-sensitive lidar SPAD-SoC, enabling native fusion of spatial and color perception at the ASIC level. Built on this platform, Hesai’s ETX lidar series has been upgraded to support up to 4320 channels and is expected to enter mass production in the second half of 2026. The company also previewed Kosmo, a new spatial intelligence AI hardware product, and outlined a new direction in robotic actuation modules for physical AI systems. 

At the core of today’s announcement is Picasso, Hesai’s fifth-generation 6D full-color ultra-sensitive lidar ASIC platform, designed to enable vehicles to see both geometry and color natively on a single chip.

Unlike conventional lidar systems that capture only geometric information such as XYZ, Picasso integrates RGB sensing and time-of-flight (ToF) ranging at the chip-level, enabling the direct generation of colorized point clouds without the need for complex sensor fusion. This 6D full-color capability delivers precise spatial and temporal alignment, resulting in richer environmental understanding and significantly enhancing the perception capabilities of next-generation autonomous systems. 

With photon detection efficiency (PDE) exceeding 40%, Picasso delivers industry-leading sensitivity, enabling stronger long-range performance, better detection of small objects, and improved performance in low-light environments within the same power envelope.

Rather than simply combining camera imagery with lidar point clouds, Picasso enables true ASIC-level fusion, with each point inherently carrying color information. This allows autonomous systems to move from spatial perception to real-time understanding of the driving environment, improving performance in different scenarios such as traffic signals, lane markings, and construction zones. 

The introduction of Picasso marks a major step in lidar development, moving beyond incremental improvements in resolution toward a new generation of full-color perception. This breakthrough is supported by Hesai’s long-term vertical integration strategy and in-house development across core lidar technologies. Following the launch of Fermi C500, a RISC-V-based high-performance lidar controller SoC that integrates MCU, FPGA functions, and ADC into a single chip, the company has established full-stack in-house ASIC development capabilities. This technology foundation has already translated into large-scale commercialization, with Hesai’s upgraded ATX lidar achieving full-scale mass production and securing over 6 million units in orders from leading OEMs.

 ETX is expected to enter mass production in the second half of 2026, with planned deployment across multiple flagship vehicle models, supporting the large-scale adoption of L3 autonomous driving systems. 

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Link: https://www.sony-semicon.com/en/news/2026/2026050801.html

Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership 

Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the signing of a non-binding memorandum of understanding (“MOU”) to form a strategic partnership for the development and manufacturing of next-generation image sensors.

Under the proposed partnership, Sony and TSMC intend to establish a joint venture (“JV”), with Sony being the majority and controlling shareholder,to set up development and production lines in Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture. Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

With the MOU signed, Sony and TSMC are discussing potential investments by the JV. These investments, along with new capital investment by Sony in its existing plant in Nagasaki, are being considered on the premise that they would be implemented in phases based on market demand, and that they would receive support from the Japanese government.

This partnership also seeks to explore and address emerging opportunities in physical AI applications, such as automotive and robotics, paving the way for future innovations and expanded technological advancements. The establishment of the JV remains subject to the execution of a definitive legally binding agreement regarding the partnership and the satisfaction of customary closing conditions. 

“Building on the trust cultivated through our long-standing collaboration with TSMC, I am delighted that we have reached an agreement to advance our partnership to a new stage,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation.“This JV is a significant initiative that brings together the strengths of both companies and aims to drive further advancement in technology and business within the next-generation image sensor field. Building on this JV, Sony intends to further strengthen its business operations with a focus on creating high added value. Rooted in the Sony Spirit that has guided us since our founding, we intend to continue to take on the challenge of creating new markets through unprecedented ideas and distinctive technologies.”

“Sony has been our long-time partner in the CMOS image sensor business. We are excited to elevate our collaboration to the next level, which represents a key step forward in driving future sensing technology in the AI era,” said TSMC Senior Vice President and Deputy Co-COO, Dr. Kevin Zhang. “This partnership underscores our shared commitment and mutual vision of leveraging cutting-edge technologies and innovative solutions to deliver leading sensing technology and products. We look forward to working closely together to achieve impactful results and create lasting value for all stakeholders.” 

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Image Sensors Blog is soliciting 1-2 volunteers to help me maintain our weekly posting schedule. We have a large readership spanning industry and academia. This is a great opportunity esp. for an early-career academic (graduate student/postdoc) to provide valuable service to the image sensors community. Please email me (see contact listed in the "Blog Authors" sidebar) with a short introduction and how you see yourself contributing to the blog.

Many thanks to Dave Gilblom who is now retiring from his role as one of the blog maintainers. Thanks, Dave, for the countless hours of hard work poring over image sensor documentation, and for spearheading the Job Postings and Conference List features on the blog! 

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