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There is one positive consequence of image sensor noise - it helps to prevent forgeries. Université Paris-Saclay, France, and Universidad de la República, Uruguay, publish a paper "Noisesniffer: a Fully Automatic Image Forgery Detector Based on Noise Analysis" by Marina Gardella, Pablo Musé, Jean-Michel Morel, and Miguel Colom.Archives for July 2021
A Positive Effect of Image Sensor Noise
Quantum Dots Thesis
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Universidad de Sevilla, Spain, publishes a BSc Thesis "Quantum dots: concept and application for image sensors" by Adri´an Romero Campelo.Samsung Paper on Under-Display Camera
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EI publishes Samsung paper "Under Display Camera Image Recovery through Diffraction Compensation" by Jeongguk Lee, Yunseok Choi, Han-Sol Lee, Eundoo Heo, Dongpan Lim, Geunyoung Lee, and Seongwook Song presented at EI conference in January 2021.Samsung Paper on Under-Display Camera
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EI publishes Samsung paper "Under Display Camera Image Recovery through Diffraction Compensation" by Jeongguk Lee, Yunseok Choi, Han-Sol Lee, Eundoo Heo, Dongpan Lim, Geunyoung Lee, and Seongwook Song presented at EI conference in January 2021.Canon to support news media at Tokyo 2020 Games, releases photos of on-location service center aiming for “Zero Downtime”
IDTechEx Forecasts Event-Based Sensor Sales of $20M in 10 Years from Now
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PRNewswire: IDTechEx analyst Matt Dyson says: "IDTechEx forecast the market for the event-based vision sensor chips alone rising from its primarily pre-revenue status today to $20 million per year over the next 10 years. Furthermore, much of the value is likely to be captured by the software facilitated by event-based vision hardware, leading to a much greater total market."IDTechEx Forecasts Event-Based Sensor Sales of $20M in 10 Years from Now
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PRNewswire: IDTechEx analyst Matt Dyson says: "IDTechEx forecast the market for the event-based vision sensor chips alone rising from its primarily pre-revenue status today to $20 million per year over the next 10 years. Furthermore, much of the value is likely to be captured by the software facilitated by event-based vision hardware, leading to a much greater total market."Canon announces award winners for its New Cosmos of Photography 2021 (44th edition) photo competition
Canon’s activities lead to the removal of 4,691 listings from Amazon in Germany, Italy, Spain, the United Kingdom, France, The Netherlands and Turkey
199 listings removed from Amazon in Canada and the United States of America after Canon files infringement reports
Ams Releases NanEyeM Module
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3D-Stacked SPAD Image Sensor
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University of Edinburgh, University of Glasgow, and Heriot-Watt University publish a SPIE paper "High-speed vision with a 3D-stacked SPAD image sensor" by Istvan Gyongy, Germán Mora Martín, Alex Turpin, Alice Ruget, Abderrahim Halimi, Robert Henderson, and Jonathan Leach.ON Semi Announces 16MP Global Shutter Sensor for Machine Vision Applications
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BusinessWire: ON Semiconductor expands its XGS series of CMOS sensors. The XGS 16000 is a 16MP global shutter sensor for factory automation applications including robotics and inspection systems. Consuming 1W at 65fps, the XGS 16000 is said to be one of the best in class for power consumption, among 29 x 29 mm sensors.
The XGS 16000 shares a common architecture and footprint with other XGS CMOS image sensors. This enables manufacturers to use a single camera design to develop products in different resolutions.
The XGS 16000 is designed in a unique 1:1 square aspect ratio, which helps maximize the image capture area within the optical circle of the camera lens and ensure optimal light sensitivity.
ON Semi offers color and mono versions of the XGS 16000 X-Cube and X-Celerator developer kits.
Sharp Image Sensor Lineup
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2021 Sharp catalog reveals that its image sensor linup is still dominated by CCDs, although CMOS sensors section is expanding. Sharp CCDs are quite fast by CCD standards with 8MP one reaching 25fps frame rate:e2v iToF Sensor Demos
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Teledyne e2v publishes 3 video demos of its iToF Hydra3D sensor announced a year ago (1, 2, 3):
Photomultiplication in NIR Organic Diodes
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Nature publishes a paper "Enhancing sub-bandgap external quantum efficiency by photomultiplication for narrowband organic near-infrared photodetectors" by Jonas Kublitski, Axel Fischer, Shen Xing, Lukasz Baisinger, Eva Bittrich, Donato Spoltore, Johannes Benduhn, Koen Vandewal, and Karl Leo from Technische Universität Dresden (Germany), Leibniz-Institut für Polymerforschung Dresden (Germany) and Hasselt University (Belgium).Canon announces conclusion of toner supply container-related patent infringement disputes in U.S. International Trade Commission and in U.S. District Court
FBK on SPAD IR Sensitivity Enhancement
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FBK presents "NIR-sensitive single-photon devices (SiPM and SPADs in custom technologies), for industrial and automotive LIDAR applications" by Fabio Acerbi, G. Paternoster, A. Mazzi, A. Gola, and L. Ferrario:Elmos iToF Presentation
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Elmos publishes a slide deck "3D ToF sensor design and it‘s application in gesture and object recognition" by Sarah Blumenthal:Canon PowerShot G1 retro review
ST Presentation on Pixel-Level Stacking
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ST presentation "Challenges and capabilities of 3D integration in CMOS imaging sensors" by Dominique Thomas, Jean Michailos, Krysten Rochereau, Joris Jourdon, and Sandrine Lhostis presents the company's achievements up to September 2019:A (Wrong) Attempt to Improve Imaging
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University of Glasgow and University of Edinburgh publish a paper "Noise characteristics with CMOS sensor array scaling" by Claudio Accarino, Valerio F. Annese, Boon Chong Cheah, Mohammed A. Al-Rawhania, Yash D. Shaha, James Beeley, Christos Giagkoulovitis, Srinjoy Mitra, David R.S.Cumming. The paper compares SNR of a large single sensor with an array of smaller sensors having the same combined area. The conclusion looks fairly strange:More about Sony-TSMC Fab in Japan
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NikkeiAsia, TaiwanNews: The planned TSMC fab in Kumamoto, on the island of Kyushu in western Japan, would go forward in two phases, according to Nikkei Asia. The board of TSMC is expected to decide on the investment in the current quarter.Image Sensors at In-Person Autosens Brussels
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Austosens Brussels is to be held in in-person (!!!) on September 15-16. The agenda has been published and includes a lot of image sensor related stuff:- Sensor technology and safety features to address the challenging needs for reliable and robust sensing/viewing systemsYuichi Motohasi, Automotive Image Sensor Applications Engineer, SonyIn this presentation, the key characteristics of the image sensors will be presented. Also, the state-of-the-art of functional safety and cybersecurity requirement to achieve reliable and robust sensing/viewing system will be discussed.
- Beyond the Visible: SWIR Enhanced Gated Depth Imaging
Ziv Livne, CBO, TriEye
We will introduce a new and exciting SWIR-based sensor modality which provides HD imaging and ranging information in all conditions (“SEDAR”). How it works, its main benefits, and why it is the future. We will then show experimental evidence of SEDAR superiority over sensors of other wavelengths. These include recordings in difficult conditions such as nighttime, fog, glare, dust, and more. Also, show depth map field results. - Automotive 2.1 µm High Dynamic Range Image SensorsSergey Velichko, Sr. Manager, ASD Technology and Product Strategy, ON Semiconductor
This work describes a first generation 8.3 Mega-Pixel (MP) 2.1 µm dual conversion gain (DCG) pixel image sensor developed and released to the market. The sensor has high dynamic range (HDR) up to 140 dB and cinematographic image quality. Non-bayer color filter arrays improve low light performance significantly for front and surround Advanced Driver Assistance System (ADAS) cameras. This enables transitioning from level 2 to level 3 autonomous driving (AD) and fulfilling challenging Euro NCAP requirements. - High Dynamic Range Backside Illuminated Voltage Mode Global Shutter CIS for in Cabin MonitoringBoyd Fowler, CTO, OmniVision TechnologiesAlthough global shutter operation is required to minimize motion artifacts in in-cabin monitoring, it forces large changes in the CIS architecture. Most global shutter CMOS image sensors available in the market today have larger pixels and lower dynamic range than rolling shutter image sensors. This adversely impacts their size/cost and performance under different lighting conditions. In this paper we describe the architecture and operation of backside illuminated voltage mode global shutter pixels. We also describe how the dynamic range of these pixels can be extended using either multiple integration times or LOFIC techniques. In addition, how backside illuminated voltage mode global shutter pixels can be scaled, enabling smaller more cost effective camera solutions and results from recent backside illuminated voltage mode global shutter CIS will be presented.
- Chip-scale LiDAR for affordability and manufacturabilityDongjae Shin, Principal researcher, Samsung Advanced Institute of TechnologyIn this presentation, we introduce a chip-scale solid-state LiDAR technology promising the cost and manufacturability advantages inherited from the silicon technology. The challenge of the light source integration has been overcome by the III/V-on-silicon technology that has just emerged in the silicon industry. With the III/V-on-silicon chip in the core, initial LiDAR module performance, performance scalability, and application status are presented for the first time. Cost-volume analysis and eco-system implications are also discussed.
- A novel scoring methodology and tool for assessing LiDAR performance
Dima Sosnovsky, Principal System Architect, Huawei
This presentation presents a tool, which summarizes the most crucial characteristics and provides a common ground to compare each solution's pros and cons, by drawing a scoring envelope based on 8 major parameters of the LiDAR system, representing its performance, suitability to an automotive application, and business advantages.
Assorted Videos: Omnivision, Aeye, Qualcomm, MIPI
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Omnivision continues its series of video interviews with its CTO Boyd Fowler. This part is about LED flicker mitigation:Canon RF 400mm f2.8L RF 600mm f4L review
Luminar Acquires InGaAs Sensor Manufacturer
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BusinessWire: LiDAR maker Luminar is acquiring its exclusive InGaAs chip design partner and manufacturer, OptoGration Inc., securing supply chain as Luminar scales Iris LiDAR into series production. The acquisition secures a key part of Luminar’s supply chain and enables deeper integration with its ROIC design subsidiary Black Forest Engineering (BFE), which Luminar acquired in 2017. Luminar is combining the latest technology from Optogration and BFE to power its new fifth-generation lidar chip in Iris as the company prepares for series production of its product and technology.Optical Neural Processor Integrated onto Image Sensor
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Metasurface-based optical CNNs start to be a hot topic for papers and presentations, for example, here and here. Another metasurface CNN example by Aydogan Ozcan from UCLA is shown in the video below:Event-Based Camera Tutorial
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Tobi Delbruck delivers an excellent tutorial on event-based cameras prepared for the 2020 Telluride Neuromorphic workshop and ESSCIRC. The pdf file with slides is available here.Graphene and Other 2D Materials Sensors Review
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Nature publishes a review paper "Silicon/2D-material photodetectors: from near-infrared to mid-infrared" by Chaoyue Liu, Jingshu Guo, Laiwen Yu, Jiang Li, Ming Zhang, Huan Li, Yaocheng Shi & Daoxin Dai from Zhejiang University, China.