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InVisage announces an advance screening of its new short film, “Prix,” at the Mill Valley Film Festival. “Prix” was produced on a smartphone image sensor with InVisage’s QuantumFilm technology, and demonstrates for the first time an expanded dynamic range mode called QuantumCinema.

QuantumCinema is a capability specific to InVisage’s QuantumFilm camera sensor that allows for more details to be captured simultaneously in both low and bright light. Conventional digital image sensors rely on silicon to sense light linearly and therefore saturate when too much light enters the sensor. In contrast, photochemical film has a non-linear response that can preserve details in more extreme light conditions. With the greater shift from film to digital cameras, digital camera users have had to compromise on dynamic range in exchange for convenience. QuantumFilm sensors, however, behave more like film in that they also have a non-linear response to light, which allows for the expanded dynamic range of QuantumCinema. The screening of “Prix” will mark the first time footage taken in QuantumCinema mode is shown to the public.

“InVisage is bringing amazing cinema-quality images to smartphones and mobile devices,” said InVisage President and CEO Jess Lee. “With this panel and the worldwide release of ‘Prix,’ we’re kicking off a broader conversation on the huge impact camera technologies have had on film and will continue to have in future.”

The company publishes its Prix cinema trailer on Youtube:



Invision's Facebook page has a nice collection behind the scene pictures:

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CNES, ESA, AIRBUS DEFENCE & SPACE, THALES ALENIA SPACE, SODERN co-sponsor the 4th Toulouse CMOS image sensors workshop “CMOS Image Sensors for high erformance applications,” to be held in Toulouse, France on November 18-19, 2015. The free of charge mandatory workshop registration is open on its web site. The program is quite large for a 2 day event:

SESSION 1 CMOS FOR SPACE APPLICATIONS:

The Status of ESA supported Visible and NIR/SWIR CMOS Image Sensor developments
N. Nelms, European Space Agency.

Space qualification of the CIS115, a 3 MPixel CMOS APS for the JANUS camera on Jupiter Icy Moon Explorer
M.Soman, E. Allanwood, A. Holland, M. Leese, J. Gow, K. Stefanov, Centre for Electronic Imaging, Open University.
H. Michaelis, German Aerospace Center (DLR), Institute of Planetary Research.

Highly integrated, backside illuminated CMOS image sensor for EnMAP VNIR camera
M. Mücke, C. Neumann, F. Gansmann, B. Sang, OHB System AG
H. Venus, A. Eckardt, R. Reulke, DLR Institute of Optical Sensor

SESSION 2 CMOS TDI:

CNES CMOS Roadmap and new results in CCD-on-CMOS Test Chip for TDI applications
C. Virmontois, A. Materne, CNES, B. Patin, Sophia Conseil

An Innovative Large Scale Linear CMOS Image Sensor Architecture
MY. Yeh, M. Huang, Jer Ling, National Space Organization(NSPO)

2nd Generation CMOS Charge Transfer TDI: Results on Proton Irradiation
F. Mayer, F. Barbier, J. Endicott, e2v semiconductors,
J. Rushton, K. Stefanov, Open University

Backside illuminated CMOS-TDI image sensor for space applications
N.Ben-Ari, O. Cohen, E. Ilan, S. Elkind, I. Nevo, R. Talmor, N. Shiloah, Y. Chaham, O. Cohen, G. Zohar and R. Dobromislin, SemiConductor Devices (SCD)

Time Delay Integration embedded CCD platform development
P.Boulenc, J. Robbelein, L. Haspeslagh, M. Rosmeulen, L. Wu, S. Terryn, V. Malandruccolo, J. Borremans, P. De Moor, IMEC

SESSION 3 LOW NOISE, HIGH DYNAMIC RANGE:

Low temperature measurements of a large-area, backthinned, and low-noise CMOS sensors
S.Johnson, J. Pratlong, A. Ibrahim, P. Jerram, P. Jorden, e2v technologies
S. Wang and M. Lehner, ASIAA

PERCIVAL: A Back Side Illuminated, Wafer Scale, Low Noise CMOS Image Sensor for the Detection of Low Energy X-Rays
I. Sedgwick on behalf of the PERCIVAL Collaboration (DESY, DLS, Elettra, PAL, RAL)

High Dynamic Range technics for SUPERCAM Remote Micro Imager
A. Toulemont, C. Virmontois, A. Bardoux, CNES

A 120dB dynamic range image sensor with single readout using in pixel HDR
J. Caranana, Pyxalis

QLog – Single Electron Detection Capable Logarithmic CMOS Pixel
Y. NI, New Imaging Technologies SA

SESSION 4 RADIATIONS & IN-FLIGHT HERITAGE:

Radiation results obtained from the CMOS sensor designed for FCI-VisDa detector
R. Simpson, N. Swift, J. Pratlong, A. Pike, P. Jerram, e2v.

Single Event Upset Sensitivity of D-Flip Flop in Infrared Image Sensors for Low Temperature Applications
L. Artola, G. Hubert, ONERA, O. Gilard, M. Boutillier, B. Baradat, CNES
S. Ducret, F. Perrier, N. Ricard, Sofradir, P. Garcia, G. Vignon, TRAD

Examination on long term variation of nonlinearity for GOCI CMOS image sensor
G. Kang, S. Shin, S. Yong, Korean Aerospace Research Institute
P. Coste, P. Luquet, Airbus Defence & Space

SESSION 5 LANDSCAPE OF EUROPEAN FOUNDRIES:

Integration of high-performance optical detection devices in a standard 0.35µm CMOS Process
W. Brockherde, Fraunhofer IMS

IMEC’s offering for space imagers
P. De Moor, IMEC

STMicroelectronics Imaging premium foundry offering for a strong European Imaging industry
C. Gachon, T. Lachaud, STMicroelectronics

SESSION 6 CMOS for INFRA-RED DETECTION:

Digital Focal Plane arrays for Enhanced Cooled Infrared Detectors Performances
G.Decaens, V. Badet, L. Baud, F. Advent, P. Mejean, A. Maltere, S. Aufranc, G. Chalet, R. Cotte, S. Parola, N. Ricard, SOFRADIR

Continuous improvements of ROIC design for space infrared applications
N.Ricard, P. Maillart, G. Decaens, L. Baud, F. Advent, F. Salvetti, A. Maltere, S. Aufranc, SOFRADIR

NIRCA cryogenic test results for focal plane array detectors
P.Påhlsson, D. Meier, H. K. Otnes Berge, P. Øya, D. Steenari, A. Olsen, A. Hasanbegovic, M. A. Altan, B. Najafiuchevler, J. Talebi, S. Azman, C. Gheorghe, T. M. Johansen, J. Ackermann, G. Mæhlum, Integrated Detector Electronics AS

Image Signal Processor for bolometers IR detectors
F. Bonnaire, P. Robert, T.Rahaga, ULIS

TUTORIAL:

The Pinned Photodiode
by Nobukazu Teranishi (University of Hyogo / Shizuoka University)
Winner of the 2013 J.J. Ebers Award, and 2013 Yamazaki-Teiichi Prize in the field of semiconductors and semiconductor devices for the Development of Image Sensors with Pinned Photodiode

SESSION 7 PIXEL ARCHITECTURES & PERFORMANCE:

Creapyx: An innovative pixel evaluation platform
J. Michelot, PYXALIS

Dark Current Blooming in Pinned Photodiode CMOS Image Sensors
J.-M. Belloir, ISAE, CNES, CEA, J.-B. Lincelles, ISAE, ADS, A. Pelamatti, CNES, ADS
V. Goiffon, P. Magnan, ISAE, C. Virmontois, O. Gilard, CNES, P. Paillet, CEA DAM

On the CMOS Pixel Based on the Deep Trapping Gate Principle: Prospects and Challenges
N.T. Fourches, CEA

SESSION 8 PROCESS:

UV-White-Yellow Bayer-like pattern imager
B.Dierickx, Q.Yao, J.Zhu, P.Coppejans, R.Zhang, G.Cai, P.Gao, B.Luyssaert, B.Spinnewyn, Caeleste

Design and integration of planar lenses dedicated to Near Infrared detection (1,064 µm) for CMOS image sensors
T.Lopez, S. Massenot, M. Estribeau, P. Magnan, Institut Superieur de l'Aeronautique et de l'Espace (ISAE-SUPAERO) JL. Pelouard, Laboratoire de Photonique et de Nanostructures (LPN-CNRS)

Integrated diffractive optics for pixel performance enhancement
V. Rochus, S. Guerrieri, J. Van Olmen, V. Paraschiv, I. De Wolf, P. De Moor and X. Rottenberg, IMEC

Low dark current backside illuminated CMOS image sensors for high performance applications
S.Lavizzari, S. Guerrieri, C. Kerner and L. Haspeslagh, IMEC

Exploration of high density interconnect 3D stacking for SPAD arrays
V. Lalucaa, P. Martin-Gonthier, S. Rolando, F. Raymundo, P. Magnan, Institut Superieur de l'Aeronautique et de l'Espace (ISAE-SUPAERO)

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Tokyo, Japan-based Komamura Corp. offers a color night vision camera under Falcon Eye brand. The company's brochure and the FAQ offers quite a lot of info about the KClux image sensor in it:

"The Falcon Eye cameras do not work with IR illumination or an image intensifier unit as most night vision equipment does.

The Falcon Eye cameras are build with a new type of CMOS sensor and combined with the advanced electronics and image controlling software it has been possible to create this unique system with a light sensitivity way beyond what other night vision systems can deliver.

The proprietary KClux CMOS sensor and KCnoise 2D/3D noise reduction technologies are the secrets behind the revolutionary KC-2000 cameras.

High quality viewing, video recording and photo capturing during day and night with ISO 2,000,000. Can even record through dark tinted glass.

All parts 100% designed, manufactured and assembled in Japan including sensor, housing, and optics."


And then, Falcon Eye cameras have a dedicated Youtube channel with many video demos:





Thanks to BC for the info!

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EETimes: Chronocam AS (Paris, France) is a 2014 spin-off of University Pierre et Marie Curie and University of Vienna. The startup is based on 15-year long research on asynchronous image sensors.

"The initial image sensor is QVGA resolution (320 by 240 pixels) with a pixel size of 30-microns on a side and sampling circuit alongside each pixel. The sensor is not clocked and does not send frames of data, said Christop Posch, chief technology officer. Each of the pixels in the array acts independently and sends information that is time-based. In addition, the pixel only sends information when there is a significant change. The result is scene-dependent data compression that results in time-continuous but sparse stream of events sent over an asynchronous data bus. Chronocam calls the technology CCAM EyeOT.

Combined performance figures include up-date speeds equivalent to 100k frames per second, a dynamic range of greater than 120dB. The video compression is a factor of 100 up from conventional image sensors and a power consumption of less than 10mW."

The first sensor uses UMC process, and has a size of 1cm by 0.8cm. The company is working on the pixel size reduction.


The company fundings include ones of €750,000 from Robert Bosch Venture Capital and CEA Investissement.

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Rambus paper "Ultra-miniature, computationally efficient diffractive visual-bar-position sensor" by Mehjabin Monjur, Leonidas Spinoulas, Patrick R. Gill and David G. Stork presented at SENSORCOMM 2015 in Italy, wins "Best Paper Award."

“Computationally efficient algorithms then process this sensed information to yield an accurate estimate of the position of the bar. The optical grating is very small (120 μm diameter), has large angle of view (140◦), and extremely large depth of field (0.5 mm to infinity). The design of this sensor demonstrates the power of end-to-end optimization (optics and digital processing) for high accuracy and very low computational cost in a new class of ultra- miniature computational sensors.”

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i-Micronews: Yole Developpement analysts Pierre Cambou and Guillaume Girardin wrote an analysis of iPhone 6s and 6s Plus camera technology. Their conclusion is that Apple camera module team becomes less innovative over time:

"We’ll have to wait another year for the iPhone’s big hardware update. Video is the new innovation paradigm, followed most likely by 3D imaging within a few years. Now that the competition is closing in on Apple’s proposition, Apple must make a significant technological leap forward. Our take on this is that such a leap is definitely possible, and even underway. It could involve the Linx technology Apple acquired last year, the integration of STMicroelectronics’ laser ranging technology, and probably even more..."

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Melexis signs a licensing agreement with Sony to keep using Softkinetic technology in its automotive ToF sensors. Melexis has been Softkinetic licensee for a number of years for products such as the MLX75023, said to be the world’s first automotive ToF sensor in production.

Now, Melexis will collaborate with Sony to further expand this technology. The products derived from this collaboration will be fabricated at Sony’s world-class wafer fabrication facility in image sensor technology and support its offering in the area of gesture recognition.

Francoise Chombar, CEO Melexis, comments: “The combination of Sony's superior image sensor technology and our year-long automotive sensor know-how and experience provides an exciting new platform for enhancing the Time-of-Flight technology. This innovative technology could change dramatically the way drivers communicate with their vehicles. No more touch screens or knobs, but a simple gesture might suffice in the future.”

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BusinessWire: ON Semiconductor is collaborating with GainSpan and GEO Semiconductor to rapidly respond to the growing potential of the Internet of Things (IoT). Through this partnership, customers will benefit from the leadership each company has shown in its respective field: ON Semiconductor’s advanced and expansive portfolio of image sensors, GEO’s highly cost-effective and power efficient image signal processing technology, and GainSpan’s expertise in low power Wi-Fi solutions.

A highly optimized IoT video reference design based on AR0330 image sensor is the trio’s first collaboration. The GS-AR0330-Based Full HD Video, available via GainSpan and its distributors, targets smart 1080p video streaming over Wi-Fi.

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BusinessWire: Toshiba launches T4KE1, a near-infrared 2.1MP BSI sensor that supports iris recognition on mobile devices. Sample shipments start today.

T4KE1 is a 2.1 MP 1.12um BSI CMOS image sensor with a 1/7.3 inch optical format and 60fps at 1080p image output. The new sensor captures images for recognition with higher sensitivity than conventional CMOS image sensors, as it discards the usual color filter in the pixel structure, increasing sensitivity in the near infrared spectrum.


PRNewswire: "This is an exciting time for the image sensor business, as new applications and technologies are affording electronics manufacturers wider opportunities for improving their devices' capabilities," said Andrew Burt, VP of the Image Sensor Business Unit, System LSI Group at TAEC. "Toshiba is helping device makers meet these growing requirements by continually introducing innovative technology into our CMOS image sensor family, such as the NIR iris recognition in our new T4KE1."

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Sony has completed the acquisition of Softkinetic Systems S.A., after reaching an agreement with the company and its major shareholders. With this acquisition, Softkinetic - which possesses ToF image sensor technology, as well as related systems and software - has become a wholly-owned subsidiary of Sony.

Sony will focus on combining Softkinetic's ToF range image sensor technology expertise with its own technologies with the aim of developing the next generation of range image sensors and solutions, not only in the field of imaging, but for broader sensing-related applications as well.

Overview of Softkinetic Systems S.A.

Headquarters: Brussels, Belgium
Employees: 77
Business offices: Brussels, Belgium; Sunnyvale, CA, USA
Primary areas of business:

• Development and licensing of ToF range image sensors
• Development and licensing of range imaging software, such as for range image signal processing and gesture recognition
• Development of ToF range image sensor modules and reference designs

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The latest crop of SPI color night vision videos specifically states that they are shot at starlight with now moon. The first video uses 50mm F1.2 lens:



The second video was shot with 80mm F1.4 lens:

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Light Co. introduces its first multi-aperture camera product. The L16 camera will retail for $1,699 and ship in late summer 2016. A limited quantity will be available for pre-order through November 6, 2015 at a special price of $1,299. The camera offers:

• Adjust focus and depth of field even after a photo is taken, all the way to f/1.2
• Built-in 35-150mm true optical zoom
• Exceptional low light performance
• Low image noise
• 3 fast prime lenses
• DSLR quality images up to 52MP

The company's Vimeo video talks about the camera design:




Update: Imaging Resource adds few more details about the L16 camera:

"L16 packs in sixteen 13-megapixel camera modules at three different focal lengths – 35mm (5), 70mm (5) and 150mm (6) – for a total of 52-megapixels. Each of these modules captures an individual image, which is then stitched together via software to yield a photo that Light claims is equal to the quality of a DSLR with a large lens attached."

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PRNewswire: Cadence Tensilica Vision P5 processor core offers up to 13X performance boost, with an average of 5X less energy usage on vision tasks compared to the previous generation IVP-EP imaging and video DSP. The Vision P5 DSP is built from the ground up for applications requiring ultra-high memory and operation parallelism to support complex vision processing at high resolution and high frame rates. It is aimed to off-loading vision and imaging functions from the main CPU to increase throughput and reduce power. End-user applications that can benefit from the DSP's capabilities include image and video enhancement, stereo and 3D imaging, depth map processing, robotic vision, face detection and authentication, augmented reality, object tracking, object avoidance and advanced noise reduction.

The Vision P5 core includes an expanded and optimized Instruction Set Architecture (ISA) targeting mobile, ADAS (which includes pedestrian detection, traffic sign recognition, lane tracking, adaptive cruise control, and accident avoidance) and IoT systems.

The Vision P5 core includes these new features:

• Wide 1024-bit memory interface with SuperGather technology for maximum performance on the complex data patterns of vision processing
• Up to 4 vector ALU operations per cycle, each with up to 64-way data parallelism
• Up to 5 instructions issued per cycle from 128-bit wide instruction delivering increased operation parallelism
• Enhanced 8-,16- and 32-bit ISA tuned for vision/imaging applications
• Optional 16-way IEEE single-precision vector floating-point processing unit delivering a massive 32GFLOPs at 1GHz

EETimes believes that such kind of a processor could increase the number of cameras in smartphone from 2 to 4.

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CCTV News quotes IHS analyst Brian O'Rourke giving Sony image sensor market share numbers for Q2 2015:


Sony image sensor business spin-off is called "both expected and surprising at the same time. Over the past two years, Sony has spun out its audio and video business (February 2015), and its TV and PC businesses (February 2014). However, the semiconductor spin out is different. While the TV, PC and A/V businesses had been struggling to some extent with increased competition and a slow-growing world economy, the semiconductor business has generated a significant amount of Sony's recent revenues and profitability. The semiconductor business is highlighted by image sensors, a historically successful and profitable business for Sony.
...
Today, it dominates the CMOS image sensor business, with Q2 2015 revenues of slightly over USD1 billion, good for over 42% of the worldwide market, nearly three times the revenue of its closest competitor, Samsung Electronics.
...
Why interfere with a good thing? The current Sony corporate structure seemed to be working well enough to ensure image sensor success. How will the new Sony Semiconductor Solutions benefit the image sensor business? The answer may be in simplifying a corporate structure so that Sony can react more rapidly."

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PRNewswire: OmniVision received a notice from the Committee on Foreign Investment in the United States ("CFIUS") that it has concluded its review of the proposed acquisition of OmniVision by a consortium composed of Hua Capital Management Co., Ltd., CITIC Capital Holdings Limited, and GoldStone Investment Co., Ltd., and determined that there are no unresolved national security concerns with respect to the proposed acquisition. OmniVision expects the proposed acquisition to close in the third or fourth fiscal quarter of fiscal year 2016.

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Reuters, Bloomberg: Sony announces that it will establish Sony Semiconductor Solutions Corporation ("Sony Semiconductor Solutions") to further reinforce this business, and concentrate on sustained growth in image sensors, its primary business focus. R&D, business control, sales and other operations related to the semiconductor business, which are currently overseen by business groups and R&D units within Sony Corporation, will be transferred to Sony Semiconductor Solutions. The new company will aim to commence operations on April 1, 2016. In February 2015, Sony outlined its intention to sequentially split out the business units currently within Sony Corporation and operate them alongside existing Sony Group companies. The aim of these measures is to ensure clearly attributable accountability and responsibility from the perspective of shareholders, management policies with an emphasis on sustainable profit generation, and the acceleration of decision-making processes and reinforcement of business competitiveness. The decision to establish Sony Semiconductor Solutions forms part of this strategy.

Terushi Shimizu, currently Deputy President, Device Solutions Business Group, Sony Corporation, is expected to be appointed President, Sony Semiconductor Solutions. Sony Semiconductor Corporation (President: Yasuhiro Ueda) and Sony LSI Design Inc. (President: Makoto Ishii), which cover Sony's semiconductor manufacturing and design operations respectively, will become subsidiaries of Sony Semiconductor Solutions.

The Devices segment, including Sony Semiconductor Solutions, battery and storage media businesses, will continue to be overseen by Tomoyuki Suzuki, Executive Deputy President and Corporate Executive Officer, Sony Corporation.

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PRNewswire: LensVector announces that its liquid crystal autofocus lens, LV4522, has made its retail debut through a partnership with Sunny Opotech and Vital Mobile.

LV4522 uses proprietary technology to transform a liquid crystal cell into a variable focus lens, said to consume about 80% less power than the traditional mechanical lens currently used in mobile devices. Since the device does not use any moving parts, manufacturing LV4522 costs about half as much as it does to manufacture voice-coil motors and is inherently more reliable. Additionally, each module is seamlessly integrated into each smartphone, not requiring individual adjustment or tuning by the handset manufacturer.

LensVector has made initial shipments though its partnership with production partner Sunny Optical to Vital Mobile, which is currently selling LV4522-enabled phones in Taiwan, Bangladesh and India under the Karbonn brand.

As LV4522 ships, LensVector is preparing to ship its next-generation lens by year's end, which provides dramatically higher image resolution, twice the focusing speed of most mechanical lenses, and a minimum focus distance of just 5cm, half the distance of most existing lenses used in mobile devices.

The current lens and the next-generation lens are based on patented technology that transforms a liquid crystal cell into a variable focus lens using small electrical charges to dynamically change the refractive index of the lens material:

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The pco.flim camera system is said to be the first standard product for luminescence lifetime imaging using a two tap CMOS sensor. The camera can internally generate a wide range of frequencies and also accepts external modulation signals.

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The Edinburgh Reporter: Photon Force Ltd. formed at the University of Edinburgh has won 2015 Converge Challenge Award – Scotland’s premier company creation competition jointly funded by the Scottish Funding Council and Scotland’s eight research-intensive universities. Photon Force Ltd. was founded by Richard Walker, a Post Doctorate Research Fellow at the University of Edinburgh’s School of Engineering. Richard received £35,000 to start his business plus a further £25,000 in business support from a number of commercial and professional services organisations.

Photon Force Ltd designs, builds and supplies scientific sensors that can very precisely detect and measure single photons. While this technology is in high demand for many applications, such as biomedical imaging, Richard identified that current systems are bulky, slow and restrictive. Photon Force has developed an integrated image sensor solution which will deliver significant competitive advantage with respect to incumbent systems.

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PRNewswire: Socionext, the company created by merging of Fujitsu and Panasonic semiconductor businesses, announces a volume production of MB86S29, a 'camera front engine' specialized for Bayer data processing with new functions supporting the latest image sensors.

The MB86S29 is the newest Milbeaut Image Processor for smartphones. By accommodating new functionalities of the latest image sensors, the MB86S29 lets module makers implement these functions without replacing their application processors.

Recently, it is common to find cameras in smartphones or other mobile devices that are configured with application processors (AP) equipped with built-in ISP functionalities. These APs can directly process output from image sensors, and help reduce the footprint and cost of camera modules. The MB86S29 supports this trend as a "Camera Front Engine" that replaces conventional ISPs. Connected in between an image sensor and an AP, it is specialized for Bayer data processing, so users can configure their APs with the same interface directory connected to image sensors, and to make full use of PDAF and HDR.

The MB86S29 has 4 lanes each of 2.1Gbps MIPI Rx / Tx. It can process 16MP images at 30 fps. It is also applicable for noise reduction, shading correction, and 3A (AE / AF / AWB) detection. It is available in the smallest package of any member of the Milbeaut series, at 4mm x 4mm.

The MB86S29 has been designed to utilize "Hybrid AF", which combines the accuracy of contrast AF and the speed of phase detect AF, enabling maximum 4x faster AF, in comparison with the previous Milbeaut products. Low power consumption is just 310mW when processing phase detect AF.


The MB86S29 also supports Sensor HDR. Conventional HDR imaging, which generates a picture from multiple frames taken with different exposures, has disadvantages, such as image blurs caused by the difference between the frames, and time needed to take those multiple frames. The MB86S29 can process data with different exposure settings within one image so it can process the HDR images with higher visibility in 16MP, at the speed of 30 fps.


MB86S29 Specifications

• 16MP at 30fps, Bayer Output
• Compatible with PDAF Sensors
• Compatible with Sensor HDR
• Defective Pixel Correction (including pixels for PDAF)
• Shading Correction
• Package: 4mm x 4mm
• MIPI-Rx: 4 lanes (2.1Gbps) + 2 lanes (1.5Gbps)
• MIPI-Tx: 4 lans (2.1Gbps)
• Dual ARM processor Core

The new MB86S29 is available for $3.00 each when purchased in volume quantities of 5 Million pieces or more.

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BusinessWire: Toshiba announces that it has developed a new 2MP CMOS sensor for automotive cameras, CSA02M00PB, equipped with the industry’s first LED flicker mitigation function (first for 2MP sensors). Sample shipments start in March, 2016.

The new 2MP sensor is equipped with Toshiba’s original LED flicker (pulsed LED) mitigation circuit to minimize image flicker caused by LED light sources. When recording LED traffic lights and signs with conventional CMOS sensors, the output images often flickers, preventing an accurate sensing function. Toshiba’s new sensor mitigates the flicker and delivers clear images for faster, more accurate image sensing.

The sensor also adopts Toshiba’s original next-generation HDR system and BSI process. Toshiba’s next-generation HDR system uses the company’s single frame method for clear images free of the degraded resolution and blown-out highlights typical of high contrast-light conditions. Later in the PR, Toshiba talks about different exposure times in a frame: "The maximum frame rate may change per operating conditions specified. Exposure condition 1 assumes 2 different exposure times in a frame; exposure condition 2 assumes 3."

The BSI process is said to be first brought to automotive image sensors by Toshiba. In July 2015, ON Semi too announced its automotive BSI sensor.

The new sensor integrates functions to meet the requirements of ASIL, the Automotive Safety Integrity Level intended to protect life, and supports failure detection, report flagging and control of vehicles. It is also compliant with AEC-Q100 (Grade 2) and is suited both for front end sensing cameras for the ADAS and the latest viewing applications, such as e-Mirror and CMS (Camera Monitor System).

Toshiba foresees three-fold growth in the automotive CMOS image sensor market in the period to 2020. Toshiba will continue to develop its automotive CMOS sensor business to fully meet expanding market requirements.

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Edoardo Charbon is promoted to a Full Professor of Microtechnology in the School of Engineering (STI) at EPFL:

"Edoardo Charbon is an internationally recognised leader in the field of photosensors, especially single-photon avalanche diodes. By combining applied physics with electrical engineering he has achieved groundbreaking successes in the production of photon counters for large-format sensors. His findings have resulted in important advances in areas such as medical imaging, particularly positron emission tomography. In addition to his academic excellence, Edoardo Charbon will contribute his experience in teaching and technology transfer to EPFL."

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Orbbec presents Astra Pro, a 3D camera with 720p high-definition color, and Persee, said to be the world’s first 3D camera with a fully functioning computer. The devices are first available to supporters of the Orbbec Indiegogo campaign. The Indiegogo campaign will raise funds to mass produce and ship Astra Pro by the end of the year and Persee in early 2016. The cameras have been pre-announced in May 2015.

“We believe that the future of computing is 3D and all consumer devices will include 3D cameras in the near future,” said Yuanhao (Howard) Huang, founder and CEO of Orbbec. “Achieving this vision requires superb 3D cameras that are affordably priced and universally available. It also requires a world-class hardware and development platform, which we are delivering with Orbbec Persee.”

Orbbec camera features:

• Highest Resolution – With smoother gradients, precise contours, and the ability to filter out low-quality depth pixels in a way other cameras cannot, Orbbec 3D cameras are suitable for 3D scanning and point cloud development.
• Longest Range – With a range of 0.4m - 8m, Orbbec 3D cameras are intended for a wide range of scenarios, including gesture control, robotics, 3D scanning, and many new areas.
• Exceptional Accuracy – Orbbec 3D cameras offer depth measurement accurate to within 0.5 centimeters at a distance of 2 meters.
• Lowest Latency –Astra Pro is said to be the most responsive 3D camera on the market today.

So far, Orbbec published two patent applications on its 3D camera design: WO2014135127 and WO2014135128. The English abstract of the later application "DYNAMIC PHASE ACQUIRING DEVICE" by HUANG Yuanhao says:


"Provided is a dynamic phase acquiring device, comprising: a light-acquisition port (1), a semi-reflective semi-transmitting lens (2), a phase shifter (3), a polarizer (4), a planar mirror (5), a photo-sensitive element (6), and a phase processor (7); the acquired light passes through the light-acquisition port and reaches the semi-reflective semi-transmitting lens, and then follows two paths: one path sequentially passes through the phase shifter, the polarizer, and the photo-sensitive element, forming a first image; the other path is reflected by the planar mirror and then directly passes through the polarizer and reaches the photo-sensitive element, forming a second image; the pixels of the first image are in one-to-one correspondence with the pixels of the second image; the photo-sensitive element is connected to the phase processor; the photo-sensitive element transmits the first and second images to the phase processor, and the phase processor generates phase data; the phase shifter provides phase lead or phase lag ranging from 1 degree to 20 degrees. By using the phase shifter to provide a lead or a lag by a small angle, such as from 1 to 20 degrees, or even from 5 to 10 degrees, phase data can be obtained via two-path image detection, thus eliminating the need for optical elements for at least one path detection, and thereby simplifying the structure and reducing costs."

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SeekingAlpha predicts that Cambridge Mechatronics smart alloy OIS actuators (SMA) is set to benefit from mass adoption of OIS in smartphones. The main sign is that its manufacturing Cambridge Mechatronics with Hutchinson Technology have partnered with New Shicoh, China's largest producer of auto-focus camera actuators.

"This is significant because SMA technology is much cheaper to manufacture than its counterpart, VCM technology, and more importantly, it's much thinner. The best point of reference is the iPhone 6, which uses a VCM OIS actuator in the camera and has a large bump on the back of the phone. As SMA technology goes mainstream, the camera bump goes away, and HTCH is the sole manufacturer of that product.

There's no question about the demand for the product. In addition to the issue of thickness on the back camera, there's the issue of the front camera. Currently, there are no smartphones on the market with an OIS camera on the front because of the thickness. The selfie craze has consumers demanding better cameras on the front of the phone, and with SMA technology, that is finally possible."

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SPI Corp publishes two more color night vision videos:



The second Youtube video is here.

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ON Semi publishes a Youtube video showing different approaches to fish eye lens de-warping implemented in its AP0102 automotive image processor:



Another Youtube video overviews the company's automotive image processors offerings.

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IEDM 2015 published its technical program. Section 30 "Advanced Imagers and Photodetectors" has 7 papers:

30.1 Multi-storied Photodiode CMOS Image Sensor for Multiband Imaging with 3D Technology,
Y. Takemoto, K. Kobayashi, M. Tsukimura, N. Takazawa, H. Kato, S. Suzuki, J. Aoki, T. Kondo, H. Saito, Y. Gomi, S. Matsuda, and Y. Tadaki
Olympus Corporation

We demonstrated multiband imaging with a multi- storied photodiode CMOS image sensor comprising two semiconductor layers that function individually for optimized performance. The sensor captures a wide variety of multiband images, including visible RGB images taken with a Bayer filter and invisible infrared images, at the same time without color degradation.

30.2 First Demonstration of 0.9 μm Pixel Global Shutter Operation by Novel Charge Control in Organic Photoconductive Film,
M. Takase, Y. Miyake, T. Yamada, T. Tamaki, M. Murakami and Y. Inoue
Panasonic Corporation

This paper introduces new charge generation and extraction operation in organic photoconductive film sensor. By spatial and temporal control of electric field in organic photoconductive film, high speed global shutter operation in sub-micron pixel, electrical iris control without ND filter, phase difference detective autofocusing are demonstrated.

30.3 Color Image Sensor with Organic Photoconductive Films (Invited),
T. Sakai, H. Seo, T. Takagi, M. Kubota, H. Ohtake, and M. Furuta*
NHK Science and Technology Research Laboratories, *Kochi University of Technology

A color image sensor with three-stacked organic photoconductive films (OPFs) and transparent readout circuits for high-resolution, high-sensitive, compact color video cameras is described. The sensor separates and simultaneously detects the three primary colors. We fabricated test image sensors and confirmed the feasibility of a color video camera with three-stacked OPFs.

30.4 Optical Performance Study of BSI Image Sensor with Stacked Grid Structure
Y.-W. Cheng, T.-H. Tsai, C.-H. Chou, K.-C. Lee, H.-C. Chen, and Y.-L. Hsu
Taiwan Semiconductor Manufacturing Company

Stacked grid structure is implemented into BSI image sensors and device performance for various grid dimension and height has been investigated. Simulated angular response shows less QE degradation in large incident angle and SNR-10 has a ~10% improvement for devices with stacked grid structure.

30.5 Avalanche Photodiode Featuring Germanium-Tin Multiple Quantum Wells on Silicon: Extending Photodetection to Wavelengths of 2 μm and Beyond,
Y. Dong, W. Wang, S.Y. Lee*, D. Lei, X. Gong, W. Khai Loke*, S.-F. Yoon*, G. Liang, Y.-C. Yeo
National University of Singapore, *Nanyang Technological University

We report the world’s first demonstration of a Ge0.9Sn0.1 multiple quantum wells on Si avalanche photodiode (Ge0.9Sn0.1 MQW/Si APD), achieving a cutoff wavelength λ above 2 μm. A high optical responsivity of 0.33 A/W is achieved at λ = 2003 nm due to the internal avalanche multiplication.

30.6 High Dose Efficiency, Ultra-high Resolution Amorphous Selenium/CMOS Hybrid Digital X-ray Imager,
C.C. Scott, A. Parsafar, A. El-Falou, P.M. Levine, K.S. Karim
University of Waterloo

We demonstrate high dose efficiency from a high- resolution 5.6 µm×6.25 µm pixel pitch amorphous selenium/CMOS hybrid X-ray imager that could radically accelerate bioengineering research by enabling lab-based in vivo pre-clinical imaging. Compared to existing scintillator-based imagers, our approach enables 100× gains in dose efficiency at spatial frequencies of 20-60 cycles/mm.

30.7 Stacked Image Sensor Using Chlorine-doped Crystalline Selenium Photoconversion Layer Composed of Size-controlled Polycrystalline Particles,
S. Imura, K. Kikuchi, K. Miyakawa, H. Ohtake1, M. Kubota, T. Okino*, Y. Hirose*, Y. Kato*, and N. Teranishi**,
NHK Science and Technology Research Laboratories, *Panasonic Corporation, **University of Hyogo

We demonstrate a stacked CMOS image sensor overlaid with a chlorine (Cl)-doped crystalline selenium (c-Se) photoconversion layer. The size of the polycrystalline particles of c-Se, which is strongly related to the fixed pattern noise, is perfectly controlled by Cl doping to c-Se; hence, the resulting device provides clearer images.

Session 19 has 1 paper on flexible image sensors:

19.5 Large Area Sensing Surfaces: Flexible Organic Printed Interfacing Circuits and Sensors (Invited),
S. Jacob, M. Benwadih, J. Bablet, M. Charbonneau, A. Aliane, A. Plihon, and A.Revaux,
CEA, LITEN

Organic Large Area Electronics has been identified as a key enabling technology for smart sensing. This paper presents the last major results on different printed organic interfacing circuits and sensors which have been integrated together to achieve an image sensor on a flexible plastic substrate, demonstrating the potential of our technology for large area sensing surfaces.

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