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Link: https://www.sony-semicon.com/en/news/2026/2026050801.html

Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership 

Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the signing of a non-binding memorandum of understanding (“MOU”) to form a strategic partnership for the development and manufacturing of next-generation image sensors.

Under the proposed partnership, Sony and TSMC intend to establish a joint venture (“JV”), with Sony being the majority and controlling shareholder,to set up development and production lines in Sony’s newly constructed fab in Koshi City, Kumamoto Prefecture. Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

With the MOU signed, Sony and TSMC are discussing potential investments by the JV. These investments, along with new capital investment by Sony in its existing plant in Nagasaki, are being considered on the premise that they would be implemented in phases based on market demand, and that they would receive support from the Japanese government.

This partnership also seeks to explore and address emerging opportunities in physical AI applications, such as automotive and robotics, paving the way for future innovations and expanded technological advancements. The establishment of the JV remains subject to the execution of a definitive legally binding agreement regarding the partnership and the satisfaction of customary closing conditions. 

“Building on the trust cultivated through our long-standing collaboration with TSMC, I am delighted that we have reached an agreement to advance our partnership to a new stage,” said Shinji Sashida, President and CEO of Sony Semiconductor Solutions Corporation.“This JV is a significant initiative that brings together the strengths of both companies and aims to drive further advancement in technology and business within the next-generation image sensor field. Building on this JV, Sony intends to further strengthen its business operations with a focus on creating high added value. Rooted in the Sony Spirit that has guided us since our founding, we intend to continue to take on the challenge of creating new markets through unprecedented ideas and distinctive technologies.”

“Sony has been our long-time partner in the CMOS image sensor business. We are excited to elevate our collaboration to the next level, which represents a key step forward in driving future sensing technology in the AI era,” said TSMC Senior Vice President and Deputy Co-COO, Dr. Kevin Zhang. “This partnership underscores our shared commitment and mutual vision of leveraging cutting-edge technologies and innovative solutions to deliver leading sensing technology and products. We look forward to working closely together to achieve impactful results and create lasting value for all stakeholders.” 

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Image Sensors Blog is soliciting 1-2 volunteers to help me maintain our weekly posting schedule. We have a large readership spanning industry and academia. This is a great opportunity esp. for an early-career academic (graduate student/postdoc) to provide valuable service to the image sensors community. Please email me (see contact listed in the "Blog Authors" sidebar) with a short introduction and how you see yourself contributing to the blog.

Many thanks to Dave Gilblom who is now retiring from his role as one of the blog maintainers. Thanks, Dave, for the countless hours of hard work poring over image sensor documentation, and for spearheading the Job Postings and Conference List features on the blog! 

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Advanced Packaging and Multi-Dimensional Systems Integration for Image Sensors

November 5 & 6, 2026
Antwerp, Belgium

Abstract
Packaging technology for image sensors is an underappreciated issue in the systems integration process, greatly affecting performance, scalability, physical area, and cost. The multi-dimensional package as well as the underlying technology can greatly affect the overall electrical, optical, mechanical, and thermal characteristics of the integrated system. These systems have become multi-dimensional in nature, composed of several interacting layers and multiple sensors with the imagers vertically integrated within the overall system. Now that image sensors are driven more than ever to extreme performance capabilities, novel packaging options and technologies have become increasingly important. An important trend to support large scale sensors integrated into systems are the widely applied stacking and chiplet technologies in which several layers of active silicon are placed above each other. In this way, highly compact, high performance imaging systems are becoming possible. Packaging of systems including image sensors has become much more than placing a single silicon die into a package and attaching some wires.

The landscape of image sensor applications is widening at an accelerating rate, requiring new and different packaging solutions. This forum will review this key issue as well as include a series of highly related topics. This year’s Harvest Imaging Forum is focusing on the existing field of multi-dimensional packaging technology for image sensors. Related topics such as on-chip interconnect, power delivery, synchronization, network communication, thermal behavior, and heterogeneous integration will also be discussed. The focus will be on both current and near term capabilities. These next generation technologies are now becoming available, allowing the development and integration of large scale systems composed of multiple layers and chiplets to produce large scale systems operating at increasingly higher levels of performance. 

https://harvestimaging.com/forum_registration_2026.php 

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[ST Press Release from April 2026.]

STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors

VD55G4 and VD65G4 extend the ST BrightSense portfolio with compact, ultralow-power, microcontroller-compatible sensors for wearables, AR/VR, and smart devices

These new global-shutter image sensors can consume up to 10x less, in operating mode at around 800×700 resolution and 10 frames per second

Geneva, Switzerland — April 28, 2026 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB color) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today.
Designed for the next wave of personal electronics and smart devices, the new sensors serve applications including wearables, AR/VR and XR headsets, smart home appliances and medical devices. They are engineered to deliver rich visual context and AI-ready data under tight constraints on power, size, and cost. The sensors combine an ultralow-power detect-and-wake architecture with a very small global-shutter optical format and interfaces optimized for low-power microcontrollers and cost-effective systems on chips (SoCs).

“Always‑on vision is becoming essential for the next generation of personal electronics, from smart glasses and AR/VR headsets to intelligent home appliances and medical devices. With VD55G4 and VD65G4, we are bringing this capability to smaller, lighter products that must run for a long time on a tiny battery. These new sensors help our customers create more intuitive and responsive experiences, extend battery life, and bring embedded vision and edge AI into everyday devices,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.

From wearables and AR/VR to smart appliances
VD55G4 and VD65G4 bring always‑on vision to products that must stay small, light, and extremely power‑efficient. Building on the ST BrightSense family, they add a color option, faster response for interactive use cases, and simple connectivity to low‑power microcontrollers, making it easier to add vision to space‑ and cost‑constrained designs.

In wearables, the sensors enable all‑day, always‑aware features such as glance detection, presence sensing, and contextual alerts, while fitting into very compact designs and working directly with microcontroller‑based platforms.

For AR/VR and XR headsets, they combine low power and high‑quality capture to support accurate tracking and spatial awareness, helping extend battery life without compromising comfort.

In smart home appliances, IoT devices, and medical products, the sensors allow more intelligence to run locally on the device itself, reducing cloud dependence and standby power. Their tiny size and energy efficiency also make them well suited to solar‑ or energy‑harvesting‑powered vision nodes.

Ultralow‑power design that consumes up to 10x less
Thanks to an optimized sensor architecture and dedicated always‑on mode, VD55G4 and VD65G4 can consume up to 10 times less power than conventional global‑shutter sensors. They can watch for changes in a scene and wake up the main processor only when needed, shifting from continuous streaming to event‑driven operation. This enables all‑day, always‑on experiences, longer battery life, and practical vision systems powered by small batteries or energy harvesting.

Their very small footprint and integrated image processing simplify design and reduce system cost, while supporting responsive, AI‑ready vision features in a wide range of edge devices. 

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Link: https://it.chosun.com/news/articleView.html?idxno=2023092160385 

"Lee Je-seok, Vice President and Chief Technology Officer (CTO) of the Sensor Business Team, also resigned recently after 32 years at the company. Lee is considered a "living witness" of Samsung’s image sensor brand, ISOCELL, and is credited with leading the development of the world's first 100-megapixel and 200-megapixel sensors, as well as securing a spot in Apple’s supply chain.

Following his resignation, Lee is reportedly preparing to launch an image sensor startup. On social media, he posted an image signaling a "stealth mode" startup with global experts, stating he would "redefine the future of imaging in January 2027." Industry observers are closely watching as a key designer of Samsung's proprietary technology could emerge as a potential competitor."

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18th International Conference on Sensing Technology (ICST2026) - 7-9 December 2026 - Sydney, Australia - Website

International Technical Exhibition on Image Technology and Equipment (ITE) - 2-4 December 2026 - Yokohama, Japan - Website

IEEE International Electron Devices Meeting - 12-16 December 2026 - San Francisco, CA, USA - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

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Press release: https://www.usa.canon.com/newsroom/2026/20260415-camera

Canon U.S.A. Sets New Standard in Low-Light Imaging with the Launch of the MS-510 Multi-Purpose Camera at NAB 2026

Featuring a new Canon 1-inch SPAD sensor, the MS-510 delivers impressive low-light and long-range performance for ultra-low-light environments 

MELVILLE, N.Y., April 15, 2026 – Canon U.S.A., Inc., a leader in digital imaging solutions, today announced the release of the MS-510, an innovative multi-purpose camera engineered to meet the rigorous demands of ultra-low-light full-color video shooting. Building on the success of the MS-500, the new MS-510 is designed to deliver high-fidelity captures of everything from nocturnal wildlife and natural nightscapes to high-security areas such as seaports, public infrastructure facilities, and national borders where "seeing the unseen" is a mission-critical requirement.

In response to increasing demands for excellent performance in near-total darkness, the MS-510 features a new Canon 1-inch Single-Photon Avalanche Diode (SPAD) sensor with the world’s highest number of pixels at approximately 3.2 million with improved Near-Infrared (NIR) sensitivity.

By leveraging this technology, the camera achieves a minimum subject illumination of 0.0006 lux, a significant improvement over the 0.001 lux of its predecessor. This allows for bright, full-color imaging in ultra-low-light environments where traditional cameras can fail. Furthermore, the MS-510 boasts improved NIR capabilities, providing a tactical advantage for night-mode operations and long-distance detection.

The MS-510 is not just a camera; it is a sophisticated tool for critical infrastructure monitoring and law enforcement. Key features include:

•  Broadcast-Grade Optics: Equipped with the broadcast industry standard B4 mount, the MS-510 has a built in magnifying optical system offering compatibility with Canon’s extensive lineup of 2/3-inch ultra-telephoto broadcast zoom lenses, enabling crystal-clear identification over vast distances.
•  Advanced Image Processing: Integrated Haze Compensation automatically reduces the interference of mist and haze while adjusting contrast, and Smart Shade Control corrects for highlights and shadows to maintain image integrity in challenging lighting conditions.
•  Customizable Imaging Profiles: Users can create up to 20 customized image quality settings or utilize Custom Picture Presets to prioritize wide dynamic range or maximum noise reduction depending on the environment.

Designed to fit into existing security ecosystems, the MS-510 shares common protocols with the MS-500, including NU, Pelco-D®, ONVIF®, and WebView. It offers versatile output options, including 3G/HD-SDI for high-quality video feeds and a LAN terminal for IP-based camera control and distribution.

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Why Samsung Can't Beat Sony's Image Sensors:

 China’s Newest Tech Billionaire Made His Fortune From Developing Image Sensor Chips For Robotics: 

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Jinwen Wei and Liangcai Cao, "Compact Neural Pancake Camera for High-Perceptual-Quality Foveated Imaging," ACS Photonics (2026).

Link: https://doi.org/10.1021/acsphotonics.6c00691 

Pancake catadioptric optics utilize optical folding to effectively reduce the optical-path thickness in virtual-reality display systems. However, limited optical throughput and optical degradation make image reconstruction for pancake cameras severely ill-posed, hindering broader imaging applications. In this article, we propose a neural pancake camera with adaptive-prior deconvolution, achieving compact, high-perceptual-quality imaging. By introducing latent-space projection, adaptive prior deconvolution alleviates the trade-off between pixel fidelity and perceptual quality and addresses the excessive smoothing inherent in conventional pixelwise optimization. The proposed neural pancake camera reduces the ratio of axial length to physical aperture diameter by 3.2 times compared with other flat cameras with high imaging quality. Experiments and ablation studies substantiate that the proposed adaptive prior deconvolution improves perceptual quality by 70%, as measured by CLIP-IQA, while also outperforming the state-of-the-art deep learning models on pixel-level fidelity. As a representative application of the proposed neural Pancake camera, this work further showcases bioinspired foveated imaging, highlighting its potential for bandwidth-efficient imaging in next-generation edge and portable devices. 

Figure 1. Pipeline of the proposed neural Pancake camera. (a) Conceptual illustration of the proposed compact Pancake camera scheme. (b) The inherent trade-off between perceptual quality and pixel-level quality of computational imaging. This work proposes adaptive prior deconvolution to promote the perceptual imaging quality of Pancake cameras while improving pixel fidelity. (c) Overview of the training process of the end-to-end adaptive prior deconvolution. The framework operates by optimizing the learnable deconvolution network while leveraging a latent natural-image manifold prior, anchoring the restoration output to the natural image manifold to reconcile the perceptual-pixel trade-off.

Figure 3. Quantitative evaluation and visualization of the adaptive-prior deconvolution. (a) Schematic illustration of the inference process based on the adaptive-manifold prior. (b) Quantitative performance profiles of averaged MUSIQ, SSIM, and PP-IQA across inference steps. (c) Visual comparisons demonstrating the effects of the low prior, the adaptively selected proper prior, and the over-prior.

Figure 4. Demonstration of neural Pancake camera-based foveated imaging. (a) Schematic illustration of foveated imaging in the human visual system. (b) Profiles of high-frequency content proportion and relative acuity versus field of view. (c) Comparison of reconstructed and raw-captured images across different fields of view. 

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Link: https://imagesensors.org/CFP2027/fcfp2027.pdf

FIRST CALL FOR PAPERS ABSTRACTS DUE Dec 10, 2026
2027 International Image Sensor Workshop
The Westin Resort & Spa, Whistler, BC, Canada
June 13-17, 2027

The 2027 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is its tradition, the 2027 workshop will emphasize an open exchange of information among participants in an informal, secluded setting besides Whistler, BC, Canada.

The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and flash presentation papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing
Event-based image sensors

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels
Techniques for increasing QE, well capacity, reducing
crosstalk, and improving angular response
Front side illuminated, back side illuminated, and
stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and
3D, CAD for design and simulation, improved models 

Application Specific Imagers
Image sensors and pixels for range sensing: TOF, RGBZ,
Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging, computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Wafer-on-wafer and chip-on-wafer stacking technologies
Backside thinning
New characterization methods
Packaging and testing: reliability, yield, cost
Defects, noises, and leakage currents
Radiation damage and radiation hard imagers

On-chip optics
Advanced optical path, color filters, microlens, light guides
Nanotechnologies for Imaging
Wafer level cameras

Submission of abstracts:
An abstract should consist of a single page of maximum 500-words text with up to two pages of
illustrations (3 pages maximum), and include authors’ name(s) and affiliation, mailing address,
telephone and e-mail address.

The deadline for abstract submission is 11:59pm, Thursday Dec 10th, 2026 (PST).
To submit an abstract, please go to: https://cmt3.research.microsoft.com/IISW2027
Above website should be open by Aug 1st, 2026.

The first time you visit the paper submission site, you'll need to click on "Create Account". Once you create and verify your account with your email address, you will be able to submit abstracts by logging in and clicking “Create New Submission”.

Please visit http://imagesensors.org/CFP2027 for complete instructions and any updates to the
abstract and paper submission procedures.

Abstracts will be considered on the basis of originality and quality. High quality papers on work in progress are also welcome. Abstracts will be reviewed confidentially by the Technical Program
Committee.

Key Dates
Authors will be notified of the acceptance of their abstract by February 12th, 2027.
Final-form 4-page paper submission date is March 20th, 2027.
Presentation material submission date is April 30th, 2027.

Location and format:
The IISW 2027 will be held at the Westin Resort & Spa in Whistler, British Columbia in Canada.

Registration, Workshop fee and Program:
The Workshop Program and registration details will be provided in the Final Announcement of the Workshop. 

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In a paper titled "Design and Optimization of a Twisted Photodiode Pixel Structure for All-Directional Phase-Detection Autofocus CMOS Image Sensors" a team from Canon write:

To achieve an all-directional and high-speed, high-accuracy autofocus (AF) function, we propose a CMOS image sensor with a Twisted Photodiode (PD) structure. The developed 3D-stacked back-side illuminated (BSI) sensor employs the Twisted PD, which enables equivalent angular response characteristics in both the horizontal and vertical directions for the two PDs integrated within a single pixel, thereby realizing AF detection for all pixels and all directions. This paper describes the Twisted PD structure that enables all-directional AF and presents an analysis of charge transfer behavior in this unique 3D configuration. In this paper, “all-directional” refers to robustness with respect to subject direction.

This paper was published in the IISW2025 special issue of Sensors. 
Link: https://www.mdpi.com/1424-8220/26/6/1758

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Omnivision is listed on HKSE https://www.reuters.com/world/asia-pacific/chinas-omnivision-open-slightly-higher-hong-kong-trading-debut-2026-01-12/ 

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ESA, CNES, AIRBUS DEFENCE & SPACE, ISAE-SUPAERO, OHB, SODERN, and THALES ALENIA SPACE are pleased to invite you to:

VISSA: VISible detection for Space Applications, the 9th iteration of the workshop series known as “Space & Scientific CMOS Image Sensors”

Please find attached the CALL FOR ABSTRACTS for the workshop planned for 24 and 25 November at ESA-ESTEC, The Netherlands.

This is a very popular event and has become one of the main European technical exchanges on CMOS image sensors. The aim of this workshop is to focus on latest developments in advanced image sensors for scientific and space applications targeting wavelengths shorter than 1.1 μm.

The deadline for abstract submission is 4 September 2026.

Please send a short abstract on one A4 page maximum in word or pdf format giving the
title, the author name(s) and affiliation(s), and presenting the subject of your talk, to
matthew.soman@esa.int and valerian.lalucaa@cnes.fr 

Abstracts shall preferably address one or more of the following topics:
• Pixel design (high QE, FWC, MTF optimization, low lag, …)
• Electrical design (low noise amplifiers, shutter, CDS, high speed architectures, TDI, HDR, …)
• On-chip ADC or TDC (in pixel, column, …)
• On-chip processing (smart sensors, multiple gains, summation, corrections)
• Low-light detection (electron multiplication, avalanche photodiodes, quanta image sensors, …)
• Photon counting, Time resolving detectors (gated, time-correlated single-photon counting, …)
• Hyperspectral architectures
• Materials (thin film, optical layers, dopant, high-resistivity, amorphous Si, …)
• Processes (backside thinning, hybridization, 3D stacking, anti-reflection coating, …)
• Packaging
• Optical design (micro-lenses, trench isolation, filters, …)
• Large size devices (stitching, butting, …)
• High speed interfaces
• Focal plane architectures
• CMOS image sensors with recent space heritage showing in-flight performance 

Workshop format & official language
Oral presentations shall be requested for the workshop. The official workshop language is English.
 

Slide submission
After abstract acceptance notification, the authors will be requested to prepare their presentation in pdf
or Powerpoint file format, to be presented at the workshop. Authors will also be required to provide a
version to the organizing committee along with an authorization to make it available for Workshop
attendees, and on-line for the COMET members. No proceedings will be compiled and so no detailed
manuscript needs to be submitted.
 

Registration
Registration fee : Attendees: 120 Euro // students: 60 Euro
On-line registration link will be sent at registration opening.
 

Exhibition/Sponsorship:
Booths will be available during the workshop. If you are interested to exhibit, please contact the
organizing committee. 

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Product overview page: https://www.sony-semicon.com/en/products/is/scientific/x-ray.html

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.

It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.

The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.

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IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room-Temperature Semiconductor Detectors Symposium - 7-14 November 2026 - Granada, Spain - Website

SPIE Future Sensing Technologies 2026 - 9-12 November 2026 - Yokohama, Japan - Website - (co-located with SPIE Asia-Pacific Remote Sensing and Photonics Innovation)

Sensing with Quantum Light (SQL26) - 9-13 November 2026 - Cologne, Germany - Website

electronica - 10-13 November 2026- Munich Germany - Website

Compamed - 16-19 November 2026 - Dusseldorf, Germany - Website

Sensors 2026 - 19-21 November 2026 - Osaka, Japan - Website

18th Symposium Sensor Data Fusion: Trends, Solutions and Applications - Bonn, Germany - 23-25 November 2026 - Website

9th VISSA: Visible Detection for Space Applications - 24-25 November 2026 - Noordwijk, the Netherlands - Website

RSNA 2026 - 29 November-3 December 2026 - Chicago, Illinois, USA - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

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VISION - 6-8 October 2026 - Stuttgart, Germany - Website

Photonics Spectra Sensing Technologies Summit 2026 - 7 October 2026 - Online - Website

Optica Laser Congress and Exhibition - 11-15 October 2026 - Vilnius, Lithuania - Website

ASNT Annual Conference - 12-15 October 2026 - Columbus, Ohio, USA - Website

CPAD 2026 (Coordinating Panel for Advanced Detectors) - 20-23 October 2026 - Seattle, Washington, USA - Website

SPIE/COS Photonics Asia - 24-26 October 2026 - Nantong, Jiangsu, China - Website

IEEE Sensors Conference - 25-28 October 2026 - Rotterdam, The Netherlands, -  Website

Image Sensors Asia - 28-29 October 2026 - Seoul, South Korea/Hybrid - Website

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Link: https://www.photonics.com/Articles/Single-Photon-Detection-Bridges-the-Gap-Between/p7/a71989

Single-Photon Detection Bridges the Gap Between Quantum Tech and Industrial Users

The article covers the following companies and startups:

• NovoViz: Integrating SPAD sensors with on-chip digital processing for industrial applications.
• VTEC Lasers & Sensors: Offering "Quspads" InP-based SPAD chips with high efficiency and room-temperature operation.
• Ubicept: Software platforms for real-time reconstruction with megapixel color SPAD sensors.
• Photon Force: High-throughput SPAD array camera with 50-picosecond temporal resolution.
• Quantum Computing Inc. (QCi): Quantum lidar and quantum photonic vibrometer systems.
• ID Quantique (IDQ): SNSPD systems for integrated circuit inspection and Ariane 6 rocket monitoring.
• Sony: Manufacturer of SPAD-based lidar modules. 

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AlpsenTek Completes Series B+ as Hybrid Vision Sensors Become a New Gateway to the AI-Powered Physical World

SHENZHEN, China — March 17, 2026 — AlpsenTek, a pioneer in hybrid vision sensor technology, today announced the completion of a Series B+ financing round and the total fund-rasing has surpassed 100 million USD.

The B+ round was jointly backed by BEIDM, Guangdong Finance Fund Management, GAC Capital, Circumference Capital, Changjiang Capital, Bluetrum, UNICC Capital, Zhichen Investment, Wofo Venture Capital, and Sunyes.

The new funding will support continued core technology development, large-scale product manufacturing, and global market expansion, accelerating the industrial adoption of next-generation AI vision sensing technologies.

The Growing Need for Real-Time Perception in Physical AI

As artificial intelligence moves beyond the digital world and increasingly interacts with the physical environment, real-time environmental perception is becoming a fundamental infrastructure for intelligent systems.

Traditional vision sensors, which rely on fixed-frame-rate image capture and full-pixel data acquisition, are gradually struggling to meet the emerging requirements of intelligent perception systems that demand high speed, low latency, and high dynamic range.

Hybrid Vision Sensing: A New Path for AI Machine Vision

AlpsenTek’s Hybrid Vision Sensor (HVS) technology introduces a new technical paradigm for machine vision systems.

The technology integrates frame-based image sensing and event-based sensing mechanisms on a single sensor chip, enabling devices to simultaneously capture both image information and brightness change signals within a scene. This provides AI systems with visual inputs that are both more efficient and more representative of real-world dynamics.

If traditional image sensors record “what the world looks like,” hybrid vision sensors capture both “what the world looks like” and “how the world is changing.”

Dual-Modality Perception for Next-Generation AI

Compared with vision systems that rely solely on frame-based images, hybrid vision sensors can detect scene changes with much higher temporal resolution while maintaining full image output capability.

This dual-modality perception approach allows AI systems to achieve more stable and efficient visual perception in high-speed motion, high dynamic range, and complex lighting environments.

For rapidly developing AI applications—including robotics, autonomous driving, and intelligent devices—machines must not only see two-dimensional image details, spatial structure, and color, but also understand how environments evolve over time.

By introducing the temporal dimension alongside traditional visual information, hybrid vision sensors enable machines to more effectively perceive object motion, interactions, and environmental changes, significantly enhancing a system’s ability to understand the real world.

Reducing Data Redundancy for Efficient Edge AI

At the same time, traditional visual systems generate large amounts of redundant data during video capture, requiring substantial computational resources for processing.

Hybrid vision sensors adopt an event-driven sensing mechanism, outputting key information only when changes occur in a scene. This reduces redundant data generation at the source and provides more efficient data input for edge AI systems.

In the AI era, vision sensors are evolving from simple imaging devices into core interfaces through which machines perceive and understand the physical world.

CEO Perspective

Deng Jian, founder and CEO of AlpsenTek, said the rapid transition of AI from digital environments into the real world is reshaping the role of perception technologies.

“Artificial intelligence is rapidly moving from digital space into the real world,” Deng said. “Future AI systems—whether robots, intelligent devices, or automated systems—will require continuous, real-time perception of the physical environment. Hybrid vision sensors were developed to meet this demand. By simultaneously providing image information and motion-change data, we aim to build a more efficient visual perception foundation for the next generation of intelligent systems.”

Building a Hybrid Vision Product Ecosystem

As a key innovator in hybrid vision technology, AlpsenTek has established a complete proprietary technology stack spanning pixel architecture, chip design, and vision algorithms, and has been among the first globally to achieve large-scale production of hybrid vision sensors.

In 2025, the company introduced the APX014 (ALPIX-Pizol) hybrid vision sensor designed for edge AI perception applications, along with the APX002 (ALPIX-Maloja) pure event-based vision sensor.

Together with the previously released APX003 series and APX004 series, the company has formed a growing product portfolio targeting applications across robotics, wearables, smart home devices, automotive electronics, and consumer electronics.

Accelerating Industry Adoption

AlpsenTek is currently collaborating with several leading global technology companies to advance the large-scale adoption of hybrid vision sensors in intelligent devices and AI systems.

Deng said the company is entering a stage of acceleration as AI vision technologies move toward mass deployment.

“We are now at a pivotal moment for AI vision technologies to move into large-scale applications,” Deng said. “Over the next decade, countless intelligent systems will enter the real world, and visual perception will be one of their most fundamental technologies. Our goal is to make hybrid vision sensors one of the key perception interfaces for next-generation intelligent devices.”

As AI and intelligent hardware continue to evolve, new visual perception technologies are entering an unprecedented phase of opportunity. AlpsenTek said it will continue advancing core technological innovation and product commercialization to expand hybrid vision sensing into more real-world applications.

In an era where AI is moving into the physical world, machines must first learn to see the world—and see its changes—efficiently.

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AlpsenTek Completes Series B+ as Hybrid Vision Sensors Become a New Gateway to the AI-Powered Physical World

SHENZHEN, China — March 17, 2026 — AlpsenTek, a pioneer in hybrid vision sensor technology, today announced the completion of a Series B+ financing round and the total fund-rasing has surpassed 100 million USD.

The B+ round was jointly backed by BEIDM, Guangdong Finance Fund Management, GAC Capital, Circumference Capital, Changjiang Capital, Bluetrum, UNICC Capital, Zhichen Investment, Wofo Venture Capital, and Sunyes.

The new funding will support continued core technology development, large-scale product manufacturing, and global market expansion, accelerating the industrial adoption of next-generation AI vision sensing technologies.

The Growing Need for Real-Time Perception in Physical AI

As artificial intelligence moves beyond the digital world and increasingly interacts with the physical environment, real-time environmental perception is becoming a fundamental infrastructure for intelligent systems.

Traditional vision sensors, which rely on fixed-frame-rate image capture and full-pixel data acquisition, are gradually struggling to meet the emerging requirements of intelligent perception systems that demand high speed, low latency, and high dynamic range.

Hybrid Vision Sensing: A New Path for AI Machine Vision

AlpsenTek’s Hybrid Vision Sensor (HVS) technology introduces a new technical paradigm for machine vision systems.

The technology integrates frame-based image sensing and event-based sensing mechanisms on a single sensor chip, enabling devices to simultaneously capture both image information and brightness change signals within a scene. This provides AI systems with visual inputs that are both more efficient and more representative of real-world dynamics.

If traditional image sensors record “what the world looks like,” hybrid vision sensors capture both “what the world looks like” and “how the world is changing.”

Dual-Modality Perception for Next-Generation AI

Compared with vision systems that rely solely on frame-based images, hybrid vision sensors can detect scene changes with much higher temporal resolution while maintaining full image output capability.

This dual-modality perception approach allows AI systems to achieve more stable and efficient visual perception in high-speed motion, high dynamic range, and complex lighting environments.

For rapidly developing AI applications—including robotics, autonomous driving, and intelligent devices—machines must not only see two-dimensional image details, spatial structure, and color, but also understand how environments evolve over time.

By introducing the temporal dimension alongside traditional visual information, hybrid vision sensors enable machines to more effectively perceive object motion, interactions, and environmental changes, significantly enhancing a system’s ability to understand the real world.

Reducing Data Redundancy for Efficient Edge AI

At the same time, traditional visual systems generate large amounts of redundant data during video capture, requiring substantial computational resources for processing.

Hybrid vision sensors adopt an event-driven sensing mechanism, outputting key information only when changes occur in a scene. This reduces redundant data generation at the source and provides more efficient data input for edge AI systems.

In the AI era, vision sensors are evolving from simple imaging devices into core interfaces through which machines perceive and understand the physical world.

CEO Perspective

Deng Jian, founder and CEO of AlpsenTek, said the rapid transition of AI from digital environments into the real world is reshaping the role of perception technologies.

“Artificial intelligence is rapidly moving from digital space into the real world,” Deng said. “Future AI systems—whether robots, intelligent devices, or automated systems—will require continuous, real-time perception of the physical environment. Hybrid vision sensors were developed to meet this demand. By simultaneously providing image information and motion-change data, we aim to build a more efficient visual perception foundation for the next generation of intelligent systems.”

Building a Hybrid Vision Product Ecosystem

As a key innovator in hybrid vision technology, AlpsenTek has established a complete proprietary technology stack spanning pixel architecture, chip design, and vision algorithms, and has been among the first globally to achieve large-scale production of hybrid vision sensors.

In 2025, the company introduced the APX014 (ALPIX-Pizol) hybrid vision sensor designed for edge AI perception applications, along with the APX002 (ALPIX-Maloja) pure event-based vision sensor.

Together with the previously released APX003 series and APX004 series, the company has formed a growing product portfolio targeting applications across robotics, wearables, smart home devices, automotive electronics, and consumer electronics.

Accelerating Industry Adoption

AlpsenTek is currently collaborating with several leading global technology companies to advance the large-scale adoption of hybrid vision sensors in intelligent devices and AI systems.

Deng said the company is entering a stage of acceleration as AI vision technologies move toward mass deployment.

“We are now at a pivotal moment for AI vision technologies to move into large-scale applications,” Deng said. “Over the next decade, countless intelligent systems will enter the real world, and visual perception will be one of their most fundamental technologies. Our goal is to make hybrid vision sensors one of the key perception interfaces for next-generation intelligent devices.”

As AI and intelligent hardware continue to evolve, new visual perception technologies are entering an unprecedented phase of opportunity. AlpsenTek said it will continue advancing core technological innovation and product commercialization to expand hybrid vision sensing into more real-world applications.

In an era where AI is moving into the physical world, machines must first learn to see the world—and see its changes—efficiently.

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Link: https://www.gizmochina.com/2026/03/27/smartsens-sc5a6xs-1inch-50mp-sensor-launch/

SmartSens unveils SC5A6XS 1-inch 50MP sensor, brings advanced HDR tech, 4K 120fps support

Chinese image sensor maker SmartSens has introduced a new camera sensor aimed at flagship smartphones. The SC5A6XS brings a 50-megapixel 1-inch format and focuses on improving dynamic range and video capabilities. The announcement highlights upgrades in HDR processing, low-light imaging, and power efficiency, setting the stage for next-generation mobile photography.

The SC5A6XS is built on a 22nm stacked process and integrates the brand’s upgraded Lofic HDR 3.0 technology. This system enhances image quality in challenging lighting by capturing a wider range of brightness levels. With a peak dynamic range of 115dB, the sensor aims to preserve highlight details while retaining shadow information in high-contrast scenes.

The HDR system works through multi-frame fusion within a single exposure, which also helps reduce motion artefacts. This is particularly useful in video scenarios where subjects or the camera are in motion. The sensor supports 4K video at 120fps, along with 4K 60fps recording in HDR mode, making it suitable for advanced video use cases on smartphones.

In terms of hardware, the sensor features a 1.6μm pixel size and incorporates SFCPixel technology to improve light sensitivity. With higher sensitivity and reduced read noise, it is designed to produce clearer images in dim conditions without excessive grain.

Autofocus is handled through a combination of full-pixel AllPix ADAF and partial pixel phase detection, allowing faster and more reliable focusing across different lighting environments. Additionally, the company has worked on reducing power consumption, with an approximate 11 percent improvement in HDR mode, which may help control device heating during extended video recording.

The SC5A6XS has already entered the sampling phase and is expected to move into mass production in the second quarter of 2026. It is likely to appear in upcoming flagship smartphones, probably the Huawei Pura 90 series, being the likely candidate, focusing heavily on camera performance. 

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[Update Apr 6, 2026: a previous version of this post incorrectly said "global shutter" in the title.] 

Sensor specs: https://www.sony-semicon.com/en/products/is/security/security/IMX908.html

News: https://www.sony-semicon.com/en/news/2026/2026031701.html 

Sony Semiconductor Solutions to Release 4K Image Sensor for Security Cameras with the Industry’s Smallest 1.45 µm LOFIC Pixels
Contributing to improved recognition precision with high image quality in high-contrast environments and dark scenes

Atsugi, Japan — Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX908, a 4K CMOS image sensor for security cameras with the industry’s smallest 1.45 µm LOFIC pixels.

The new sensor uses the newly developed LOFIC pixels to achieve 96 dB high dynamic range imaging at 4K resolution with a single exposure. Building on this, improved low-light performance delivers high-quality imaging with reduced highlight blowout, loss of shadow detail, and noise in both high contrast environments and dark locations compared to conventional products.

The new sensor will expand Sony’s lineup of products with both high-resolution and high dynamic range for security camera applications, which require high-precision image recognition in a wide range of indoor and outdoor environments, thereby contributing to a safer and more secure society.

Security cameras have been widely used not just for security surveillance, but also in broad applications including monitoring public spaces such as urban areas and other facilities. As AI-based image recognition becomes a standard feature in cameras, the demand for image sensors that can provide stable and high-quality imaging in conditions from bright to dark continues to grow.

The IMX908 employs STARVIS 3™, Sony’s proprietary LOFIC pixel technology developed for security cameras. It enables nearly 20x the amount of saturated charge as conventional products and delivers an approximately 27% improvement in low-light performance, which makes for a dynamic range of 96 dB. Not using multiple exposures, the more common method for HDR imaging, this sensor also provides high dynamic range imaging with a single exposure to deliver high-definition images with fewer artifacts, even of scenes with moving subjects. Furthermore, Sony’s original pixel design has enabled all these features to be provided at the industry’s smallest LOFIC pixel size of 1.45 µm. By offering higher-quality 4K imaging even in high-contrast scenes and dark environments, the new product will contribute to improved recognition accuracy and multifunctionality in security cameras.

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IEEE 2026 International Conference on Multisensor Fusion and Integration for Intelligent Systems - 2-4 September 2026 - Pilsen, Czechia - Website

IEEE European Solid-State Electronics Research Conference - 7-10 September 2026 - Palma de Mallorca, Spain - Website

The 12th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2026 - 7-11 September 2026 - Miyazaki, Japan - Website

IEEE International Conference on Image Processing - 13-17 September 2026 - Tampere, Finland - Website

SPIE Sensors + Imaging 2026 - 14-17 September 2026 - Edinburgh, Scotland, UK - Website

Sensor Expo Japan - 16-18 September 2026 - Tokyo, Japan - Website

RADiation and its Effects on Components and Systems (RADECS) - 28 September-2 October 2026 - Prague, Czech Republic - Website

12th International Conference on Sensors and Electronic Instrumentation Advances - 30 September-2 October 2026 - Granada, Spain - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

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IEEE 2026 International Conference on Multisensor Fusion and Integration for Intelligent Systems - 2-4 September 2026 - Pilsen, Czechia - Website

IEEE European Solid-State Electronics Research Conference - 7-10 September 2026 - Palma de Mallorca, Spain - Website

The 12th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2026 - 7-11 September 2026 - Miyazaki, Japan - Website

IEEE International Conference on Image Processing - 13-17 September 2026 - Tampere, Finland - Website

SPIE Sensors + Imaging 2026 - 14-17 September 2026 - Edinburgh, Scotland, UK - Website

Sensor Expo Japan - 16-18 September 2026 - Tokyo, Japan - Website

RADiation and its Effects on Components and Systems (RADECS) - 28 September-2 October 2026 - Prague, Czech Republic - Website

12th International Conference on Sensors and Electronic Instrumentation Advances - 30 September-2 October 2026 - Granada, Spain - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

Go to the original article...

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IEEE 2026 International Conference on Multisensor Fusion and Integration for Intelligent Systems - 2-4 September 2026 - Pilsen, Czechia - Website

IEEE European Solid-State Electronics Research Conference - 7-10 September 2026 - Palma de Mallorca, Spain - Website

The 12th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2026 - 7-11 September 2026 - Miyazaki, Japan - Website

IEEE International Conference on Image Processing - 13-17 September 2026 - Tampere, Finland - Website

SPIE Sensors + Imaging 2026 - 14-17 September 2026 - Edinburgh, Scotland, UK - Website

Sensor Expo Japan - 16-18 September 2026 - Tokyo, Japan - Website

RADiation and its Effects on Components and Systems (RADECS) - 28 September-2 October 2026 - Prague, Czech Republic - Website

12th International Conference on Sensors and Electronic Instrumentation Advances - 30 September-2 October 2026 - Granada, Spain - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

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Paper link: https://opg.optica.org/oe/fulltext.cfm?uri=oe-34-4-6880

In a recently published paper in Optics Express titled "Highly curved large-format sensors for infrared imaging", O'Masta et al of HRL Laboratories LLC write:

A curved, rather than flat, photoreceptive surface requires fewer optical elements and enhances illumination and sensitivity uniformity for wide-field vision. While such designs are common in vertebrate eyes, creating manmade curved sensing surfaces using high-performance sensors has been technologically challenging. Here, we surpassed previous practices by manipulating the strain within a die using a ductile metal layer. This enabled scalability to large-format sensors, which are valuable for capturing wide viewing angles with high resolution. We showcased this methodology using two types of III-V compound semiconductor photodetectors for mid-wave infrared (MWIR) imaging. The radiometric response of a hybridized fanout chip curved to a solid angle of 0.24 sr – over 300% beyond the limit of standard methods – was evaluated. A fully imaging focal plane array curved to 0.11 sr exhibited >97% operability. This demonstration of a spherically curved, cryogenically cooled MWIR imaging sensor highlights the feasibility of curving sensors comprised of heterogeneous semiconductor layering, which are commonly used in infrared, visible, and ultraviolet imagers. 

Pushing the limits for spherically curving existing imaging sensors, as demonstrated with an infrared focal plane array (FPA). (a) A simple lens naturally focuses light onto a curved rather than flat image surface. (b) Cross-sectional schematic showing heterogenous layering of a cryogenically-cooled, MWIR FPA, following post-processing steps to enhance curving potential. (c) Historical [2–10] and present chip solid angle as a function of chip size. Details are provided in Supplement 1, Table S2. The dashed line represents the predicted limit for curving bare semiconductor die developed here. (d) Image of MWIR hybridized fanout chip curved to a 0.24 sr solid angle.

Mechanical failure modes when spherically curving bare semiconductor chips. Data is shown for a 37 mm side length, square Si die. (a) Image sequence of 60 µm thick Si die being curved to 0.08 sr, with the pneumatic pressure noted along top. Striped pattern is from reflection of a poster board to aid visualization of curvature. Die is imaged through a transparent Mylar film. (b) Fracture of an 80 µm thick die curved to 0.08 sr. (c) Buckling of a 40 µm thick die when curving to 0.12 sr. (d), (e) FEA simulations of the dies curved in (b) and (c), respectively. (f) Fracture (contour map) and buckling (greyed in region) predictions. Symbols show experimental values, with measured probabilities of fracture from 10 replicate specimens indicated by color. (g) Predicted maximum solid angle for square Si dies, assuming Pf = 30%.

Maps of the minimum thickness hcr to suppress buckling of a bare Si die. (a) Comparison of buckling criterion predictions (dashed lines) compared to FEA results (circles) for square die of side length L. Thicknesses below a given line are predicted to buckle. (b) Comparison of predictions (dashed line) to experimental values (squares) for an L = 37 mm square die.

A 16 megapixel, 10 µm pitch InAsSb bulk alloy based FPA curved to 0.11 sr. (a) Picture of the curved FPA after wire-bonding to the PCBA for testing. (b) Measured responsivity across the curved FPA. (c) Histogram of the responsivity.

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