Foveated imaging with optical folding

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Jinwen Wei and Liangcai Cao, "Compact Neural Pancake Camera for High-Perceptual-Quality Foveated Imaging," ACS Photonics (2026).

Link: https://doi.org/10.1021/acsphotonics.6c00691 

Pancake catadioptric optics utilize optical folding to effectively reduce the optical-path thickness in virtual-reality display systems. However, limited optical throughput and optical degradation make image reconstruction for pancake cameras severely ill-posed, hindering broader imaging applications. In this article, we propose a neural pancake camera with adaptive-prior deconvolution, achieving compact, high-perceptual-quality imaging. By introducing latent-space projection, adaptive prior deconvolution alleviates the trade-off between pixel fidelity and perceptual quality and addresses the excessive smoothing inherent in conventional pixelwise optimization. The proposed neural pancake camera reduces the ratio of axial length to physical aperture diameter by 3.2 times compared with other flat cameras with high imaging quality. Experiments and ablation studies substantiate that the proposed adaptive prior deconvolution improves perceptual quality by 70%, as measured by CLIP-IQA, while also outperforming the state-of-the-art deep learning models on pixel-level fidelity. As a representative application of the proposed neural Pancake camera, this work further showcases bioinspired foveated imaging, highlighting its potential for bandwidth-efficient imaging in next-generation edge and portable devices. 

 


Figure 1. Pipeline of the proposed neural Pancake camera. (a) Conceptual illustration of the proposed compact Pancake camera scheme. (b) The inherent trade-off between perceptual quality and pixel-level quality of computational imaging. This work proposes adaptive prior deconvolution to promote the perceptual imaging quality of Pancake cameras while improving pixel fidelity. (c) Overview of the training process of the end-to-end adaptive prior deconvolution. The framework operates by optimizing the learnable deconvolution network while leveraging a latent natural-image manifold prior, anchoring the restoration output to the natural image manifold to reconcile the perceptual-pixel trade-off.

 


Figure 3. Quantitative evaluation and visualization of the adaptive-prior deconvolution. (a) Schematic illustration of the inference process based on the adaptive-manifold prior. (b) Quantitative performance profiles of averaged MUSIQ, SSIM, and PP-IQA across inference steps. (c) Visual comparisons demonstrating the effects of the low prior, the adaptively selected proper prior, and the over-prior.

 


 

Figure 4. Demonstration of neural Pancake camera-based foveated imaging. (a) Schematic illustration of foveated imaging in the human visual system. (b) Profiles of high-frequency content proportion and relative acuity versus field of view. (c) Comparison of reconstructed and raw-captured images across different fields of view. 

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IISW 2027 call for papers available, abstracts due Dec 10, 2026

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Link: https://imagesensors.org/CFP2027/fcfp2027.pdf

FIRST CALL FOR PAPERS ABSTRACTS DUE Dec 10, 2026
2027 International Image Sensor Workshop
The Westin Resort & Spa, Whistler, BC, Canada
June 13-17, 2027

The 2027 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is its tradition, the 2027 workshop will emphasize an open exchange of information among participants in an informal, secluded setting besides Whistler, BC, Canada.

The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and flash presentation papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing
Event-based image sensors

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels
Techniques for increasing QE, well capacity, reducing
crosstalk, and improving angular response
Front side illuminated, back side illuminated, and
stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and
3D, CAD for design and simulation, improved models 

Application Specific Imagers
Image sensors and pixels for range sensing: TOF, RGBZ,
Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging, computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Wafer-on-wafer and chip-on-wafer stacking technologies
Backside thinning
New characterization methods
Packaging and testing: reliability, yield, cost
Defects, noises, and leakage currents
Radiation damage and radiation hard imagers

On-chip optics
Advanced optical path, color filters, microlens, light guides
Nanotechnologies for Imaging
Wafer level cameras

Submission of abstracts:
An abstract should consist of a single page of maximum 500-words text with up to two pages of
illustrations (3 pages maximum), and include authors’ name(s) and affiliation, mailing address,
telephone and e-mail address.

The deadline for abstract submission is 11:59pm, Thursday Dec 10th, 2026 (PST).
To submit an abstract, please go to: https://cmt3.research.microsoft.com/IISW2027
Above website should be open by Aug 1st, 2026.

The first time you visit the paper submission site, you'll need to click on "Create Account". Once you create and verify your account with your email address, you will be able to submit abstracts by logging in and clicking “Create New Submission”.

Please visit http://imagesensors.org/CFP2027 for complete instructions and any updates to the
abstract and paper submission procedures.

Abstracts will be considered on the basis of originality and quality. High quality papers on work in progress are also welcome. Abstracts will be reviewed confidentially by the Technical Program
Committee.

Key Dates
Authors will be notified of the acceptance of their abstract by February 12th, 2027.
Final-form 4-page paper submission date is March 20th, 2027.
Presentation material submission date is April 30th, 2027.

Location and format:
The IISW 2027 will be held at the Westin Resort & Spa in Whistler, British Columbia in Canada.

Registration, Workshop fee and Program:
The Workshop Program and registration details will be provided in the Final Announcement of the Workshop. 

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Canon "twisted photodiode" paper (IISW2025 special issue)

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In a paper titled "Design and Optimization of a Twisted Photodiode Pixel Structure for All-Directional Phase-Detection Autofocus CMOS Image Sensors" a team from Canon write:

To achieve an all-directional and high-speed, high-accuracy autofocus (AF) function, we propose a CMOS image sensor with a Twisted Photodiode (PD) structure. The developed 3D-stacked back-side illuminated (BSI) sensor employs the Twisted PD, which enables equivalent angular response characteristics in both the horizontal and vertical directions for the two PDs integrated within a single pixel, thereby realizing AF detection for all pixels and all directions. This paper describes the Twisted PD structure that enables all-directional AF and presents an analysis of charge transfer behavior in this unique 3D configuration. In this paper, “all-directional” refers to robustness with respect to subject direction.

This paper was published in the IISW2025 special issue of Sensors. 
Link: https://www.mdpi.com/1424-8220/26/6/1758

 








 

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Miscellaneous 2026 market news: Omnivision, Canon, Oculi, Sony

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Omnivision is listed on HKSE https://www.reuters.com/world/asia-pacific/chinas-omnivision-open-slightly-higher-hong-kong-trading-debut-2026-01-12/ 

Canon will manufacture image sensor image processing chips in 2nm process at Rapidus. https://asia.nikkei.com/business/tech/semiconductors/rapidus-adds-canon-as-first-major-domestic-customer-candidate-for-2nm-chips
 
 
 
Emberion has officially become part of Exosens https://www.emberion.com/exosens-acquires-emberion/

[Updated June 30 to fix a mistake in the summary of the Canon/Rapidus news article.]

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VISSA VISible detection for Space Applications open for abstract submissions

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ESA, CNES, AIRBUS DEFENCE & SPACE, ISAE-SUPAERO, OHB, SODERN, and THALES ALENIA SPACE are pleased to invite you to:

VISSA: VISible detection for Space Applications, the 9th iteration of the workshop series known as “Space & Scientific CMOS Image Sensors”

Please find attached the CALL FOR ABSTRACTS for the workshop planned for 24 and 25 November at ESA-ESTEC, The Netherlands.

This is a very popular event and has become one of the main European technical exchanges on CMOS image sensors. The aim of this workshop is to focus on latest developments in advanced image sensors for scientific and space applications targeting wavelengths shorter than 1.1 μm.

The deadline for abstract submission is 4 September 2026.

Please send a short abstract on one A4 page maximum in word or pdf format giving the
title, the author name(s) and affiliation(s), and presenting the subject of your talk, to
matthew.soman@esa.int and valerian.lalucaa@cnes.fr 

Abstracts shall preferably address one or more of the following topics:
• Pixel design (high QE, FWC, MTF optimization, low lag, …)
• Electrical design (low noise amplifiers, shutter, CDS, high speed architectures, TDI, HDR, …)
• On-chip ADC or TDC (in pixel, column, …)
• On-chip processing (smart sensors, multiple gains, summation, corrections)
• Low-light detection (electron multiplication, avalanche photodiodes, quanta image sensors, …)
• Photon counting, Time resolving detectors (gated, time-correlated single-photon counting, …)
• Hyperspectral architectures
• Materials (thin film, optical layers, dopant, high-resistivity, amorphous Si, …)
• Processes (backside thinning, hybridization, 3D stacking, anti-reflection coating, …)
• Packaging
• Optical design (micro-lenses, trench isolation, filters, …)
• Large size devices (stitching, butting, …)
• High speed interfaces
• Focal plane architectures
• CMOS image sensors with recent space heritage showing in-flight performance 

Workshop format & official language
Oral presentations shall be requested for the workshop. The official workshop language is English.
 

Slide submission
After abstract acceptance notification, the authors will be requested to prepare their presentation in pdf
or Powerpoint file format, to be presented at the workshop. Authors will also be required to provide a
version to the organizing committee along with an authorization to make it available for Workshop
attendees, and on-line for the COMET members. No proceedings will be compiled and so no detailed
manuscript needs to be submitted.
 

Registration
Registration fee : Attendees: 120 Euro // students: 60 Euro
On-line registration link will be sent at registration opening.
 

Exhibition/Sponsorship:
Booths will be available during the workshop. If you are interested to exhibit, please contact the
organizing committee. 

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Sony’s new X-ray image sensor IMX711

Image Sensors World        Go to the original article...

Product overview page: https://www.sony-semicon.com/en/products/is/scientific/x-ray.html

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.

It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.

The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.


 


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400×400 pixel stacked CIS HDR sensor for AR/VR applications

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In a June 2026 paper titled "A 400×400 3.24-μm 117-dB Dynamic Range Three-Layer Stacked Digital Pixel Sensor With Triple Quantization and Fixed Pattern Noise Correction" published in IEEE Trans. Electron Devices, a team from Brillnics, Meta, and SesameAI* write:

This article presents a 400×400 digital pixel sensor (DPS) with a 3.24 μm pixel pitch, fabricated using a 45/40/40 nm three-layer stacked process. The sensor achieves single-exposure high dynamic range (SEHDR) through overlapped triple quantization (3Q), fixed pattern noise correction (FPN-C), and black level correction (BLC). An on-chip image signal processor (ISP) is integrated to support defect pixel correction (DPC), SEHDR linearization, and gamma correction. Sparse transmission (ST) is incorporated to reduce transmitted data volume and, consequently, transmission power consumption. A wafer-level chip-scale package (WLCSP) with two redistribution layers (RDLs) is employed, resulting in a compact form factor of 2.47×1.85 mm^2. This work achieves a dynamic range (DR) of 117 dB while consuming 2.45 mW at 30 frames/s (fps), yielding a figure of merit (FoM) of 0.0046 e- rms  pJ, and is developed to meet the growing demands of augmented reality (AR) and virtual reality (VR) applications.

Full paper: https://doi.org/10.1109/TED.2026.3687537 

 











 

* Sesame AI (https://www.sesame.com/) is developing "conversational AI agents", with a smart glasses product slated for 2027.

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Conference List November 2026

Image Sensors World        Go to the original article...

IEEE Nuclear Science Symposium, Medical Imaging Conference, and Room-Temperature Semiconductor Detectors Symposium - 7-14 November 2026 - Granada, Spain - Website

SPIE Future Sensing Technologies 2026 - 9-12 November 2026 - Yokohama, Japan - Website - (co-located with SPIE Asia-Pacific Remote Sensing and Photonics Innovation)

Sensing with Quantum Light (SQL26) - 9-13 November 2026 - Cologne, Germany - Website

electronica - 10-13 November 2026- Munich Germany - Website

Compamed - 16-19 November 2026 - Dusseldorf, Germany - Website

Sensors 2026 - 19-21 November 2026 - Osaka, Japan - Website

18th Symposium Sensor Data Fusion: Trends, Solutions and Applications - Bonn, Germany - 23-25 November 2026 - Website

9th VISSA: Visible Detection for Space Applications - 24-25 November 2026 - Noordwijk, the Netherlands - Website

RSNA 2026 - 29 November-3 December 2026 - Chicago, Illinois, USA - Website


If you know about additional local conferences, please add them as comments.

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Low-cost ultra-high-speed imager using spatio-temporal encoding

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In a preprint titled "Low-cost passive single-shot ultrafast imaging at 685 Gfps" Eşlik et al write: 

Capturing ultrafast transient phenomena conventionally requires streak cameras or computational imaging based on compressed sensing, which lead to complex and costly systems. In this Letter, we demonstrate, to the best of our knowledge, the first fully passive single-shot ultrafast imaging architecture assembled entirely from off-the-shelf, low-cost components. A commercial microlens array combined with a stack of standard microscope cover glasses maps temporal information into multiple spatial channels, and a consumer-grade CMOS image sensor records all delayed replicas within a single camera exposure. The proposed system has a total hardware cost below US$500 and captures the evolution of a picosecond laser pulse with a temporal sampling interval of 1.46 ps, an effective frame rate of 685 Gfps, and a sequence depth of ten frames. The temporal fidelity of the system is verified by recovering the expected Gaussian pulse profile, and the spatial resolution is characterized through a point-source measurement with a point spread function of 1.86 and 1.62 pixels full width at half maximum along the horizontal and vertical directions, respectively. The proposed architecture presents an alternative approach to single-shot ultrafast imaging with a simple, low-cost, computation-free, and fully passive design.

Schematic of the proposed low-cost passive spatially multiplexed ultrafast imaging system. A microlens array generates replicated image channels, each of which experiences a different optical delay introduced by a stack of standard microscope cover glasses. Temporally delayed replicas are simultaneously recorded within a single camera exposure using a consumer-grade CMOS sensor. 

Single-shot reconstruction of the temporal evolution of a picosecond laser pulse. Each sub-image corresponds to a different optical delay introduced by the proposed spatial multiplexing architecture. The sequence is recovered from a single camera exposure with a temporal spacing of 1.46 ps between the frames.
 

Normalized total intensity extracted from reconstructed frames as a function of relative temporal delay. The measured temporal profile follows a Gaussian distribution (dashed curve), which confirms the accurate preservation of the pulse dynamics.
 

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ICCP 2026 posts call for posters & demos, registrations open

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Submission deadline: June 1, 2026, 11:59pm AoE 

ICCP 2026 brings together researchers and practitioners from the multiple fields that computational imaging intersects: computational photography, computational optics, computational sensing, computational displays, computer vision, computer graphics, art, and design. We invite you to present your work to this broad audience during the ICCP poster and demo session. Whereas ICCP papers must describe original research, ICCP posters and demos give an opportunity to showcase previously-published or yet-to-be-published work to a broader community.

The poster track is non-exclusive. All papers accepted at ICCP will have a poster reserved for them. The list of accepted and presented posters and demos will be announced on our conference website, which serves as a record of the presentation.

We are now accepting submissions in the following categories:

Posters:
- Recent research broadly related to computational imaging, previously published in another venue (conference or journal). This is your chance to present your work in person to a cross-section of the computational imaging community.
- Late-breaking technical results and research, including, but not limited to, progress in computational algorithms, optical system design, and innovative applications.

Demos:
Demos of working computational imaging prototypes, computational displays, tools, software platforms, and/or imaging instrumentation utilizing computational imaging techniques, including both research and commercial systems.


ICCP 2026 registration site is openhttps://iccp2026.iccp-conference.org/#registration
Early discounted rates available until June 11.

ICCP 2026 discounted hotel roomshttps://iccp2026.iccp-conference.org/#lodging

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Gpixel IPO on HKSE

Image Sensors World        Go to the original article...

Link: https://www.caproasia.com/2026/04/11/china-image-sensor-company-gpixel-changchun-microelectronics-hong-kong-ipo-to-raise-332-million-at-1-5-billion-valuation-with-expected-ipo-listing-on-17th-april-2026-founded-in-2012-by-xinyang-wang/

China Image Sensor Company Gpixel Changchun Microelectronics Hong Kong IPO to Raise $332 Million at $1.5 Billion Valuation with Expected IPO Listing on 17th April 2026, Founded in 2012 by Xinyang Wang

China image sensor company Gpixel Changchun Microelectronics Hong Kong IPO is raising $332 million at $1.5 billion valuation, with expected IPO listing on 17th April 2026.  Gpixel Changchun Microelectronics was founded in 2012 by Xinyang Wang. Gpixel Changchun Microelectronics – Gpixel is a turn key supplier of advanced off-the-shelf, customized and full custom CMOS image sensors for industrial, professional, medical and scientific applications. Our seasoned, multi-disciplinary team of image sensor experts work from our offices in Changchun and Hangzhou, China, Tokyo, Japan and Antwerp, Belgium to serve the worldwide market for specialty image sensors.

Additional news coverage:
https://www.forbes.com/sites/zinnialee/2026/04/21/chinas-newest-tech-billionaire-made-his-fortune-from-developing-image-sensor-chips-for-robotics/
https://www.marketscreener.com/news/gpixel-changchun-microelectronics-nets-hk-2-5-billion-in-hong-kong-ipo-ahead-of-debut-ce7e50d2da8af624

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Gpixel Leica collaboration

Image Sensors World        Go to the original article...

Link: https://www.gpixel.com/en/details_236.html

New Era of Imaging: Leica Camera AG and Gpixel Announce Strategic Partnership for Next-Generation Image Sensor Development

Wetzlar, Germany & Changchun, China, 20 April 2026 Today, Leica Camera AG and Gpixel, a leading global provider of advanced CMOS image sensors, announce a strategic partnership. Both partners agreed to combine their core competencies in the area of innovative imaging technologies to

co-develop a new high performance imaging sensor tailored for next-generation Leica cameras. This collaboration brings together Leica’s long-standing expertise in premium imaging and Gpixel’s cutting-edge sensor design capabilities to push the boundaries of what is technically possible in digital photography.

The partnership focuses on jointly engineering a bespoke image sensor optimized for Leica’s rigorous imaging standards, enabling unprecedented levels of image quality, dynamic range, color fidelity, and low-light performance across future Leica products.

 

Dr. Andreas Kaufmann, Chairman of the Supervisory Board and majority shareholder Leica Camera AG said: „I am really happy and proud that our long-term cooperation with Gpixel will result in a true Leica sensor, incorporating the best ingredients of engineering between Wetzlar, Antwerp and Changchun.”

 

“At Gpixel, we have always admired Leica’s uncompromising approach to craftsmanship and image performance,” said Xinyang Wang, CEO of Gpixel. “Collaborating with Leica gives us the opportunity to combine our sensor-engineering strengths with their legendary imaging heritage. This partnership allows us to co-create a new generation of sensors that will empower photographers with extraordinary image-making capabilities.”

 

The jointly developed sensor will be purpose-engineered to meet the highest performance requirements in color reproduction, noise optimization, dynamic range, and detail rendering. The collaboration also includes close cooperation in validation, image tuning, and production readiness.


About Gpixel

Gpixel is a global leader in advanced CMOS image sensor solutions, serving industrial, professional, and scientific imaging markets. Known for delivering state-of-the-art performance across a broad portfolio of sensor technologies—from high-resolution and high-speed imaging to low-noise and specialized sensor architectures—Gpixel helps partners across the world bring next-generation imaging products to life.

 

About Leica Camera

Leica Camera AG is an international, premium manufacturer of cameras, lenses and sports optics. As part of its growth strategy, the company has expanded its portfolio to include mobile imaging (smartphones) and the manufacture of high-quality spectacle lenses and watches, and is also represented in the home cinema segment with its own projectors. 

Leica Camera AG, having its headquarters in Wetzlar, Germany, and a second production site in Vila Nova de Famalicão, Portugal, operates a global network of its own distribution companies with around 120 Leica Stores worldwide. 

The Leica brand stands for excellence in quality, German craftsmanship and industrial design, combined with innovative technologies. An integral aspect of the brand culture is the promotion of the culture of photography, with around 30 Leica Galleries worldwide, the Leica Akademie and international awards such as the Leica Hall of Fame Award and the Leica Oskar Barnack Award (LOBA). 



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Conference List – October 2026

Image Sensors World        Go to the original article...

VISION - 6-8 October 2026 - Stuttgart, Germany - Website

Photonics Spectra Sensing Technologies Summit 2026 - 7 October 2026 - Online - Website

Optica Laser Congress and Exhibition - 11-15 October 2026 - Vilnius, Lithuania - Website

ASNT Annual Conference - 12-15 October 2026 - Columbus, Ohio, USA - Website

CPAD 2026 (Coordinating Panel for Advanced Detectors) - 20-23 October 2026 - Seattle, Washington, USA - Website

SPIE/COS Photonics Asia - 24-26 October 2026 - Nantong, Jiangsu, China - Website

IEEE Sensors Conference - 25-28 October 2026 - Rotterdam, The Netherlands, -  Website

Image Sensors Asia - 28-29 October 2026 - Seoul, South Korea/Hybrid - Website


If you know about additional local conferences, please add them as comments.

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Photonics article on single-photon detectors industry use-cases

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Link: https://www.photonics.com/Articles/Single-Photon-Detection-Bridges-the-Gap-Between/p7/a71989

Single-Photon Detection Bridges the Gap Between Quantum Tech and Industrial Users

The article covers the following companies and startups:

  • NovoViz: Integrating SPAD sensors with on-chip digital processing for industrial applications.
  • VTEC Lasers & Sensors: Offering "Quspads" InP-based SPAD chips with high efficiency and room-temperature operation.
  • Ubicept: Software platforms for real-time reconstruction with megapixel color SPAD sensors.
  • Photon Force: High-throughput SPAD array camera with 50-picosecond temporal resolution.
  • Quantum Computing Inc. (QCi): Quantum lidar and quantum photonic vibrometer systems.
  • ID Quantique (IDQ): SNSPD systems for integrated circuit inspection and Ariane 6 rocket monitoring.
  • Sony: Manufacturer of SPAD-based lidar modules. 
 

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AlpsenTek raises another round of funding for its hybrid vision sensor

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AlpsenTek Completes Series B+ as Hybrid Vision Sensors Become a New Gateway to the AI-Powered Physical World

SHENZHEN, China — March 17, 2026AlpsenTek, a pioneer in hybrid vision sensor technology, today announced the completion of a Series B+ financing round and the total fund-rasing has surpassed 100 million USD.

The B+ round was jointly backed by BEIDM, Guangdong Finance Fund Management, GAC Capital, Circumference Capital, Changjiang Capital, Bluetrum, UNICC Capital, Zhichen Investment, Wofo Venture Capital, and Sunyes.

The new funding will support continued core technology development, large-scale product manufacturing, and global market expansion, accelerating the industrial adoption of next-generation AI vision sensing technologies.

The Growing Need for Real-Time Perception in Physical AI

As artificial intelligence moves beyond the digital world and increasingly interacts with the physical environment, real-time environmental perception is becoming a fundamental infrastructure for intelligent systems.

Traditional vision sensors, which rely on fixed-frame-rate image capture and full-pixel data acquisition, are gradually struggling to meet the emerging requirements of intelligent perception systems that demand high speed, low latency, and high dynamic range.

Hybrid Vision Sensing: A New Path for AI Machine Vision

AlpsenTek’s Hybrid Vision Sensor (HVS) technology introduces a new technical paradigm for machine vision systems.

The technology integrates frame-based image sensing and event-based sensing mechanisms on a single sensor chip, enabling devices to simultaneously capture both image information and brightness change signals within a scene. This provides AI systems with visual inputs that are both more efficient and more representative of real-world dynamics.

If traditional image sensors record “what the world looks like,” hybrid vision sensors capture both “what the world looks like” and “how the world is changing.”

Dual-Modality Perception for Next-Generation AI

Compared with vision systems that rely solely on frame-based images, hybrid vision sensors can detect scene changes with much higher temporal resolution while maintaining full image output capability.

This dual-modality perception approach allows AI systems to achieve more stable and efficient visual perception in high-speed motion, high dynamic range, and complex lighting environments.

For rapidly developing AI applications—including robotics, autonomous driving, and intelligent devices—machines must not only see two-dimensional image details, spatial structure, and color, but also understand how environments evolve over time.

By introducing the temporal dimension alongside traditional visual information, hybrid vision sensors enable machines to more effectively perceive object motion, interactions, and environmental changes, significantly enhancing a system’s ability to understand the real world.

Reducing Data Redundancy for Efficient Edge AI

At the same time, traditional visual systems generate large amounts of redundant data during video capture, requiring substantial computational resources for processing.

Hybrid vision sensors adopt an event-driven sensing mechanism, outputting key information only when changes occur in a scene. This reduces redundant data generation at the source and provides more efficient data input for edge AI systems.

In the AI era, vision sensors are evolving from simple imaging devices into core interfaces through which machines perceive and understand the physical world.

CEO Perspective

Deng Jian, founder and CEO of AlpsenTek, said the rapid transition of AI from digital environments into the real world is reshaping the role of perception technologies.

“Artificial intelligence is rapidly moving from digital space into the real world,” Deng said. “Future AI systems—whether robots, intelligent devices, or automated systems—will require continuous, real-time perception of the physical environment. Hybrid vision sensors were developed to meet this demand. By simultaneously providing image information and motion-change data, we aim to build a more efficient visual perception foundation for the next generation of intelligent systems.”

Building a Hybrid Vision Product Ecosystem

As a key innovator in hybrid vision technology, AlpsenTek has established a complete proprietary technology stack spanning pixel architecture, chip design, and vision algorithms, and has been among the first globally to achieve large-scale production of hybrid vision sensors.

In 2025, the company introduced the APX014 (ALPIX-Pizol) hybrid vision sensor designed for edge AI perception applications, along with the APX002 (ALPIX-Maloja) pure event-based vision sensor.

Together with the previously released APX003 series and APX004 series, the company has formed a growing product portfolio targeting applications across robotics, wearables, smart home devices, automotive electronics, and consumer electronics.

Accelerating Industry Adoption

AlpsenTek is currently collaborating with several leading global technology companies to advance the large-scale adoption of hybrid vision sensors in intelligent devices and AI systems.

Deng said the company is entering a stage of acceleration as AI vision technologies move toward mass deployment.

“We are now at a pivotal moment for AI vision technologies to move into large-scale applications,” Deng said. “Over the next decade, countless intelligent systems will enter the real world, and visual perception will be one of their most fundamental technologies. Our goal is to make hybrid vision sensors one of the key perception interfaces for next-generation intelligent devices.”

As AI and intelligent hardware continue to evolve, new visual perception technologies are entering an unprecedented phase of opportunity. AlpsenTek said it will continue advancing core technological innovation and product commercialization to expand hybrid vision sensing into more real-world applications.

In an era where AI is moving into the physical world, machines must first learn to see the world—and see its changes—efficiently.

 

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AlpsenTek raises another round of funding for its hybrid vision sensor

Image Sensors World        Go to the original article...

AlpsenTek Completes Series B+ as Hybrid Vision Sensors Become a New Gateway to the AI-Powered Physical World

SHENZHEN, China — March 17, 2026AlpsenTek, a pioneer in hybrid vision sensor technology, today announced the completion of a Series B+ financing round and the total fund-rasing has surpassed 100 million USD.

The B+ round was jointly backed by BEIDM, Guangdong Finance Fund Management, GAC Capital, Circumference Capital, Changjiang Capital, Bluetrum, UNICC Capital, Zhichen Investment, Wofo Venture Capital, and Sunyes.

The new funding will support continued core technology development, large-scale product manufacturing, and global market expansion, accelerating the industrial adoption of next-generation AI vision sensing technologies.

The Growing Need for Real-Time Perception in Physical AI

As artificial intelligence moves beyond the digital world and increasingly interacts with the physical environment, real-time environmental perception is becoming a fundamental infrastructure for intelligent systems.

Traditional vision sensors, which rely on fixed-frame-rate image capture and full-pixel data acquisition, are gradually struggling to meet the emerging requirements of intelligent perception systems that demand high speed, low latency, and high dynamic range.

Hybrid Vision Sensing: A New Path for AI Machine Vision

AlpsenTek’s Hybrid Vision Sensor (HVS) technology introduces a new technical paradigm for machine vision systems.

The technology integrates frame-based image sensing and event-based sensing mechanisms on a single sensor chip, enabling devices to simultaneously capture both image information and brightness change signals within a scene. This provides AI systems with visual inputs that are both more efficient and more representative of real-world dynamics.

If traditional image sensors record “what the world looks like,” hybrid vision sensors capture both “what the world looks like” and “how the world is changing.”

Dual-Modality Perception for Next-Generation AI

Compared with vision systems that rely solely on frame-based images, hybrid vision sensors can detect scene changes with much higher temporal resolution while maintaining full image output capability.

This dual-modality perception approach allows AI systems to achieve more stable and efficient visual perception in high-speed motion, high dynamic range, and complex lighting environments.

For rapidly developing AI applications—including robotics, autonomous driving, and intelligent devices—machines must not only see two-dimensional image details, spatial structure, and color, but also understand how environments evolve over time.

By introducing the temporal dimension alongside traditional visual information, hybrid vision sensors enable machines to more effectively perceive object motion, interactions, and environmental changes, significantly enhancing a system’s ability to understand the real world.

Reducing Data Redundancy for Efficient Edge AI

At the same time, traditional visual systems generate large amounts of redundant data during video capture, requiring substantial computational resources for processing.

Hybrid vision sensors adopt an event-driven sensing mechanism, outputting key information only when changes occur in a scene. This reduces redundant data generation at the source and provides more efficient data input for edge AI systems.

In the AI era, vision sensors are evolving from simple imaging devices into core interfaces through which machines perceive and understand the physical world.

CEO Perspective

Deng Jian, founder and CEO of AlpsenTek, said the rapid transition of AI from digital environments into the real world is reshaping the role of perception technologies.

“Artificial intelligence is rapidly moving from digital space into the real world,” Deng said. “Future AI systems—whether robots, intelligent devices, or automated systems—will require continuous, real-time perception of the physical environment. Hybrid vision sensors were developed to meet this demand. By simultaneously providing image information and motion-change data, we aim to build a more efficient visual perception foundation for the next generation of intelligent systems.”

Building a Hybrid Vision Product Ecosystem

As a key innovator in hybrid vision technology, AlpsenTek has established a complete proprietary technology stack spanning pixel architecture, chip design, and vision algorithms, and has been among the first globally to achieve large-scale production of hybrid vision sensors.

In 2025, the company introduced the APX014 (ALPIX-Pizol) hybrid vision sensor designed for edge AI perception applications, along with the APX002 (ALPIX-Maloja) pure event-based vision sensor.

Together with the previously released APX003 series and APX004 series, the company has formed a growing product portfolio targeting applications across robotics, wearables, smart home devices, automotive electronics, and consumer electronics.

Accelerating Industry Adoption