400×400 pixel stacked CIS HDR sensor for AR/VR applications

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In a June 2026 paper titled "A 400×400 3.24-μm 117-dB Dynamic Range Three-Layer Stacked Digital Pixel Sensor With Triple Quantization and Fixed Pattern Noise Correction" published in IEEE Trans. Electron Devices, a team from Brillnics, Meta, and SesameAI* write:

This article presents a 400×400 digital pixel sensor (DPS) with a 3.24 μm pixel pitch, fabricated using a 45/40/40 nm three-layer stacked process. The sensor achieves single-exposure high dynamic range (SEHDR) through overlapped triple quantization (3Q), fixed pattern noise correction (FPN-C), and black level correction (BLC). An on-chip image signal processor (ISP) is integrated to support defect pixel correction (DPC), SEHDR linearization, and gamma correction. Sparse transmission (ST) is incorporated to reduce transmitted data volume and, consequently, transmission power consumption. A wafer-level chip-scale package (WLCSP) with two redistribution layers (RDLs) is employed, resulting in a compact form factor of 2.47×1.85 mm^2. This work achieves a dynamic range (DR) of 117 dB while consuming 2.45 mW at 30 frames/s (fps), yielding a figure of merit (FoM) of 0.0046 e- rms  pJ, and is developed to meet the growing demands of augmented reality (AR) and virtual reality (VR) applications.

Full paper: https://doi.org/10.1109/TED.2026.3687537 

 











 

* Sesame AI (https://www.sesame.com/) is developing "conversational AI agents", with a smart glasses product slated for 2027.

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Galaxycore announces dual analog gain HDR CIS

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Press release: https://en.gcoreinc.com/news/detail-66

GalaxyCore Unveils Industry's First DAG Single-Frame HDR 13Megapixels CIS

2023.08.11

GalaxyCore has officially launched the industry's first 13megapixels image sensor with Single-Frame High Dynamic Range (HDR) capability – the GC13A2. This groundbreaking 1/3.1", 1.12μm pixel back-illuminated CIS features GalaxyCore's unique Dual Analog Gain (DAG) circuit architecture, enabling low-power consumption 12bit HDR output during previewing, photography, and video recording. This technology enhances imaging dynamic range for smartphones, tablets, and more, resulting in vividly clear images for users.

The GC13A2 also supports on-chip Global Tone Mapping, which compresses real-time 12bit data into 10bit output, preserving HDR effects and expanding compatibility with a wider range of smartphone platforms.



High Dynamic Range Technology

Dynamic range refers to the range between the darkest and brightest images an image sensor can capture. Traditional image sensors have limitations in dynamic range, often failing to capture scenes as perceived by the human eye. High Dynamic Range (HDR) technology emerged as a solution to this issue.


Left Image: blowout in the bright part resulting from narrow dynamic range/Right Image: shot with DAG HDR

Currently, image sensors use multi-frame synthesis techniques to enhance dynamic range:
Photography: Capturing 2-3 frames of the same scene with varying exposure times – shorter exposure to capture highlight details and longer exposure to supplement shadow details – then combining them to create an image with a wider dynamic range.

Video Recording: Utilizing multi-frame synthesis, the image sensor alternates between outputting 60fps long-exposure and short-exposure images, which the platform combines to produce a 30fps frame with preserved highlight color and shadow details. While multi-frame synthesis yields noticeable improvements in dynamic range, it significantly increases power consumption, making it unsuitable for prolonged use on devices like smartphones and tablets. Moreover, it tends to produce motion artifacts when capturing moving objects.



Left Image: shot with Multi-Frame HDR (Motion Artifact) Right Image: shot with DAG HDR

GalaxyCore's Patented DAG HDR Technology

GalaxyCore's DAG HDR technology, based on single-frame imaging, employs high analog gain in shadow regions for improved clarity and texture, while low analog gain is used in highlight parts to prevent overexposure and preserve details. Compared to traditional multi-frame HDR, DAG HDR not only increases dynamic range and mitigates artifact issues but also addresses the power consumption problem associated with multi-frame synthesis. For instance, in photography, scenes that used to require 3-frame synthesis are reduced by 50% when utilizing DAG HDR.

Left Image: Traditional HDR Photography Right Image: DAG HDR Photography

GC13A2 Empowers Imaging Excellence with HDR


Empowered by DAG HDR, the GC13A2 is capable of low-power 12bit HDR image output and 4K 30fps video capture. It reduces the need for frame synthesis during photography and lowers HDR video recording power consumption by approximately 30%, while avoiding the distortion caused by motion artifacts.

Compared to other image sensors of the same specifications in the industry, GC13A2 supports real-time HDR previewing, allowing users to directly observe every frame's details while shooting. This provides consumers with an enhanced shooting experience.

GC13A2 has already passed initial verification by brand customers and is set to enter mass production. In the future, GalaxyCore will introduce a series of high-resolution DAG single-frame HDR products, including 32Megapixels and 50Megapixels variants. This will further enhance GalaxyCore’s high-performance product lineup, promoting superior imaging quality and an enhanced user experience for smartphones.

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MDPI IISW2023 special issue – 316MP, 120FPS, HDR CIS

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A. Agarwal et al. have published a full length article on their IISW 2023 conference presentation in a special issue of MDPI Sensors. The paper is titled "A 316MP, 120FPS, High Dynamic Range CMOS Image Sensor for Next Generation Immersive Displays" and is joint work between Forza Silicon (AMETEK Inc.) and Sphere Entertainment Co..

Full article (open access): https://doi.org/10.3390/s23208383

Abstract
We present a 2D-stitched, 316MP, 120FPS, high dynamic range CMOS image sensor with 92 CML output ports operating at a cumulative date rate of 515 Gbit/s. The total die size is 9.92 cm × 8.31 cm and the chip is fabricated in a 65 nm, 4 metal BSI process with an overall power consumption of 23 W. A 4.3 µm dual-gain pixel has a high and low conversion gain full well of 6600e- and 41,000e-, respectively, with a total high gain temporal noise of 1.8e- achieving a composite dynamic range of 87 dB.

Figure 1. Sensor on a 12 inch wafer (4 dies per wafer), die photo, and stitch plan.



Figure 2. Detailed block diagram showing sensor partitioning.


Figure 3. Distribution of active and dark rows in block B/H, block E, and final reticle plan.


Figure 5. Sensor timing for single-exposure dual-gain (HDR) operation.



Figure 6. Data aggregation and readout order for single-gain mode.


Figure 7. Data aggregation and readout order for dual-gain mode.

Figure 8. ADC output multiplexing network for electrical crosstalk mitigation.


Figure 9. Conventional single-ended ADC counter distribution.


Figure 10. Proposed pseudo-differential ADC counter distribution.


Figure 11. Generated thermal map from static IR drop simulation.

Figure 12. Measured dark current distribution.

Figure 13. SNR and transfer function in HDR mode.


Figure 14. Full-resolution color image captured in single-gain mode at 120 FPS.







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Paper on "Charge-sweep" CIS Pixel

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In a recent paper titled "Design and Characterization of a Burst Mode 20 Mfps Low Noise CMOS Image Sensor" (https://www.mdpi.com/1424-8220/23/14/6356) Xin Yue and Eric Fossum write:

This paper presents a novel ultra-high speed, high conversion-gain, low noise CMOS image sensor (CIS) based on charge-sweep transfer gates implemented in a standard 180 nm CIS process. Through the optimization of the photodiode geometry and the utilization of charge-sweep transfer gates, the proposed pixels achieve a charge transfer time of less than 10 ns without requiring any process modifications. Moreover, the gate structure significantly reduces the floating diffusion capacitance, resulting in an increased conversion gain of 183 µV/e−. This advancement enables the image sensor to achieve the lowest reported noise of 5.1 e− rms. To demonstrate the effectiveness of both optimizations, a proof-of-concept CMOS image sensor is designed, taped-out and characterized.











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OmniVision three-layer stacked sensor

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From Businesswire --- "OMNIVISION Announces World’s Smallest Global Shutter Image Sensor for AR/VR/MR and Metaverse".

OmniVision has announced the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor. The OG0TB is the world’s smallest image sensor for eye and face tracking in AR/VR/MR and Metaverse consumer devices, with a package size of just 1.64mm x 1.64mm, it has a 2.2µm pixel in a 1/14.46-inch optical format (OF). The CMOS image sensor features 400×400 resolution and ultra-low power consumption, ideal for some of the smallest and lightest battery-powered wearables, such as eye goggles and glasses. Ultra-low power consumption is critical for these battery-powered devices, which can have 10 or more cameras per system. Their OG0TB BSI GS image sensor consumes less than 7.2mW at 30 frames per second (fps).



SANTA CLARA, Calif.--(BUSINESS WIRE)--OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor. The OG0TB is the world’s smallest image sensor for eye and face tracking in AR/VR/MR and Metaverse consumer devices, with a package size of just 1.64mm x 1.64mm, it has a 2.2µm pixel in a 1/14.46-inch optical format (OF). The CMOS image sensor features 400x400 resolution and ultra-low power consumption, ideal for some of the smallest and lightest battery-powered wearables, such as eye goggles and glasses.

“OMNIVISION is leading the industry by developing the world’s first three-layer stacked global shutter pixel technology and implementing it in the smallest GS image sensor with uncompromising performance,” said David Shin, staff product marketing manager – IoT/Emerging at OMNIVISION. “We pack all of these features and functions into the world’s smallest ‘ready-to-go’ image sensor, which provides design flexibility to put the camera in the most ideal placement on some of the smallest and slimmest wearable devices.” Shin adds, “Ultra-low power consumption is critical for these battery-powered devices, which can have 10 or more cameras per system. Our OG0TB BSI GS image sensor consumes less than 7.2mW at 30 frames per second (fps).”

The worldwide market for AR/VR headsets grew 92.1% year over year in 2021, with shipments reaching 11.2 million units, according to new data from the International Data Corporation (IDC) Worldwide Quarterly AR/VR Headset Tracker1. New entrants as well as broader adoption from the commercial sector will propel the market further as headset shipments are forecast to grow 46.9% year over year in 2022. In fact, IDC expects this market to experience double-digit growth through 2026 as global shipments of AR/VR headsets surpass 50 million units by the end of the forecast, with a 35.1% compounded annual growth rate (CAGR).

OMNIVISION is supporting the growing market for AR/VR headsets by introducing new products such as the OG0TB GS image sensor, which features the company’s most advanced technology:

 It is built on OMNIVISION’s PureCel®Plus-S stacked-die technology.

 It features a three-layer stacked sensor with pixel size at 2.2µm in a 1/14.46-inch OF to achieve 400x400 resolution.

 Nyxel® technology enables the best quantum efficiency (QE) at the 940nm NIR wavelength for sharp, accurate images of moving objects.

 The sensor’s high modulation transfer function (MTF) enables sharper images with greater contrast and more detail, which is especially important for enhancing decision-making processes in machine vision applications.

 The sensor supports a flexible interface, including MIPI with multi-drop, CPHY, SPI, etc.

The OG0TB GS image sensor will be available for sampling in Q3 2022 and in mass production in the 2H 2023.


PS: It is worth noting that Sony made a claim for "world's first 3 layer stacked CIS" back in 2017 after their ISSCC paper titled "A 1/2.3inch 20Mpixel 3-layer stacked CMOS Image Sensor with DRAM" (DOI: 10.1109/ISSCC.2017.7870268). The three layers consisted of photodiodes, DRAM memory, and mixed-signal ISP. But that was a rolling shutter sensor, whereas this one from OmniVision is a global shutter sensor. 

PPS: Readers of blog who know of any journal or conference publication about OmniVision's new design please share them in the comments below! 


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Gpixel announces new global shutter GSPRINT 4502 sensor

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Gpixel press release on August 17, 2022:

Gpixel expands high-speed GSPRINT image sensor series with a 2/3” 2.5 MP 3460 fps global shutter GSPRINT4502


Gpixel announces a high-speed global shutter image sensor, GSPRINT4502, a new member of the GSPRINT series taking high speed imaging to another level.


GSPRINT4502 is a 2.5 Megapixel (2048 x 1216), 2/3” (φ10.7 mm), high speed image sensor designed with the latest 4.5 µm charge domain global shutter pixel. It achieves more than 30 ke- charge capacity and less than 4 e- rms read noise, with dynamic range of 68 dB which can be expanded using a multi-slope HDR feature. Utilizing an advanced 65 nm CIS process with light pipe and micro lens technology, the sensor achieves >65% quantum efficiency and < -92 dB parasitic light sensitivity.

GSPRINT4502 can achieve extremely high frame rates up to 3460 fps in 8-bit mode, 1780 fps in 10-bit mode or 850 fps in 12-bit mode, all at full resolution. With 2×2 on-chip charge binning, full well capacity can be further increased to 120 ke- and frame rate to 10,200 fps. GSPRINT4502 supports vertical and horizontal regions of interest for higher frame rates. GSPRINT4502 is perfect for high-speed applications including 3D laser profiling, industrial inspection, high speed video and motion analysis.

Data output from GSPRINT4502 is through 64 pairs sub-LVDS channels running 1.2 Gbps each. Flexible output channel multiplex modes make it possible to reduce frame and data rate to make the sensor compatible with all available camera interface options. GSPRINT4502 is packaged in a 255-pin uPGA ceramic package and will be offered in sealed and removable glass lid versions.

“The market reaction to the GSPRINT high-speed image sensor family provides evidence that a growing number of applications require higher frame rates,” said Wim Wuyts, Chief Commercial Officer of Gpixel. “We are excited to continue to expand the portfolio to bring these high frame rates to more applications.”

GSPRINT4502 engineering samples can be ordered today for delivery in October, 2022. 

About the GSPRINT sensor family

The GSPRINT series is Gpixel’s high-speed global shutter product family, including the 21 MP GSPRINT4521, 10 MP GSPRINT4510 and 2.5 MP GSPRINT4502. The GSPRINT technology will be used to expand the sizes and resolutions available in the family in the future. To learn more about the GSPRINT series, please contact us at: info@gpixel.com
 

About Gpixel

Gpixel provides high-end customized and off-the-shelf CMOS image sensors for industrial, professional, medical, and scientific applications. Gpixel’s standard products include the GMAX and GSPRINT global shutter, fast frame rate sensors, the GSENSE and GLUX high-end scientific CMOS image sensor series, the GL series of line scan imagers, the GLT series of TDI line scan imagers and the GTOF series of iTOF imagers. Gpixel’s broad portfolio of products utilizes the latest technologies to meet the ever-growing demands of the professional imaging market.

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3D Wafer Stacking: Review paper in IEEE TED June 2022 Issue

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In IEEE Trans. Electr. Dev. June 2022 issue, in a paper titled "A Review of 3-Dimensional Wafer Level Stacked Backside Illuminated CMOS Image Sensor Process Technologies," Wuu et al. write:

Over the past 10 years, 3-dimensional (3-D) wafer-level stacked backside Illuminated (BSI) CMOS image sensors (CISs) have undergone rapid progress in development and performance and are now in mass production. This review paper covers the key processes and technology components of 3-D integrated BSI devices, as well as results from early devices fabricated and tested in 2007 and 2008. This article is divided into three main sections. Section II covers wafer-level bonding technology. Section III covers the key wafer fabrication process modules for BSI 3-D waferlevel stacking. Section IV presents the device results.




This paper has quite a long list of acronyms. Here is a quick reference:
BDTI = backside deep trench isolation
BSI = backside illumination
BEOL = back end of line
HB = hybrid bonding
TSV = through silicon via
HAST = highly accelerated (temperature and humidity) stress test
SOI = silicon on insulator
BOX = buried oxide

Section II goes over wafer level direct bonding methods.



Section III discusses important aspects of stacked design development for BSI (wafer thinning, hybrid bonding, backside deep trench isolation, pyramid structure to improve quantum efficiency, use of high-k dielectric film to deal with crystal defects, and pixel performance analyses).














Section IV shows some results of early stacked designs.







Full article: https://doi.org/10.1109/TED.2022.3152977

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Labforge releases new 20.5T ops/s AI machine vision camera

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Labforge has designed and developed a smart camera called Bottlenose which supports 20.5 trillion operations/second processing power and on-board AI, depth, feature points & matching, and a powerful ISP. The target audience is robotics and automation. They have built the camera around a Toshiba Visconti-5 processor. The current models are available as both stereo and monocular versions with IMX577 Sony image sensors. For future models there will be a range of resolutions and shutter options available. 






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Sony releases new sensors IMX487, IMX661

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IMX487 UV 8.13MP

[Advertised as "new product launch" but this has been around for a while.]

Global shutter CMOS image sensor specialized for the UV spectrum

With the structure specially designed for the properties of the UV wavelengths coupled with Pregius S technology, the image sensor can capture undistorted images of moving objects within a UV range of 200–400 nm and at a high frame rate of 193 fps (operated in the 10-bit mode). This image sensor has a potential to expand the scope of application from the conventional use of UV cameras in the inspection of semiconductors, etc. to areas that require high-speed capability, such as sorting of recycled materials.

Low noise

This image sensor has adopted the component materials dedicated for UV range imaging, and a special structure has been developed for its light receiving area. These make it possible to maintain high UV sensitivity while significantly minimizing noises to produce high quality images.

Smaller pixels

The pixels are miniaturized down to 2.74 um while maintaining high UV sensitivity, realizing a small multi-pixel sensor of the 2/3 type with approximately 8.13 megapixels. It serves well with factory automation, but also for many other purposes, notably for outdoor use for infrastructure inspections, by virtue of its portability and high resolution.






IMX661 127MP

The IM661 is a diagonal 56.73 mm (Type 3.6) CMOS active pixel type solid-state image sensor with a square pixel array and 127 M effective pixels. This chip features a global shutter with variable charge-integration time. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V quadruple power supply. (Applications: FA cameras)





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Samsung’s ISOCELL HP3 sensor

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Samsung has published details about its now 200MP sensor 'ISOCELL HP3'.

https://semiconductor.samsung.com/image-sensor/mobile-image-sensor/isocell-hp3/

Press release: https://news.samsung.com/global/samsung-unveils-isocell-image-sensor-with-industrys-smallest-0-56%CE%BCm-pixel


Samsung Electronics, a world leader in advanced semiconductor technology, today introduced the 200MP ISOCELL HP3, the image sensor with the industry’s smallest 0.56-micrometer (μm)-pixels.

“Samsung has continuously led the image sensor market trend through its technology leadership in high resolution sensors with the smallest pixels,” said JoonSeo Yim, Executive Vice President of Sensor Business Team at Samsung Electronics. “With our latest and upgraded 0.56μm 200MP ISOCELL HP3, Samsung will push on to deliver epic resolutions beyond professional levels for smartphone camera users.”

Epic Resolution Beyond Pro Levels

Since its first 108MP image sensor roll-out in 2019, Samsung has been leading the trend of next-generation, ultra-high-resolution camera development. Through the steady launch of new image sensors and advancements in performance, the company is once again forging ahead with the 0.56μm 200MP ISOCELL HP3.

The ISOCELL HP3, with a 12 percent smaller pixel size than the predecessor’s 0.64μm, packs 200 million pixels in a 1/1.4” optical format, which is the diameter of the area that is captured through the camera lens. This means that the ISOCELL HP3 can enable an approximately 20 percent reduction in camera module surface area, allowing smartphone manufacturers to keep their premium devices slim.

The ISOCELL HP3 comes with a Super QPD auto-focusing solution, meaning that all of the sensor’s pixels are equipped with auto-focusing capabilities. In addition, Super QPD uses a single lens over four-adjacent pixels to detect the phase differences in both horizontal and vertical directions. This paves way for a more accurate and quicker auto focusing for smartphone camera users.

The sensor also allows users to take videos in 8K at 30 frames-per-second (fps) or 4K at 120fps, with minimal loss in the field of view when taking 8K videos. Combined with the Super QPD solution, users can take movie-like cinematic footage with their mobile devices.

Ultimate Low Light Experience Through ‘Tetra2pixel’

The ISOCELL HP3 also provides an ultimate low-light experience, with the Tetra2pixel technology that combines four pixels into one to transform the 0.56μm 200MP sensor into a 1.12μm 50MP sensor, or a 12.5MP sensor with 2.24μm-pixels by combining 16 pixels into one. The technology enables the sensor to simulate a large-sized pixel sensor to take brighter and more vibrant shots even in dimmed environments, like in-doors or during nighttime.

To maximize the dynamic range of the mobile image sensor, the ISOCELL HP3 adopts an improved Smart-ISO Pro feature. The technology merges image information made from the two conversion gains of Low and High ISO mode to create HDR images. The upgraded version of the technology comes with a triple ISO mode — Low, Mid and High — that further widens the sensor’s dynamic range. In addition, the improved Smart-ISO Pro enables the sensor to express images in over 4 trillion colors (14-bit color depth), 64 times more colors than the predecessor’s 68 billion (12-bit). Furthermore, by supporting staggered HDR along with Smart-ISO Pro, the ISOCELL HP3 can switch between the two solutions depending on the filming environment to produce high-quality HDR images.

Samples of the Samsung ISOCELL HP3 are currently available, and mass production is set to begin this year.


Effective Resolution 16,320 x 12,288 (200M)

Pixel Size 0.56μm

Optical Format 1/1.4"

Color Filter Super QPD Tetra2pixel, RGB Bayer Pattern

Normal Frame Rate 7.5 fps @ full 200 MP, 27 fps @ 50 MP, and 120 fps @ 12.5 MP

Video Frame Rate 30 fps @ 8K, 120 fps @ 4K, and 480 fps @ FHD

Shutter Type Electronic rolling shutter

ADC Accuracy 10-bits

Supply Voltage 2.2 V for analog, 1.8 V for I/O, and 0.9 V for digital core supply

Operating Temperature -20℃ to +85℃

Interface 4 lanes (2.5Gbps per lane) D-PHY / 3 lanes (4.0Gsps per lane) C-PHY

Chroma Tetra2pixel

Auto Focus RGB Bayer Pattern

HDR Smart-ISO Pro (iDCG), Staggered HDR

Output Formats RAW10/12/14

Analog Gain x128 with High Conversion Gain

Product Status Samples Available 

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PhD Thesis on Dynamic Range Improvements

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A PhD thesis titled "Proposal of Architecture and Circuits for Dynamic Range Enhancement of Vision Systems on Chip designed in Deep Submicron Technologies" by from Universidad de Sevilla is now available to the public. The thesis is by Sonia Vargas Sierra who did this work at the Image Sensor group of Microelectronic Institute of Seville.

Although the thesis is from a few years ago, some of the content in the thesis may be of interest now due to recent developments in vertical integrated technologies.

From the Preface:

The work presented in this thesis proposes new techniques for dynamic range expansion in electronic image sensors. Since Dynamic Range (DR) is defined as the ratio between the maximum and the minimum measurable illuminations, the options for improvement seem obvious; first, to reduce the minimum measurable signal by diminishing the noise floor of the sensor, and second, to increase the maximum measurable light by increasing the sensor saturation limit.

In our case, we focus our studies to the possibility of providing DR enhancement functionality in a single chip, without requiring any external software/hardware support, composing what is called a Vision-System-on-Chip (VSoC). In order to do so, this thesis covers two approaches. Chronologically, our first option to improve the DR relied on reducing the noise by using a fabrication technology that is specially devoted to image sensor fabrication, a so-called CMOS Image Sensor (CIS) technology. However, measurements from a test chip indicated that the dynamic range improvement was not sufficient to our purposes (beyond the 100dB limit). Additionally, the technology had some important limitations on what kind of circuitry can be placed next to the photosensor in order to improve its performance. Our second approach has consisted in, first, designing a tone mapping algorithm for DR expansion whose computational needs can be easily mapped onto simple signal conditioning and processing circuitry around the photosensor, and second, designing a test chip implementing this algorithm in a standard CMOS technology.

This thesis is organized in five chapters. Chapter 1 describes the main concepts involved in image sensors focusing in High Dynamic Range (HDR) operation. Chapter 2 presents the study of an image sensor optimized technology in order to be considered for dynamic range improvement techniques. Chapter 3 describes an innovative tone mapping algorithm used to optimize the compression of HDR scenes. Chapter 4 introduces the image sensor chip that has been designed and fabricated, which implements the new tone mapping algorithm. Chapter 5 shows the experimental results and evaluation of the performance of the chip. 


Link to download thesis pdf: https://idus.us.es/handle/11441/130619


A couple of references related to the topic of this thesis: 
  1. S. Vargas-Sierra et al., "A 151 dB high dynamic range CMOS image sensor chip architecture with tone mapping compression embedded in-pixel", IEEE Sensors J. Jan. 2015. https://ieeexplore.ieee.org/document/6860247 
  2. Mori et al., "A 4.0 μm Stacked Digital Pixel Sensor Operating in a Dual Quantization Mode for High Dynamic Range," IEEE TED June 2022 issue. https://ieeexplore.ieee.org/abstract/document/9762367/

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Surveillance market and SmartSens

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From DigiTimes Asia news: https://www.digitimes.com/news/a20220527PD203/sensor-surveillance.html


China security surveillance market boom buoys SmartSens

The expanding security surveillance market in China continues to boost the shipments of CMOS image sensor (CIS) chips from Chinese CIS startup SmartSens Technology, which has entered the supply chains of China's first-tier security camera vendors including Hikvision Digital Technology, Uniview Technologies and Dahua Technology, according to industry sources.

IDC statistics show China's security surveillance market scale reached US$16.2 billion in 2021 and is estimated to grow to US$20.1 billion in 2022, for a CAGR of 13.6% for the period. High-definition security camera lenses have become the tipping point of market growth, fast driving CIS sales in China, the sources said.

Since launching its first CIS chip SC1035 in 2014, SmartSens has quickly built a strong presence in the security surveillance sector. Its CIS shipments topped 100 million in 2017 and grew all the way to 146 million in 2020, registering the highest global market share at 35% in the security CIS sector, according to Frost & Sullivan statistics.

Over the years, SmartSens has been dedicated to developing high-performance CIS chips with higher light sensitivity and signal-to-noise ratios, as well as better low-light performance as the core requirements, while deepening deployments in AI, intelligent perception and machine vision capabilities, the industry sources noted.

In terms of future security-use CIS development, its co-founder and CEO Richard Xu has said that as the surveillance lens application scenarios continue to expand, the features of low light and wide dynamic range (WDR) will be increasingly highlighted for security camera solutions so that they can penetrate higher-end applications.

Since late April this year, SmartSens has kicked off a plan to list its shares on China's Sci-Tech Innovation Board (STAR Market), aiming to raise CNY2.82 billion to finance equipment procurement and system construction for its R&D center as well as the development of car-use CIS products, the sources said.

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Samsung making a new larger ISOCELL camera sensor?

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Samsung is the world’s second-biggest mobile camera sensor maker, and its sensors are used by almost every smartphone brand. Over the past couple of years, the South Korean firm has launched various big-sized camera sensors, including the ISOCELL GN1 and the ISOCELL GN2. This year, it has made one more giant ISOCELL camera sensor.

The company has developed the ISOCELL GNV camera sensor, and it will be used in a Vivo smartphone. It is being reported that the ISOCELL GNV is custom-made for Vivo phones, and it has a size of 1/1.3-inch. It is most likely a 50MP sensor, similar to the ISOCELL GN1, ISOCELL GN2, and the ISOCELL GN5. It will act as the Vivo X80 Pro+’s primary camera and features a gimbal-like OIS system.



The ISOCELL GNV is likely a slightly modified version of Samsung’s ISOCELL GN1. The Vivo smartphone has three other cameras, including a 48MP/50MP ultrawide camera (Sony IMX sensor), a 12MP telephoto camera with 2x optical zoom and OIS, and an 8MP telephoto camera with 5x optical zoom and OIS. The phone can record 8K videos using the primary camera and up to 4K 60fps videos using the rest of its cameras. On the front, it could have a 44MP selfie camera.

The phone also uses Vivo’s custom ISP (Image Signal Processor) named V1+, which has been made in close collaboration with MediaTek. The new chip brings 16% higher brightness and 12% better white balance to images in low-light conditions. Prominent sections of an image can see up to 350% better brightness for lower noise and better colors.

The rest of the phone’s specifications include a 6.78-inch 120Hz Super AMOLED LTPO display, Snapdragon 8 Gen 1 processor, 8GB/12GB RAM, 128GB/256GB storage, 4,700mAH battery, 80W fast wired charging, 50W fast wireless charging, stereo speakers, and an IP68 rating for dust and water resistance.

https://www.sammobile.com/news/samsung-isocell-gnv-camera-sensor-coming/

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Wide field-of-view imaging with a metalens