Image Sensors World        Go to the original article...

PRNewswire: OmniVision announced the OV9732 and OV9733, two power-efficient 720p30 CameraChip sensors based on OmniPixel3‑HS pixel for mainstream security systems and wireless battery-powered smart-home cameras.

The OV9732 is a traditional Bayer sensor. The OV9733 is equipped with RGB-IR pixels that can replace the traditional mechanical IR cut filter, thus simplifying the system designs and enabling the sensor to capture high quality infrared images and video, even from long ranges.

"Power consumption and image quality are among the most critical performance indicators for compact, battery-powered cameras found in new security systems and IoT-based smart-home and lifestyle cameras," said Chris Yiu, senior strategic marketing manager at OmniVision. "The extremely power-efficient OV9732 and OV9733 are 35 percent smaller than the previous-generation OV9712 CameraChip sensor, while capturing equally exceptional images. These benefits make the OV9732 and OV9733 extremely versatile imaging solutions, capable of supporting most mainstream security cameras and battery-operated camera platforms."

The sensors' narrow 9-degree CRA supports consumer-grade optical lens systems and reduces image artifacts for enhanced performance. When operating in low-power mode, the 1/4-inch OV9732 requires just 115mW to capture 720p30 video.

The OV9732 is currently in volume production and the OV9733 is expected to enter volume production in the Q4 2015.

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: Ambarella introduced S3L, a low-power IP camera SoC that enables H.265, or HEVC video encoding in cloud-based home monitoring and mainstream professional IP cameras. S3L includes multi-exposure HDR, 180-degree fisheye lens correction and a high performance CPU for intelligent video analytics.

“Our new S3L SoC family brings the low bit rate benefits of H.265 to cloud-based home monitoring and mainstream professional cameras,” said Chris Day, VP of marketing and business development at Ambarella.

Go to the original article...

Image Sensors World        Go to the original article...

InVisage announces the release of “Prix”, a short film shot entirely with InVisage’s QuantumFilm smartphone camera sensor. The film is said to capture "a stunning level of detail despite dynamic lighting environments and shooting fast-moving subjects outdoors. This quality is made possible thanks to InVisage’s QuantumFilm, a quantum dot camera sensor technology."

“Today, filmmakers of all types have access to HD-quality cameras through their smartphones,” said InVisage President and CEO Jess Lee. “However, achieving truly cinematic quality can be difficult without professional-grade cameras. Our expanded dynamic range capability is a major step forward in allowing smartphones to capture the tiniest of details across a wide range of lighting conditions. The results can be seen in ‘Prix,’ a charming short film about children who make their own technological innovations.”


Prix film has been published on Youtube, while another Youtube video talks about the QuantumFilm advantages and gives a short Invisage office tour:



Update: Phys.org posts a collection of responses from different web sites on the QuantumCinema technology.

Go to the original article...

Image Sensors World        Go to the original article...

Nikkei reports that "Toshiba is in late-stage talks on selling its image sensor operations to Sony in a deal estimated at around 20 billion yen ($163 million)."

"Negotiations on the sale have reached an advanced stage. Toshiba is looking to divest its newest production facility in Oita, which can handle 300mm wafers. Besides production equipment, Sony would take over some employees as well as customer accounts, which include automakers and camera manufacturers.

Besides production equipment, Sony would take over some employees as well as customer accounts, which include automakers and camera manufacturers.

Toshiba would in effect withdraw from the image sensor market and concentrate its semiconductor investment on its more competitive memory business.

Toshiba's global market share in CMOS sensors came to just 1.9% last year, compared with 40.3% for Sony, according to Tokyo-based Techno Systems Research. Sony's investments in this business will help it fend off rising competition from Samsung Electronics."

Reuters confirms this story, based on its own sources.

Another Nikkei article talks about Toshiba restructuring and its hard choices:

"Toshiba has little choice but to carry out a sweeping reorganization of its presence in semiconductors. It has turned to Sony, which once sold a portion of its semiconductor operations in Nagasaki to Toshiba, only to buy it back later.

Some workers at its Oita semiconductor operations in southern Japan would go to Sony as part of the image sensor business sale.

Muromachi [Masashi Muromachi, the new Toshiba President who started the re-org - ISW] once ran Toshiba's semiconductor operations in Oita."

The Japan Times quotes Yomiuri newspaper saying the deal will be officially announced next week.

Toshiba Oita Fab

Go to the original article...

Image Sensors World        Go to the original article...

Sept. 2015 issue of NHK R&D Journal is almost entirely devoted to the image sensor projects:

Fabrication of Three-Dimensional Integrated Circuits for CMOS Image Sensors with Pixel-Parallel Signal Processing
Masahide GOTO, Kei HAGIWARA, Yoshinori IGUCHI and Hiroshi OHTAKE
ABSTRACT
We studied a three-dimensional (3D)-integrated image sensor that is capable of pixel-parallel signal processing, thereby meeting the demand for high-resolution and high-frame-rate imaging. Unlike the conventional 3D-stacked devices using through silicon vias (TSVs), which are not applicable to image sensor pixels of a few micrometers or less due to its hole diameter larger than the pixel size, we have recently developed a novel 3D-structuring method by using the direct bonding that could transfer signals vertically without using TSVs. Demonstrations are performed on 3D-CMOS inverters and 3D-ring oscillators with 101 stages through the lowtemperature hybrid bonding of Au contacts embedded in a SiO2 surface. The experimental results show that the developed technology is promising for high-density 3D-integrated circuits.

Color Image Sensor using Three Stacked Organic Photoconductive Films with Silicon Nitrides as Interlayer Insulators
Hokuto SEO, Toshikatsu SAKAI and Hiroshi OHTAKE
ABSTRACT
We are developing a color image sensor with three stacked organic photoconductive films (OPFs) sensitive to only one primary color component (red (R), green (G), or blue (B)); each OPF has a signal readout circuit. In this study, we fabricated a structure with three stacked OPFs sensitive to the R, G, or B component with a thickness of 5.8μm by using 2-μmthick silicon nitrides as interlayer insulators.

Development on Low-voltage Carrier Multiplication Film using Chalcopyrite Based Materials
Kenji KIKUCHI, Shigeyuki IMURA, Kazunori MIYAKAWA, Hiroshi OHTAKE and Misao KUBOTA
ABSTRACT
There is a need for highly sensitive imaging devices for high-resolution and high-frame-rate image sensors. We have been developing low-voltage carrier multiplication film using chalcopyrite based materials, CuIn1-xGax(Se1-ySy)2 (CIGS), to increase the sensitivity of image sensors. A gallium oxide (Ga2O3) thin layer, which functioned as a hole-blocking layer, was used for the CIGS layer to achieve low dark current. The electric and optical properties of Ga2O3/CIGS photodiodes were investigated. The quantum efficiency in the visible light range (400-700nm) was 95% at an applied voltage of 4V. Moreover, carrier multiplication phenomena were observed at applied voltages under 5V.

Development of CMOS Image Sensors Overlaid with Crystalline Selenium-based Heterojunction Photodiode
Shigeyuki IMURA, Kenji KIKUCHI, Kazunori MIYAKAWA, Hiroshi OHTAKE and Misao KUBOTA
ABSTRACT
We have been investigating highly sensitive imaging devices with crystalline selenium (c-Se) as a photosensitive layer for applications to nextgeneration ultra high-definition imaging systems. By using c-Se with a high absorption coefficient over the entire visible region instead of using silicon, which has been conventionally applied to a photoelectric conversion material, highly sensitive image sensors using avalanche multiplication in a photoelectric conversion film can be realized. In this paper, we describe the first observation of avalanche multiplication in a c-Se film fabricated on the glass substrate which exhibits external quantum efficiency of greater than 100%. Furthermore, we successfully created high resolution images by applying a uniform c-Se film to the CMOS circuits.

Selenium sensor external QE

Go to the original article...

Image Sensors World        Go to the original article...

Socionext (ex-Fujitsu) is now shipping its “M-8M” series, or MB86S27, a compact image processor which is the eighth-generation product from its Milbeaut Image Processor series. The MB86S27 features H.264 4K Codec Engine originally developed at Socionext, and comes with 360-degree distortion correction and other image processing functionalities suitable for video devices such as surveillance cameras, drones, action cameras and drive recorders. Its power consumption is as low as 1.3W, when operating with 4K at 30 fps.

In a separate PRNewswire release, CEVA announces that it has licensed its image processing IP for use in the Socionext new MB86S27 Milbeaut processor.

"The inclusion of the CEVA imaging and vision DSP in our Milbeaut series of image processors allows our customers achieve true product differentiation by implementing proprietary technologies and applications that can take advantage of its powerful vector processing engine," said Mitsugu Naito, CVP and Head of Business Group Ⅲ at Socionext. "The DSP offers outstanding performance, flexibility and power efficiency for implementing such advanced algorithms, making it the ideal choice for our imaging processing products."

"We are honored to welcome Socionext to the extensive list of leading companies adopting our imaging and vision DSPs for their image processor SoCs," said Gideon Wertheizer, CEO of CEVA. "Advanced computational photography and embedded vision capabilities are key differentiators in next-generation camera-enabled devices, and our DSP brings these features to Socionext's Milbeaut products in a low-power, cost efficient manner."

Go to the original article...

Image Sensors World        Go to the original article...

Omnivision presented its mobile imaging solutions at Qualcomm 3G/LTE Summit in Hong Kong on Sept. 14-16, 2015. Few slides explaining its PureCel Plus pixel technology:

Go to the original article...

Image Sensors World        Go to the original article...

Sony presented its mobile imaging solutions at Qualcomm 3G/LTE Summit in Hong Kong on Sept. 14-16, 2015. Few slides from the presentation:

Go to the original article...

Image Sensors World        Go to the original article...

Altek presented its view on dual camera imaging at Qualcomm 3G/LTE Summit in Hong Kong on Sept. 14-16, 2015. Few slides from the presentation saying that dual cameras will conquer the mobile world:

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: Intersil introduces a ToF signal processing IC that provides a complete object detection and distance measurement when combined with an external emitter (LED or laser) and photodiode. The ISL29501 ToF device is said to offer one-of-a-kind functionality, including ultra-small size, low-power consumption and superior performance for IoT, as well as consumer mobile devices and the emerging commercial drone market.

The ISL29501 overcomes the shortcomings of traditional amplitude-based proximity sensors and other ToF solutions that perform poorly in lighting conditions above 2,000 lux, or cannot provide distance information unless the object is perpendicular to the sensor. Alternative solutions are too expensive, bulky or power hungry for use in small form factor, battery-powered applications. Based on Intersil's patented technology, the ISL29501 sensor provides a small solution footprint and precision long-range accuracy up to two meters in both dark and bright ambient light conditions. Unlike competitive solutions, the ISL29501 allows customers to select the emitter and photodiode of their choice and configure a low power ToF sensing system customized for their application.

"Prior to Intersil's time-of-flight technology breakthrough, there was no practical way to measure distance up to two meters in a small form factor," said Andrew Cowell, senior vice president of Mobile Power Products at Intersil. "The innovative ISL29501 provides customers a cost-effective, small footprint solution that also gives them the flexibility to use multiple devices to increase the field of view to a full 360 degrees for enhanced object detection capabilities."

Intersil has received a number of patents of ToF with ambient illumination rejection, such as US8274037 "Automatic calibration technique for time of flight (TOF) transceivers" by David W. Ritter, Philip Golden, Carl Warren Craddock and US8530819 "Direct current (DC) correction circuit for a time of flight (TOF) photodiode front end" by David W. Ritter, Philip Golden, Carl Warren Craddock, Kevin Brehmer, and US8530819 "Direct current (DC) correction circuit for a time of flight (TOF) photodiode front end" by David W. Ritter, Itaru Hiromi.

Key features:

• On-chip DSP calculates ToF for accurate proximity detection and distance measurement up to two meters
• Modulation frequency of 4.5MHz prevents interference with other consumer products such as IR TV remote controls that operate at 40kHz
• On-chip emitter DAC with programmable current up to 255mA allows designers to choose the desired current level to optimize distance measurement and power budget
• Operates in single shot mode for initial object detection and approximate distance measurement, while continuous mode improve distance accuracy
• On-chip active ambient light rejection minimizes or eliminates the influence of ambient light during distance measurement
• Programmable distance zones: allows the user to define three ToF distance zones for determining interrupt alerts
• Interrupt controller generates interrupt alerts using distance measurements and user defined thresholds
• Automatic gain control sets optimum analog signal levels to achieve best SNR response
• Supply voltage range of 2.7V to 3.3V
• I2C interface supports 1.8V and 3.3V bus

The ISL29501 ToF processing IC is available now in a low profile 4mm x 5mm, 24-lead TQFN package and is priced at $4.87 USD in 1k quantities.

Go to the original article...

Image Sensors World        Go to the original article...

ON Semi presented its mobile imaging solutions at Qualcomm 3G/LTE Summit in Hong Kong on Sept. 14-16, 2015. Few slides from the presentation, including Clarity+ explanations and the mobile sensor roadmap:

Go to the original article...

Image Sensors World        Go to the original article...

Samsung presentation on smartphone solutions has few slides on its mobile CIS offerings:

Go to the original article...

Image Sensors World        Go to the original article...

IEDM 2015 publishes the conference preview with few pictures from Olympus paper:

Paper 30.1 – “Multi-Storied Photodiode CMOS Image Sensor for Multiband Imaging with 3D Technology” Y. Takemoto, et al, Olympus

"Multiband Imaging in One Device: There is a growing demand for integrated imaging systems that can simultaneously capture both red-green-blue (RGB) visible light and near-infrared (NIR) wavelengths that contain range-finding, or depth-of-field, information. In medicine, for example, the ability to capture all of these wavelengths simultaneously with one compact device would make it easier and less time-consuming to identify and pinpoint a wide range of targets in different parts of the body, such as pathological lesions. Until now, however, trying to detect both RGB and NIR signals on the same chip would compromise either one or the other. Researchers at Olympus will detail how they used 3D wafer-stacking technology to integrate two separate CMOS imagers into one device, each optimized for either RGB or NIR through a careful balance of active silicon thickness and pixel size. The top imager is optimized for visible detection with an array of small pixels and a thinned 3µm active silicon layer. NIR signals pass through it to reach the bottom imager, which is optimized for NIR detection with an array of larger pixels and thick active silicon. The researchers say there is no degradation in color reproduction, sensitivity or resolution."

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: ON Semiconductor announces sampling of the LED Flicker Mitigation (LFM) technology in a new 2.3MP CMOS sensor for ADAS applications. Capable of capturing 1080p HDR video, the AR0231AT also includes features that support Automotive Safety Integrity Level B (ASIL B).

The LFM technology (patent pending) eliminates high frequency LED flicker from traffic signs and vehicle LED lighting and allows Traffic Sign Reading algorithms to operate in all light conditions. The AR0231AT has a 1/2.7-inch optical format and a 1928(H) x 1208(V) active pixel array. It uses the latest 3.0um BSI pixel with DR-Pix dual conversion gain technology. It captures images in linear, HDR or LFM modes, and offers frame-to-frame context switching between modes.

The new device offers up to 4-exposure HDR, capturing more than 120 dB dynamic range with superior noise performance. The AR0231AT is capable of multi-camera synchronization support to ease implementation in vehicle applications with multiple sensor nodes, and user programmability is achieved via a simple two-wire serial interface. It also has multiple data interfaces including MIPI, parallel and HiSPi. Other key features include selectable automatic or user controlled black level control, spread-spectrum input clock support and multiple color filter array options.

“Features that support LFM and ASIL B in a 2.3 MP, 1080p BSI image sensor represent a state of the art combination ideal for high performance automotive ADAS cameras,” said Alvin Wong, senior director, Automotive Imaging and Scanning Division at ON Semiconductor.

The AR0231AT engineering samples are available now. It will be available in mass production in 2016.

Go to the original article...

Image Sensors World        Go to the original article...

Heptagon has updated its web site and now shows some of its products:

Heptagon ToF modules

Go to the original article...

Image Sensors World        Go to the original article...

Ambarella announces A12S and A9SE processors to its range of camera solutions for drones, or flying cameras. The 28nm A12S SoC family provides 1080p video at 60fps and up to 64MP photography. It supports advanced image stabilization with rolling shutter correction, HDR, as well as low delay, live video streaming to the flying camera controller. A 1-GHz ARM Cortex A9 CPU provides the required performance for advanced camera, flight control and streaming applications. With the option of an 11x11mm package and power consumption of under 1 Watt, A12S is ideal for miniature camera designs.

A12S block diagram

The A9SE SoC family is a new, enhanced, higher performance 28nm version of the 32nm A9 SoC.

Go to the original article...

Image Sensors World        Go to the original article...

Samsung publishes a Youtube promotional video on its ISOCELL CMOS sensors:

Go to the original article...

Image Sensors World        Go to the original article...

Omnivision patent application US20150288902 "Feed-forward technique for power supply rejection ratio improvement of bit line" by Tianjia Sun, Rui Wang, Liping Deng, and Tiejun Dai proposes an approach that reduces the structured row noise in image sensors:

"Limited by the design and layout constraints of pixel cells, the source follower circuits can suffer from an unsatisfactory power supply rejection ratio, such as −20 dB. An unsatisfactory power supply rejection ratio can present many challenges, including noise from power supplies that can enter into the output signal path. Furthermore, the ripple of power supplies can cause unwanted horizontal ripple in the captured image."

Go to the original article...

Image Sensors World        Go to the original article...

Samsung patent application US20150286059 "Image sensor having improved light utilization efficiency" by Seokho Yun, Sunghyun Nam, Sookyoung Roh, Changgyun Shin, and Hyungue Hong proposes a color-splitting optics integrated into each pixel:


Another Samsung patent application US20150286060 "Color separation device and image sensor including the color separation device" by Sookyoung Roh, Sunghyun Nam, and Changgyun Shin proposes to use refraction factor gradients to split the light into colors:

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: ON Semi has added four new high resolution devices to its PYTHON family of CMOS image sensors. The new imagers are based on 4.5um pixel with in-pixel CDS (ipCDS) to enable global shutter imaging with CDS in a compact pixel size. The new sensors are aimed to general purpose industrial imaging applications such as machine vision, inspection and motion monitoring, security, surveillance, and intelligent transportation systems (ITS).

• PYTHON 10K - 4/3-inch 11MP, 175fps
• PYTHON 12K - 4/3-inch, 12.5MP, 160fps
• PYTHON 16K - APS-H, 16.8MP, 120fps
• PYTHON 25K - APS-H, 26MP, 80fps

Go to the original article...

Image Sensors World        Go to the original article...

ON Semi opens a new Imaging Technology Center (ITC) in Detroit. The center, co-located with the company’s Detroit Sales Office, will help customers select and implement imaging solutions for automotive and other applications. An ITC lab facilitates the development and tuning of new camera designs. A new ITC Demo Room will also provide an ongoing showcase of the company latest imaging solutions.

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: Axcelis has released an extended energy range option for its Purion XE high energy implanter. This new option was developed specifically to address the emerging needs of the image sensor and specialty device manufacturers. The extended energy range option is scheduled to be available on new systems in the second quarter of 2016.

Bill Bintz, EVP, marketing and engineering, said, "We're excited to be able to offer our customers the ability to perform ultra-high energy implants for next generation image sensor and power device manufacturing. These implants enable extremely precise and very deep doping profiles, for applications that include deep wells. In the case of image sensors, this allows for more effective separation of photodiodes, reduced noise and dark current, and higher quality color."

John Aldeborgh, EVP, customer operations, commented, "Image sensors and specialty devices are two of the fastest growing market segments in IC manufacturing, due to the proliferation of smartphones, tablets and digital cameras. We see significant opportunity for the Purion XE in these very active markets."

The company's Youtube video talks about the implanters for image sensors:

Go to the original article...

Image Sensors World        Go to the original article...

Chipworks publishes a concise iPhone 6s teardown report with some info on its front and rear cameras:

Go to the original article...

Image Sensors World        Go to the original article...

Abert Theuwissen reports that 3rd session of ToF Imaging Forum to be held on Jan. 11-12, 2016 is almost full.

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: Sony compact FF camera RX1 RII features a switchable OLPF to implement resolution-priority and moire reduction-priority modes:


The company's Youtube video explains how it works:



The camera FF BSI sensor features copper wiring to improve speed 3.5x over the previous generation sensor:

Go to the original article...

Image Sensors World        Go to the original article...

EETimes: Morocco-based camera module maker and Tessera WLP and WLC licensee Nemotek ceased its operations. The comapny was founded in 2008 and funded by Caisse de Dépôt et de Gestion (CDG), one of the largest investment funds in Morocco. In 2009 the company opened a 12,000 square meter facility including clean room. Production capacity at the facility was around 3,000 wafers per month for WLP and around one million cameras per month for WLC, according to Nemotek's website.

Go to the original article...

Image Sensors World        Go to the original article...

PTC has signed a definitive agreement to acquire the Vuforia business from Qualcomm for $65M. Vuforia is the widely adopted AR platform supported by a global ecosystem of developers in 130 countries, and has powered more than 20,000 apps with more than 200 million app installs worldwide. Under terms of the agreement, PTC will acquire the award-winning Vuforia business, including the developer ecosystem. PTC is committed to continued investment in the Vuforia platform and to the ongoing support and growth of the Vuforia ecosystem.

“By delivering powerful computer vision functionality through a simple API, the Vuforia platform has enabled developers and leading brands to deliver award-winning experiences to consumers around the globe,” said Jay Wright, VP of Vuforia, Qualcomm Connected Experiences, Inc. “Vuforia has also captured the attention of industry leaders who envision the potential for augmented reality to transform work. As part of PTC, Vuforia will allow developers to realize this potential through integration with PTC’s industry leading applications and ThingWorx IoT platform.”

Vuforia has wide adoption from leading companies including 37 of the Interbrand 100 and has consistently been awarded for its performance, robustness, and ease of use, including “Best Tool” at Augmented World Expo in each of the last three years. Vuforia supports multiple developer tools, including Eclipse, xCode, and Unity and runs on multiple operating systems and devices, including iOS and Android phones, tablets, and selected mobile eyewear.

Vuforia annual revenue is currently not material to PTC financial results. The transaction is expected to close by the end of calendar year 2015.

A Youtube Qualcomm Vuforia overview:

Go to the original article...