Sony announces IMX927 a 105MP global-shutter CIS

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Product page: https://www.sony-semicon.com/en/products/is/industry/gs/imx927-937.html

Release page: https://www.sony-semicon.com/en/info/2025/2025092901.html 

PetaPixel article: https://petapixel.com/2025/09/29/sonys-new-global-shutter-sensor-captures-105-megapixels-at-100fps/ 

Sony Semiconductor Solutions to Release the Industry-Leading Global Shutter CMOS Image Sensor for Industrial Use That Achieves Both Approximately 105-Effective-Megapixels and High-Speed 100 FPS Output

Delivering high-resolution and high-frame-rate imaging to contribute to diversified, advanced inspections 

Atsugi, Japan — Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming release of the IMX927 stacked CMOS sensor with back-illuminated pixel structure and global shutter. It is the industry-leading sensor that achieves both high-resolution of approximately 105-effective-megapixels and high-speed output at a maximum frame rate of 100 fps.

The new sensor product is equipped with Pregius S™ global shutter technology made possible by Sony’s original pixel structure, ensuring high-quality imaging performance with distortion free imaging and minimal noise. By optimizing the sensor drive in pixel reading and A/D converter, it supports high-speed image data output. Introducing this high-resolution and high-frame-rate model into the product lineup will help improving productivity in industrial equipment domain, where recognition targets and inspection methods continue to diversify.

With the automation of factories progressing, the need for machine vision cameras that can capture a variety of objects at high speed and high resolution is growing in industrial equipment domain. With its proprietary back-illuminated pixel structure, Sony’s global shutter CMOS image sensors deliver high sensitivity and saturation capacity. Because they can capture moving subjects at high resolution without distortion, they are increasingly being used in a wide range of applications such as precision component recognition and foreign matter inspection. The new IMX927 features a high resolution of approximately 105 effective megapixels while delivering a high frame rate of up to 100 fps, helping shorten measurement and inspection times. It also shows promise in advanced measurement and inspection applications, for instance imaging larger objects in high resolution and three-dimensional inspection using multiple sets of image data. 

Along with the IMX927, Sony will also release seven products with different image sizes and frame rates. It has also developed a new ceramic package with connector that is compatible with a series of all these products, which allows cameras to be designed with sensors removable from camera modules. This can contribute to streamlining camera assembly and sensor replacement. By expanding its global shutter product lineup, Sony is contributing to the advancement of industrial equipment, where recognition and inspection tasks continue to become ever more precise and diversified.

Main Features
■ Global shutter technology with Sony’s proprietary pixel structure for high-resolution and high-sensitivity imaging
The new sensor is equipped with Pregius S global shutter technology. The very small 2.74 μm hat use Sony’s proprietary back-illuminated pixels and stacked structure enable the approximately 105-effective-megapixels resolution in a compact size with a high level of sensitivity and saturation capacity. In addition to inspections of precision components such as semiconductors and flat-panel displays, which require a high degree of accuracy, this feature also enables the capture of larger objects with distortion free, high-resolution, low-noise images. Thereby machine vision cameras can achieve higher precision measurement and inspection processes in a wide range of applications.
■ Circuit structure enabling a highly efficient sensor drive that saves power and makes high-speed imaging possible
The new sensor employs a circuit structure that optimizes pixel reading and sensor drive in the A/D converter, which saves power and enables faster data processing. This design makes a high-speed frame rate of up to 100 fps possible, reducing the time to output image data for more efficiency in measurement and inspection tasks. It also shows promise for application in advanced inspections such as three-dimensional inspections, which use multiple image data sets.
■ New ceramic package with connector to streamline camera assembly and contribute to stable operation
Sony has also developed a new ceramic package with connector, which is compatible with a series of eight products including the IMX927, making it possible to combine or detach sensors from camera modules flexibly to design cameras. Using this package makes camera assembly easier and streamlines the process of replacing sensors to suit camera specifications. It also has a superior heat dissipation structure, which suppresses the impact of heat on camera performance, contributing to stable, long-term operation.

 

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ISSW 2026 call for papers

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The International SPAD Sensor Workshop

1st-4th June 2026 / Yonsei University, Seoul, South Korea

The 2026 International SPAD Sensor Workshop (ISSW) is a biennial event focusing on Single-Photon Avalanche Diodes (SPAD), SPAD-based sensors, and related applications. The workshop welcomes all researchers (including PhD students, postdocs, and early-career researchers), practitioners, and educators interested in these topics.

This fifth edition of the workshop will take place in Seoul, South Korea, hosted at Yonsei University, in a venue suited to encourage interaction and a shared experience among the attendees. The workshop will follow a 1-day introductory school on SPAD sensor technology, which will be held in the same venue as the workshop on June 1st, 2026.

The workshop will include a mix of invited talks and peer-reviewed contributions. Accepted works will be published on the International Image Sensor Society website (https://imagesensors.org/). Submitted works may cover any of the aspects of SPAD technology, including device modeling, engineering and fabrication, SPAD characterization and measurements, pixel and sensor architectures and designs, and SPAD applications.

Topics
Papers on the following SPAD-related topics are solicited:

●      CMOS/CMOS-compatible technologies
●      SiPMs
●      III-V, Ge-on-Si
●      Modeling
●      Quenching and front-end circuits
●      Architectures
●      Time-to-digital converters
●      Smart data-processing techniques
●      Applications of SPAD single pixel and arrays, such as:
o   Depth sensing / ToF / LiDAR
o   Time-resolved imaging
o   Low-light imaging
o   Quantum imaging
o   High-dynamic-range imaging
o   Biophotonics
o   Computational imaging
o   Quantum RNG
o   High-energy physics
o   Quantum communications
●      Emerging technologies & applications

Draft paper submission
Submission portal TBD.

Paper format - Each submission should comprise a 1000-character abstract and a 3-page paper, equivalent to 1 page of text and 2 pages of images. The submission must include the authors' name(s) and affiliation, mailing address, and email address. The formatting can adhere to either a style that integrates text and figures, akin to the standard IEEE format, or a structure with a page of text followed by figures, mirroring the format of the International Solid-State Circuits Conference (ISSCC) or the IEEE Symposium on VLSI Technology and Circuits. Examples illustrating these formats can be accessed in the online database of the International Image Sensor Society.

The deadline for paper submission is 23:59 CET, January 11th, 2026.

Papers will be considered on the basis of originality and quality. High-quality papers on work in progress are also welcome. Papers will be reviewed confidentially by the Technical Program Committee.

Accepted papers will be made freely available for download from the International Image Sensor Society website.

Poster submission
In addition to talks, we wish to offer all graduate students, post-docs, and early-career researchers an opportunity to present a poster on their research projects or other research relevant to the workshop topics.

If you wish to take up this opportunity, please submit a 1000-character abstract and a 1-page description (including figures) of the proposed research activity, along with the authors’ name(s) and affiliation, mailing address, and e-mail address.

The deadline for paper submission is 23:59 CET, January 11th, 2026.

Key dates
The deadline for paper submission is 23:59 CET, January 11th, 2026.

Authors will be notified of the acceptance of their papers & posters latest by February 22nd, 2026.

The final paper submission date is March 29th, 2026.

The presentation material submission date is May 22nd, 2026.

Location
ISSW 2026 will be held fully in-person in Seoul, S. Korea, at the Baekyang Nuri Grand Ballroom at Yonsei University. 

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Conference List – March 2026

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Electronic Imaging - 1-5 March 2026 - Burlingame, California, USA - Website

22nd Annual Device Packaging Conference - 2-5 March 2026 - Phoenix, Arizona, USA - Website

EDIT (Excellence in Detector and Instrumentation Technologies) - 3-13 March 2026 - Geneva, Switzerland - Website

Laser World of Photonics China - 18-20 March 2026 - Shanghai, China - Website

Image Sensors Europe - 17-18 March 2026 - London, UK - Website

MEMS & Sensors Executive Conference - 31 March - 2 April 2026 - Cambridge, Massachusetts, USA - Website

If you know about additional local conferences, please add them as comments.

Return to Conference List index

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Happening Today: Swiss Photonics Lunch Chat

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Link: https://www.swissphotonics.net/home?event_id=4480

Lunch Chat: SPAD arrays and cameras: a comparison with conventional image sensors and detectors

Tue, 16.09.2025, online

This talk will introduce single-photon avalanche diode (SPAD) arrays and cameras, highlighting how they differ from conventional imaging and photon-counting technologies. We will review the state-of-the-art in SPAD devices and compare their performance with established detectors such as photomultiplier tubes (PMTs), silicon photomultipliers (SiPMs), EMCCD cameras, as well as modern sCMOS and qCMOS image sensors. The discussion will focus on their working principles and on when SPAD-based systems provide unique advantages versus when conventional solutions may be more appropriate, depending on the application.

Speaker:
Milo Wu, PhD, Business Development Manager PI Imaging

Date
Tuesday, 16 September 2025

Time
12:00 - 12:45 (CEST)

Software
Zoom

Costs
free of charge

Registration only necessary once
This event series requires registration (see link above). We will send you the access information (Zoom-link and ID) by email after the registration. As the Zoom link remains the same every week, you do not need to register again for the following meetings.

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Job Postings – Week of 14 September 2025

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Amazon

ASIC SoC Manager, Amazon Camera ASIC Team

Sunnyvale, California, USA

Link

GlobalFoundries

Principal Engineer Device Engineering (FRCMOS): SPAD/CIS Development

Singapore

Link

Vital Chemicals

IC Designer

Cupertino, California, USA

Link

Sony

European Graduate Program - Image Sensor Designer

Oslo, Norway

Link

Qualcomm

Camera AF/EIS Algorithm System Engineer

Shanghai, China

Link

Teledyne FLIR

Sr. Principal ASIC/Analog Design Engineer

Goleta, California, USA

Link

HEPHY

PHD STUDENT on semiconductor detector development and readout electronics

Vienna, Austria

Link

Fairchild Imaging

Senior Quality Engineer

San Jose, California, USA

Link

Johannes Gutenberg University

Particle Detectors for Future Experiments from Concept to Operation

Mainz, Germany

Link

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Image sensors workshop at IEEE Sensors 2025

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A workshop titled "Future CMOS Image Sensors for AI Era – AI or not" will be held alongside IEEE Sensors 2025 in Vancouver, Canada on Sunday Oct 19, 2025.

Artificial intelligence (AI) is becoming increasingly integrated into our daily lives. In particular, Deep Neural Networks (DNNs) are expected to merge with CMOS Image Sensors (CISs), which, soon, will open up a new era of smart, adaptive, and autonomous systems in various consumer electronics, such as smartphones, automotive technology, and augmented/virtual reality glasses.

Future CMOS Image Sensors for AI Era – AI or not
Artificial intelligence (AI) is becoming increasingly integrated into our daily lives. In particular, Deep Neural Networks (DNNs) are expected to merge with CMOS Image Sensors (CISs), which, soon, will open up a new era of smart, adaptive, and autonomous systems in various consumer electronics, such as smartphones, automotive technology, and augmented/virtual reality glasses.   

This workshop will focus on the future CISs that incorporate state-of-the-art computational image sensor processors (ISPs). These capabilities have evolved from traditional computation to DNNs in the AI era. Industry leaders and academic researchers will present invited talks covering two major topics: 
1. Trends in CISs technology focused on computation, including neural networks for future applications and associated software.
2. Sensor technologies and ISPs designed for the AI era, and Sensor simulations tailored for future CISs

We believe this workshop will pave the way for advancements in future imaging and sensing technology.   We encourage all attendees of the IEEE SENSORS 2025 conference to engage in discussions about "Future CMOS Image Sensors for AI Era – AI or not". 


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Zeiss Otus ML 50mm f1.4 review

Cameralabs        Go to the original article...

The Zeiss Otus ML 50mm f1.4 is a wide-aperture, manual focus, standard prime lens designed for Sony, Canon, and Nikon mirrorless full-frame cameras. Find out how it stacks up against its legendary 2013 predecessor in my comprehensive review!…

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International Image Sensor Workshop (IISW) 2025 proceedings available

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IISW 2025 papers available in our public archive at https://imagesensors.org/2025-papers/.

Each article also got a DOI assigned for easy future references, just like all other papers published by IISS since 2007.

Thank you to the all the organizers and volunteers who made this workshop possible!

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VoxelSensors Qualcomm collab

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https://www.globenewswire.com/news-release/2025/08/28/3140996/0/en/VoxelSensors-to-Advance-Next-Generation-Depth-Sensing-Technology-with-10x-Power-Savings-for-XR-Applications.html 

 VoxelSensors to Advance Next-Generation Depth Sensing Technology with 10x Power Savings for XR Applications
VoxelSensors, a company developing novel intelligent sensing and data insights technology for Physical AI, today announced a collaboration with Qualcomm Technologies, Inc. to jointly optimize VoxelSensors’ sensing technology with Snapdragon® XR Platforms.

 Brussels, Aug. 28, 2025 (GLOBE NEWSWIRE) -- VoxelSensors, a company developing novel intelligent sensing and data insights technology for Physical AI, today announced a collaboration with Qualcomm Technologies, Inc. to jointly optimize VoxelSensors’ sensing technology with Snapdragon® XR Platforms.

Technology & Industry Challenges

VoxelSensors has developed Single Photon Active Event Sensor (SPAES™) 3D sensing, a breakthrough technology that solves current critical depth sensing performance limitations for robotics and XR. The SPAES™ architecture addresses them by delivering 10x power savings and lower latency, maintaining robust performance across varied lighting conditions. This innovation is set to enable machines to understand both the physical world and human behavior from user’s point-of-view, advancing Physical AI.

Physical AI processes data from human perspectives to learn about the world around us, predict needs, create personalized agents, and adapt continuously through user-centered learning. This enables new and exciting applications previously unattainable. At the same time, Physical AI pushes the boundaries of operation to wider environments posing challenging conditions like variable lighting and power constraints.

VoxelSensors’ technology addresses both challenges by offering a technology that expands the operative limits of current day sensors, while collecting human point-of-view data to better train physical AI models. Overcoming these challenges will define the future of human-machine interaction.
Collaboration

VoxelSensors is working with Qualcomm Technologies to jointly optimize VoxelSensors’ SPAES™ 3D sensing technology with Snapdragon AR2 Gen 1 Platform, allowing a low-latency and flexible 3D active event data stream. The optimized solution will be available to select customers and partners by December 2025.

“We are pleased to collaborate with Qualcomm Technologies,” said Johannes Peeters, CEO of VoxelSensors. “After five years of developing our technology, we see our vision being realized through optimizations with Snapdragon XR Platforms. With our sensors that are ideally suited for next-generation 3D sensing and eye-tracking systems, and our inference engine for capturing users’ egocentric data, we see great potential in enabling truly personal AI agent interactions only available on XR devices.”
“For the XR industry to expand, Qualcomm Technologies is committed to enabling smaller, faster, and more power-efficient devices,” said Ziad Asghar, SVP & GM of XR at Qualcomm Technologies, Inc. “We see great potential for small, lightweight AR smart glasses that consumers can wear all day. VoxelSensors’ technology offers the potential to deliver higher performance rates with significantly lower power consumption, which is needed to achieve this vision.”

Market Impact and Future Outlook

As VoxelSensors continues to miniaturize their technology, the integration into commercial products is expected to significantly enhance the value proposition of next-generation XR offerings. Collaborating with Qualcomm Technologies, a leader in XR chipsets, emphasizes VoxelSensors’ commitment to fostering innovation to advance the entire XR ecosystem, bringing the industry closer to mainstream adoption of all-day wearable AR devices.

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SMPTE awards Dr. Peter Centen

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https://www.smpte.org/about/awards-programs/camera-winners

2025 - Dr. Peter G. M. Centen

For pioneering innovations in image sensor technology that transformed electronic cinematography and broadcast imaging. Over a career spanning more than four decades, Dr. Centen played a pivotal role in the industry’s transition from CCD to CMOS image sensors, serving as chief architect of the Xensium family that enabled HD, 4K, HDR, and HFR imaging. During the transitions from SD to HD, narrow-screen to widescreen, and film to digital cinematography, his development of Dynamic Pixel Management—a groundbreaking sub-pixel-control technology—allowed a single sensor to support multiple resolutions and aspect ratios, including ultra-wide formats (~2.4:1), without compromise. This innovation, first implemented in the Viper FilmStream camera, eliminated the need for format-specific imaging systems and laid the foundation for today’s flexible, high-performance camera designs.

The Camera Origination and Imaging Medal, established in 2012, recognizes significant technical achievements related to inventions or advances in imaging technology, including sensors, imaging processing electronics, and the overall embodiment and application of image capture devices.​ 

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SMPTE awards Dr. Peter Centen

Image Sensors World        Go to the original article...

https://www.smpte.org/about/awards-programs/camera-winners

2025 - Dr. Peter G. M. Centen

For pioneering innovations in image sensor technology that transformed electronic cinematography and broadcast imaging. Over a career spanning more than four decades, Dr. Centen played a pivotal role in the industry’s transition from CCD to CMOS image sensors, serving as chief architect of the Xensium family that enabled HD, 4K, HDR, and HFR imaging. During the transitions from SD to HD, narrow-screen to widescreen, and film to digital cinematography, his development of Dynamic Pixel Management—a groundbreaking sub-pixel-control technology—allowed a single sensor to support multiple resolutions and aspect ratios, including ultra-wide formats (~2.4:1), without compromise. This innovation, first implemented in the Viper FilmStream camera, eliminated the need for format-specific imaging systems and laid the foundation for today’s flexible, high-performance camera designs.

The Camera Origination and Imaging Medal, established in 2012, recognizes significant technical achievements related to inventions or advances in imaging technology, including sensors, imaging processing electronics, and the overall embodiment and application of image capture devices.​ 

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Prophesee announces GenX320 starter kits for Raspberry Pi

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https://www.prophesee.ai/2025/08/26/prophesee-brings-event-based-vision-to-raspberry-pi-5-with-genx320-starter-kit/

Prophesee Brings Event-Based Vision to Raspberry Pi 5 with GenX320 Starter Kit

New starter kit provides developers efficient, cost-effective way to leverage low-power, high-speed neuromorphic vision for IoT, drones, robotics, security and surveillance—with one of the world’s most popular embedded development platforms

PARIS, Aug 26, 2025

Prophesee, the inventor and leader in event-based neuromorphic vision systems, today announces the launch of the GenX320 Starter Kit for Raspberry Pi® 5, making its breakthrough frameless sensing technology available to the Raspberry Pi developer community for the first time. Built around Prophesee’s ultra-compact, ultra-efficient GenX320 event-based vision sensor, the kit connects directly to the Raspberry Pi 5 camera connector to allow development of real-time applications that leverage the advantages of event-based vision for drones, robotics, industrial automation, surveillance, and more. 

The kit enables efficient, cost-effective and easy-to-use access to develop solutions based on Prophesee’s advanced Metavision® event-based vision platform, through use of the company’s OpenEB, open-source core of its award-winning Metavision SDK. The Raspberry Pi ecosystem is one of the largest and most active hardware communities in the world, with more than 60 million units sold and millions of developers engaged across open-source and maker platforms.

Event-based vision is a paradigm shift from traditional frame-based approaches. It doesn’t capture entire images at once but instead detects changes in brightness, known as “events,” at each pixel. This makes sensors much faster (responding in microseconds), able to operate with much less data and processing power, and be more power-efficient than traditional sensors. 

The kit is purpose-built to enable real-world, real-time applications where traditional frame-based vision struggles:

  • Drones & Robotics: Obstacle avoidance, drone-to-drone tracking, real-time SLAM
  • Industrial IoT: 3D scanning, defect detection, and predictive maintenance
  • Surveillance & Safety: Intrusion detection, fall detection, and motion analytics 

ABOUT THE KIT

The GenX320 Starter Kit is built around the Prophesee GenX320 sensor, the smallest and most power-efficient event-based vision sensor available. With a 320×320 resolution, >140 dB dynamic range, event rate equivalent to ~10,000 fps, and sub-millisecond latency, the sensor provides the performance needed for demanding real-time applications on an embedded platform.

Key Features:

  •  Compact event-based camera module with MIPI CSI-2 interface
  •  Native integration with Raspberry Pi 5 (board sold separately)
  •  Power-efficient operation (<50 mW sensor-only consumption)
  •  OpenEB support with Python and C++ APIs

Software Resources:

  • Developers will be able to access drivers, data recording, replay and visualization tools on GitHub.
  •  Access to the Prophesee Knowledge Center, a centralized location for users to access various resources, including: a download repository, user guides, and FAQs; a community forum to share ideas; a support ticket system; and additional resources such as application notes, product manuals, training videos, and more than 200 academic papers.

AVAILABILITY

The Prophesee GenX320 Starter Kit for Raspberry Pi 5 is available for pre-order starting August 26, 2025, through Prophesee’s website and authorized distributors. For more information or to order, visit: www.prophesee.ai/event-based-starter-kit-genx320-raspberry-pi-5/ 

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Galaxycore 50MP 0.61um CIS

Image Sensors World        Go to the original article...

Translated from Baidu news: https://baijiahao-baidu-com.translate.goog/s?id=1839605263838551524&wfr=spider&for=pc&_x_tr_sl=zh-CN&_x_tr_tl=de&_x_tr_hl=de&_x_tr_pto=wapp

GLOBAL HUI, August 5th | GalaxyCore (688728.SH) announced that it has recently achieved mass production and shipment of its 0.61-micron 50-megapixel image sensor product. This product, the world's first single-chip 0.61-micron pixel image sensor, is based on the company's unique Galaxy Cell 2.0 process platform and manufactured in the company's own wafer fab, significantly improving small-pixel performance. This product utilizes a 1/2.88 optical size, reducing the thickness of the camera module and making it widely applicable to smartphone rear-mounted main cameras, ultra-wide-angle cameras, and front-facing cameras. Furthermore, this product integrates single-frame high dynamic range (DAGHDR) technology, achieving wider dynamic range coverage in a single exposure, effectively addressing overexposure and underexposure issues in backlit scenes. It also supports PDAF phase autofocus, ensuring a fast and accurate shooting experience.

The company's 0.61-micron 50-megapixel image sensor has entered mass production and shipment, successfully entering the rear-mounted main camera market for branded mobile phones. This marks further market recognition of the company's innovative high-pixel single-chip integration technology and fully demonstrates the efficiency of its Fab-Lite model. To date, the company has achieved mass production of 0.7-micron 50-megapixel, 1.0-micron 50-megapixel, and 0.61-micron 50-megapixel image sensors based on single-chip integration technology. The company will subsequently leverage this technology platform to further enhance the performance of high-pixel products such as 32-megapixel and 50-megapixel, while also launching products with specifications exceeding 100 megapixels. This will continuously strengthen the company's core competitiveness, increase market share, and expand its leading position. 

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Canon 400MP CIS

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Link: https://www.photografix-magazin.de/canon-zeigt-410-mp-vollformatsensor-technik-rekord-fuer-spezialanwendungen/

Related post on the blog in January: https://image-sensors-world.blogspot.com/2025/01/canon-announces-410mp-full-frame-sensor.html 

Canon has presented its new record image sensor with 410 megapixels to the public for the first time. The presentation took place at the P&I 2025 in China.

Spectacular engineering key data 

  •  Resolution: 24.592 x 16,704 pixels, which corresponds to almost 200 times Full-HD and 12 x 8K.
  •  Sensor architecture : New, rearly lit stacked sensor with integrated signal processing.
  •  Data throughput : impressive read speed of 3,280 MP/s, which allows 8 frames/s in full resolution.
  •  Monochrome version : Uses 4-pixel binning for higher light sensitivity and allows 100 MP videos at 24 fps.

Target market: Industry instead of consumers

Canon does not position the LI8030SA for the mass market, but for highly specialized industries such as monitoring, medicine and machine vision. At P&I 2025, the sensor was presented behind glass, which is usually a clear signal that it is still in the development phase. Canon is already looking for expressions of interest, but the first models should not be intended for classic cameras. Nevertheless, the technology could also influence commercial Canon sensors in the future.

With the 410-MP sensor, Canon impressively shows where the journey can go. For hobby photographers, however, this sensor remains a distant dream. Most of us don't need such an exaggerated resolution anyway. In the professional sector, however, it opens up new dimensions.

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Harvest Imaging 2025 Forum – Dec 8, 9 – Single-Photon Detection

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Registration page: https://harvestimaging.com/forum_introduction_2025_coming.php

The Harvest Imaging forum will continue with a next edition scheduled for December 8 & 9, 2025, in Delft, the Netherlands. The basic intention of the Harvest Imaging forum is to have a scientific and technical in-depth discussion on one particular topic that is of great importance and value to the digital imaging community.

The 2025 Harvest Imaging forum will deal with a single topic and will have only one world-level expert as the speaker: 

"SINGLE PHOTON DETECTION"
Prof. dr. Robert HENDERSON (Univ. of Edinburgh, UK)

Abstract:

Access to the ultrafast quantum statistics of light enabled by new solid-state single photon imaging technologies is revolutionizing camera technology. 

The noise-free detection and precise localization of individual photons enables imaging of time itself (which directly enables depth perception) at unprecedented temporal and spatial resolutions. Such solid-state single photon imaging technologies now approach the sensitivity, timing resolution and dark noise of vacuum electrocathode approaches whilst providing robustness, low cost and high spatial resolution. Amongst these, CMOS single Photon Avalanche Diode (SPAD) arrays offer the unique capability to extract single photon statistics in high background conditions using massively parallel on-chip timing and digital computation.

This forum will highlight the modelling, device structures, characterisation methods and circuitry necessary to develop this new generation of SPAD imaging system. Recent advances in SPAD direct time of flight (dToF) and photon counting sensor design techniques optimized for low power, computation, and area will be reviewed. 

The forum will focus primarily on the mainstream commercial applications of SPADs in low light imaging, depth imaging (RGB-Z) and LIDAR. Further examples will be drawn from emerging use cases in fluorescence microscopy, Raman spectroscopy, non-line-of-sight imaging, quantum optics and medical diagnostics (X-ray, PET). Future trends and prospects enabled by 3D-stacking technology will be considered.

Bio

Robert K. Henderson is a Professor of Electronic Imaging in the School of Engineering at the University of Edinburgh. He obtained his PhD in 1990 from the University of Glasgow. From 1991, he was a research engineer at the Swiss Centre for Microelectronics, Neuchatel, Switzerland. In 1996, he was appointed senior VLSI engineer at VLSI Vision Ltd, Edinburgh, UK where he worked on the world’s first single chip video camera.

From 2000, as principal VLSI engineer in STMicroelectronics Imaging Division he developed image sensors for mobile phone applications. He joined University of Edinburgh in 2005, designing the first SPAD image sensors in nanometer CMOS technologies in the MegaFrame and SPADnet EU projects. This research activity led to the first volume SPAD time-of-flight products in 2013 in the form of STMicroelectronics FlightSense series, which perform an autofocus-assist now present in over 2 billion smartphones. He benefits from a long-term research partnership with STMicroelectronics in which he explores medical, scientific and high speed imaging applications of SPAD technology. In 2014, he was awarded a prestigious ERC advanced fellowship. He is an advisor to Ouster Automotive and a Fellow of the IEEE and the Royal Society of Edinburgh.

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Sony 3-layer stacked sensor

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Tranlated from baidu.com: https://baijiahao-baidu-com.translate.goog/s?id=1839758590887948034&wfr=spider&for=pc&_x_tr_sl=zh-CN&_x_tr_tl=de&_x_tr_hl=de&_x_tr_pto=wapp

In-depth: Sony's three-layer CIS changes the global sensor market

Source: AI Core World (Aug 7, 2025)

Sony is developing a three-layer image sensor

Sony Semiconductor Solutions (SSS) showcased a potentially groundbreaking three-layer image sensor design as part of a presentation to investors, the company's Imaging & Sensing Solutions (I&SS) division announced today. The design promises significant performance improvements.

Although Sony has used stacked sensors in several cameras, including its flagship a1 II, these sensors currently have a dual-layer structure. One layer is the photodiode layer responsible for capturing light, which contains all the light-sensitive pixels; the other layer is the transistor layer located below it, which is responsible for image processing tasks. Sony's core long-term goal is to introduce the crucial third layer in the image sensor stack. This essentially means an expansion of processing power and a leap in image quality.

When other conditions are equal, the stronger the processing power at the sensor level, the better the imaging effect will naturally be. Sony explains that increasing processing power at the sensor level will directly translate into improvements in several key performance areas: dynamic range, sensitivity, noise performance, power efficiency, readout speed, and resolution.

While adding sensor layers doesn't directly change the pixel resolution itself, it unlocks entirely new video recording modes by significantly improving the overall speed and performance of the sensor.
Image sensors remain a core pillar of Sony's strategy in diverse areas including mobile devices, automotive, industrial and cameras. Sony expects the camera-related sensor market to continue expanding at a compound annual growth rate of 9% by fiscal 2030, which indicates that Sony will continue to increase its investment in this field. 

Next-generation sensor technology will become a driving force for differentiation

Sony is focusing on R&D in multi-layer sensor stack architectures and advanced process nodes to improve sensitivity, dynamic range, power efficiency and readout speed – cutting-edge technologies that will directly power future Alpha and FX camera series. To achieve these goals, Sony plans to invest a total of nearly 930 billion yen in capital expenditures between 2024 and 2026, about half of which will be dedicated to the research and development and production of advanced image sensor processes.
As outlined in its long-term strategy, Sony is going all out and investing in next-generation sensor technologies, including multi-layer stacked image sensors.

Sony's triple-stacked sensor, used in the Xperia 1 V and adopted by other mainstream smartphone models, significantly improves image quality. The architecture also supports multimodal sensing and on-chip artificial intelligence processing, marking a shift in the industry's focus from simply pursuing resolution to intelligent sensing. The breakthrough in 22nm logic stacking technology is committed to achieving ultra-low power consumption and expanded computing power, among which FDSOI technology is expected to be applied in the field of neuromorphic sensing.

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Also covered by PetaPixel: https://petapixel.com/2025/07/30/sonys-triple-layer-image-sensor-promises-huge-performance-gains/ 

 Sony’s Triple-Layer Image Sensor Promises Huge Performance Gains

 




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Nikon Z 24-70mm f2.8 S II review

Cameralabs        Go to the original article...

Nikon has totally reworked their pro Z 24-70mm f2.8 S with improved features for photographers and videographers. How does it compare to its predecessor and Tamron? Find out in my review.…

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AIStorm and Tower Semiconductor release AI-in-Imager chip

Image Sensors World        Go to the original article...

AIStorm & Tower Semiconductor Introduce Cheetah HS, World’s First Up-to-260K FPS AI-in-Imager Chip for Inspection, Robotics & Sports

Charge-domain imager with on-chip neural network, provides breakthrough slow-motion vision at a fraction of the cost and power consumption of competing high-speed cameras

HOUSTON, Texas, and MIGDAL HAEMEK, Israel - August 12, 2025: AIStorm, the market leader in charge-domain solutions for edge AI, and Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the availability of the Cheetah HS — a high-speed, 120×80-pixel imager with first-layer AI capability that captures up to 260,000 frames per second — 2,000 to 4,000 times faster than conventional CMOS sensors. The Cheetah HS architecture is made possible by Tower’s unique charge-domain imaging platform which is leveraged by AIStorm’s proprietary charge-domain-based analog AI neurons.

By combining ultra-high-speed imaging with charge-domain AI, Cheetah HS slashes system power requirements and bill-of-materials cost for designers of robotics, drones, vibration- and structure-health monitors, high-speed security and surveillance tracking systems, manufacturing and assembly lines, barcode readers, PCB-inspection equipment, biometric unlock systems, vehicle-speed detectors, and even golf-swing analyzers.

“Many consumer and industrial applications require ultra-slow-motion analysis of real-time events to analyze performance or detect anomalies. Such solutions are very costly, and our Cheetah HS solution makes them affordable for a wide range of markets and end applications,” said David Schie, CEO of AIStorm. “Tower is a global leader in charge-domain global-shutter pixels, making them the ideal partner for the development and production of such groundbreaking products.”
“We are very pleased to see the fruits of our long term, close collaboration with AIStorm on this unique breakthrough platform of analog charge-domain embedded AI technology,” said Dr. Avi Strum, SVP and GM of the Sensors and Displays BU at Tower Semiconductor. “Its inherent low-power, low-cost, and high-performance virtues will enable a family of affordable, high-volume products in the near future.”

Key advantages of Cheetah HS
 Adjustable frame rate up to 260,000 frames per second (fps)
 Integrated LED driver (programmable up to 40 mA)
 Enhanced low light performance
 Integrated charge-domain neuron layer outputting pulse streams for downstream neural-network layers or raw high-speed video
 Dramatic cost advantage over competitors
 Lowers processing costs by capturing images quickly, leaving more time per frame for processing
 Ability to capture extremely high-speed events and analyze them in slow motion

How it works
Traditional high-speed cameras utilize expensive high-speed data converters to capture data, which separates the AI input layer from the pixels, increasing the BOM cost and necessitating high-speed connectors and interface components. Cheetah HS’s charge-domain architecture converts incoming photons to charge, computes the first neural-network layer in analog form, then outputs a pulse train that can be processed by downstream networks. The capture rate is programmable, allowing lower frame rates with faster capture times (reducing the cost of processing) or faster frame rates for accurate measurements or slow-motion analysis.

Availability
Cheetah HS is available now in both chip form as well as full reference-camera systems [aistorm.ai/cheetah]. 

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A New Image Sensor Company in China is Recruiting

Image Sensors World        Go to the original article...

Shanghai Primevision Technology Co., LTD

Recruiting for 11 positions (Link to list) including:
CIS image sensor test - Link
CIS image sensor pixel design - Link
CIS (Image Sensor) Sales - Link

Most positions in Shanghai, China
曹蕾 Cao Lei, Human Resources Director, can provide additional details - lei.cao@primevision.ai

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Toshiba announces linear CCD sensor for document scanners

Image Sensors World        Go to the original article...

Toshiba Releases Lens-Reduction Type CCD Linear Image Sensor with Low Random Noise That Helps Improve Image Quality in Devices Such as A3 Multifunction Printers

KAWASAKI, Japan--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a lens-reduction type CCD linear image sensor “TCD2728DG” for A3 multifunction printers. Shipments start today. The sensor has 7,500 image sensing elements (pixels) and supports A3 multifunction printers. It is also more effective at reducing random noise (NDσ) than Toshiba’s current TCD2726DG.

Business offices are seeing a growing need for high-speed, high-resolution copying and scanning of large volumes of different kinds of documents. This is particularly true for A3 multifunction printers, where improving image quality has become an important issue, and NDσ in the signal has to be suppressed to enhance image quality.

TCD2728DG has lower output amplifier gain than Toshiba’s current product, TCD2726DG, and reduces NDσ by approximately 40%. This improvement enhances image quality in multifunction printers. The new CCD linear sensor achieves a data rate of 100 MHz (50 MHz × 2 channels), enabling high-speed processing of large volumes of images. This makes it well-suited for line scan cameras used in inspection systems that require real-time decision-making.

Toshiba will continue to expand its product lineup to support scanning by multifunction printers and the sensing applications of inspection devices, and to meet growing demand for high-speed, high-resolution imaging and sensing technologies. 

Applications
 A3 multifunction printers (resolution of 600 dpi)
 7500-pixel line scan camera for various inspection systems (semiconductor inspection equipment, food sorting equipment, etc.)


Features
 Reduces random noise by approximately 40%
 High-speed CCD linear image sensor: Data rate =100MHz (Master clock frequency 50MHz × 2ch) (max)
 The built-in timing generator circuit and CCD driver help facilitate system development 

 

 

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Omnivision Needs an Applications Engineer

Image Sensors World