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BusinessWire: Grand View Research estimates the global camera module market size at USD 17.84 billion in 2014. Among the different electronic devices, smartphones and tablet PC is the major segment and is expected to acquire over 75% of the global market in terms of shipments in 2022. The industry is highly fragmented with no dominant player. LG-Innotek led the industry, and occupied a major share of the global market in 2014.

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Eric Mazur, Harward University Professor, Black Silicon inventor, and SiOnyx founder, publishes his presentation on Black Silicon properties and applications given at the 11th Conference on Lasers and Electro- Optics Pacific Rim (CLEO-PR 2015) in Busan, South Korea on 25 August 2015. Black Silicon is manufactured by high power laser treatment of the silicon surface and looks like this:


A TEM cross-sectional image reveals an interesting picture. It's scary to think that SiOnyx made image sensors out of this:

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EETimes publishes its "Silicon 60: 2015's Startups to Watch" list. There are quite a few imaging companies there:

• Geo Semiconductor Inc. (San Jose, Calif.) founded in 2009, is a fabless semiconductor company that designs video and geometry processing integrated circuits (ICs). Its chips have found use in consumer displays and projection systems and the company is moving into automotive and security applications.
• Gpixel Inc. (Changchun, China) develops high-end CMOS image sensor solutions for industrial, medical and scientific applications. Founded in 2012, the company produces standard off-the-shelf image sensors, as well as customer-designed products. In 2014 Gpixel worked with foundry Tower Semiconductor Ltd. to produce a record-setting 150-Mpixel full-frame CMOS image sensor.
• InVisage Technologies Inc. (Menlo Park, Calif.) is a fabless semiconductor company developing QuantumFilm, an imaging-sensing technology that it claims has superior performance to silicon. Its first product enables high-resolution images from handheld devices such as camera phones and PDAs. Founded in 2006, in 2015, InVisage opened its first high-volume manufacturing facility, QFAB3, in Hsinchu, Taiwan.
• NeuroMem Inc. (Petaluma, Calif.) founded in October 2014 develops, markets and licenses neuromorphic circuits and sells chips, boards and development tools for pattern recognition and classification applications. Company is spin-off from General Vision Inc., developer of the CM1K neural network IC and the same technology is present in the Quark SE processor from Intel.
• Softkinetic SA (Brussels, Belgium) founded in 2007 is a developer of sensor-to-software 3D gesture recognition systems. It has licensed its platform to Texas Instruments Inc. and Melexis SA.
• TeraDeep Inc. (Santa Clara, Calif.) founded in December 2013 as spin off from Purdue University to focus on the design of mobile coprocessors and neural network hardware for the understanding of images and videos.
• V-Nova Ltd. (London, England) founded in 2011 by Guido Meardi (CEO), Luca Rossato (chief scientist), Eric Achtmann (executive chairman) and Pierdavide Marcolongo (angel investor), to create a superior video codec. Perseus is the result and is being developed in an open innovation model with a business consortium that includes Broadcom, Encompass, Intel, Hitachi and Sky Italia.
• Wavelens SA (Grenoble, France) is a CEA-Leti spinoff that was launched in November 2012. The company focuses on developing MEMS optical systems to integrate such autofocus, image stabilization and zoom.

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TowerJazz September 2015 newsletter updates on TowerJazz-Panasonic foundry progress:

"TPSCo has developed CIS production solutions with world leading quantum efficiencies, sub-blooming pixel charge saturation figures of merit, and dark current/white pixel performance due to our unique proprietary dual light pipe structure coupled with an ultra-deep photodiode structure. We offer 65nm CIS process solutions for pixel requirements from 1.12um to 6um and above pitch, in sensor sizes from VGA to full frame and above using 1D or 2D stitching technology. This includes full wafer 300mm sensors for X-ray applications. We are offering optimized pixel designs free of charge to qualified customers for fast sensor development. Additionally, we will offer a global shutter process with selected customer sampling in Q1 2016. Finally, we are now focusing on development of ultra-high QE sensors with a new light collecting technology. This technology will be ready for customer samples in 2017."

"[In Korea,] we have already started detailed discussions on CMOS image sensor (CIS) opportunities with several worldwide well-known surveillance and mobile companies who are interested in 65nm CIS technology on 300mm wafers. The state of the art pixel which is known as the best in the world is especially drawing customers’ attention."

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Albert Theuwissen continues his series of posts on blooming measurements. Post #2 talks about difference between blooming and other effects that might behave in a similar way. Post #3 talks about vertical and horizontal blooming differences.

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ARMdevices takes a video interview from Laurent Jamet demonstrating ISORG's printed image sensor at IDTechEx:

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PRWeb: Pinnacle Imaging Systems acquires the IP, products and trademarks developed by Unified Color Technologies with plans to offer its technology as embedded HDR solutions for digital still and video cameras.

“With our technology embedded in next generation still and video cameras, system designers requiring improved video quality will be able to deliver the most accurate color and tonal rendition possible for real-time HDR capture,” said Alfred Zee, President & CEO of Pinnacle Imaging Systems.

“HDR video capture is the new frontier for improving video quality and data capture for recognition. Currently, demand for HDR video is being driven from the top-down with digital content creators looking for HDR capabilities to be embedded into cameras and production equipment, and consumers seeking HDR-capable smart TV's and set top boxes. Eventually that demand will trickle down into consumer mobile devices over the next three to five years,” said Ron Tussy, Principal Analyst, The Imerge Group. “Embedded HDR tone mapping will not only improve the quality of video, but is also a critical underlying technology necessary to improve data for applications such as depth mapping and recognition in automotive ADAS as well as security/surveillance applications. Pinnacle Imaging Systems, with their proprietary IP, is the only provider of embedded HDR video that keeps all the color data intact and does so without a color shift.”

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Toshiba America VP of Image Sensor Business Unit Andrew Burt publishes a post on self-driven cars in his blog "Eye on Sensors." While mostly discussing legal and ethical issues of self-driving, the post also gives some statistics on automotive cameras:

"Vehicles may contain as many as 10 cameras when the age of self-driving cars arrives, and Strategy Analytics estimates that global shipments of automotive cameras will more than triple, reaching 102 million units by 2020 (see chart below)."

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IMV Europe: Bratislava, Slovakia-based Photoneo has secured a €2.1M seed investment. The investment was led by Prague-based venture capital firm Credo Ventures, with the participation of several co-investors including the investment arm of RSJ, one of the largest algorithmic trading companies in the world, co-founder of ESET Miroslav Trnka, Avast's co-founders Eduard Kucera and Pavel Baudiš, CEO of Ximea Max Larin, and founder of Finviz Juraj Duris.

Jan Zizka, CEO of Photoneo says: "The newly raised capital will allow our company to finish the image sensor chip thanks to which our camera will operate at full resolution at higher speeds. Additionally, we plan to strengthen our team on both technical and sales side to accommodate the large spectrum of use cases our potential customers are seeking to accommodate."

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Leopold Kostal is presenting a camera-based driver assistance system with Infineon ToF sensor inside. The system detects whether the driver is showing signs of drowsiness (nodding off) or is distracted. And the car instantly responds – with a vibrating seat or a warning tone, for instance. The less attentive the driver gets, the more attentive the car gets. In order to respond quickly and accurately, the assistance and the emergency braking systems can automatically activate in advance of a potential emergency.

“For semi-autonomous or autonomous driving, the assistance system of the vehicle needs to know the state of the driver at all times,” says Frank Blaesing, Head of Innovation Management and Advanced Engineering at Kostal. “It needs to know if and how well the driver is informed about what’s happening on the road at that moment. This information is especially needed when the control over the vehicle needs to be turned back to the driver in a complex traffic situation.”

By 2018, cars with the 3D camera system from Kostal will be running off the assembly line. The optical system is only 49 by 29 millimeters (about 2 by 1 inches) in size and is embedded into the dashboard: Through the steering wheel, it “looks” front-facing at the driver’s body and head. It records the exact head position and recognizes the blink of an eye even through glasses or sunglasses.

The heart of the camera system is the 3D ToF image sensor. At only 7 by 8 millimeters (.28 by .31 inches), it contains a 352 x 288 pixel array, intelligent control logic and a several ADCs. These convert the analog image data (distance and brightness) into digital data in less than a thousandth of a second. The robustness to ambient light irradiation is supported by the Suppression of Background Illumination (SBI) function. SBI is supplied by pmdtechnologies GmbH, the development partner of Infineon in the ToF technology and the 3D image sensor chips.

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Autoevolution: One of the big new features in the new 2016 BMW 7 Series cars is a gesture control. "The system uses a 3D sensor installed in the roof lining of the car, next to the rearview mirror. It recognizes the hand gestures of the driver, as long as he keeps his hand between the steering wheel, dash and the gearshift lever. The system works best if you use gestures close to the dash and in front of the iDrive screen."

BMW video tutorial shows its operation:

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Slovakia-based 3D camera startup Photoneo announces its ToF PhoXi Cam:

"We are changing the industry and are working hard to make the impossible a reality. Our patent pending technology embedded into the PhoXi Cam can deliver the high quality outputs of the structured light systems like PhoXi Scan with the speed of Time of Flight systems.

Based on our revolutionary sensor technology, we are able to capture the high-resolution 3D data with a single frame of the camera. We call it the Multi-Image sensing and it is based on a massive parallelism on a level of photons. In collaboration with our projection unit, it basically freezes objects in space and deliver a motion-blur free 3D reconstruction. It is suitable for all dynamic applications (alongside of all static ones).

This level of performance is possible due to our custom-design smart CMOS sensor. We hope, that our camera will help to shape the new wave of industry automation. To serve as a vision platform for new autonomous systems aware of their surroundings."

It appears that Germany-based Ximea was somehow involved in PhoXi Cam design.


Photoneo's only published patent application WO2015132726 "Method and Apparatus for Superpixel Modulation" by KOVACOVSKY Tomas, MALY Michal, and ZIZKA Jan has 105 pages and describes a modulated structured light image sensor, rather than the ToF one. The application presents an array of superpixels, each of them being a group of 3 x 3 pixels. Each pixel in the group get orthogonal demodulation signals:

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Imaging Resource noticed Sony PDAF patent application published in Japanese language Egami blog. The application presents an asymmetrical microlens covering two neighboring pixels:

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Rambus publishes a Youtube video showing eye tracking use case for its LSS image sensor, among few other use cases:

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So far, Hamamatsu ToF image sensor operation principles have not been presented to the broad public. University of Siegen, Germany, MSc Thesis "Analysis of a pulse-based ToF camera for automotive application" by Simon Theiß fills this gap. The work is based on Hamamatsu S11963-01CR sensor:

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Sony, Olympus, and their medical joint venture - Sony Olympus Medical Solutions Inc. - announce that their jointly developed 4K surgical endoscopy system will be commercialized since early October 2015. Sony Olympus Medical Solutions has brought together the core technologies and expertise of Sony (image sensors, image and signal processing, optical transmission, 4K imaging) and Olympus (medical products R&D, deep understanding of the needs of the medical community) and combined them to create a powerful technological base and image processing system for medical devices.

Sony contributed its technology and expertise in 4K and digital imaging. For the 4K camera head, Sony provided its 4K Exmor R CMOS image sensor, image and signal processing technologies, and miniaturization technologies, which - taken together - make for very high image clarity and advanced functionality. In addition, Sony's 4K image transmission technologies made possible the nearly latent-free delivery of 4K visuals from the endoscope to the monitor.

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After LG G3 smartphone has presented ST ToF sensor-assisted AF last year and G4 is following its path this year, there are few more smartphone makers adopting ST ToF solution. One of them is the recently announced Oppo R7 Plus: "With a laser focus technology to quickly capture the focal point within 0.3 seconds, a RGBW sensor that is able to shoot high-clarity photos in low-light environments <..> to capture <..> sports events."


Another recent smartphone with ST VL6180 ToF sensor is OnePlus 2: "The 2015 flagship model, OnePlus 2, relies on ST sensors for its superior camera system performance that includes an ultra-fast 0.2s “human-eye” -grade focus time and advanced optical anti-shake technology that delivers a 20% improvement in effective image resolution, as well as a 55% reduction in power consumption compared with standard optical anti-shake mobile-camera systems."


Asus Zenphone 2 Laser too features ToF sensor AF: "The brand-new laser-autofocus feature greatly reduces blurring and enhances image stabilization..."


There are few more models from LG and Asus, as well as Lenovo Vibe Shot, and Meizu MX5. There is even a rumor that the next generation Google Nexus will have the ToF AF too:

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SpectroNet publishes a video presentation "Multi/Hyper-Spectral Imaging Applications" by Vivek Sharma - KU Leuven / IMEC:

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PRNewswire: OmniVision announces the OV8856, a 1/4-inch 8MP, 1.12um pixel PureCel sensor for mainstream mobile devices.

"The global market for 8-megapixel sensors is booming, with analysts expecting over one billion in annual unit sales by 20171. A vast number of mainstream mobile handsets are already using 8-megapixel cameras for their rear-facing cameras. Looking forward, industry observers expect a strong trend toward an ever-increasing number of mobile handsets with their former 1/4-inch 5-megapixel cameras upgraded to 1/4-inch 8-megapixel cameras2," said Arun Jayaseelan, product marketing manager at OmniVision. "The capabilities and compactness of the OV8856 address the increasing consumer demand for higher resolution and more advanced features in mobile front- and rear-facing cameras."

The OV8856 captures full-resolution 8MP images and video at 30fps, and 1080p video at 60fps. The sensor also supports interlaced HDR (iHDR) for HDR video. The OV8856 is said to be one of the smallest 8MP sensors in the market today, and is approximately 15 percent smaller than OmniVision's previous generation OV8858 image sensor. It can fit into a 6.5 mm x 6.5 mm fixed focus module with a z-height of approximately 4 mm.

OmniVision also announces the OV8855, a variation of the OV8856 with PDAF. Both sensors are currently available for sampling, and are expected to enter volume production in the fourth quarter of 2015.

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While Canon is first to unveil its plans to commercialize the first affordable 8K Cinema camera, NHK is already talking about 8K HDR system at IBC 2015 being held these days in Amsterdam, the Netherlands.

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SPIE publishes a video of SPIE Optics + Photonics 2015 conference plenary talk "Extreme Imaging and Beyond" by Keisuke Goda of the University of Tokyo:

Thanks to AS for the SPIE video link!

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SPI Infrared Corp. presents The X26 Hyper Fidelity Intensified Sensor (HFIS) camera. It's said to be "a state of the art, cutting edge digital HD High Definition Camera that utilizes Advanced BsTFA (Broad spectrum Thin Film Array). The X26 Low Light Imaging Camera works in day or night. Its stellar night time capabilities are where the X26 really performs. The ultra sensitive chip outperforms currently fielded and widely used military issue Image Intensified night vision systems which are analog, The X26 is fully digital and images to 1100 nanometers, at this range the X26 low light night vision CMOS is able to see battlefield 1064NM lasers and all IR sources up to 1100 NM. The X26 is a tiny (1″ Cube) extremely efficient, low power consuming, no maintenance true digital image intensified night vision sensor which offers incredible High Resolution image quality never seen before in any low light level night vision or CMOS imaging technology."

"The X26 Broad Spectrum Thin Film Array is the absolute best low light digital imaging military grade night vision solution that offers exceptionally better night vision capabilities over SWIR, SCmos, CNV, EMCCD, EBAPS, E2V, Nocturn and all other current CCD/CMOS chip / intensified cameras, and low lux light sensor technologies which are also extremely expensive & power hungry."

"Unlike other low light technologies, the x26 DOES NOT slow down its frame rate to compensate for darker scenes, and retains full frame rate imaging, this is another area where the HFIS BsTFA excels dramatically over any other low light night / low lux technology available ANYWHERE."

SPI Corp's X26 brochure shows the new sensor picture with iStock watermarks for some reason:

SPI HFiS X26 sensor

The company's Youtube and Vimeo videos show the new sensor capabilities:




Thanks to YN for the link!

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European Doctorate in Image Sensors and Optical Nanotechnology (EDISON) at the University of Oxford, UK is organizing a free workshop on September 28-29. The 1st Workshop on Advancements in Circuits and Imaging program is:

• Larger and faster: CMOS Image Sensors for scientific applications at the Rutherford Appleton Laboratory, Dr. Renato Turchetta, Rutherford Appleton Labs, UK
• High Performance Detectors, Prof. Daniela Bortoletto, Oxford Physics, UK
• Silicon Retina Technology, Prof. Tobias Delbruck, ETH, Zurich, Switzerland
• CMOS image sensor technologies for high dynamic range capture, Dr. Johannes Solhusvik, Omnivision, Norway
• Efficient Feature Extraction in CMOS Vision Sensors, Prof. Ricardo Carmona Galán, Institute of Microelectronics, Seville, Spain
• Direct Interpolation ADCs and DACs, Prof. Allan Belcher, Signal Conversion,UK
• Extended Counting: a very efficient improved incremental A/D conversion technique, Prof. Pieter Rombouts, Ghent University, Belgium
• Metal oxide nanowires integrated on silicon micromachined or flexible polymeric substrates for resistive or optical gas sensing, Prof. Eduard Llobet, Universitat Rovira i Virgili, Spain
• Delta-sigma modulators, compressive sensing: Collaborative Possibilities, Dr. Jaswinder Lota, University of East London, UK
• Miniaturization trends in medical imaging enabled by full wafer level integration of micro camera modules, Martin Wäny, Awaiba, Portugal
• Challenges and Opportunities in 3D IC stacking, Dr. Vasilis Pavlidis, University of Manchester, UK
• Development of organic circuitry for low-cost smart sensor systems, Dr. Munira Raja, Liverpool University, UK

Thanks to AB for the link!

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IEEE Spectrum reports that multi-thousand-dollar laser ranging (lidar) systems that most self-driving cars rely on to sense obstacles can be hacked by a setup costing just $60, according to a security researcher.

“I can take echoes of a fake car and put them at any location I want,” says Jonathan Petit, Principal Scientist at Security Innovation, a software security company. “And I can do the same with a pedestrian or a wall.” Using such a system, attackers could trick a self-driving car into thinking something is directly ahead of it, thus forcing it to slow down. Or they could overwhelm it with so many spurious signals that the car would not move at all for fear of hitting phantom obstacles.

The lidar laser pulses were not encoded or encrypted, which allowed him to simply replay them at a later point. “The only tricky part was to be synchronized, to fire the signal back at the lidar at the right time,” Petit says. “Then the lidar thought that there was clearly an object there.”

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BusinessWire: Freescale acquires Ottawa, Canada-based CogniVue, a developer of image cognition IP for automotive and consumer applications used in Freescale ADAS processors. “The acquisition of CogniVue accelerates our autonomous vehicles portfolio with leading-edge vision processing IP,” said Bob Conrad, SVP and GM of Freescale’s Automotive MCU group. “With the exceptional market response to our S32V234 vision processor, as well as demand for our next generation vision solutions, this acquisition places Freescale in a position to supply highly automated car applications with the requisite performance, safety, security and reliability those systems require.”

CogniVue vision processing IP is already available in multiple Freescale products, including the S32V processor announced in March 2015, as well as other offerings.

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Image Sensors Americas 2015 to be held in Berkeley, CA on November 17-19, published its agenda:

Future Outlook for CIS Technology and Markets:

• Image Sensors for the Next Generation of Globally Connected Technology, Ron Tussy, President and Principal Analyst, The Imerge Group
• Image Sensor Market Overview and Major Trends, Pierre Cambou, Activity Leader - Imaging, Yole Developpement
• Title TBC, Tsutomu Haruta, Senior Manager, Sony
• Objective Image Quality Testing and Standards – Implications for New Sensor Applications, Jackson Roland, Imaging Science Engineer, Imatest

Small Form Factor Cameras – Creating New Opportunities with Ever Smaller Imagers:

• Imaging in Small Spaces, Lou Hermans, COO, CMOSIS
• The Need for Highly Efficient and Automated Assembly - Enabling Technologies, Ignazio Piacentini, Director of Business Development, FiconTEC
• Introducing Low Cost MIPI Cameras to Clamshell Form Factors, Rich Hicks, Imaging Architect, Intel
• Slim Form Factor Cameras for Mobile Applications, Speaker TBC

Advances in Image Processing for Growing Applications:

• 360° Image Quality Tuning Using Panomorph Technology, Patrice Roulet, Director of Engineering and Co-Founder of Technology, ImmerVision
• Computer Vision - Review of the Latest Developments in Industry and Academia, Ashok Veeraraghavan, Assistant Professor of Electrical and Computer Engineering, Rice University
• Deep Learning - Impacts on Sensor Design. Yair Siegel, Director of Product Marketing, Imaging & Vision, CEVA DSP

Sensor Innovations and Novel Applications:

• Monolithic Deep Depletion CMOS Imagers on High Resistivity Silicon, Stefan Lauxtermann, President and Founder, Sensor Creations
• Integrated CMOS Spectral and 3D Depth Sensors, Steve Saxe, Product Line Manager - Optical Security and Performance Products, Viavi Solutions
• Optogenetics and Computational Diffractive Sensing for Novel Brain Interfaces, David Stork, Fellow, Rambus
• Novel CMOS Technology for Superior Low Light Performance, Speaker TBC

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Canon announces that it is developing a Cinema EOS System 8K camera and a still-image 120MP DSLR camera.

The Cinema EOS System 8K camera being developed will be equipped with a Canon Super 35 mm-equivalent CMOS sensor with 8,192 x 4,320 pixel (approximately 35.39 million effective pixels) resolution, and a full resolution frame rate of 60fps with 13 stops of DR.

Another product in development is a DSLR camera featuring a resolution of approximately 120 effective megapixels, that "will incorporate a Canon-developed high-pixel-density CMOS sensor within the current EOS-series platform."

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Imaging Resource reports that a 12MP image sensor inside iSight cameras on the new iPhone 6S and 6S Plus feature two new technologies:

"The first of these is the decision to move the color filter that normally sits above the sensor directly onto top of the pixels, leaving less room for error. The second technology is the use of what Apple calls ‘Deep Trench Isolation’, which puts small dividers between the pixels to prevent light from bouncing around unnecessarily."


A Youtube video from today's Apple event shows the camera part of the presentation, starting from time 1:25:

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Yole Developpement publishes few more details from its 2015 Camera Module Industry Report. This time, Yole highlights the CCM price increase: “This trend is a real surprise. Indeed, at Yole, we follow the electronic components market for the mobile phones industry for a long time and we know the strategic importance of price in this sector”, comments Pierre Cambou, Activity Leader at Yole.

This market demand is partly answered by the penetration of Auto Focus (AF) and the Optical Image Stabilization (OIS) application reaching US$ 5.5 billion in 2020, with 21% CAGR between 2015 and 2020. Such figure highlights the strategic importance of the AF & OIS applications in the mobile phones sector and the possible implication of those technologies in future sensing applications.

“There is a different market trajectory for the lens and sensor markets, which are now maturing at approximately 14% CAGR with the emergence of giant billion-dollar companies”, explain Yole’s analysts. CCM and auto-focus manufacturing markets, which are still very fragmented and growing at roughly 20% CAGR, should experience consolidation over the next five years.

Automotive camera module revenue reached US$1.2 billion in 2014, and growing at a CAGR of 36% should reach US$7.9 billion by 2020. This growth has mainly benefited the CCM industry’s second-tier players, but the response of market leaders will be worth watching.

Few more slides from Yole's Slideshare presentation:

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Aphesa organizes an image sensor and camera technology training tour between October 2015 and November 2016. The training sessions are organized as three days per location and split over several courses, it is possible to subscribe for a single course, multiple courses or the full session.

The courses are introductory to mid-level, with some advanced topics, and are designed for engineers who are new to the field of imaging or non-engineering personnel who needs a more in-depth understanding of the technology. It is also a good refresher course for experienced engineers and a good introductory course for sales, marketing and support personnel. Each course is accompanied by a question and answer session and an open discussion session.

The course agenda:

– Monday, October 12th:

• Introduction to imaging (light, light spectrum, light sources, scene, behavior of light, basic radiometry and photometry, lighting techniques, polarization, filters, optical basics, MTF, camera basics, color issues, multispectral and hyperspectral imaging, camera interfaces, photography and imaging terms, lens standards, camera interface standards)
• Introduction to CMOS image sensors (photodiodes, pixels, arrays, readout circuits, ADC circuits, architectures, spatial and temporal noise sources and noise compensation, color filters, microlenses, dark current, defect pixels, ageing, temperature effects, image sensor design flow).

– Tuesday, October 13th:

• Introduction to software based (mutliple exposure) high dynamic range imaging, including algorithms and artifacts
• Specific CMOS image sensors for high dynamic range imaging, including control methods, pixel designs and artifacts
• Introduction to 3D imaging
• Introduction to the EMVA1288 standard
• Introduction to high speed and real time imaging

– Wednesday, October 14th:

• Introduction to image processing

The Training Tour path is:

• October 2015 – Spa, Belgium – minimum of 4 attendees per course
• Early December 2015 – Yokohama, Japan – minimum of 19 attendees per course
• Late January 2016 – San Diego, CA – minimum of 10 attendees per course
• Early February 2016 – San Francisco, CA (limited courses only as part of SPIE Photonics
• West and IS&T Electronic Imaging, separate symposium registration required)
• Early May 2016 – Boston, MA – minimum of 7 attendees per course
• July 2016 – Seoul, South Korea – minimum of 11 attendees per course
• November 2016 – Stuttgart, Germany – minimum of 8 attendees per course

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