Holes vs Pyramids

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W&W Sens Device together with Universities of California at Davis and Santa Cruz publishes Arxiv.org paper "Optimization of CMOS image sensors with single photon-trapping hole per pixel for enhanced sensitivity in near-infrared" by E. Ponizovskaya Devine, Ahasan Ahamed, Ahmed S. Mayet, Soroush Ghandiparsi, Cesar Bartolo-Perez, Lisa McPhillips, Aly F. Elrefaie, Toshishige Yamada, Shih-Yuan Wang, and M Saif Islam.

"The optimization of silicon photodiode-based CMOS sensors with backside-illumination for 300-1000 nm wavelength range was studied. It was demonstrated that a single hole on a photodiode increases the optical efficiency of the pixel in near-infrared wavelengths. A hole with optimal dimensions enhanced optical absorption by 60% for a 3 μm thick Si photodiode, which is 4 orders better than that for comparable flat photodiodes. We have shown that there is an optimal size and depth of the hole that exhibits maximal absorption in blue, green, red, and infrared. Crosstalk was successfully reduced by employing thin trenches between pixels of 1.12 μm^2 in size."

Although the labels on the following figures seem to be off, the general conclusion is clear: NIR sensitivity is a little bit better with holes, but visible is significantly worse:

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Sony Mavica MVC FD5 retro review

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Back in 1997 Sony had a cunning plan: forget expensive cards, built-in memory or non-standard ports, the new Digital MAVICAs would record photos onto standard 3.5in floppies! 24 YEARS later I retro-review the first model!…

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ST to Start Quantum Dot Image Sensor Production

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SeekingAlpha article "Quantum Dots - All The Colours Of The Rainbow" by Edison Investment Research tells about ST QD sensor plans. The article is also published in a pdf form.

"STMicroelectronics ready to commercialise QD photodetector platform technology

In May 2021, ST presented a paper at the Society for Information Display’s annual symposium. This announced that the company was ready to commercialise its QD photodetector platform technology and intended to have 940nm engineering samples ready for release to early adopters during calendar H221 and SWIR (<1,400nm) samples ready during calendar 2022. The paper noted that the technology held great promise for enabling lower cost (100–1,000 times lower), high-performance, high-resolution, large spectral response image sensors, which would potentially drive large SWIR imaging growth. It identified initial opportunities in mobile devices, miniature spectrometers and hyperspectral imaging, machine vision and advanced driver assistance, noting that the variant currently at R&D scale was likely to surpass the required performance specifications including sensor speed for time-of-flight applications in future.

We have previously inferred elsewhere that ST is deploying QDs from Nanoco for this application. If successful, this programme could lead to production scale-up and eventual volume production in calendar 2023 at Nanoco’s proven production facility in Runcorn. Nanoco is also working with a ‘very significant’ Asian chemical company on the development of QDs or infra-red sensing applications. The Asian customer intends to incorporate Nanoco’s nanomaterials in its own materials, which it will sell globally to companies making electronic devices (i.e., companies at a similar level in the supply chain to ST). Volume production for the Asian customer is likely to commence one year to 18 months after any potential volume ramp-up for ST."

Investing.com article is based on an earlier version of Edison report giving more details about ST-Nanoco cooperation history:

"Nanoco and ST have been working together for around three years. Originally this was as part of a supply chain for a major US customer, with Nanoco manufacturing nanomaterials that ST used to improve the sensitivity of its silicon infrared sensors. In June 2019 the US customer advised Nanoco that the joint programme would not be extended beyond December 2019 when the contract covering a range of stress tests and commissioning services at the Runcorn facility concluded. This decision was for reasons wholly unconnected to the performance of Nanoco’s materials and service delivery. The nanomaterials production facility in Runcorn had been successfully commissioned, with Nanoco delivering the final milestones for the US customer during FY20 and earning the contracted milestone payments in full.

With the US customer having withdrawn from the scene and the exclusivity agreement with it having lapsed, ST is able to offer the enhanced, proven, near infrared (NIR) sensors developed for the US customer across its extensive, global customer base. In May 2020 ST signed a framework agreement with Nanoco covering both development work and commercial supply of nanomaterials for use in multiple infrared sensing applications over a five-year period. The agreement covers the supply of small-scale volumes of nanomaterials for NIR sensors. It also covered a development project, which initially extended from April to December 2020, on a new generation of nanomaterials for potential use in other infrared sensing applications, which we infer from a recent paper given by ST (see below) are in the short-wave infrared (SWIR) range. This development activity was not impaired by the coronavirus pandemic. During H1/21 Nanoco successfully delivered all of the technical and commercial milestones on the first phase of this project, which contributed £0.8m of the total £1.0m revenues for the period. In May 2021 Nanoco announced that it was working on the second phase, which is the optimisation of the new materials. This phase is scheduled to complete in Q1/22. If successful, this phase could lead to production scale-up and eventual volume production in calendar 2023.

The agreement also commits ST to taking a specified minimum volume of nanomaterials from Nanoco if the enhanced sensors gain market traction and commercial volumes are required. These materials would be produced at the existing facility dedicated to sensing applications in Runcorn."

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Quantum Dot/Graphene Detectors Reviews

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IOP NanoExpress publishes Kansas University paper "Quantum dots/graphene nanohybrids photodetectors: progress and perspective" by Judy Wu and Maogang Gong.

"Semiconductor quantum dots/graphene heterostructure nanohybrids combine the advantages of the enhanced light–matter interaction and spectral tunability of quantum dots (QDs) and high charge mobility in graphene as a charge transport pathway, providing a unique platform for exploration of photodetectors with high performance. In particular, the QDs/graphene nanohybrids allow resolution to the critical issue of charge transport in QDs-only photodetectors stemming from the low charge mobility associated with both QD surface defect states and inter-QD junctions. Furthermore, the achieved capability in industrial-scale fabrication of graphene and colloidal QDs has motivated efforts in research of QDs/graphene nanohybrids focal plane arrays that are expected to be not only high performance and low cost, but also light-weight, flexible and wearable. This paper aims to highlight recent progress made in the research and development of QDs/graphene nanohybrid photodetectors and discuss the challenges remained towards their commercial applications."


Wiley Advanced Science publishes a paper "Integration of Colloidal Quantum Dots with Photonic Structures for Optoelectronic and Optical Devices" by Mengyu Chen, Lihua Lu, Hui Yu, Cheng Li, and Ni Zhao from Xiamen University, Institute of Xiamen, and Chinese University of Hong Kong.

"In this review, the recent advances in this research area are summarized. In particular, the use of four typical photonic structures, namely, diffraction gratings, resonance cavities, plasmonic structures, and photonic crystals, in modulating the light absorption (e.g., for solar cells and photodetectors) or light emission (e.g., for color converters, lasers, and light emitting diodes) properties of QD-based devices is discussed. A brief overview of QD-based passive devices for on-chip photonic circuit integration is also presented to provide a holistic view on future opportunities for QD/photonic structure-integrated optoelectronic systems."

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One-pixel Camera from HDR Inventor

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Steve Mann publishes Instructables article "One-pixel Camera for Teaching and Research on Comparametric Equations and HDR." It starts from a claim of a multi-frame HDR invention in 1996:

"Back in the 1980s and early 1990s I invented something called HDR (High Dynamic Range) imaging that is now widely used in smartphones and cameras and augmented reality vision systems, etc.. My general philosophy was to regard the camera as an array of light meters. The idea is to turn a camera into a scientific measuring instrument."

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GeSn/Ge/Si Detector to Extend SWIR Sensor Sensitivity to 2.45um

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Photonics: Researchers at the Forschungszentrum Jülich (Jülich Research Center) and the Politecnico di Milano (Polytechnic University of Milan) have developed an IR detector that provides a bias-switchable spectral response in two distinct IR bands. When the bias voltage for the detector is reversed, the device switches from the NIR to the SWIR band. The dual-band photodetector is Si-wafer based and is said to be suitable for integration into cameras and smartphones.

The paper "CMOS-Compatible Bias-Tunable Dual-Band Detector Based on GeSn/Ge/Si Coupled Photodiodes" by Enrico Talamas Simola, Vivien Kiyek, Andrea Ballabio, Viktoria Schlykow, Jacopo Frigerio, Carlo Zucchetti, Andrea De Iacovo, Lorenzo Colace, Yuji Yamamoto, Giovanni Capellini, Detlev Grützmacher, Dan Buca, and Giovanni Isella is published in ACS Photonics.

"Here, we present a two-terminal dual-band detector, which provides a bias-switchable spectral response in two distinct IR bands. The device is obtained from a vertical GeSn/Ge/Si stack, forming a double junction n-i-p-i-n structure, epitaxially grown on a Si wafer. The photoresponse can be switched by inverting the bias polarity between the near and the short-wave IR bands, with specific detectivities of 1.9 × 1010 and 4.0 × 109 cm·(Hz)1/2/W, respectively. The possibility of detecting two spectral bands with the same pixel opens up interesting applications in the field of IR imaging and material recognition, as shown in a solvent detection test. The continuous voltage tuning, combined with the nonlinear photoresponse of the detector, enables a novel approach to spectral analysis, demonstrated by identifying the wavelength of a monochromatic beam."

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KT Imaging Files Patent Lawsuits against Apple, Microsoft, Google, Samsung, etc.

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KT Imaging patent holding company believes that a number of companies infringed on its image sensor packaging patents. So, KT Imaging files the lawsuits against Apple, Microsoft, Google, Dell, Samsung, HP, AsusTek, Acer, etc.

AppleInsider publishes the case against Apple is published on Scribd. The patents in the case are 7,196,322, 7,511,261, 7,598,580, 8,004,602, and 8,314,481, filed for between 2004 and 2008 by Kingpak (Kingpak has been acquired by Tong Hsing two years ago.)

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Gpixel Releases World’s Highest Resolution Global Shutter CMOS Sensor

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Gpixel expands the GMAX product family of global shutter image sensors with the 152 MP GMAX32152, the highest resolution global shutter CMOS sensor commercially available in the market.

This latest GMAX sensor incorporates a 3.2 µm charge domain global shutter pixel in a 16556 (H) x 9200 (V) array for an imaging area of 53 mm x 29.4 mm (60.6 mm diagonal). The 1.8:1 wide aspect ratio optimizes the inspection of flat panel displays of similar format and increases the efficiency of large field of view aerial mapping applications.

GMAX32152 shares a common pixel and read-out architecture with the 103 MP GMAX32103, achieving the same full well capacity of 9.4 ke- and a read noise of 4 e- for a dynamic range of 67.6 dB.

The read out of image data is accomplished using 38 pairs of sub-LVDS channels each operating at 960 MHz delivering a full resolution frame rate of 16 fps at 12bit output and total aggregate data rate of 36.48 Gbps.

This sensor is provided in monochrome and RGB Bayer color options. Monochrome and RGB color engineering samples can be ordered today for delivery in October 2021, production release is expected by mid 2022.

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Sony Unveils UV-Optimized Image Sensor

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Sony announces the commercialization of the IMX487, a 2/3-type CMOS image sensor for industrial equipment, which is optimized for UV wavelength and comes with global shutter functionality and the industry’s highest (among UV sensors) pixel count of 8.13MP.

The sensor captures UV light with high efficiency made possible by the industry’s smallest (among UV sensors) 2.74 µm pixel size. It utilizes Sony’s Pregius S global shutter technology, which employs a unique back-illuminated pixel structure on a stacked CMOS image sensor,

Sony expects the new sensor to be useful in a variety of applications, including semiconductor pattern defect inspection in the existing UV camera market, thereby contributing to improving productivity in manufacturing processes and helping to solve industrial issues.

In general, UV cameras enable sorting of materials that would be difficult in visible light, as well as checking for minute scratches and defects on the surface of objects. They have conventionally been used in semiconductor pattern defect inspection; however, to expand the scope of application in the future, demand has continued to grow for an image sensor that not only provides sensitivity in the UV wavelength, but also delivers high resolution, low noise, and high-speed performance.

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Pixel with Nearly Unity-Gain SF

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IEEE Sensors publishes a video presentation of Xiaoliang Ge and Albert Theuwissen (Delft University) paper "A CMOS Image Sensor with Nearly Unity-Gain Source Follower and Optimized Column Amplifier."

"This paper presents a CMOS image sensor with in-pixel nearly unity-gain pMOS transistor based source followers and optimized column-parallel amplifiers. The prototype sensor has been fabricated in a 0.18 µm CMOS process. By eliminating the body effect of the source follower transistor, the voltage gain for the pixel-level readout circuitry approaches unity. The use of a single-ended common-source cascode amplifier with ground rail regulation improves the PSRR of the column-parallel analog front-end circuitry and further the noise performance. The prototype sensor with proposed readout architecture reaches a 1.1e- input-referred temporal noise with a column-level ×16 analog gain."

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Syntiant Partners with Pixart on Low Power Always-On Applications

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GlobeNewswire: Competing with Himax WiseEye always-on IoT platform, Pixart partners with Syntyant neural processing startup to come up with a joint low power vision platform.

Syntiant introduces its Syntiant® NDP200 Neural Decision Processor (NDP), the company’s first chip designed for vision processing that can provide highly accurate inference at under 1mW.

The NDP200 can run multiple applications simultaneously with minimal power consumption, including AI vision features such as person detection, object classification, motion tracking and occupancy monitoring.

Our NDP200 brings extraordinary inference capabilities to a wide variety of always-on image and sensor applications,” said Kurt Busch, CEO of Syntiant. “Our Core 2 architecture minimizes data movement by coupling memory and MAC functions that generally provides 100x improvement in efficiency and performance. As an example, an application that lasts three and a half days on a battery-powered device using an Arm A53 processor would last one year running on the NDP200.

The combination of Syntiant’s NDP200 and PixArt's ultra-low-power image sensor offers the ability to develop highly accurate person and object detection systems that consume very little power with almost no latency,” said Sen Huang, CEO of PixArt Imaging. “These features are extremely critical to the growing need for imaging sensor applications found in battery-operated IoT devices, such as video doorbells and security cameras.”

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IntoPIX Announces IP Cores for 10x Raw Image Data Compression

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BusinessWire: IntoPIX announces the extension of its range of TICO RAW IP-cores supporting additional pixel per clock architectures to target more devices and more sensor types.

Integrated on ASIC or in small FPGAs, these IP-cores cover the most popular CFA Bayer patterns, sensor bit-depths from 10 up to 16 bits and resolutions from 1MP up to 100MP.

TICO-RAW is the new RAW. It preserves access to the control over white balance, exposure and color grading with the world's best efficiency. “The continued use of regular RAW files means that the ultimate image quality can’t be maintained without creating monster-size files or using too much bandwidth,” explains Jean-Baptiste Lorent, Marketing and Sales Director at intoPIX. With 10 times less bandwidth required and 10 times less storage needed compared with those of regular RAW, TICO-RAW offers a high speed and low complexity.

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“NIKKOR – The Thousand and One Nights (Tale 79) has been released”

Nikon | Imaging Products        Go to the original article...

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Canon Inc. completes acquisition of Redlen Technologies as a wholly owned subsidiary

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Strategy Analytics on H1 2021 Smartphone CIS Market

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Strategy Analytics estimates that Sony has captured 42% smartphone CIS market share in H1 2021 and 41% in Q2 2021. The whole smartphone CIS market grew 10% YoY in H1:

"The global smartphone Image sensor market in H1 2021 clocked a total revenue of $7 billion.

This Strategy Analytics research report finds that the smartphone image sensor market managed to record a revenue growth of more than 10 percent year-over-year in H1 2021.

The report estimates that the top three vendors took almost 80 percent revenue share in the global smartphone image sensor market in H1 2021.

Jeffrey Mathews, Senior Analyst at Strategy Analytics says, “The image sensor vendors witnessed an accelerated momentum from smartphone OEMs, who actively adopted high-resolution CIS and low-pixel CIS products for multicamera applications, to secure inventory and cater to pent-up demand. Sony, Samsung and OmniVision supplied key high-resolution CIS products to leading smartphone OEMs in H1 2021.”

Stephen Entwistle , Vice President of the Strategic Technologies Practice at Strategy Analytics commented, “The introduction of new high-resolution and large format CIS products from the major vendors are expected to boost the revenue opportunities in the market. However, we note that the supply fluctuations of various high-pixel and low pixel CIS products continue to challenge the growth prospects of the smartphone image sensor market.

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Low Noise SPAD in 180nm Process

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IEEE Journal of Selected Topics in Quantum Electronics publishes EPFL and KIST paper "A Low-noise CMOS SPAD Pixel with 12.1 ps SPTR and 3 ns Dead Time" by Francesco Gramuglia, Ming-Lo Wu, Claudio Bruschini, Myung-Jae Lee, and Edoardo Charbon.

"Single-photon avalanche diodes (SPADs) have become the sensor of choice in many applications whenever high sensitivity, low noise, and sharp timing performance are required, simultaneously. Recently, SPADs designed in CMOS technology, have yielded moderately good performance in these parameters, but never equaling their counterparts fabricated in highly customized, non-standard technologies. The arguments in favor of CMOS-compatible SPADs were miniaturization, cost and scalability. In this paper, we present the first CMOS SPAD with performance comparable or better than that of the best custom SPADs, to date. The SPAD-based design, fully integrated in 180 nm CMOS technology, achieves a peak photon detection probability (PDP) of 55% at 480 nm with a very broad spectrum spanning from near ultraviolet (NUV) to near infrared (NIR) and a normalized dark count rate (DCR) of 0.2 cps/µm^2, both at 6V of excess bias. Thanks to a dedicated CMOS pixel circuit front-end, an afterpulsing probability of about 0.1% at a dead time of ∼3 ns were achieved. We designed three SPADs with a diameter of 25, 50, and 100 µm to study the impact of size on the timing jitter and to create a scaling law for SPADs. For these SPADs, a single-photon time resolution (SPTR) of 12.1 ps, 16 ps, and 27 ps (FWHM) was achieved at 6 V of excess bias, respectively. The SPADs operate in a wide range of temperatures, from -65◦C to 40◦C, reaching a normalized DCR of 1.6 mcps/µm^2 at 6 V of excess bias for the 25 µm at -65◦C."

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Galaxycore 12-inch BSI Facility to Start Production in 2 Years

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Laoyaoba: Galaxycore says on the investor interaction platform that the company's 12-inch CIS BSI facility construction is progressing smoothly, and the main building has been capped on August 16. The company expects to start the production in 2 years. The fab capacity is 20,000 wafers per month.

In 2018, 2019 and 2020, the gross profit margin of Galaxycore's CMOS sensors was 25.32%, 27.50% and 28.54%, respectively which is similar to or even higher than that of its competitors. Galaxycore is confident in the competitiveness of its new high-end products in development now.

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Open Letter from Junichi Nakamura, New President of the International Image Sensor Society

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Open Letter from the New President

Dear all,

This time, I was elected as a new President of International Image Sensor Society (IISS) by the IISS Board of Directors at the Board meeting just after the 2021 International Image Sensor Workshop (IISW) closure. It is my great pleasure and honor to serve as President of IISS and I will try my best to improve services of IISS/IISW.

As was mentioned at the very beginning of the 2021 IISW by Johannes Solhusvik, the General Chair of the 2021 IISW, the key concept of the IISW is to provide an opportunity to exchange the latest progress in image sensor and related R&D activities to the top image sensor technologists in the world in an informal atmosphere. This concept was conceived by Eric Fossum, the Founder of this series of workshop, at the very first workshop in 1986 (named “IEEE Workshop on CCDs”), and has been realized and enhanced by the three former Presidents of IISS, Eric, Nobukazu Teranishi and Albert. This will be kept in the future workshop.

With the retirement of Eric, Nobu and Albert from the Board, the Board of Directors has invited three very strong image sensor technologists to the Board, namely, Boyd Fowler (OmniVision, USA), Robert Henderson (University of Edinburgh, UK) and Yusuke Oike (Sony, Japan). Please join me in welcoming them to the Board of IISS.

Finally, I would like to express my sincere gratitude to the three Co-Founders/former Presidents of IISS for their enthusiasm to “bring the imaging community to a higher level”. The IISS Directors will inherit this spirit. I hope Eric, Nobu and Albert can continue giving us any suggestions and insights as members of the newly established Governance Advisory Committee.

Best regards,

Junichi Nakamura
President of IISS
CTO of Brillnics Inc.

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STA Founder Dick Bredthauer Passed Away

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As posted in CCD-World mailing list, Semiconductor Technology Associates, Inc. founder Dick Bredthauer passed away.

Dr. Richard Bredthauer was involved in the design and fabrication of a large variety of scientific imaging CCDs from 1975 to 2016. He managed CCD development at Lockheed Martin, Loral, Ford Aerospace, and Rockwell.  He designed the original 9k x 9k imager while at Lockheed Martin, and his CCDs included notable instruments such as Hubble’s WFPC2, all of the visible imagers on Cassini, the stereo camera in Mars Pathfinder, and most recently the lightning imager for GOES-R. In 2016, his son Dr. Greg Bredthauer became president of STA and took over daily operations.


Thanks to GM for the pointer!

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Open Letter from Albert Theuwissen

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OPEN LETTER TO THE INTERNATIONAL IMAGE SENSOR SOCIETY.

Dear all,

Yesterday (Thursday 23/09/2021) the International Image Sensor Workshop 2021 came to an end. Immediately after the workshop closure we had a meeting with the Board of Directors of the International Image Sensor Society. In that meeting Eric Fossum, Nobukazu Teranishi and Albert Theuwissen (the three co-founders of IISS) announced their retirement from the Board. The retired members will set up a Government Advisory Committee (without any voting rights anymore), but they will be no longer directly involved in the organization of the IISW.

If I speak for myself : it was a great honour and even a greater pleasure for me to work for and to work with Eric, Nobu and all other Board members. This is a group of people that constantly tries to bring the imaging community to a higher level. Imaging has given and still gives me a lot of joy, motivation, strength in my professional live and last but not least also in my private life it brought us a nice piece of bread on our table. So for me it was very normal to give something back to our imaging community by means of my activities in IISS.

Over the years I learned a lot from my involvement in IISS, about how to work with various cultures, how to work with world-level top-experts in the field and how to work with individuals that all have a strong character (otherwise they would not have climbed up to the level where they now are). And very often the cooperation with my Board colleagues put myself in front of the mirror which led to some self-reflection.

I wish IISS and all Board members all the best in the coming future. It is now up to the next generation to manage IISS and I am more than confident that the next generation will succeed. But if needed, they always can count on me for advice.

Best regards from Belgium.

Albert, former president of IISS.

24/09/2021.

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IDQ Photon Sensors – from Mobile Phones to Space Launchers

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Física Exactas UBA publishes a presentation "Quantum technologies for mobile phones and space launchers" by Félix Bussières ID Quantique SA, Switzerland:

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Galaxycore Evaluates its 32MP Sensor Engineering Samples

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DailyEconomicNews: In line with its intentions to penetrate mid- to high-end CIS market, Galaxycore announces at the investor interactive platform on September 24: "Dear investors, hello. The company's high-end pixel research and development is progressing smoothly, and the CMOS image sensor with 32 million pixels and above has entered the stage of internal evaluation of engineering samples. Thank you for your attention!"

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Smartsens Announces Three BSI Global Shutter Sensors

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CoreIntelligenceSmartSens launches three new SmartGS-2 series image sensors-SC350HGS / SC650HGS / SC950HGS with 3MP to 9MP resolutions aimed to industrial cameras for intelligent applications. the QE of the three products reaches 90% at 520nm.

Samples of the three sensors are available now, and mass production is expected to start in Q4 2021.

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Excess Noise Reduction in APDs

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IEEE Journal of Selected Topics in Quantum Electronics publishes a paper "Evolution of Low-Noise Avalanche Photodetectors" by Joe C. Campbell from University of Virginia.

"This paper reviews materials and structural approaches that have been developed to reduce the excess noise in avalanche photodiodes and increase the gain-bandwidth product."

"It has been shown for a wide range of materials including InP, GaAs, In1-xAlxAs, Si, AlxGa1-xAs, SiC, GaP, and GaInP that reducing the thickness of the multiplication layer, usually to submicron dimensions, results in lower excess noise. This is contrary to expectations based on the local-field model and points to its inadequacy when the non-local nature of impact ionization becomes significant."

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Assorted Videos: Trinamix, Vision Research, Immervision, Teledyne-e2v, Cepton

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Trinamix expands its multispectral 3D imaging applications with smartphone behind OLED face recognition and driver monitoring:


Vision Research promotes its fast BSI sensors:


Immervision publishes its SPIE Optical Systems Design International Symposium presentation on freeform lenses in consumer applications:


Teledyne-e2v promotes its linescan sensors:


Autosens publishes interviews with Cepton:

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SPADs in Globalfoundries’ 55nm BCD Process

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It appears that Globalfoundries becomes a viable option for SPAD-based sensors. At least, three Globalfoundries' employees are co-authors of the following paper:

IEEE Journal of Selected Topics in Quantum Electronics publishes a paper "Engineering Breakdown Probability Profile for PDP and DCR Optimization in a SPAD Fabricated in a Standard 55nm BCD Process" by Francesco Gramuglia, Pouyan Keshavarzian, Ekin Kizilkan, Claudio Bruschini, Shyue Seng Tan, Michelle Tng, Elgin Quek, Myung-Jae Lee, and Edoardo Charbon from EPFL (Switzerland), Globalfoundries (Singapore), KIST (Korea).

"In this paper, we present SPADs based on DPW/BNW junctions in a standard Bipolar-CMOS-DMOS (BCD) technology with results comparable to the state-of-the-art in terms of sensitivity and noise in a deep sub-micron process. Technology CAD (TCAD) simulations demonstrate the improved PDP with the simple addition of a single existing implant, which allows for an engineered performance without modifications to the process. The result is an 8.8 μm diameter SPAD exhibiting ~2.6 cps/μm^2 DCR at 20°C with 7 V excess bias. The improved structure obtains a PDP of 62 % and ~4.2 % at 530 nm and 940 nm, respectively. Afterpulsing probability is ~0.97 % and the timing response is 52 ps FWHM when measured with integrated passive quench/active recharge circuitry at 3V excess bias."

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PAM4 in Image Sensor-based Communication

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PAM4 signalling has been adopted in many recent high speed interfaces, such as PCIe 6.0, MIPI A-PHY, Auto-Serdes, and many others. In the following OSA paper, PAM4 is being proposed for image sensor based communication:

"PAM4 rolling-shutter demodulation using a pixel-per-symbol labeling neural network for optical camera communications" by Yun-Shen Lin, Chi-Wai Chow, Yang Liu, Yun-Han Chang, Kun-Hsien Lin, Yi-Chang Wang, and Yi-Yuan Chen from National Yang Ming Chiao Tung University, National Chiao Tung University, and Industrial Technology Research Institute, Taiwan, with Philips Hong Kong.

"The typical optical camera communication (OCC) modulation scheme is based on binary intensity modulation. To increase the transmission data rate, multi-level modulation format is highly desirable. In this work, we bring forward and demonstrate a rolling shutter 4-level pulse amplitude modulation (PAM4) demodulation scheme for OCC systems using pixel-per-symbol labeling neural network (PPSL-NN) for the first time up to the authors’ knowledge. A bit-rate distance product of 28.8 kbit/s • m per color is achieved. The proposed scheme is to calculate and re-sample the pixel-per-symbol (PPS) to make sure the same number of pixels in each PAM4 symbol is corresponding to a label for the neural network. Experiment results reveal that the proposed scheme can efficiently demodulate high speed PAM4 signal in the rolling shutter OCC pattern."

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PAM4 in Image Sensor-based Communication

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PAM4 signalling has been adopted in many recent high speed interfaces, such as PCIe 6.0, MIPI A-PHY, Auto-Serdes, and many others. In the following OSA paper, PAM4 is being proposed for image sensor based communication:

"PAM4 rolling-shutter demodulation using a pixel-per-symbol labeling neural network for optical camera communications" by Yun-Shen Lin, Chi-Wai Chow, Yang Liu, Yun-Han Chang, Kun-Hsien Lin, Yi-Chang Wang, and Yi-Yuan Chen from National Yang Ming Chiao Tung University, National Chiao Tung University, and Industrial Technology Research Institute, Taiwan, with Philips Hong Kong.

"The typical optical camera communication (OCC) modulati