A (Wrong) Attempt to Improve Imaging

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University of Glasgow and University of Edinburgh publish a paper "Noise characteristics with CMOS sensor array scaling" by Claudio Accarino, Valerio F. Annese, Boon Chong Cheah, Mohammed A. Al-Rawhania, Yash D. Shaha, James Beeley, Christos Giagkoulovitis, Srinjoy Mitra, David R.S.Cumming. The paper compares SNR of a large single sensor with an array of smaller sensors having the same combined area. The conclusion looks fairly strange:

"In this paper we have compared the noise performance of a sensor system made using a single large sensor, versus the noise achieved when averaging the signal from an array of small independent sensors. Whilst the SNR of a smaller physical sensor is typically less than that of a single larger sensor, the properties of uncorrelated Gaussian noise are such that the overall performance of an array of small sensors is significantly better when the signal is averaged.

This elegant result suggests that there is merit in using sensor arrays, such as those that can be implemented in CMOS, even if the application only calls for a single measurement. Given the relatively low cost of CMOS and the wide availability of CMOS sensors, it is therefore beneficial to use arrays in any application where low noise or multiple parallel sensing are a priority."

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More about Sony-TSMC Fab in Japan

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NikkeiAsia, TaiwanNews: The planned TSMC fab in Kumamoto, on the island of Kyushu in western Japan, would go forward in two phases, according to Nikkei Asia. The board of TSMC is expected to decide on the investment in the current quarter. 

The plant is expected to start operation in 2023. Once both phases are complete, the new fab will produce about 40,000 wafers per month in 28nm process. The fab is expected to be mainly used to make image sensors for Sony, TSMC's largest Japanese customer. Nikkei has been told that TSMC is open to a collaboration that would give Sony more say in operating the plant and negotiating with the Japanese government.

ElectronicsWeekly presents another view on Sony-TSMC fab project: "Sony has a $7 billion+  revenue business in image sensors which makes the  $2.5 billion cost of such a fab a reasonable proposition."

Bloomberg reports that Japan intends to revive its domestic chip design and production industry and reverse the current downward R&D trend:

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Image Sensors at In-Person Autosens Brussels

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Austosens Brussels is to be held in in-person (!!!) on September 15-16. The agenda has been published and includes a lot of image sensor related stuff:
  • Sensor technology and safety features to address the challenging needs for reliable and robust sensing/viewing systems
    Yuichi Motohasi, Automotive Image Sensor Applications Engineer, Sony
    In this presentation, the key characteristics of the image sensors will be presented. Also, the state-of-the-art of functional safety and cybersecurity requirement to achieve reliable and robust sensing/viewing system will be discussed.
  • Beyond the Visible: SWIR Enhanced Gated Depth Imaging
    Ziv Livne, CBO, TriEye
    We will introduce a new and exciting SWIR-based sensor modality which provides HD imaging and ranging information in all conditions (“SEDAR”). How it works, its main benefits, and why it is the future. We will then show experimental evidence of SEDAR superiority over sensors of other wavelengths. These include recordings in difficult conditions such as nighttime, fog, glare, dust, and more. Also, show depth map field results.
  • Automotive 2.1 µm High Dynamic Range Image Sensors
    Sergey Velichko, Sr. Manager, ASD Technology and Product Strategy, ON Semiconductor
    This work describes a first generation 8.3 Mega-Pixel (MP) 2.1 µm dual conversion gain (DCG) pixel image sensor developed and released to the market. The sensor has high dynamic range (HDR) up to 140 dB and cinematographic image quality. Non-bayer color filter arrays improve low light performance significantly for front and surround Advanced Driver Assistance System (ADAS) cameras. This enables transitioning from level 2 to level 3 autonomous driving (AD) and fulfilling challenging Euro NCAP requirements.
  • High Dynamic Range Backside Illuminated Voltage Mode Global Shutter CIS for in Cabin Monitoring
    Boyd Fowler, CTO, OmniVision Technologies
    Although global shutter operation is required to minimize motion artifacts in in-cabin monitoring, it forces large changes in the CIS architecture. Most global shutter CMOS image sensors available in the market today have larger pixels and lower dynamic range than rolling shutter image sensors. This adversely impacts their size/cost and performance under different lighting conditions. In this paper we describe the architecture and operation of backside illuminated voltage mode global shutter pixels. We also describe how the dynamic range of these pixels can be extended using either multiple integration times or LOFIC techniques. In addition, how backside illuminated voltage mode global shutter pixels can be scaled, enabling smaller more cost effective camera solutions and results from recent backside illuminated voltage mode global shutter CIS will be presented.
  • Chip-scale LiDAR for affordability and manufacturability
    Dongjae Shin, Principal researcher, Samsung Advanced Institute of Technology
    In this presentation, we introduce a chip-scale solid-state LiDAR technology promising the cost and manufacturability advantages inherited from the silicon technology. The challenge of the light source integration has been overcome by the III/V-on-silicon technology that has just emerged in the silicon industry. With the III/V-on-silicon chip in the core, initial LiDAR module performance, performance scalability, and application status are presented for the first time. Cost-volume analysis and eco-system implications are also discussed.
  • A novel scoring methodology and tool for assessing LiDAR performance
    Dima Sosnovsky, Principal System Architect, Huawei
    This presentation presents a tool, which summarizes the most crucial characteristics and provides a common ground to compare each solution's pros and cons, by drawing a scoring envelope based on 8 major parameters of the LiDAR system, representing its performance, suitability to an automotive application, and business advantages.

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Assorted Videos: Omnivision, Aeye, Qualcomm, MIPI

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Omnivision continues its series of video interviews with its CTO Boyd Fowler. This part is about LED flicker mitigation:


Aeye tells a (marketing) story behind its inception:


Qualcomm publishes a panel with its customers adopting its AI camera technology:


MIPI Alliance publishes a couple of presentation about the future imaging needs needs and A-PHY standard (link1 and link2):

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Canon RF 400mm f2.8L RF 600mm f4L review

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The RF 400mm f2.8 and RF 600mm f4 are the two largest and most expensive lenses for Canon’s full-frame mirrorless system to date. Unashamedly aimed at pro sports and wildlife photographers, or very well-heeled enthusiasts, they represent Canon at the top of their game. Find out why Canon now believes EOS R is ready for anything in my review of both lenses.…

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Luminar Acquires InGaAs Sensor Manufacturer

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BusinessWire: LiDAR maker Luminar is acquiring its exclusive InGaAs chip design partner and manufacturer, OptoGration Inc., securing supply chain as Luminar scales Iris LiDAR into series production. The acquisition secures a key part of Luminar’s supply chain and enables deeper integration with its ROIC design subsidiary Black Forest Engineering (BFE), which Luminar acquired in 2017. Luminar is combining the latest technology from Optogration and BFE to power its new fifth-generation lidar chip in Iris as the company prepares for series production of its product and technology.

For the past five years, Luminar has been closely collaborating with OptoGration, developing, iterating, and perfecting the specialized InGaAs photodetector technology that is required for 1550nm lidar. OptoGration has capacity to produce approximately one million InGaAs chips with Luminar’s design each year at their specialized fabrication facility in Wilmington, Mass, with the opportunity to expand to up to ten million units per year capacity.

Acquiring OptoGration is the culmination of a deep, half-decade long technology partnership that has dramatically advanced the proprietary lidar chips that power the industry-leading performance of our newest Iris sensor,” said Jason Eichenholz, Co-founder and CTO at Luminar. “The OptoGration team is unique in their ability to deliver photodetectors with the performance and quality that achieve our increasingly demanding requirements. Chip-level innovation and integration has been key to unlocking our performance and driving the substantial cost reductions we’ve achieved.

Luminar combines its InGaAs photodetector chips from Optogration with silicon ASICs, produced by BFE, to create its lidar receiver and processing chip, which is said to be the most sensitive, highest DR InGaAs receiver of its kind in the world.

OptoGration’s founders are joining Luminar as part of this transaction and will continue to lead the business with support from Luminar.

Luminar is a great home for OptoGration because we share a vision for transforming automotive safety and autonomy with lidar,” said William Waters, President of OptoGration. “We also share a commitment to continuous innovation and have an incredible track record of combining our technologies to increase performance and lower cost. Together we can go even faster to scale and realize Luminar’s vision.

The OptoGration acquisition is expected to close in the third quarter. The transaction price was not disclosed but does not represent a material impact to Luminar’s cash position or share count.

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Optical Neural Processor Integrated onto Image Sensor

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Metasurface-based optical CNNs start to be a hot topic for papers and presentations, for example, here and here. Another metasurface CNN example by Aydogan Ozcan from UCLA is shown in the video below:



A recent Arxiv.org paper "Metasurface-Enabled On-Chip Multiplexed Diffractive Neural Networks in the Visible" by Xuhao Luo, Yueqiang Hu, Xin Li, Xiangnian Ou, Jiajie Lai, Na Liu, and Huigao Duan from Hunan University (China), University of Stuttgart (Germany), and Max Planck Institute for Solid State Research (Germany) presents a fairly complete system integrated on an image sensor:

"Replacing electrons with photons is a compelling route towards light-speed, highly parallel, and low-power artificial intelligence computing. Recently, all-optical diffractive neural deep neural networks have been demonstrated. However, the existing architectures often comprise bulky components and, most critically, they cannot mimic the human brain for multitasking. Here, we demonstrate a multi-skilled diffractive neural network based on a metasurface device, which can perform on-chip multi-channel sensing and multitasking at the speed of light in the visible. The metasurface is integrated with a complementary metal oxide semiconductor imaging sensor. Polarization multiplexing scheme of the subwavelength nanostructures are applied to construct a multi-channel classifier framework for simultaneous recognition of digital and fashionable items. The areal density of the artificial neurons can reach up to 6.25x106/mm2 multiplied by the number of channels. Our platform provides an integrated solution with all-optical on-chip sensing and computing for applications in machine vision, autonomous driving, and precision medicine."

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Event-Based Camera Tutorial

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Tobi Delbruck delivers an excellent tutorial on event-based cameras prepared for the 2020 Telluride Neuromorphic workshop and ESSCIRC. The pdf file with slides is available here.

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Graphene and Other 2D Materials Sensors Review

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Nature publishes a review paper "Silicon/2D-material photodetectors: from near-infrared to mid-infrared" by Chaoyue Liu, Jingshu Guo, Laiwen Yu, Jiang Li, Ming Zhang, Huan Li, Yaocheng Shi & Daoxin Dai from Zhejiang University, China.

"Two-dimensional materials (2DMs) have been used widely in constructing photodetectors (PDs) because of their advantages in flexible integration and ultrabroad operation wavelength range. Specifically, 2DM PDs on silicon have attracted much attention because silicon microelectronics and silicon photonics have been developed successfully for many applications. 2DM PDs meet the imperious demand of silicon photonics on low-cost, high-performance, and broadband photodetection. In this work, a review is given for the recent progresses of Si/2DM PDs working in the wavelength band from near-infrared to mid-infrared, which are attractive for many applications. The operation mechanisms and the device configurations are summarized in the first part. The waveguide-integrated PDs and the surface-illuminated PDs are then reviewed in details, respectively. The discussion and outlook for 2DM PDs on silicon are finally given."

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Assorted Videos: ST, Leti, Omnivision, Innoviz, P2020, University of Wisconsin-Madison

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ST presents one more use case for its ToF proximity sensors:


CEA-Leti publishes a video about its perovskite-based X-Ray imagers:


Omnivision publishes its CTO Boyd Fowler's interview on automotive in-cabin monitoring: "Automotive in-cabin monitoring is on the rise – not just for drivers, but for passengers as well. Why? Hear from our FutureInSight chief technology officer, Boyd Fowler, in his one-on-one with AutoSens researcher Francis Nedvidek."


Innoviz CEO Omer Keilaf presents his company's LiDAR technology:


American Traffic Safety Services Association (ATSSA) publishes an IEEE P2020 presentation on LED flicker by Brian Deegan from Valeo, team leader of the IEEE P2020 Automotive Image Quality Working Group, LED Flicker Subgroup, and Robin Jenkin, Principal Image Quality Engineer at NVIDIA.


University of Wisconsin-Madison publishes an 1-hour long presentation by Mohit Gupta on single-photon imaging:

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Smartsens News: Star Light Sensor Series, Mobile Market Debut, AI Family Improvements

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Smartsens unveils SC850SL, a 4K-resolution image sensor in a new Star Light (SL) Series product lineup for high-end night vision cameras.

The 8MP SC850SL features stack BSI and rolling shutter process and offers 15% sensitivity improvement over "its type on the market." Also, compared with similar products in the industry, the SC850SL leverages SmartSens’ ultra-low noise reading circuit design to reduce the RN and FPN by 69% and 59% respectively. Additionally, with SmartSens’ 2nd Gen NIR+ Technology, the QE of the SC850SL is boosted up by 55% at 850 nm and 80% at 940 nm in comparison with the previous generation NIR+ technology, respectively. Furthermore, the sensor supports both the Staggered HDR with up to 100 dB dynamic range and PixGain HDR without HDR combination artifacts. Additional features include enhanced SNR and higher image quality under high temperature conditions.

Currently, SC850SL is sampling and is expected to begin mass production in September 2021.


Smartsens also enters low-end smartphone image sensor sensor market with 2MP products. The SC201CS comes in a 1/5.1-inch optical format at a pixel size of 1.75 μm, in two versions—SC201CS-mono and SC201-color. The SC201CS FPN and the read noise are as low as 0.43e- rms and 1.5e- rms respectively. Also, the SC201CS delivers 35e-/s dark current and 87 ppm white pixel at 60°C and thus adapts well under high temperatures.

The company intends to expand its mobile phone image sensor lineup in future.


Smartsens announces upgrades its Advanced Imaging (AI) image sensor family: the SC230AI, SC430AI, and its third 3K-resolution CIS SC530AI in the AI Series to include performance upgrade technology SmartClarity-2. These three products target an assortment of 2MP to 5MP surveillance applications.

SmartClarity-2 leverages SFCPixel technology, PixGain technology, NIR+ technology and low noise reading circuit design to offer increased sensitivity and reduce the readout noise level by 21%. SmartSens NIR+ technology boosts QE of SC230AI to 36% at 850nm and 21% at 940nm.

SmartClarity-2 provides up to 50% higher FWC compared with the mainstream sensors of its type. Each sensor is developed in a package that is Pin2Pin compatible with the previous generation and makes it an easy upgrade for customers.

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Sony’s View on Stacked CIS Evolution – English Version

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M. kindly sent me an English translation of Sony paper on stacked sensor evolution. The pdf version of the translated paper is available here.

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MagikEye Announces Invertible Light Technology Development Kit

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BusinessWire: Structured light 3D sensing company Magik Eye announces its latest Invertible Light Technology (ILT) development kits. “With its high speed, low latency and superior surface visibility at near ranges, developers will now have a great new tool for object detection, guidance and gesture recognition. We are excited that developers can now explore optimal use cases for applications such as robotics that are truly effective for near-range applications and easy to use,” said Takeo Miyazawa, Founder & CEO of MagikEye.

The ILT Development Kit (DK-ILT001) combines a simple IR laser projector with a standard CMOS image sensor to achieve 3D imaging at more than 600 fps, or up to 120 FPS with a simple Raspberry Pi host. With ILT’s proprietary algorithm, DK-ILT001 is able to accurately measure the position and shape of a target with ultra-low processing overhead.

DK-ILT001 will be released as an entry-level module for easy evaluation of fast, accurate and responsive 3D sensing technology as well as for enable new software applications development.


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Sunny View on Smartphone Camera Trends

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Sunny Optical publishes its Investor Day Presentation talking about smartphone camera trends:

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Plasmonic Diffracting DTI Enhances Pixel Response at 940nm by 5.3x

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OSA publishes Shizuoka University and University of Hyogo paper "Near-infrared sensitivity improvement by plasmonic diffraction for a silicon image sensor with deep trench isolation filled with highly reflective metal" by Atsushi Ono, Kazuma Hashimoto, and Nobukazu Teranishi.

"We propose a plasmonic diffraction structure combined with deep trench isolation (DTI) filled with highly reflective metal to enhance the near-infrared (NIR) sensitivity of image sensors. The plasmonic diffraction structure has a silver grating on the light-illuminated surface of a typical silicon backside-illuminated CMOS image sensor. The structural parameters of the silver grating were investigated through simulations, and the mechanism of the NIR sensitivity enhancement was clarified. Under the quasi-resonant conditions of surface plasmon polaritons, incident NIR light effectively diffracted as a propagating light to the sensor silicon layer. The diffracted light travelled back and forth between the DTIs. The effective propagation length in silicon was extended to six times by silver-filled DTI, resulting in approximately five times improvement of the 3-µm-thick silicon absorption at a wavelength of 940 nm."

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Quanergy Claims to Achieve Major Improvement in its OPA Scanning LiDAR Range

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Quanergy SPAC merge presentation shows a dramatic improvement of its Optical Phase Array (OPA) LiDAR performance over the course of the last year. At the same time, the company admits that its previous designs had a very short range:

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Samsung Unveils CornerPixel for Automotive HDR-LFM Applications

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BusinessWireSamsung introduces ISOCELL Auto S5K4AC, an automotive image sensor that offers 120dB HDR and LED flicker mitigation (LFM) especially for surround-view monitors (SVM) or rear-view cameras (RVC) in high-definition resolution (1280 x 960). The new sensor is said to be Samsung’s first imaging solution optimized for automotive applications.

The new ISOCELL Auto 4AC combines Samsung’s innovative and market-proven image sensor technologies with a unique CornerPixel solution for advanced HDR and LFM capabilities, offering exceptional viewing experiences regardless of lighting conditions,” said Duckhyun Chang, EVP of sensor business at Samsung. “Starting with the ISOCELL Auto 4AC, we plan to expand our automotive sensor lineup to areas such as camera monitor systems (CMS), autonomous driving and in-cabin monitoring.

The CornerPixel technology features a specialized pixel structure that mitigates LED flicker at over 90Hz. Within a single pixel area, it embeds two photodiodes, one 3.0µm pixel for viewing low light images, and a 1.0µm pixel placed at the corner of the big pixel for brighter environments. With two photodiodes capturing images in different exposures simultaneously, the sensor offers up to 120dB HDR with minimal motion blur.

To minimize LED flickering, the smaller photodiode’s exposure time can be extended, preventing pulsing LED light from being displayed as flickering on the camera screen.

The Samsung ISOCELL Auto 4AC comes in a 1/3.7-inch optical format with 1.2MP resolution and an ISP embedded within the sensor. The 4AC meets AEC-Q100 Grade 2 qualifications, including a -40°C to 125°C operating temperature range, and is currently in mass production.


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Sony’s View on Stacked CIS Evolution

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IEICE ESS Fundamentals Review publishes Sony paper "Evolving Image Sensor Architecture through Stacking Devices" by Yusuke OIKE. Unfortunately, there is no English version available and the pdf is protected from copying the text for an on-line translation.

"The evolution of CMOS image sensors and the prospects utilizing advanced imaging technologies promise to improve our quality of life. CMOS image sensors now dominate the market of digital cameras with the advent of parallel ADCs and back-illuminated technology. Moreover stacked CMOS image sensors continue to enhance functionality and user experience in mobile devices. We introduce the evolution of image sensor architecture for accelerating drastic performance improvements and for integrating edge computing connected to the sensor layer through stacking technologies. Furthermore, the fine pitch connection between the pixel and logic layers makes pixel parallel circuit architecture practical for the next stage of evolution."

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Actlight Continues Work on its Single Photon Sensitivity Technology for "Leading Sensor Company"

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PRNewswire: ActLight has signed the second service agreement based on its Single Photon Sensitivity technology with a leading company in the image sensor market.

'This agreement is the natural continuation of the customer project started in 2020 and successfully completed earlier this year. We are very pleased to continue the joint activities with a market player of this caliber and to add value to their technology roadmap,' said Serguei Okhonin, Co-founder and CEO at ActLight. 'The adoption of Single Photon Avalanche Diode (SPAD) array in 3D sensing applications is today a growing reality and the markets are demanding performance improvements (e.g. pixel scaling, higher QE at near IR and higher performance/costs ratio). ActLight technology is developed to address these specific needs and, thanks to its unique features such as tunable sensitivity, low voltage and digital read-out, is perfectly suited to become the sensing solution of reference for 3D systems used in smartphones, cars and other mainstream products.`

EPFL publishes a PhD thesis by Denis Sallin "A low-voltage CMOS-compatible time-domain photodetector, device & front end electronics" explaining Actlight's device operation:

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Huawei AV Unit President: Cars will Never Be Fully Autonomous

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Reuters: "Our team's goal is to reach true driverless passenger cars in 2025," Wang Jun, senior executive at Huawei's smart vehicle unit, told at 2021 World Artificial Intelligence Conference.

WorldStockMarket: "The L5 level of autonomous driving will never be reached. Mainly because the definition of the L5 level of autonomous driving covers all scenarios anytime, anywhere and in any weather, no human driver can handle it, so neither can a car be able to handle it," said Su Qing, President and Chief Architect of Huawei's ADS Intelligent Driving Solutions at the same conference ended last week in Shanghai.

Currently, Huawei's ADS autopilot system is equipped with a total of 34 sensors: 3 LiDARs, 13 cameras, 6 mm-wave radars, and 12 ultrasonic sensors.

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AT&S Makes Miniature Package for AMS

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AT&S shows its miniature package for AMS Naneye:

"The image sensor not only creates sharp images due to its 100,000-pixel resolution, but it also has low power consumption thanks to our smart connection architecture,” says Markus Maier, Global Account Manager at AT&S. AT&S developed the PCB for the sensor, while the sensor itself was built by ams OSRAM.

The interconnect design was implemented using ECP (Embedded Component Packaging) technology. ECP enables both active and passive components to be integrated into laminate-based substrates, i.e. in a minimum of space. “Instead of placing the components on the PCB, they are integrated into the PCB. They ‘disappear’ inside the PCB,” Maier says.

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Bankrupt CIS Fab is Up for Sale

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Yangtze Evening News, OFweek, EET-China: As has been reported earlier, Huaian Imaging Device Manufacturer (HIDM) went bankrupt scrapping a total investment of 45 billion yuan and ambitious plans to produce 240,000 12-inch CIS wafers per year.

Now, the entire assets of HIDM will be auctioned. The starting price is 1.66 billion yuan. According to the auction list, the overall assets of HIDM in this auction include 19 buildings such as production and office buildings, as well as 171,265.90 sq.m of industrial land, as well as machinery and equipment, electronic equipment, vehicles, raw materials, and other items.

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Pixart Explains Optical Tracking Sensors Operation

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Pixart publishes a video explaining laser and LED-based optical tracking sensors principles:

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Sony AI Sensors in Rome

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Sony publishes a