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The annual Image Sensors Europe 2024 will be held in London on March 20-21, 2024.

Link: https://www.image-sensors.com/image-sensors-europe/2020-speakers?EventId=4047&page=2

Lindsay Grant - OmniVision Technology
Federico Canini - Datalogic
Nasim Sahraei - Edgehog Advanced Technologies Inc.
Pawel Latawiec - Metalenz
Emilie Huss - STMicroelectronics
Nicolas Roux - STMicroelectronics
Abhinav Agarwal - Forza Silicon (Ametek Inc.)
Dr Claudio Jakobson - SCD
Jan Bogaerts - Gpixel
Christian Mourad - VoxelSensors
Carl Philipp Koppen - pmdtechnologies AG
Dr Artem Shulga - QDI systems
Albert Theuwissen - Harvest Imaging
Anthony Huggett - onsemi
Matthias Schaffland - Sensor to Image GmbH
Dr. Kazuhiro Morimoto - Canon Inc.
Svorad Štolc - Photoneo
Florian Domengie - Yole Intelligence
Adi Xhakoni - ams-osram

CIS Masterclass

Dr. Albert Theuwissen will give a Masterclass on "Recent Developments in the CIS World over the last 12 months" which will cover the following topics: Numbers and Market Trends, High Dynamic Range, Global Shutter, Low Noise, Colour Filter News, Phase Detective Auto-Focus Pixels, New materials, Beyond Silicon in the Near-IR, Event-Based Imagers

About Image Sensors Europe

Image Sensors Europe established and held its first conference in 2007, and has since grown to be the go-to annual image sensors technical and business conference. Each year this ever evolving market continuously prompts new and exciting opportunities for the entire supply chain.

This esteemed event provides a platform for over 250 representatives from across the digital imaging supply chain to engage in high calibre discussions and face-to-face networking opportunities with key industry experts and colleagues.

2024 Key Themes:

• Image sensor market challenges and opportunities: CMOS image sensor industry analysis and 2018-2028 forecastsTechnology focus: SPAD, SWIR, triple-stack sensors, metaoptics, event-based imaging and 3D perception
• Image sensor application updates: industrial, automotive, biomedical, surveillance & security, consumer
• Global foundry updates: Manufacturing capacity, chip stacking timelines, realistic improvements and opportunities
• Data processing & compression - high speed data handling and transfer

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Eliminating Stray Light Image Artifacts via Invisible Image Sensor Coverglass

High-quality images are critical for machine vision applications like autonomous vehicles, surveillance systems, and industrial automation. However, lens flare caused by internal light reflections can significantly degrade image quality. This “ghosting” effect manifests as spots, starbursts, and other artifacts that obscure objects and details.

Traditional anti-reflective coatings help reduce flare by creating destructive interference to cancel out light reflections. But they fall short at wider angles where reflections still occur. Stray light hitting image sensors causes flares. These artifacts interfere with image clarity and create glare, which decreases the signal-to-noise ratio, especially in environments with high dynamic range.

Omnidirectional Anti-Reflection CMOS Coverglass
Edgehog’s Omnidirectional Anti-Reflection (OAR) nanotexturing technology takes a fundamentally different approach to eliminating reflections. Instead of coatings, OAR uses nano-scale surface textures that create a gradual transition in refractive index from air to glass. Edgehog’s texturing allows light to transmit through the surface without internal reflections, regardless of angle.

• OAR nanotexturing provides exceptional advantages:Omnidirectional performance - Anti-reflection at angles up to 70 degrees
• Broad spectrum - Works across all wavelengths from UV to IRThermal stability - No risk of delamination like traditional coatings
• Anti-fogging technology spreads water droplets on the surface, reducing fogging

By treating the image sensor cover glass with OAR nanotexturing, Edgehog enables flare-free imaging under any lighting condition. Edgehog delivers crisper images and videos with enhanced contrast, sharpness, and color accuracy.

Case Study
Edgehog recently showcased the impact of its technology by retrofitting a camera’s stock CMOS cover glass with an OAR-treated replacement. Simulations showed OAR’s superiority in mitigating flare irradiance compared to the original glass. Real-world testing also exhibited significant flare reduction in challenging high-glare environments.  

Images taken from two identical camera models showing a significant reduction in lens flare in
the bottom left of the images. The image on the left (A) is taken using an off-the-shelf FLIR Blackfly
S camera where the sensor coverglass utilizes conventional anti-reflection coatings. The right
image (B) is taken using an identical camera with the sensor coverglass replaced with Edgehog
coverglass, as shown in the schematic above.

Photos were captured simultaneously in an indoor garage. (A) off-the-shelf FLIR Blackfly S
camera and (B) identical camera setup with Edgehog-enhanced sensor coverglass.

Photos captured simultaneously outdoors on a sunny day. (A) off-the-shelf FLIR Blackfly S
camera and (B) identical camera setup with Edgehog-enhanced sensor coverglass.

Edgehog’s Seeking Manufacturing Partners
Overall, Edgehog’s nanotextured anti-reflection technology represents a revolutionary leap forward for imaging components. OAR enables reliable, high-performance vision capabilities for autonomous systems by stopping flare at the source. We are looking for manufacturing partners to scale up our manufacturing.

To learn more about eliminating lens flare with omnidirectional anti-reflection, download Edgehog’s full white paper today or email us to discover how nanotexturing can enhance image quality and enable the next generation of machine vision.

Download Edgehog’s whitepaper - https://www.edgehogtech.com/machine-vision-whitepaper

Visit Edgehog’s Website - www.edgehogtech.com

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Samsung press release: https://semiconductor.samsung.com/emea/news-events/news/samsung-unveils-two-new-isocell-vizion-sensors-tailored-for-robotics-and-xr-applications/

Samsung Unveils Two New ISOCELL Vizion Sensors Tailored for Robotics and XR Applications
The ISOCELL Vizion 63D, a time-of-flight sensor, captures high-resolution 3D images with exceptional detail
The ISOCELL Vizion 931, a global shutter sensor, captures dynamic moments with clarity and precision 

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D, and a global shutter sensor, the ISOCELL Vizion 931. First introduced in 2020, Samsung’s ISOCELL Vizion lineup includes ToF and global shutter sensors specifically designed to offer visual capabilities across an extensive range of next-generation mobile, commercial and industrial use cases.  

“Engineered with state-of-the-art sensor technologies, Samsung’s ISOCELL Vizion 63D and ISOCELL Vizion 931 will be essential in facilitating machine vision for future high-tech applications like robotics and extended reality (XR),” said Haechang Lee, Executive Vice President of the Next Generation Sensor Development Team at Samsung Electronics. “Leveraging our rich history in technological innovation, we are committed to driving the rapidly expanding image sensor market forward.”

ISOCELL Vizion 63D: Tailored for capturing high-resolution 3D images with exceptional detail

Similar to how bats use echolocation to navigate in the dark, ToF sensors measure distance and depth by calculating the time it takes the emitted light to travel to and from an object. 

Particularly, Samsung’s ISOCELL Vizion 63D is an indirect ToF (iToF) sensor that measures the phase shift between emitted and reflected light to sense its surroundings in three dimensions. With exceptional accuracy and clarity, the Vizion 63D is ideal for service and industrial robots as well as XR devices and facial authentication where high-resolution and precise depth measuring are crucial.

The ISOCELL Vizion 63D sensor is the industry’s first iToF sensor with an integrated depth-sensing hardware image signal processor (ISP). With this innovative one-chip design, it can precisely capture 3D depth information without the help of another chip, enabling up to a 40% reduction in system power consumption compared to the previous ISOCELL Vizion 33D product. The sensor can also process images at up to 60 frames per second in QVGA resolution (320x240), which is a high-demand display resolution used in commercial and industrial markets. 

Based on the industry’s smallest 3.5㎛ pixel size in iToF sensors, the ISOCELL Vizion 63D achieves high Video Graphics Array (VGA) resolution (640x480) within a 1/6.4” optical format, making it an ideal fit for compact, on-the-go devices.

Thanks to backside scattering technology (BST) that enhances light absorption, the Vizion 63D sensor boasts the highest level of quantum efficiency in the industry, reaching 38% at an infrared light wavelength of 940 nanometers (nm). This enables enhanced light sensitivity and reduced noise, resulting in sharper image quality with minimal motion blur.

Moreover, the ISOCELL Vizion 63D supports both flood (high-resolution at short-range) and spot (long-range) lighting modes, significantly extending its measurable distance range from its predecessor’s five meters to 10.

ISOCELL Vizion 931: Optimized for capturing dynamic movements without distortion 

The ISOCELL Vizion 931 is a global shutter image sensor tailored for capturing rapid movements without the “jello effect”. Unlike rolling shutter sensors that scan the scene line by line from top to bottom in a “rolling” manner, global shutter sensors capture the entire scene at once or “globally,” similar to how human eyes see. This allows the ISOCELL Vizion 931 to capture sharp, undistorted images of moving objects, making it well-suited for motion-tracking in XR devices, gaming systems, service and logistics robots as well as drones.

Designed in a one-to-one ratio VGA resolution (640 x 640) that packs more pixels in a smaller form factor, the ISOCELL Vizion 931 is optimal for iris recognition, eye tracking as well as facial and gesture detection in head-mounted display devices like XR headsets. 

The ISOCELL Vizion 931 also achieves the industry’s highest level of quantum efficiency, delivering an impressive 60% at 850nm infrared light wavelength. This feat was made possible by incorporating Front Deep Trench Isolation (FDTI) which places an insulation layer between pixels to maximize light absorption, in addition to the BST method used in the ISOCELL Vizion 63D.

The Vizion 931 supports multi-drop that can seamlessly connect up to four cameras to the application processor using a single wire. With minimal wiring required, the sensor provides greater design flexibility for device manufactures. 

Samsung ISOCELL Vizion 63D and ISOCELL Vizion 931 sensors are currently sampling to OEMs worldwide.

Coverage on PetaPixel: https://petapixel.com/2023/12/20/samsungs-new-vizion-sensors-boast-wild-tech-for-industrial-use/

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Samsung press release: https://semiconductor.samsung.com/emea/news-events/news/samsung-unveils-two-new-isocell-vizion-sensors-tailored-for-robotics-and-xr-applications/

Samsung Unveils Two New ISOCELL Vizion Sensors Tailored for Robotics and XR Applications
The ISOCELL Vizion 63D, a time-of-flight sensor, captures high-resolution 3D images with exceptional detail
The ISOCELL Vizion 931, a global shutter sensor, captures dynamic moments with clarity and precision 

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D, and a global shutter sensor, the ISOCELL Vizion 931. First introduced in 2020, Samsung’s ISOCELL Vizion lineup includes ToF and global shutter sensors specifically designed to offer visual capabilities across an extensive range of next-generation mobile, commercial and industrial use cases.  

“Engineered with state-of-the-art sensor technologies, Samsung’s ISOCELL Vizion 63D and ISOCELL Vizion 931 will be essential in facilitating machine vision for future high-tech applications like robotics and extended reality (XR),” said Haechang Lee, Executive Vice President of the Next Generation Sensor Development Team at Samsung Electronics. “Leveraging our rich history in technological innovation, we are committed to driving the rapidly expanding image sensor market forward.”

ISOCELL Vizion 63D: Tailored for capturing high-resolution 3D images with exceptional detail

Similar to how bats use echolocation to navigate in the dark, ToF sensors measure distance and depth by calculating the time it takes the emitted light to travel to and from an object. 

Particularly, Samsung’s ISOCELL Vizion 63D is an indirect ToF (iToF) sensor that measures the phase shift between emitted and reflected light to sense its surroundings in three dimensions. With exceptional accuracy and clarity, the Vizion 63D is ideal for service and industrial robots as well as XR devices and facial authentication where high-resolution and precise depth measuring are crucial.

The ISOCELL Vizion 63D sensor is the industry’s first iToF sensor with an integrated depth-sensing hardware image signal processor (ISP). With this innovative one-chip design, it can precisely capture 3D depth information without the help of another chip, enabling up to a 40% reduction in system power consumption compared to the previous ISOCELL Vizion 33D product. The sensor can also process images at up to 60 frames per second in QVGA resolution (320x240), which is a high-demand display resolution used in commercial and industrial markets. 

Based on the industry’s smallest 3.5㎛ pixel size in iToF sensors, the ISOCELL Vizion 63D achieves high Video Graphics Array (VGA) resolution (640x480) within a 1/6.4” optical format, making it an ideal fit for compact, on-the-go devices.

Thanks to backside scattering technology (BST) that enhances light absorption, the Vizion 63D sensor boasts the highest level of quantum efficiency in the industry, reaching 38% at an infrared light wavelength of 940 nanometers (nm). This enables enhanced light sensitivity and reduced noise, resulting in sharper image quality with minimal motion blur.

Moreover, the ISOCELL Vizion 63D supports both flood (high-resolution at short-range) and spot (long-range) lighting modes, significantly extending its measurable distance range from its predecessor’s five meters to 10.

ISOCELL Vizion 931: Optimized for capturing dynamic movements without distortion 

The ISOCELL Vizion 931 is a global shutter image sensor tailored for capturing rapid movements without the “jello effect”. Unlike rolling shutter sensors that scan the scene line by line from top to bottom in a “rolling” manner, global shutter sensors capture the entire scene at once or “globally,” similar to how human eyes see. This allows the ISOCELL Vizion 931 to capture sharp, undistorted images of moving objects, making it well-suited for motion-tracking in XR devices, gaming systems, service and logistics robots as well as drones.

Designed in a one-to-one ratio VGA resolution (640 x 640) that packs more pixels in a smaller form factor, the ISOCELL Vizion 931 is optimal for iris recognition, eye tracking as well as facial and gesture detection in head-mounted display devices like XR headsets. 

The ISOCELL Vizion 931 also achieves the industry’s highest level of quantum efficiency, delivering an impressive 60% at 850nm infrared light wavelength. This feat was made possible by incorporating Front Deep Trench Isolation (FDTI) which places an insulation layer between pixels to maximize light absorption, in addition to the BST method used in the ISOCELL Vizion 63D.

The Vizion 931 supports multi-drop that can seamlessly connect up to four cameras to the application processor using a single wire. With minimal wiring required, the sensor provides greater design flexibility for device manufactures. 

Samsung ISOCELL Vizion 63D and ISOCELL Vizion 931 sensors are currently sampling to OEMs worldwide.

Coverage on PetaPixel: https://petapixel.com/2023/12/20/samsungs-new-vizion-sensors-boast-wild-tech-for-industrial-use/

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Samsung press release: https://semiconductor.samsung.com/emea/news-events/news/samsung-unveils-two-new-isocell-vizion-sensors-tailored-for-robotics-and-xr-applications/

Samsung Unveils Two New ISOCELL Vizion Sensors Tailored for Robotics and XR Applications
The ISOCELL Vizion 63D, a time-of-flight sensor, captures high-resolution 3D images with exceptional detail
The ISOCELL Vizion 931, a global shutter sensor, captures dynamic moments with clarity and precision 

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D, and a global shutter sensor, the ISOCELL Vizion 931. First introduced in 2020, Samsung’s ISOCELL Vizion lineup includes ToF and global shutter sensors specifically designed to offer visual capabilities across an extensive range of next-generation mobile, commercial and industrial use cases.  

“Engineered with state-of-the-art sensor technologies, Samsung’s ISOCELL Vizion 63D and ISOCELL Vizion 931 will be essential in facilitating machine vision for future high-tech applications like robotics and extended reality (XR),” said Haechang Lee, Executive Vice President of the Next Generation Sensor Development Team at Samsung Electronics. “Leveraging our rich history in technological innovation, we are committed to driving the rapidly expanding image sensor market forward.”

ISOCELL Vizion 63D: Tailored for capturing high-resolution 3D images with exceptional detail

Similar to how bats use echolocation to navigate in the dark, ToF sensors measure distance and depth by calculating the time it takes the emitted light to travel to and from an object. 

Particularly, Samsung’s ISOCELL Vizion 63D is an indirect ToF (iToF) sensor that measures the phase shift between emitted and reflected light to sense its surroundings in three dimensions. With exceptional accuracy and clarity, the Vizion 63D is ideal for service and industrial robots as well as XR devices and facial authentication where high-resolution and precise depth measuring are crucial.

The ISOCELL Vizion 63D sensor is the industry’s first iToF sensor with an integrated depth-sensing hardware image signal processor (ISP). With this innovative one-chip design, it can precisely capture 3D depth information without the help of another chip, enabling up to a 40% reduction in system power consumption compared to the previous ISOCELL Vizion 33D product. The sensor can also process images at up to 60 frames per second in QVGA resolution (320x240), which is a high-demand display resolution used in commercial and industrial markets. 

Based on the industry’s smallest 3.5㎛ pixel size in iToF sensors, the ISOCELL Vizion 63D achieves high Video Graphics Array (VGA) resolution (640x480) within a 1/6.4” optical format, making it an ideal fit for compact, on-the-go devices.

Thanks to backside scattering technology (BST) that enhances light absorption, the Vizion 63D sensor boasts the highest level of quantum efficiency in the industry, reaching 38% at an infrared light wavelength of 940 nanometers (nm). This enables enhanced light sensitivity and reduced noise, resulting in sharper image quality with minimal motion blur.

Moreover, the ISOCELL Vizion 63D supports both flood (high-resolution at short-range) and spot (long-range) lighting modes, significantly extending its measurable distance range from its predecessor’s five meters to 10.

ISOCELL Vizion 931: Optimized for capturing dynamic movements without distortion 

The ISOCELL Vizion 931 is a global shutter image sensor tailored for capturing rapid movements without the “jello effect”. Unlike rolling shutter sensors that scan the scene line by line from top to bottom in a “rolling” manner, global shutter sensors capture the entire scene at once or “globally,” similar to how human eyes see. This allows the ISOCELL Vizion 931 to capture sharp, undistorted images of moving objects, making it well-suited for motion-tracking in XR devices, gaming systems, service and logistics robots as well as drones.

Designed in a one-to-one ratio VGA resolution (640 x 640) that packs more pixels in a smaller form factor, the ISOCELL Vizion 931 is optimal for iris recognition, eye tracking as well as facial and gesture detection in head-mounted display devices like XR headsets. 

The ISOCELL Vizion 931 also achieves the industry’s highest level of quantum efficiency, delivering an impressive 60% at 850nm infrared light wavelength. This feat was made possible by incorporating Front Deep Trench Isolation (FDTI) which places an insulation layer between pixels to maximize light absorption, in addition to the BST method used in the ISOCELL Vizion 63D.

The Vizion 931 supports multi-drop that can seamlessly connect up to four cameras to the application processor using a single wire. With minimal wiring required, the sensor provides greater design flexibility for device manufactures. 

Samsung ISOCELL Vizion 63D and ISOCELL Vizion 931 sensors are currently sampling to OEMs worldwide.

Coverage on PetaPixel: https://petapixel.com/2023/12/20/samsungs-new-vizion-sensors-boast-wild-tech-for-industrial-use/

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From Business Korea: https://www.businesskorea.co.kr/news/articleView.html?idxno=208769

Samsung, SK hynix Advance in AI-embedded Image Sensors

Samsung Electronics and SK hynix are making strides in commercializing “On-sensor AI” technology for image sensors, aiming to elevate their image sensor technologies centered around AI and challenge the market leader, Japan’s Sony, in dominating the next-generation market.

At the “SK Tech Summit 2023” held last month, SK hynix revealed its progress in developing On-sensor AI technology. This technology embeds an image sensor onto an AI chip, processing data directly at the sensor level, unlike traditional sensors that relay image information to the Central Processing Unit (CPU) for computation and inference. This advance is expected to be a key technology in enabling evolved Internet of Things (IoT) and smart home services, reducing power consumption and processing time.

SK hynix’s approach involves integrating an AI accelerator into the image sensor. The company is currently conducting proof-of-concept research focused on facial and object recognition features, using a Computing In Memory (CIM) accelerator, a next-generation technology capable of performing multiplication and addition operations required for AI model computations.

Additionally, SK hynix has presented its technologies for implementing On-sensor AI, including AI software and AI lightweighting, at major academic conferences like the International Conference on Computer Vision and the IEEE EDTM seminar on semiconductor manufacturing and next-generation devices.

Samsung Electronics is also rapidly incorporating AI into its image sensor business. This year, the company unveiled a 200-megapixel image sensor with an advanced zoom feature called Zoom Anyplace, which uses AI technology for automatic object tracking during close-ups. Samsung has set a long-term business goal to commercialize “Humanoid Sensors” capable of sensing and replicating human senses, with a road map to develop image sensors that can capture even the invisible by 2027.

In October, Park Yong-in, president of Samsung Electronics’ System LSI Business, emphasized at the Samsung System LSI Tech Day in Silicon Valley, the goal of pioneering the era of “Proactive AI,” advancing from generative AI through high-performance IP, short and long-range communication solutions, and System LSI Humanoids based on sensors mimicking human senses.
The push by both companies into On-sensor AI technology development is seen as a strategy to capture new AI-specific demands and increase their market share. The image sensor market, which temporarily contracted post-COVID-19 due to a downturn in the smartphone market, is now entering a new growth phase, expanding its applications from mobile to autonomous vehicles, extended reality devices, and robotics.

According to Counterpoint Research, Sony dominated the global image sensor market with a 54% share in the last year, while Samsung Electronics held second place with 29%, and SK hynix, struggling to close the gap, barely made it into the top five with 5%.

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In an ASME J. Electron. Packag. paper titled "Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors" Mei-Chien Lu writes:

Numerous technology breakthroughs have been made in image sensor development in the past two decades. Image sensors have evolved into a technology platform to support many applications. Their successful implementation in mobile devices has accelerated market demand and established a business platform to propel continuous innovation and performance improvement extending to surveillance, medical, and automotive industries. This overview briefs the general camera module and the crucial technology elements of chip stacking architectures and advanced interconnect technologies. This study will also examine the role of pixel electronics in determining the chip stacking architecture and interconnect technology of choice. It is conducted by examining a few examples of CMOS image sensors (CIS) for different functions such as visible light detection, single photon avalanche photodiode (SPAD) for low light detection, rolling shutter, and global shutter, and depth sensing and light detection and ranging (LiDAR). Performance attributes of different architectures of chip stacking are overviewed. Direct bonding followed by Via-last through silicon via (Via-last TSV) and hybrid bonding (HB) technologies are identified as newer and favorable chip-to-chip interconnect technologies for image sensor chip stacking. The state-of-the-art ultrahigh-density interconnect manufacturability is also highlighted.

Schematics of an imaging pixel array, circuit blocks and a typical 4 T-APS pixel electronics

Exemplary schematics of front side illuminated sensors (FSI-CIS) and back side illuminated sensors (BSI-CIS)

Schematics of ceramic leadless chip carrier ceramic image sensor package at the top and imaging ball grid array image sensor package at the bottom

Schematics of two camera modules with image sensor packages at the bottom parts under lens modules

A micrograph of the partitioned top and bottom circuit blocks of the first stacked image sensor from SONY

Schematics of Stacked BSI pixel chip to circuit chip bonded at dielectric surfaces with peripheral via-last TSVs

Dual-photodiode stacked chips BSI-CIS processed by 65 nm/14 nm technologies

Chip-to-chip bonding and interconnect methods with (a) direct dielectric bonding followed by via-last TSVs for chip-to-chip interconnect, (b) hybrid bonding at peripheral area, and (c) hybrid bonding under pixel arrays

Pixel array, DRAM, and logic three-chip stacked image sensor by Sony Corp using dielectric-to-dielectric bonding followed by via-last TSV interconnects at peripheral areas

A SONY stacked-chip GS using pixel-level integration with (a) the pixel array chip, (b) the processor chip, and (c) cross section of stacked chips using hybrid bonding interconnects

Schematics of pixel electronics partition and cross section view of OmniVision stacked-chip pixel level connections

A schematic of pixel electronics for ToF SPAD image sensor

A cross section of a NIR SPAD ToF image sensor using hybrid bonding at chip-to-chip interface.

Schematic of a 3D stacked SPAD image sensor: (a) cross section view of pixel array chip stacked on CMOS circuitry chip by hybrid bonding and (b) diagram of pixel electronics

A chip floor plan and pixel array for a two-tier IR SPAD sensor for LiDAR application [14]

Short wavelength infrared sensor using InP/InGaAs/InP photodiodes bond to readout circuitry in silicon chip by pixel-level integration: (a) flip-chip bumps and (b) Cu-Cu hybrid bonds

Process flow of via-last TSV for chip-to-chip interconnect

Process flow of Direct Bond Interconnect

Link to full paper (open access): https://asmedigitalcollection.asme.org/electronicpackaging/article/144/2/020801/1115637/Advancement-of-Chip-Stacking-Architectures-and

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From Semiconductor Digest: https://www.semiconductor-digest.com/cea-leti-will-present-gains-in-ultimate-3d-rf-power-and-quantum-neuromorphic-computing-with-emerging-devices/

CEA-Leti Will Present Gains in Ultimate 3D, RF & Power, and Quantum & Neuromorphic Computing with Emerging Devices

CEA-Leti papers at IEDM 2023, Dec. 9-13, in San Francisco, will present results in multiple fields, including ultimate 3D advances in radio frequency, such as performance improvement at cryogenic temperature.

The institute will present nine papers during the conference this year. Two presentations will highlight a breakthrough in 3D sequential integration and results pushing GaN/Si HEMT closer to GaN/SiC performance at 28 GHz:

 “3D Sequential Integration with Si CMOS Stacked on 28nm Industrial FDSOI with Cu-ULK iBEOL Featuring RO and HDR Pixel”, reports the world-first 3D sequential integration of CMOS over CMOS with advanced metal line levels, which brings 3DSI with intermediate BEOL closer to commercialization.

 “6.6W/mm 200mm CMOS Compatible AlN/GaN/Si MIS-HEMT with In-Situ SiN Gate Dielectric and Low Temperature Ohmic Contacts” reports development of CMOS compatible 200mm SiN/AlN/GaN MIS-HEMT on silicon substrate that brings GaN/Si high electron mobility transistors (HEMT) closer to GaN/SiC performance at 28 GHz in power density. It also highlights that SiN/AlN/GaN on silicon metal-insulated semiconductor (MIS-HEMT) is a potential candidate for high power Ka-band power amplifiers.

Leti Devices Workshop
“Semiconductor Devices: Moving Towards Efficiency & Sustainability”
Dec. 10 @ 5:30 pm, Nikko Hotel, 222 Mason Street, Third Floor
The workshop will present CEA-Leti experts’ visions for and key results in efficient computing and radiofrequency devices for More than Moore applications.

CEA-Leti Presentations

Radio Frequency

 RF: “A Cost Effective RF-SOI Drain Extended MOS Transistor Featuring PSAT=19dBm @28GHz & VDD=3V for 5G Power Amplifier Application”, by Xavier Garros
 Session 34.2: Wednesday, Dec. 13 @ 9:30 am (Continental 7-9)
 RF crypto: “RF Performance Enhancement of 28nm FD-SOI Transistors Down to Cryogenic Temperature Using Back Biasing”, by Quentin Berlingard
 Session 34.3: Wednesday, Dec. 13 @ 9:55 am (Continental 7-9)
 GaN RF: “6.6W/mm 200mm CMOS Compatible AlN/GaN/Si MIS-HEMT with In-Situ SiN Gate Dielectric and Low Temperature Ohmic Contacts”, by Erwan Morvan
 Session 38.3: Wednesday, Dec. 13 @ 2:25 pm (Continental 4)

3D Sequential Stacking

 “Ultimate Layer Stacking Technology for High Density Sequential 3D Integration”, a collaborative paper with Ionut Rad of Soitec
 Session 19.5: Tuesday, Dec. 12 @ 4:00 pm (Grand Ballroom A)
 “3D Sequential Integration with Si CMOS Stacked on 28nm Industrial FDSOI with Cu-ULK iBEOL Featuring RO and HDR Pixel”, by Perrine Batude
 Session 29.3: Wednesday, Dec. 13 @ 9:55 am (Grand Ballroom B)
Emerging Device and Compute Technology (EDT)
 “Designing Networks of Resistively-Coupled Stochastic Magnetic Tunnel Junctions for Energy-Based Optimum Search”, by Kamal Danouchi
 Session 22.3: Tuesday, Dec. 12 @ 3:10 (Continental 5)

Neuromorphic Computing

 Hybrid FeRAM/RRAM Synaptic Circuit Enabling On-Chip Inference and Learning at the Edge”, by Michele Martemucci (LIST)
 Session 23:3: Tuesday, Dec. 12 @ 3:10 (Continental 6)
 “Bayesian In-Memory Computing with Resistive Memories”, a collaborative paper with Damien Querlioz of CNRS-C2N
 Session 12:3: Tuesday, Dec. 12 @ 9:55 am (Continental 1-3)
Quantum Technology
 “Tunnel and Capacitive Coupling Optimization in FDSOI Spin-Qubit Devices”, by H. Niebojewski and B. Bertrand
 Session 22:6: Tuesday, Dec. 12 @ 4:25 pm (Continental 5)

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Original article: https://www.eejournal.com/industry_news/next-generation-multizone-time-of-flight-sensor-from-stmicroelectronics-boosts-ranging-performance-and-power-saving/

Next-generation multizone time-of-flight sensor from STMicroelectronics boosts ranging performance and power saving

Target applications include human-presence sensing, gesture recognition, robotics, and other industrial uses

Geneva, Switzerland, December 14, 2023 – STMicroelectronics’ VL53L8CX, the latest-generation 8×8 multizone time-of-flight (ToF) ranging sensor, delivers a range of improvements including greater ambient-light immunity, lower power consumption, and enhanced optics.

ST’s direct-ToF sensors combine a 940nm vertical cavity surface emitting laser (VCSEL), a multizone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400cm away, across 64 independent zones, and up to 30 captures per second.

The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extending the sensor’s maximum range in daylight from 170cm to 285cm and reducing power consumption from 4.5mW to 1.6mW in low-power mode.

ST released the first multizone time-of-flight sensor with the VL53L5CX in 2021. By increasing performance, the new VL53L8CX now further extends the advantages of these sensors over alternatives with conventional optics, which have fewer native zones and lose sensitivity in the outer areas. Thanks to its true 8×8 multizone sensing, the VL53L8CX ensures uniform sensitivity and accurate ranging throughout the field of view, with superior range in ambient light.

When used for system activation and human presence detection, the VL53L8CX’s greater ambient-light immunity enables equipment to respond more consistently and quickly. As part of ST’s STGesture™ platform that also includes the STSW-IMG035 turnkey gesture-recognition software and Gesture EVK development tool, the new sensor delivers the precision needed for repeatable gesture-based interaction. In addition to motion gesture recognition, hand posture recognition is also possible leveraging the latest AI models available in the STM32ai-modelzoo on GitHub.

Moreover, the VL53L8CX provides increased accuracy for monitoring the contents of bins, containers, silos, and tanks, including liquid-level monitoring, in industrial bulk storage and warehousing. The superior accuracy can also enhance the performance of drinks machines such as coffee makers and beverage dispensers.

Mobile robots including autonomous vacuum cleaners can leverage the VL53L8CX to improve guidance capabilities like floor sensing, small object detection, collision avoidance, and cliff detection. Also, the synchronization pin enables projectors and cameras to benefit from coordinated autofocus. There is also a motion indicator, an auto-stop feature that allows real-time actions, and the sensor is immune to cover-glass crosstalk beyond 60cm. Now supporting SPI connectivity, in addition to the 1MHz I2C interface, the new sensor handles host data transfers at up to 3MHz.

Designers can quickly evaluate the VL53L8CX and jump-start their projects taking advantage of the supporting ecosystem that includes the X-NUCLEO-53L8A1 expansion board and SATEL-VL53L8 breakout boards. The P-NUCLEO-53L8A1 pack is also available, which contains a STM32F401 Nucleo microcontroller board and X-NUCLEO-53L8A1 expansion board ready to power up and start exploring.
The VL53L8CX is available now, housed in a 6.4mm x 3.0mm x 1.75mm leadless package, from $3.60 for orders of 1000 pieces.

Please visit www.st.com/VL53L8CX for more information.

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Annoucements below from (1) Orbbec and (2) MagikEye about their upcoming CES demos.

Orbbec releases Persee N1 camera-computer kit for 3D vision enthusiasts, powered by the NVIDIA Jetson platform

Orbbec’s feature-rich RGB-D camera-computer is a ready-to-use out-of-the box solution for 3D vision application developers and experimenters

Troy, Mich, 13 December 2023 — Orbbec, an industry leader dedicated to 3D vision systems, has developed the Persee N1, an all-in-one combination of a popular stereo-vision 3D camera and a purpose-built computer based on the NVIDIA Jetson platform, and equipped with industry-standard interfaces for the most useful accessories and data connections. Developers using the newly launched camera-computer will also enjoy the benefits of the Ubuntu OS and OpenCV libraries. Orbbec recently became an NVIDIA Partner Network (NPN) Preferred Partner.

Persee N1 delivers highly accurate and reliable data for in-door/semi-outdoor operation, ideally suited for healthtech, dimensioning, interactive gaming, retail and robotics applications, and features:

• An easy setup process using the Orbbec SDK and Ubuntu-based software environment.
• Industry-proven Gemini 2 camera, based on active stereo IR technology, which includes Orbbec’s custom ASIC for high-quality, in-camera depth processing.
• The powerful NVIDIA Jetson platform for edge AI and robotics.
• HDMI and USB ports for easy connections to a monitor and keyboard.
• Multiple USB ports for data and a POE (Power over Ethernet) port for combined data and power connections.
•  Expandable storage with MicroSD and M.2 slots.

“The self-contained Persee N1 camera-computer makes it easy for computer vision developers to experiment with 3D vision,” said Amit Banerjee, Head of Platform and Partnerships at Orbbec. “This combination of our Gemini 2 RGB-D camera and the NVIDIA Jetson platform for edge AI and robotics allows AI development while at the same time enabling large-scale cloud-based commercial deployments.”

The new camera module also features official support for the widely used Open Computer Vision (OpenCV) library. OpenCV is used in an estimated 89% of all embedded vision projects according to industry reports. This integration marks the beginning of a deeper collaboration between Orbbec and OpenCV, which is operated by the non-profit Open Source Vision Foundation.

“The Persee N1 features robust support for the industry-standard computer vision and AI toolset from OpenCV,” said Dr. Satya Mullick, CEO of OpenCV. “OpenCV and Orbbec have entered a partnership to ensure OpenCV compatibility with Orbbec’s powerful new devices and are jointly developing new capabilities for the 3D vision community.”

MagikEye's Pico Image Sensor: Pioneering the Eyes of AI for the Robotics Age at CES

From Businesswire.

December 20, 2023 09:00 AM Eastern Standard Time
STAMFORD, Conn.--(BUSINESS WIRE)--Magik Eye Inc. (www.magik-eye.com), a trailblazer in 3D sensing technology, is set to showcase its groundbreaking Pico Depth Sensor at the 2024 Consumer Electronics Show (CES) in Las Vegas, Nevada. Embarking on a mission to "Provide the Eyes of AI for the Robotics Age," the Pico Depth Sensor represents a key milestone in MagikEye’s journey towards AI and robotics excellence.

The heart of the Pico Depth Sensor’s innovation lies in its use of MagikEye’s proprietary Invertible Light™ Technology (ILT), which operates efficiently on a “bare-metal” ARM M0 processor within the Raspberry Pi RP2040. This noteworthy feature underscores the sensor's ability to deliver high-quality 3D sensing without the need for specialized silicon. Moreover, while the Pico Sensor showcases its capabilities using the RP2040, the underlying technology is designed with adaptability in mind, allowing seamless operation on a variety of microcontroller cores, including those based on the popular RISC-V architecture. This flexibility signifies a major leap forward in making advanced 3D sensing accessible and adaptable across different platforms.

Takeo Miyazawa, Founder & CEO of MagikEye, emphasizes the sensor's transformative potential: “Just as personal computers democratized access to technology and spurred a revolution in productivity, the Pico Depth Sensor is set to ignite a similar transformation in the realms of AI and robotics. It is not just an innovative product; it’s a gateway to new possibilities in fields like autonomous vehicles, smart home systems, and beyond, where AI and depth sensing converge to create smarter, more intuitive solutions.”

Attendees at CES 2024 are cordially invited to visit MagikEye's booth for an exclusive first-hand experience of the Pico Sensor. Live demonstrations of MagikEye’s latest ILT solutions for next-gen 3D sensing solutions will be held from January 9-11 at the Embassy Suites by Hilton Convention Center Las Vegas. Demonstration times are limited and private reservations will be accommodated by contacting ces2024@magik-eye.com.

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News article: https://optics.org/news/14/12/11

imec presents new way to render colors with sub-micron pixel sizes

This week at the International Electron Devices Meeting, in San Francisco, CA, (IEEE IEDM 2023), imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has demonstrated a new method for “faithfully splitting colors with sub-micron resolution using standard back-end-of-line processing on 300mm wafers”.

imec says that the technology is poised to elevate high-end camera performance, delivering higher signal-to-noise ratio, enhanced color quality with unprecedented spatial resolution.
Designing next-generation CMOS imagers requires striking a balance between collecting all incoming photons, achieving a resolution down to photon size or diffraction limit, and accurately recording the light color.

Traditional image sensors with color filters on the pixels are still limited in combining all three requirements. While higher pixel densities would increase the overall image resolution, smaller pixels capture even less light and are prone to artifacts that result from interpolating color values from neighboring pixels.

Even though diffraction-based color splitters represent a leap forward in increasing color sensitivity and capturing light, they are still unable to improve image resolution.

'Fundamentally new' approach
imec is now proposing a fundamentally new way for splitting colors at sub-micron pixel sizes (i.e., beyond the fundamental Abbe diffraction limit) using standard back-end processing. The approach is said to “tick all the boxes” for next-generation imagers by collecting nearly all photons, increasing resolution by utilizing very small pixels, and rendering colors faithfully.
To achieve this, imec researchers built an array of vertical Si3N4 multimode waveguides in an SiO2 matrix. The waveguides have a tapered, diffraction-limited sized input (e.g., 800 x 800 nm2) to collect all the incident light.

“In each waveguide, incident photons are exciting both symmetric and asymmetric modes, which propagate through the waveguide differently, leading to a unique “beating” pattern between the two modes for a given frequency. This beating pattern enables a spatial separation at the end of the waveguides corresponding to a specific color,” said Prof. Jan Genoe, scientific director at imec.

Cost-efficient structures
The total output light from each waveguide is estimated to reach over 90% within the range of human color perception (wavelength range 400-700nm), making it superior to color filters, says imec.
Robert Gehlhaar, principal member of technical staff at imec, said, “Because this technique is compatible with standard 300-mm processing, the splitters can be produced cost-efficiently. This enables further scaling of high-resolution imagers, with the ultimate goal to detect every incident photon and its properties.

“Our ambition is to become the future standard for color imaging with diffraction-limited resolution. We are welcoming industry partners to join us on this path towards full camera demonstration.”

RGB camera measurement (100x magnification) of an array of waveguides with alternating 5 left-side-open-aperture and 5 right-side-open-aperture (the others being occluded by TiN) waveguides at a 1-micron pitch. Yellow light exits at the right part of the waveguide, whereas the blue exits at the left. The wafer is illuminated using plane wave white light. Credit: imec.

3D visualization (left) and TEM cross-section (right) of the vertical waveguide array for color splitting in BY-CR imaging. Credit: imec.

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Guo et al. from Omnivision presented a hybrid RGB/event vision sensor in a paper titled "A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function" at ISSCC 2023.

Abstract: Event Vision Sensors (EVS) determine, at pixel level, whether a temporal contrast change beyond a predefined threshold is detected [1–6]. Compared to CMOS image sensors (CIS), this new modality inherently provides data-compression functionality and hence, enables high-speed, low-latency data capture while operating at low power. Numerous applications such as object tracking, 3D detection, or slow-motion are being researched based on EVS [1]. Temporal contrast detection is a relative measurement and is encoded by so-called “events” being further characterized through x/y pixel location, event time-stamp (t) and the polarity (p), indicating whether an increase or decrease in illuminance has been detected.

Characterization results: Contrast response, nominal contrast, latency and noise vs. illuminance.

 

Technology trend and chip micrograph.

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X-FAB Introduces New Generation of Enhanced Performance SPAD Devices focused on Near-Infrared Applications

Link: https://www.xfab.com/news/details/article/x-fab-introduces-new-generation-of-enhanced-performance-spad-devices-focused-on-near-infrared-applications?trk=feed_main-feed-card_feed-article-content

NEWS – Tessenderlo, Belgium – Nov 16, 2023
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has introduced a specific near-infrared version to its single-phot