Canon Inc. to make Redlen Technologies a wholly owned subsidiary
Barry Burke Passed Away
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Barry E. Burke passed away on September 7, 2021, after a long illness.
Barry was a MIT Lincoln Laboratory Fellow. For most of his nearly 49-year career, he has worked on CCDs. Among the CCDs designed by Burke are those used in the space-borne soft-X-ray astronomy missions ASCA (Advanced Satellite for Cosmology and Astrophysics), Chandra, and Suzaku. Visible-band CCDs he developed are being used in several observatories, including the Panoramic Survey Telescope and Rapid Response System (Pan-STARRS) in Hawaii. He is the co-inventor of the orthogonal-transfer CCD (OTCCD), a device which can compensate for image motion by pixel shifting and which is used in the Pan-STARRS imagers. He recently completed design work on the CCD imagers used on the Transiting Exoplanet Survey Satellite (TESS) launched in April 2018.
Dr. Burke has authored or coauthored more than 100 publications and conference proceedings and is the inventor or co-inventor on 18 patents. His last papers have been published as recently as in August 2021. He was a Fellow of the IEEE.
Samsung 0.64um Pixel Presentation On-Line
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Samsung ISSCC 2021 presentation "1/2.74” 32 Megapixel-Prototype CMOS Image Sensor with 0.64μm Unit Pixels Separated by Full-Depth Deep-Trench Isolation" with a list of 32 authors Jongeun Park, Sungbong Park, Kwansik Cho, Taehun Lee, Changkyu Lee, DongHyun Kim, Beomsuk Lee, SungIn Kim, Ho-Chul Ji, DongMo Im, Haeyong Park, Jinyoung Kim, JungHo Cha, Taehoon Kim, In-Sung Joe, Soojin Hong, Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee, Donghyuk Park, EuiYeol Kim, Howoo Park, Jaekyu Lee, Yitae Kim, JungChak Ahn, YoungKi Hong, ChungSam Jun, HyunChul Kim, Chang-Rok Moon, and Ho-Kyu Kang is available one-line. Few slides:
Omnivision is Reported to Scale Down Foundry Orders by 50,000 Wafers per Month
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YahooTaiwan, UnitedDailyNews, Digitimes, SinaFinance: Omnivision reduces its 2022 foundry orders by 50,000 wafers per month. Reportedly, the main reason is the weakness of the smartphone market in China.Samsung Aims to 576MP Mobile Sensors in 2025
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Samsung SVP & Head of Automotive Sensors Haechang Lee presented the company's small pixel history and roadmap at SEMI Europe Summit on Sept. 1, 2021. The 576MP mobile sensor is planned for 2025:
Nikon Z 28mm f2.8 review
Sony to Start Sampling SPAD LiDAR Sensor for Automotive Applications in March 2022
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Samsung Expects LiDAR Market to Overgrow CIS in 2026
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SEMI Europe Summit publishes a couple of slides from the presentations including Samsung prediction about LiDAR market:
MIPI D-PHY v.3.0 Standard Increases Speed to 11Gbps per Lane
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Smartsens Launches its First 1um Pixel Product
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SkyWater Foundry Announces 90nm MPW Program
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Era of 2.2V Supply Coming?
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- Samsung newly announced 0.64um pixel in 200MP sensor uses 2.2V supply, while the "old" 0.64um pixel in 50MP sensor announced in June 2021 still relies on 2.8V supply:
- Samsung new 1um pixel in 50MP sensor with "all-directional" PDAF uses 2.2V supply too.
- Apparently Samsung modifies its "older" pixels to adopt low voltage supply, similar to the 0.7um pixel presented at EI 2021:
SUSS MicroTec and SET Form a Hybrid Bonding Partnership
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SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.
As part of this partnership, SUSS MicroTec’s high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET’s latest ultra-high accuracy D2W hybrid bonding platform.
Goetz M. Bendele, CEO of SUSS MicroTec, says: “With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET’s leading-precision die placement technology with SUSS’s proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers’ fabrication sites.”
Pascal Metzger, CEO of SET, says: “Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory state to an industrial state. Thus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process.”
8th Harvest Imaging Forum
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8th Harvest Imaging Forum is to be held on December 9-10, 2021 in Delft, the Netherlands. The Forum will be a hybrid one meaning that both in-person and remote attendances are possible:
- One can attend in-person and benefit in an utmost way of the live interaction with the speakers and audience,
- There will be also a live broadcast of the forum, still interactions with the speakers through a chat box will be made possible,
- Finally the forum also can be watched on-line at a later date.
- "Dark current, dim points and bright spots : coming to the dark side of image sensors"
Daniel McGrath (GOODiX, USA)
- "Random Telegraph Signal and Radiation Induced Defects in CMOS Image Sensors"
Vincent Goiffon (ISAE-SUPAERO, France)
Fujifilm GFX50S II review so far
Samsung Announces 50MP 1um Pixel Sensor with All-Direction PDAF
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BusinessWire: Samsung introduces the ISOCELL GN5, the first image sensor to adopt all-directional focusing Dual Pixel Pro technology with two photodiodes in a single 1.0μm pixel.
Samsung Announces 200MP 0.64um Pixel Mobile Sensor
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Samsung 108MP Sensor was Designed in India
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GadgetsNow quotes Balajee Sowrirajan, MD of Samsung Semiconductor India Research (SSIR), saying that Samsung’s R&D center in Bengaluru, India, led the development of the mobile 108MP ISOCELL HMX sensor launched two years ago.
Lynred Integrates ISP onto Microbolometric Sensor
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ALANews: Lynred unveils the ATI320, its first advanced thermal imager with embedded image signal processing. The product’s embedded features, with a lens available as an option, aim at saving camera makers time and effort in integrating thermal imaging during the development and manufacturing process, enabling them to speed products to market.- Resolution: 320×240; 12µm pixel pitch
- NETD (Noise Equivalent Temperature Difference): f/1, 300 K scene, 20°C ambient for ATI320S version: <60mK
- Scene dynamic >100°C
- Operating T°C range: -40°C; +85°C
- Full digital product with power consumption <400mW, when an image signal processing is fully activated
- Frame rate: 60Hz
- Standards compliance: Mil-Std-810/883
- Weight: <3g for ATI320S version; <7g for ATI320L version
Galaxycore History
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EastMoney, MooreElite, Laoyaoba publish a glorified history of Galaxycore from early days to IPO. Few quotes:
GPixel Unveils 4/3-inch 10MP 2,000fps Global Shutter Sensor
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Gpixel announces a high-speed global shutter sensor, GSPRINT4510, a new member of GSPRINT series targeting high speed applications.
GSPRINT4510 is a 10MP 4/3” (22.9mm) sensor based on 4.5 µm charge domain global shutter pixel. It has more than 30 ke- full well and less than 3 e- rms read noise. Using an advanced 65 nm CIS process with light pipe technology, the sensor achieves >65% QE and more than 1/40,000 shutter efficiency. With on-chip charge binning, full well capacity can be further increased and frame rate is almost quadrupled.
GSPRINT4510 will be offered in two variants to support in the most optimal way different end-use use cases. One version is dedicated to 3D laser profiling and supports 144 pairs sub-LVDS channels running at 1.2Gbps each, which delivers 2000 fps in 8-bit operation at 2048 rows and >3500 fps with an ROI of 1024 rows in combination with several HDR modes. Incorporating a thinner glass lid to reduce stray light reflection, the option to have no micro lenses, and either a sealed or removable glass lid makes GSPRINT4510 a good solution for 3D laser scanning applications.
For other applications including high-speed industrial inspection, life science imaging and 4K video applications, the sensor is offered in monochrome, color and achieve up to 500 fps @ 12-bit, 1008 fps @ 10-bit and 1928 fps @ 8-bit with full resolution. On-chip 2×2 charge binning can boost frame rates more than x3 with a full well charge increase to 120 ke-. Flexible output channel multiplex modes make it possible to reduce frame and data rate to make it compatible with all available camera interface options. This version of the sensor incorporates micro lenses and a sealed glass lid making GSPRINT4510 a good choice for many applications such as 4/3”(MFT) format global shutter cameras in slow motion capture or drone-mounted videography.
Both versions of GSPRINT4510 are packaged in a 454-pin uPGA ceramic package which is pin-compatible with GSPRINT4521. GSPRINT4510 monochrome engineering samples can be ordered today for delivery in October 2021.
Hamamatsu Presents Position-Detecting Computational Sensor
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Hamamatsu Photonics has developed a new profile sensor with an embedded computing function. This sensor, S15366, is specifically designed to calculate signals from the incident light spot within its processing chip and output incident light position information. Since this new profile sensor can output the incident light positions as coordinate data, it needs no external controller for computing processing.
New Kasalis Active Alignment Machine Features 5nm Resolution
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BusinessWire: Kasalis, an active alignment company founded in 2011 acquired by Jabil in 2015, re-launches its brand and website. "Today, we are excited to announce a new brand direction from Jabil Kasalis to simply Kasalis. We believe shifting to our established and independent brand identity will better demonstrate our distinctive value in the market." Although Kasalis remains a technology division of Jabil Inc., it appears that Jabil prepares to sell it or spin it off.
