Goodix Nominated for Most Respected Public Semiconductor Company Award

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Global Semiconductor Alliance (GSA) announces its 2019 award nominations with Goodix listed for Most Respected Public Semiconductor Company Achieving $500M to $1B in Annual Sales:

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Macquarie Research on Smartphone Camera Trends

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IFNews quotes Macquarie Research "surveyed a total of 132 smartphones launched in 2019 by the top 6 vendors – Samsung, Huawei, Apple, OPPO / Realme, vivo and Xiaomi. There are 489 cameras in total or an average of 3.7 cameras per device, with 1.0 front camera and 2.7 back cameras. About 45% of the 132 new devices adopted triple cameras, while quad camera penetration reached 18%."

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Yole’s Analysis of Hybrid Bonding IP

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Yole Developpement publishes "Hybrid Bonding: Patent Landscape Analysis" report:

"Generally, 2.5D-3D stacking was achieved thanks to Through Silicon Via (TSV) technology. However, TSVs are large and using them limits efforts to reach very dense architectures. Furthermore, filling TSVs with metals is complex and requires significant know how. To overcome these limitations, players have started to look at other solutions. A first step toward a new way of 3D stacking is ZiBond, developed by Ziptronix, a company founded in 2000 as a spin-out of Research Triangle Institute. ZiBond is an enhanced version of direct oxide bonding that involves wafer-to-wafer processing at low temperatures, from 150-300°C, to initiate high bond strengths, rivaling silicon. The next step was to combine the dielectric bond with embedded metal to simultaneously bond wafers or bond dies to wafers and form the interconnects. ZiBond is the dielectric bond that forms the basis for direct bonding interconnect (DBI) technology developed in 2005. Tessera, now called Xperi, acquired Ziptronix in 2015 and ZiBond and DBI were integrated in the Invensas subsidiary’s portfolio. This hybrid bonding technology is quickly becoming recognized as the preferred permanent bonding path to form high-density interconnects in heterogeneous integration applications, from 2D enhanced, to 3D stacking with or without TSVs, as well as MEMS.

After entering the CMOS Image Sensor (CIS) market in 2016, hybrid bonding technology has started to be investigated by other industries, such as memory. However, the hybrid bonding market’s growth follows Xperi’s developments. The company has adopted an aggressive strategy to assert its patents. Yet in parallel with the market and Xperi’s growth, some other players, like YMTC, Sony, Samsung and TSMC, have developed their own patent portfolios and strategies and are on the edge of releasing their first products using hybrid bonding processes. Understanding the IP landscape is becoming key to evaluate the risks and opportunities that go with the development and use of hybrid bonding technology.
"

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Free 1995 CCD Book

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Albert Theuwissen makes his 1995 book "Solid-State Imaging with Charge-Coupled Devices" available for a free download on this link.

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LiDAR News: Ouster, Velodyne

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BusinessWire: Ouster introduces the OS1-32, said to be the world’s most affordable 32-channel lidar. "Higher resolution sensors at an affordable price are critical for moving computer vision from simple obstacle avoidance to more advanced perception, and for moving projects from R&D to commercial viability," says Ouster CEO and co-founder Angus Pacala. "The OS1-32 gives customers what they ask for the most: higher resolution at an affordable price."

OS1-32 is priced at $8,000 for commercial applications (with volume pricing available) and $6,000 for non-profit university research.




BusinessWire: Velodyne introduces Alpha Prime, the next generation lidar with surround view.

The Alpha Prime’s features include:
  • Superior field-of-view: 360-degree surround view perception and a 40-degree vertical field-of-view.
  • High resolution of 0.2° x 0.1°
  • Long range:
    10% reflective targets >220m typical
    5% reflective targets >150m typical
    Ground plane hits >90m typical
  • Outstanding performance in a wide variety of lighting conditions, including retro reflectors and sunlight mitigation.
  • Exceptional detection of dark or low reflectance objects at long distances, such as tires, dark vehicles, low reflectivity pavement and low visibility pedestrians.
  • Advanced negative obstacle perception, such as potholes and cracks in the road.
  • The highest resolution along with robust reflectivity returns from over 4.8 million points per second, simplifying detection and tracking of vehicles, pedestrians and other obstructions.
  • High resolution and laser calibration enable the sensor to easily localize vehicles — outdoors or indoors — without a GPS, for precise positioning.
  • Improved efficiency for extended vehicle operating time within broad temperature and environmental ranges without the need for active cooling.
  • Advanced sensor-to-sensor interference mitigation.
  • Automotive mass production options from multiple sources for qualified programs.

The Alpha Prime is a significant step forward in enabling the advancement of the autonomous vehicle and robot industries,” said Anand Gopalan, CTO, Velodyne Lidar. “With its breadth of best-in-class features, the Alpha Prime is a marked advancement in sensor performance for real world conditions. Here at Velodyne, we take pride in listening to our customers and delivering innovative and high-performance products. We believe Velodyne’s versatility and agility extend our leadership status in the lidar business to empower autonomous solutions on a global scale.


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Trinamix 3D Imaging with Beam Profile Analyzer

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TrinamiX publishes a promotional video of its 3D imager:

"trinamiX 3D Imaging is based on patented Beam Profile Analysis technology. Beam profile analysis is an active measuring principle, that means that the object to be measured is illuminated with a light source emitting a regular dot pattern. The reflection of each light spot is captured by a sensor (e.g. a CMOS camera) and its beam profile is then being analyzed. From the specific beam profile, we extract the distance and information about the material of the measured object. This novel approach enables having an extra channel of information for improving decision making, robustness across platforms and reducing computational need over traditional technologies."



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IRay Demos its 1.3MP Microbolometric Camera

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China-based IRay publishes a short video from its 12um pixel microbolometric thermal sensor:

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Sony Stacked Sensor Tutorial

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IEEE Solid-State Circuits Society publishes a short tutorial "Circuit Configurations on stacked CMOS Image Sensor" presented at 2019 VLSI Conference by Yusuke Oike, Deputy Senior General Manager and Distinguished Engineer at Sony:

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Espros Demos 65m ToF Imaging at Night

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Espros ToF imagers show a remarkable range of 65m in absence of sunlight:

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TowerJazz Q3 2019 Earnings Call

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SeekingAlpha: TowerJazz updates on its image sensor business during its quarterly earnings call:

"Looking at our sensor business, we have new projects in the pipeline with large customers on our 65-nanometre global shutter platform that we expect will materialize towards the end of next year. While sales of the existing products are still growing. Although soft year-to-date, the industrial sensor market is beginning to recover and we’ve received double digit growth through 2020.

Our recent announcement of a wafer stacking backside illumination flow connecting a top thin BSI imaging wafer to a bottom CMOS wafer on our 65 nanometers, 300-millimeter technology has generated much interest. We’re in various engagements with significant customers for projects using this technology and the time of flight market mainly for face recognition.

We also continue our work with multiple customers on optical fingerprint solutions for under OLED and under LCD displays as well as we are seeing good adoption of our stitch single die, 300-millimeter substrate x-ray sensors.
"

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Quantum and Classical Images Separation

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Science Magazine publishes a paper "Quantum image distillation" by Hugo Defienne, Matthew Reichert, Jason W. Fleischer, and Daniele Faccio from University of Glasgow, UK, and Princeton University, USA. The same paper has already been published in Arxiv.org.

"Imaging with quantum states of light promises advantages over classical approaches in terms of resolution, signal-to-noise ratio, and sensitivity. However, quantum detectors are particularly sensitive sources of classical noise that can reduce or cancel any quantum advantage in the final result. Without operating in the single-photon counting regime, we experimentally demonstrate distillation of a quantum image from measured data composed of a superposition of both quantum and classical light. We measure the image of an object formed under quantum illumination (correlated photons) that is mixed with another image produced by classical light (uncorrelated photons) with the same spectrum and polarization, and we demonstrate near-perfect separation of the two superimposed images by intensity correlation measurements. This work provides a method to mix and distinguish information carried by quantum and classical light, which may be useful for quantum imaging, communications, and security."

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PMD Demos its Multipath Reduction Approach

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IEEE Sensor publishes PMD and Seigen University demo video on ToF multipath distortions reduction:

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Teledyne e2v Re-Announces 1.3MP ToF Sensor

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Eight months after the first announcement, Teledyne e2v announces one more time its Bora ToF CMOS sensor for 3D detection and distance measurement in industrial applications, including vision guided robotics, logistics and surveillance.

Based on a 10µm pixel design and incorporating a resolution of 1280 x 1024 pixels, the Bora image sensor offers a unique on-chip gated global shutter mode with gating times of up to 42ns at 30fps in a four-phase operation.

The Bora sensor comes with an evaluation kit, comprised of a compact 1-inch optical format calibrated module, which includes a light source for near infrared illumination. It also includes optics targeted at performing the ToF imaging at short-range distances to 5m or mid-range distances to 10m, while capturing real-time 3D information at a full resolution of 1.3MP.

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v says, “We are very pleased to announce our newest Time-of-Flight sensor, which provides customers with true 1.3MP depth resolution at more than 30 fps. The sensor uniquely achieves excellent precision and accuracy in 3D measurements and is highly flexible, handling both short- and long-range capture over 10 meters and in outdoor conditions.

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Omnivision Unveils VGA GS Sensor with Lightguide

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PRNewswire: OmniVision announces a 3um pixel OV7251-2B global shutter sensor with shutter efficiency of 99.96% for machine vision applications. The cost-effective OV7251-2B achieves that by adding a new lightguide feature that improves the angular response of light capture for better system-level optical performance.

"We are improving on our widely deployed family of global shutter VGA sensors by providing a drop-in replacement for our prior generation sensor that offers an even better level of shutter efficiency with no design changes required," said Devang Patel, senior staff marketing manager for the security and emerging segments at OmniVision. "Additionally, our new lightguide feature improves the family's capture capabilities with better light confinement for higher system level optical performance."

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Ink for Image Sensor Printing

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University of Toronto publishes an ACS paper "Stable Colloidal Quantum Dot Inks Enable Inkjet-Printed High-Sensitivity Infrared Photodetectors" by Rafal Sliz, Marc Lejay, James Z. Fan, Min-Jae Choi, Sachin Kinge, Sjoerd Hoogland, Tapio Fabritius, F. Pelayo García de Arquer, and Edward H. Sargent.

"Colloidal quantum dots (CQDs) have recently gained attention as materials for manufacturing optoelectronic devices in view of their tunable light absorption and emission properties and compatibility with low-temperature thin-film manufacture. The realization of CQD inkjet-printed infrared photodetectors has thus far been hindered by incompatibility between the chemical processes that produce state-of-the-art CQD solution-exchanged inks and the requirements of ink formulations for inkjet materials processing.

We fabricate inkjet-printed photodetectors exhibiting the highest specific detectivities reported to date (above 1012 Jones across the IR) in an inkjet-printed quantum dot film. As a patternable CMOS-compatible process, the work offers routes to integrated sensing devices and systems.
"

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TechInsights Pixel Zoo

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Recently, Techinsights published a number of pixel pictures from its reverse engineering reports.

Samsung S5K2P7SQ ISOCELL Fast 16MP 30fps sensor with 1.12um pixel:


Sony IMX307 STARVIS 2.1MP sensor with 2.9um pixels:


Sony IMX402 ToF sensor:


Sony IMX410 full-frame sensor from Sony A7 III mirrorless camera:


Sony IMX250MZR Global Shutter polarization-sensitive CIS with 3.45um pixels:


SmartSens SC130GS Global Shutter CIS:


SK Hynix Hi-1332 CIS from Huawei RNE-AL00 front-facing camera module:


SiOnyx XQE-1310 IR-enhanced sensor:


ON Semiconductor AR0521 5.1MP sensor with 2.2um pixels:


OmniVision OS05A20 (OMN-OSE523) 5MP IR-enhanced Nyxel sensor with 2um pixels:


Sony 12 MP CIS from iPhone XS Max Rear-Facing Wide-Angle Camera:

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Contamination at Samsung 8" Giheung Fab

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BusinessKorea reports that Samsung foundry was affected by defects at its Giheung fab that manufactures 90nm image sensors among other products. "The defects were caused by the use of contaminated equipment on an 8-inch wafer line located in Samsung Electronics' Giheung Plant in Korea. A Samsung Electronics official acknowledged that defective products were found, but said that the process has already been normalized and that the damage is estimated at billions of Korean won.

However, some experts say that the damage may be much more than estimated by Samsung Electronics. "I understand that Samsung has not calculated the exact amount of the damage yet," said an industry insider. "The loss can be much larger than the company’s estimate.


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LiDAR News: Velodyne, Robosense, Cepton, Blickfeld, Leddar

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Silicon Valley Business Journal reports that Velodyne CEO and Founder David Hall prepares to take the company public, but in an unconventional way of "direct listing" - selling shares direct to the public without an intermediate entity like NASDAQ:

"Only two major companies, Spotify and Slack Technologies, have gone that route so far. Businesses that take the direct listing route make their Wall Street debuts without the road shows and price-setting that underwriters help with. But they don't get the infusion of cash that accompanies a traditional IPO, either. Hall doesn't sound convinced that would change his mind.

"It turns out to be a lot more work for us," he said. "It looks daunting from my point of view, so I'm dragging my feet on the thing. The last few weeks have not been kind to IPOs either."

Velodyne Lidar is valued at about $1.8 billion after raising about $225 million from investors who include Nikon, Ford Motor Co. and Baidu, according to PitchBook Data.
"

BusinessWire: RoboSense wins the CES 2020 Innovation Award the second year in a row. This year’s Award is for the first MEMS-based Smart LiDAR Sensor, the RoboSense RS-LiDAR-M1, winning in the Vehicle Intelligence and Self-Driving Technology category. RS-LiDAR-M1 is said to be the world’s first and only MEMS-based smart LiDAR sensor for self-driving passenger vehicles with its own embedded AI algorithm technologies and SoC.


BusinessWire: Cepton announces its Helius Smart Lidar System has been named a CES 2020 Innovation Awards Honoree. Helius is honored in two categories: Tech for a Better World, which highlights product innovations aiming to make positive social and global impacts.

Helius fuses three technologies: Cepton’s patented Micro Motion Technology (MMT); edge computing for minimum data burden and maximum ease of integration; and built-in advanced perception software for real-time analytics.


Blickfeld too receives CES 2020 Award in Vehicle Intelligence & Transportation category. Blickfeld LiDARs use centimeter-sized mirrors with a scanning angle of up to 100° x 30° resulting in a range of up to 100 meters at 10 % reflectivity. The optical coaxial setup provides spatial filtering to achieve the highest sunlight suppression. Solid-state technology ensures mechanical robustness and longevity.


Leddar PIXELL wins CES 2020 Award in Vehicle Intelligence & Transportation category. Pixell is a 3D flash LiDAR solution with a 180-degree field of view specifically designed for ADAS and Autonomous driving applications on autonomous shuttles, commercial vehicles, transit buses, and robotaxis. It leverages LeddarTech's state-of-the-art LCA2 LeddarEngine at its core.

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Rumors and Other Questionable News

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Digitimes publishes an article saying that "Samsung Electronics is reportedly set to implement a US$100 billion sensor development project seeking to tap the lucrative worldwide sensor market."

SparrowNews quotes Chinese sources talking about "Sony Black Technology" used in not-yet-announced IMX686 sensor for smartphones:

"Sony officially said that Sony Black Technology not only created a variety of high-quality professional imaging equipment, but also provided a core component - image sensor for many brands of smartphones. The new year is not far off, let's look at the performance of the 2020 new cable image sensor." (Google translation)

"Sony's black technology not only creates a variety of high-quality professional imaging equipment, but also for a number of brands of smartphones to take pictures of the core components - image sensors. The new year is not far away, together to see the performance of the new 2020 Sotheby's image sensor." (Microsoft Bing translation)



SinoLink Securities expects Sony to unveil its 64MP 0.8um sensor till the end of this year. Possibly, the IMX686 is this sensor:

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Trieye SWIR Sensor Wins CES Innovation Awards

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PRNewswire: Israeli SWIR startup TriEye wins two CES 2020 Innovation Awards. TriEye's technology was selected as a recipient in the Embedded Technologies category, as well as Vehicle Intelligence and Transportation.

TriEye is breaking the status-quo of lidar, radar, and standard vision cameras with its CMOS-based SWIR camera. The company's advanced nanophotonics research enables a mass-produced, small size, HD SWIR camera at 1000x lower cost than the current technology.

"CES is an amazing showcase of the future of mobility and we are honored to be recognized by technology experts from the CES Innovation Awards," said Avi Bakal, CEO and Co-Founder of TriEye. "TriEye is committed to saving lives by reducing risks of car accidents in all weather and lighting conditions. We will continue to pave the way for the next generation of ADAS and AV functions with SWIR as a critical element in the necessary sensor fusion solution, enhancing vision at an affordable price."

"While TriEye's primary target market is the automotive industry, its technology is highly applicable to a wide range of other sectors, including mobile, industrial, security and optical inspection," said Ziv Livne, VP Product and Business Development of TriEye - "The company intends to address challenges and opportunities in these fields in the near future."

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ON Semi Sensors in Bad Weather

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ON Semi promotional video talks about its image sensor operation in inclement weather conditions:

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Himax Presents Q3 2019 Results

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GlobeNewswire: Himax announces its Q3 2019 results and related investors presentation:

"On CMOS image sensor business update. CMOS image sensor is another critical part of the WiseEye 2.0 NB solution I just mentioned. To support the lean camera design and high-quality image needed for laptops with thin bezels, we have made a 2-in-1 sensor that offers the duo capabilities of high quality HD image capturing and ultra-low-power, low resolution visual sensing in one single sensor, the industry’s first with the innovative design.

With this sensor, laptop makers can simplify their next generation product design and save costs by eliminating the need for an additional camera in their effort to offer context awareness for better user experience. In addition, our sensor has incorporated an RGBIR design to enable Windows Hello facial recognition. The new CMOS sensor will be available by the end of 2019.

For the traditional human vision segments, we see strong demand in notebooks, where we are one of the market leaders, and increased shipments for multimedia applications such as car recorders, surveillance, drones, home appliances, and consumer electronics, among others. Additionally, we have seen increased shipments and new design-wins in the automotive segment covering before-market solutions such as surround view and rearview camera.

Next on WiseEye, our AI-based ultra-low power smart sensing solution. The demand for battery-powered smart device with AI intelligent sensing is rapidly growing. Our total solution is built on Emza’s unique AI-based algorithm, on top of Himax’s proprietary computer vision processor and CMOS image sensor, all equipped with ultra-low power design. Currently laptop is the market of focus. Himax WiseEye 2.0 NB solution provides a ‘laptop-ready’ 3-in-1 RGB/IR/AI solution, respecting privacy while enhancing security for notebook users. The prototype we announced during Computex 2019 has been well received by leading CPU platform providers and laptop end customers who are now actively evaluating the technology. We are expected to demo the mass production version on laptops at the 2020 CES.
"

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SPW 2019 Materials

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Single Photon Workshop held in Politecnico di Milano, Italy, on Oct 21-25, 2019 publishes a book of its extended abstracts. Just a few of the interesting materials from the book:

Towards General-Purpose Passive Imaging with Single-Photon Sensors by Atul Ingle, Andreas Velten, Mohit Gupta, University of Wisconsin-Madison, Madison, WI, USA:


Quanta Image Sensor Progress by Jiaju Ma, Stanley Chan, and Eric R. Fossum, Gigajot Technology Corporation, Pasadena, CA, USA:


CMOS-SPAD arrays for Quantum Imaging Applications by L. Gasparini, M. Zarghami, M. Perenzoni, L. Parmesan, M. M. Garcia, V. Mitev, L. Balet, N. Torcheboeuf, D. Boiko, M. Unternährer, B. Bessire, A. Stefanov from Fondazione Bruno Kessler, Trento, Italy, CSEM, Neuchâtel, Switzerland, and Institute of Applied Physics, University of Bern, Bern, Switzerland


A Novel Approach to High Dynamic Range Imaging with CMOS-SPADs by Majid Zarghami, Leonardo Gasparini, Matteo Perenzoni, and Lucio Pancheri from Fondazione Bruno Kessler (FBK), Center for Material and Microsystems (CMM), Trento, Italy, and Department of Industrial Engineering, University of Trento, Trento, Italy:

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Digitimes Compares Sony and Samsung Approaches

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Digitimes Research: Sony and Samsung use different approaches in CIS competition:
  • Sony leverages the success of its 48MP sensors for smartphones and beats on integration of AI functionality onto the sensor
  • Samsung is trying to leapfrog Sony with 108MP smartphone chips and uses better process scaling capability to achieve higher pixel density
  • Sony controls 50% of CIS market
  • Smartphone CIS account for 60% of the market
  • Automotive CIS grow at a CAGR of 29.7% from 2019-2023

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Consumer Camera Sensors Comparison

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MDPI publishes a paper "Photographic Noise Performance Measures Based on RAW Files Analysis of Consumer Cameras" by by Jorge Igual from Universitat Politècnica de València, Spain.

"Photography is being benefited from the huge improvement in CMOS image sensors. New cameras extend the dynamic range allowing photographers to take photos with a higher quality than they could imagine one decade ago. However, the existence of different technologies make more complicated the photographic analysis of how to determine the optimal camera exposure settings. In this paper, we analyze how the different noise models are translated to different signal to noise SNR curve patterns and which factors are relevant. In particular, we discuss profoundly the relationships between exposure settings (shutter speed, aperture and ISO). Since a fair comparison between cameras can be tricky because of different pixel size, sensor format or ISO scale definition, we explain how the pixel analysis of a camera can be translated to a more helpful universal photographic noise measure based on human perception and common photography rules. We analyze the RAW files of different camera models and show how the noise performance analysis (SNR and dynamic range) interact with photographer’s requirements."

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Axcelis Talks about 12MeV Ion Implanter for Image Sensors

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Axcelis Q3 earnings call mentions 12MeV implanter for image sensors:

"The ...high energy product targets the most advanced image sensors. A Purion XE Max incorporates our new proprietary beam technology to deliver energy in excess of 12 MeV as well as the industry's lowest metal contamination.

The ...areas that are driving growth in mature process technology are image sensors and also power devices. Those segments for us remain very strong as customers come online with additional capacity.

During the third quarter, memory accounted for just 14% of our shipments, with the majority of shipments, 86% going to mature foundry/logic customers, particularly those manufacturing power devices and image sensors.

We expect revenues in Q4 to rebound due to increasing activity in China and continued investment by mature foundry/logic customers, particularly those with an emphasis on image sensors and power devices.

So as the new products are high energy implanters, the high energy market has been increasing as a result of demand for multiple high energy implant steps in image sensor and power device applications. This segment now accounts for 30% of the implant TAM.
"

Axcelis and Omnivision white paper shows quite deep doping profiles even with the older generation of their high energy implanters:

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Goodix Under-Display Fingerprint Sensor Reverse Engineering

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SystemPlus Consulting publishes reverse engineering report on the "Latest cost-optimized optical fingerprint sensor in Huawei P30 Pro smartphone."

"Synaptics launched the first optical fingerprint scanner on the market in 2018, with a lens-free solution. It was quickly followed by Goodix, also with a lens-free solution. This year, Goodix has launched its second generation optical fingerprint scanner, the first such product to use a lens.

The latest Goodix under-display optical fingerprint scanner has been found in Huawei P30 and P30 Pro, Vivo X23 and NEX S and other smartphones.

This scanner uses optical fingerprint technology that allows integration under the display. The new Goodix technology is radically different from those previously observed. Adding lenses reduces the pixel and CMOS image sensor die areas drastically, while keeping the same scanning area. The sensor die area and cost are much reduced.

The sensor has a resolution of 39,000 pixels, with a pixel density of 5,080ppi. The module’s light source is provided by the OLED display. The sensor is connected by wire bonding to the flexible printed circuit and uses a CMOS process.
"

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Samsung Registers Trademark for Its Event Driven Sensors

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Letsgodigital noticed Samsung filing for "ISOCELL Motion" trademark in Europe:

"Dynamic Vision Sensor (DVS); vision sensors; motion detecting sensors; object detecting sensors; automotive dynamic Vision Sensor (DVS) for object and motion detection; software for operating dynamic Vision Sensor (DVS);"

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Facial Recognition in Military Operations

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PRNewswire: Hawkeye Systems releases comments on the U.S. special operations raid that killed the Islamic State militant group's top terrorist Abu Bakr al-Baghdadi, who was identified through a combination of A.I. facial recognition technology and DNA analysis.

The US Special Operations Command's (SOCOM) use of A.I. facial recognition technology assisted in reducing several high-risk factors associated with the mission. Military officials and personnel declared the mission a success, which were also backed up by live surveillance feeds used to inform national security advisers of Special Operations efforts.

The military operation comes at a critical point where technology will begin to play a role in differentiating U.S. military capabilities globally. Imaging technology and powerful camera systems are essential to subdue threats and identify possible terrorists. With the increased adoption of AI systems in the military sector, the industry will be even more capable of differentiating between high-risk factors and non-threats.

"We are pleased to see the military leveraging camera technology with the use of facial recognition software," said Corby Marshall, founder and CEO of Hawkeye Systems. "Our recent CRADA agreement with the Department of Defense further exemplifies the necessity of AI-enabled camera systems, which not only improve training efficacy, but will also improve targeting, surveillance and recon for military leaders."

Hawkeye Systems' AXA camera system is equipped with volumetric capture and light field capture, which allows a wider field of view and superior real-time image processing capabilities. The AXA is intended to provide the military with a 360-degree, user-defined and customized, field of view in real-time that is exportable to multiple users or group outputs through various platforms simultaneously.

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Facial Recognition in Military Operations

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PRNewswire: Hawkeye Systems releases comments on the U.S. special operations raid that killed the Islamic State militant group's top terrorist Abu Bakr al-Baghdadi, who was identified through a combination of A.I. facial recognition technology and DNA analysis.

The US Special Operations Command's (SOCOM) use of A.I. facial recognition technology assisted in reducing several high-risk factors associated with the mission. Military officials and personnel declared the mission a success, which were also backed up by live surveillance feeds used to inform national security advisers of Special Operations efforts.

The military operation comes at a critical point where technology will begin to play a role in differentiating U.S. military capabilities globally. Imaging technology and powerful camera systems are essential to subdue threats and identify possible terrorists. With the increased adoption of AI systems in the military sector, the industry will be even more capable of differentiating between high-risk factors and non-threats.

"We are pleased to see the military leveraging camera technology with the use of facial recognition software," said Corby Marshall, founder and CEO of Hawkeye Systems. "Our recent CRADA agreement with the Department of Defense further exemplifies the necessity of AI-enabled camera systems, which not only improve training efficacy, but will also improve targeting, surveillance and recon for military leaders."

Hawkeye Systems' AXA camera system is equipped with volumetric capture and light field capture, which allows a wider field of view and superior real-time image processing capabilities. The AXA is intended to provide the military with a 360-degree, user-defined and customized, field of view in real-time that is exportable to multiple users or group outputs through various platforms simultaneously.

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