Nikon Z 800mm f6.3 VR S review

Cameralabs        Go to the original article...

The Z 800mm f6.3 VR S is Nikon's longest telephoto prime for Z-mount so far. It has a large f6.3 focal ratio and is aimed at pro sports and wildlife photographers. Here's my review.…

Go to the original article...

Nikon releases the NIKKOR Z 800mm f/6.3 VR S, a super-telephoto prime lens for the Nikon Z mount system

Nikon | Imaging Products        Go to the original article...

Go to the original article...

Accsoon M1 HDMI recorder review

Cameralabs        Go to the original article...

The Accsoon M1 is an adapter that lets you use an Android phone as an HDMI monitor, recorder, or streamer. It could save you money and weight over a dedicated recorder, so find out if it's right for you in my review!…

Go to the original article...

Nikon products receive the “Red Dot Award: Product Design 2022”

Nikon | Imaging Products        Go to the original article...

Go to the original article...

Hamamatsu videos

Image Sensors World        Go to the original article...

Hamamatsu has published new videos on their latest products and technologies.


ORCA-Quest quantitative CMOS (qCMOS) scientific camera: With ultra-low read noise of 0.27 electrons (rms), a high pixel count of 9.4 megapixels, and the ability to detect and quantify the number of photoelectrons, discover how our new camera can revolutionise scientific imaging applications.




Automotive LiDAR technologies - TechBites series: How recent advances in photonics, specifically in LiDAR, have played a major role in the move towards autonomous vehicles



InGaAs Cameras - TechBites Series: Short-wave infrared cameras and their applications today and in the future




Mini Spectrometers: What are mini-spectrometers and how can they be used in the medical industry?


Go to the original article...

Canon Group bolsters Label & Packaging growth strategy with acquisition of Edale

Newsroom | Canon Global        Go to the original article...

Go to the original article...

Better Piezoelectric Light Modulators for AMCW Time-of-Flight Cameras

Image Sensors World        Go to the original article...

A team from Stanford University's Laboratory for Integrated Nano-Quantum Systems (LINQS) and ArbabianLab present a new method that can potentially convert any conventional CMOS image sensor into an amplitude-modulated continuous-wave time-of-flight camera. The paper titled "Longitudinal piezoelectric resonant photoelastic modulator for efficient intensity modulation at megahertz frequencies" appeared in Nature Communications.

Intensity modulators are an essential component in optics for controlling free-space beams. Many applications require the intensity of a free-space beam to be modulated at a single frequency, including wide-field lock-in detection for sensitive measurements, mode-locking in lasers, and phase-shift time-of-flight imaging (LiDAR). Here, we report a new type of single frequency intensity modulator that we refer to as a longitudinal piezoelectric resonant photoelastic modulator. The modulator consists of a thin lithium niobate wafer coated with transparent surface electrodes. One of the fundamental acoustic modes of the modulator is excited through the surface electrodes, confining an acoustic standing wave to the electrode region. The modulator is placed between optical polarizers; light propagating through the modulator and polarizers is intensity modulated with a wide acceptance angle and record breaking modulation efficiency in the megahertz frequency regime. As an illustration of the potential of our approach, we show that the proposed modulator can be integrated with a standard image sensor to effectively convert it into a time-of-flight imaging system.



a) A Y-cut lithium niobate wafer of diameter 50.8 mm and of thickness 0.5 mm is coated on top and bottom surfaces with electrodes having a diameter of 12.7 mm. The wafer is excited with an RF source through the top and bottom electrodes. b) Simulated ∣s11∣ of the wafer with respect to 50 Ω, showing the resonances corresponding to different acoustic modes of the wafer (loss was added to lithium niobate to make it consistent with experimental results). The desired acoustic mode appears around 3.77 MHz and is highlighted in blue. c) The desired acoustic mode ∣s11∣ with respect to 50 Ω is shown in more detail. d) The dominant strain distribution (Syz) when the wafer is excited at 3.7696 MHz with 2 Vpp is shown for the center of the wafer. This strain distribution corresponds to the ∣s11∣ resonance shown in (c). e) The variation in Syz parallel to the wafer normal and centered along the wafer is shown when the wafer is excited at 3.7696 MHz with 2 Vpp.



a) Schematic of the characterization setup is shown. The setup includes a laser (L) with a wavelength of 532 nm that is intensity-modulated at 3.733704 MHz, aperture (A) with a diameter of 1 cm, neutral density filter (N), two polarizers (P) with transmission axis t^=(a^x+a^z)/2–√, wafer (W), and a standard CMOS camera (C). The wafer is excited with 90 mW of RF power at fr = 3.7337 MHz, and the laser beam passes through the center of the wafer that is coated with ITO. The camera detects the intensity-modulated laser beam. b) The desired acoustic mode is found for the modulator by performing an s11 scan with respect to 50 Ω using 0 dBm excitation power and with a bandwidth of 100 Hz. The desired acoustic mode is highlighted in blue. c) The desired acoustic mode is shown in more detail by performing an s11 scan with respect to 50 Ω using 0 dBm excitation power with a bandwidth of 20 Hz. d) The fabricated modulator is shown. e) The depth of intensity modulation is plotted for different angles of incidence for the laser beam (averaged across all the pixels), where ϕ is the angle between the surface normal of the wafer and the beam direction k^ (see “Methods” for more details). Error bars represent the standard deviation of the depth of intensity modulation across the pixels. f) Time-averaged intensity profile of the laser beam detected by the camera is shown for ϕ = 0. g) The DoM at 4 Hz of the laser beam is shown per pixel for ϕ = 0. h) The phase of intensity modulation at 4 Hz of the laser beam is shown per pixel for ϕ = 0.


a) Schematic of the imaging setup is shown. The setup includes a standard CMOS camera (C), camera lens (CL), two polarizers (P) with transmission axis t^=(a^x+a^z)/sqrt(2), wafer (W), aperture (A) with a diameter of 4 mm, laser (L) with a wavelength of 635 nm that is intensity-modulated at 3.733702 MHz, and two metallic targets (T1 and T2) placed 1.09 m and 1.95 m away from the imaging system, respectively. For the experiment, 140 mW of RF power at fr = 3.7337 MHz is used to excite the wafer electrodes. The laser is used for illuminating the targets. The camera detects the reflected laser beam from the two targets, and uses the 2 Hz beat tone to extract the distance of each pixel corresponding to a distinct point in the scene (see “Methods” for more details). b) Bird’s eye view of the schematic in (a). c) Reconstructed depth map seen by the camera. Reconstruction is performed by mapping the phase of the beat tone at 2 Hz to distance using Eq. (3). The distance of each pixel is color-coded from 0 to 3 m (pixels that receive very few photons are displayed in black). The distance of targets T1 and T2 are estimated by averaging across their corresponding pixels, respectively. The estimated distances for T1 and T2 are 1.07 m and 1.96 m, respectively (averaged across all pixels corresponding to T1 and T2). d) Ambient image capture of the field-of-view of the camera, showing the two targets T1 and T2. e The dimensions of the targets used for ToF imaging are shown.


The paper points out limitations of other approaches such as spatial light modulators and meta-optics, but doesn't mention any potential challenges or limitations of their proposed method. Interestingly, the authors cite some recent papers on high-resolution SPAD sensors to make the claim that their method is more promising than "highly specialized costly image sensors that are difficult to implement with a large number of pixels." Although the authors do not explicitly mention this in the paper, their piezoelectric material of choice (lithium niobate) is CMOS compatible. Thin-film deposition of lithium niobate on silicon using a CMOS process seems to be an active area of research (for example, see Mercante et al., Optics Express 24(14), 2016 and Wang et al., Nature 562, 2018.)

Go to the original article...

Two new papers on 55 nm Bipolar-CMOS-DMOS SPADs

Image Sensors World        Go to the original article...

The AQUA research group at EPFL together with Global Foundries have published two new articles on 55 nm Bipolar-CMOS-DMOS (BCD) SPAD technology in the upcoming issues of IEEE Journal of Selected Topics in Quantum Electronics.

Engineering Breakdown Probability Profile for PDP and DCR Optimization in a SPAD Fabricated in a Standard 55 nm BCD Process

 
Abstract:
 
CMOS single-photon avalanche diodes (SPADs) have broken into the mainstream by enabling the adoption of imaging, timing, and security technologies in a variety of applications within the consumer, medical and industrial domains. The continued scaling of technology nodes creates many benefits but also obstacles for SPAD-based systems. Maintaining and/or improving upon the high-sensitivity, low-noise, and timing performance of demonstrated SPADs in custom technologies or well-established CMOS image sensor processes remains a challenge. In this paper, we present SPADs based on DPW/BNW junctions in a standard Bipolar-CMOS-DMOS (BCD) technology with results comparable to the state-of-the-art in terms of sensitivity and noise in a deep sub-micron process. Technology CAD (TCAD) simulations demonstrate the improved PDP with the simple addition of a single existing implant, which allows for an engineered performance without modifications to the process. The result is an 8.8 μ\mu m diameter SPAD exhibiting ∼\sim 2.6 cps/ μ\mu m 2^2 DCR at 20 ∘^{\circ} C with 7 V excess bias. The improved structure obtains a PDP of 62% and ∼\sim 4.2% at 530 nm and 940 nm, respectively. Afterpulsing probability is ∼\sim 0.97% and the timing response is 52 ps FWHM when measured with integrated passive quench/active recharge circuitry at 3 V excess bias.

 

 

On Analog Silicon Photomultipliers in Standard 55-nm BCD Technology for LiDAR Applications

 
Abstract:
 
We present an analog silicon photomultiplier (SiPM) based on a standard 55 nm Bipolar-CMOS-DMOS (BCD) technology. The SiPM is composed of 16 x 16 single-photon avalanche diodes (SPADs) and measures 0.29 x 0.32 mm2. Each SPAD cell is passively quenched by a monolithically integrated 3.3 V thick oxide transistor. The measured gain is 3.4 x 105 at 5 V excess bias voltage. The single-photon timing resolution (SPTR) is 185 ps and the multiple-photon timing resolution (MPTR) is 120 ps at 3.3 V excess bias voltage. We integrate the SiPM into a co-axial light detection and ranging (LiDAR) system with a time-correlated single-photon counting (TCSPC) module in FPGA. The depth measurement up to 25 m achieves an accuracy of 2 cm and precision of 2 mm under the room ambient light condition. With co-axial scanning, the intensity and depth images of complex scenes with resolutions of 128 x 256 and 256 x 512 are demonstrated. The presented SiPM enables the development of cost-effective LiDAR system-on-chip (SoC) in the advanced technology. 
 
 



Go to the original article...

Product Videos: STMicro and Airy3D

Image Sensors World        Go to the original article...

Low power, low noise 3D iToF 0.5 Mpix sensor

The VD55H1 is a low-noise, low-power, 672 x 804 pixel (0.54 Mpix), indirect Time-of-Flight (iToF) sensor die manufactured on advanced backside-illuminated, stacked wafer technology. Combined with a 940 nm illumination system, it enables building a small form-factor 3D camera producing a high-definition depth map with typical ranging distance up to 5 meters in full resolution, and beyond 5 meters with patterned illumination. With a unique ability to operate at 200 MHz modulation frequency and more than 85% demodulation contrast, the sensor can produce depth precision twice as good as typical 100 MHz modulated sensors, while multifrequency operation provides long distance ranging. The low-power 4.6 µm pixel enables state-of-the-art power consumption, with average sensor power down to 80 mW in some modes. The VD55H1 outputs 12-bit RAW digital video data over a MIPI CSI-2 quad lane or dual lane interface clocked at 1.5 GHz. The sensor frame rate can reach 60 fps in full resolution and 120 fps in analog binning 2x2. ST has developed a proprietary software image signal processor (ISP) to convert RAW data into depth map, amplitude map, confidence map and offset map. Android formats like DEPTH16 and depth point cloud are also supported. The device is fully configurable through the I2C serial interface. It features a 200 MHz low-voltage differential signaling (LVDS) and a 10 MHz, 3-wire SPI interface to control the laser driver with high flexibility. The sensor is optimized for low EMI/EMC, multidevice immunity, and easy calibration procedure. The sensor die size is 4.5 x 4.9 mm and the product is delivered in the form of reconstructed wafers.


 



VD55G0 Consumer Global Shutter 0.4Mpix for Windows Hello Login

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.
 

 

 

DepthIQ from AIRY3D

The DEPTHIQ™ 3D computer vision platform converts any camera sensor into a single 3D sensor for generating both 2D images and depth maps that are co-aligned. DEPTHIQ uses diffraction to measure depth directly through an optical encoder called the transmissive diffraction mask which can be applied over any CMOS image sensor.


Go to the original article...

Canon Files Annual Report on Form 20-F for the Year Ended December 31, 2021

Newsroom | Canon Global        Go to the original article...

Go to the original article...

Black Phosphorus-based Intelligent Image Sensor

Image Sensors World        Go to the original article...

Seokhyeong Lee, Ruoming Peng, Changming Wu & Mo Li from U-Dub have published an article in Nature Communications titled "Programmable black phosphorus image sensor for broadband optoelectronic edge computing".

Our blog had advertised a pre-print version of this work back in November 2021: https://image-sensors-world.blogspot.com/2021/11/black-phosphorus-vision-sensor.html.

Abstract: Image sensors with internal computing capability enable in-sensor computing that can significantly reduce the communication latency and power consumption for machine vision in distributed systems and robotics. Two-dimensional semiconductors have many advantages in realizing such intelligent vision sensors because of their tunable electrical and optical properties and amenability for heterogeneous integration. Here, we report a multifunctional infrared image sensor based on an array of black phosphorous programmable phototransistors (bP-PPT). By controlling the stored charges in the gate dielectric layers electrically and optically, the bP-PPT’s electrical conductance and photoresponsivity can be locally or remotely programmed with 5-bit precision to implement an in-sensor convolutional neural network (CNN). The sensor array can receive optical images transmitted over a broad spectral range in the infrared and perform inference computation to process and recognize the images with 92% accuracy. The demonstrated bP image sensor array can be scaled up to build a more complex vision-sensory neural network, which will find many promising applications for distributed and remote multispectral sensing.



It is now peer reviewed and officially published as an open access paper: https://www.nature.com/articles/s41467-022-29171-1

Peer review report and authors' responses are also publicly available. In particular, it is interesting to see the response to some comments and about pixel non-uniformities, material stability during etching and longevity of the sensor prototype. 

Some lightly edited excerpts from the reviews and authors responses below:

Reviewer: The optical image of the exfoliated flake clearly shows regions of varying thickness. How did the authors ensure each pixel is of the same thickness? 

Authors: The mechanically exfoliated bP has several regions with different thicknesses. We fabricated all the pixels within a large region with uniform optical contrast, as outlined by the red dotted line, indicating uniform thickness. The thickness of the region is also confirmed with atomic force microscopy.

Reviewer: There is hardly any characterisation data provided for the material. How much of it is oxidised?

Authors: The oxidation of bP, it is indeed a concern. To mitigate that, we exfoliated and transferred bP in an Ar-filled glovebox. The device was immediately loaded into the atomic layer deposition (ALD) chamber to deposit the Al2O3 / HfO2 /Al2O3 (AHA) multilayers, which encapsulate the bP flake to prevent oxidation and degradation. This has been a practice reported in the literature, which generally leads to oxidation of only a few layers. Thanks to the 35 nm thick AHA encapsulation layer, our device shows long-term stability with persistent electrical and optical properties for more than 3 months after fabrication. We discuss that in the response to question 7. Furthermore, Raman spectroscopy shows no sign of Px Oy or Hx POy forming during the fabrication process. Thus, we expect that the oxidation of bP flake is no more than 3 layers (or 1.5 nm), which, if any, marginally affects the optical and electrical properties of the bP-PPT device. 

Reviewer: Why did the authors focus only on the IR range when the black phosphorus can be even more broadband into the visible at the thickness used here?

Authors: The photoresponsivity of black phosphorus certainly extends to the visible band. We have
utilized both the visible and the IR range by engineering the device with the AHA stack: IR light to input images for optoelectronic in-sensor computing; visible light to optically program the device by activating the trapped charges and process the encoded images such as pattern recognition.

Reviewer: How long do the devices keep working in a stable manner?

Authors: We agree with the reviewer that more lifetime measurement data is important to ensure the
stability of the device’s operation. We have evaluated the performance of the bP-PPT devices over a long period of time (up to 3 months) ... the gate modulation, memory window, on-off ratio, and retention time of our devices remain consistent even 3 months after they were fabricated.

In today's day and age of Twitter, it's refreshing to see how science really progresses behind the scenes --- reviewers raising genuine concerns about a new technique; authors graciously accepting limitations and suggesting improvements and alternative ways forward.

Go to the original article...

Sony Cyber-shot P1 retro review

Cameralabs        Go to the original article...

In the Year 2000, Sony launched the Cyber-shot P1, an impressively compact camera with 3.3 Megapixels and a 3x zoom that neatly folded into the candy-bar-styled body. In 2022 I take it out around Brighton for my latest retro review!…

Go to the original article...

“NIKKOR – The Thousand and One Nights (Tale 81) has been released”

Nikon | Imaging Products        Go to the original article...

Go to the original article...

Hamamatsu Develops World’s First THz Image Intensifier

Image Sensors World        Go to the original article...

Hamamatsu Photonics has developed the world’s first terahertz image intensifier (THz image intensifier or simply THz-I.I.) by leveraging its imaging technology fostered over many years. This THz-I.I. has high resolution and fast response which allows for real-time imaging of terahertz wave (*) pulses transmitted through or reflected from target objects.

This THz-I.I. will be unveiled at “The 69th JSAP (Japan Society of Applied Physics) Spring Meeting” held at the Sagamihara Campus of Aoyama Gakuin University (in Sagamihara City, Kanagawa Prefecture, Japan) for 5 days from Tuesday, March 22 to Saturday, March 26.
 

Terahertz waves are electromagnetic waves near a frequency of 1 THz and have the properties of both light and radio waves.








 


 

 Full press release: https://www.hamamatsu.com/content/dam/hamamatsu-photonics/sites/documents/01_HQ/01_news/01_news_2022/2022_03_14_en.pdf

Go to the original article...

Lensless camera for in vivo microscopy

Image Sensors World        Go to the original article...

A team comprised of researchers from Rice University and Baylor College of Medicine in Houston, TX has published a Nature Biomedical Engineering article titled "In vivo lensless microscopy via a phase mask generating diffraction patterns with high-contrast contours."

Abstract: The simple and compact optics of lensless microscopes and the associated computational algorithms allow for large fields of view and the refocusing of the captured images. However, existing lensless techniques cannot accurately reconstruct the typical low-contrast images of optically dense biological tissue. Here we show that lensless imaging of tissue in vivo can be achieved via an optical phase mask designed to create a point spread function consisting of high-contrast contours with a broad spectrum of spatial frequencies. We built a prototype lensless microscope incorporating the ‘contour’ phase mask and used it to image calcium dynamics in the cortex of live mice (over a field of view of about 16 mm2) and in freely moving Hydra vulgaris, as well as microvasculature in the oral mucosa of volunteers. The low cost, small form factor and computational refocusing capability of in vivo lensless microscopy may open it up to clinical uses, especially for imaging difficult-to-reach areas of the body.

 


 


 


 

Link to full article (open access): https://www.nature.com/articles/s41551-022-00851-z

Press release: https://www.photonics.com/Articles/Lensless_Camera_Captures_Cellular-Level_3D_Details/a67869

Go to the original article...

Nikon Z9 review so far

Cameralabs        Go to the original article...

The Z9 is Nikon’s flagship camera, engineered to delight pro sports and wildlife photographers, high-end videographers and pretty much everyone inbetween. Find out how it performed during an afternoon of track cycling at London’s Olympic Velodrome!…

Go to the original article...

Canon celebrates 19th consecutive year of No. 1 share of global interchangeable-lens digital camera market

Newsroom | Canon Global        Go to the original article...

Go to the original article...

Lensless Imaging with Fresnel Zone Plates

Image Sensors World        Go to the original article...

Although the idea of Fresnel zone plates is not new and can be traced back several decades to X-ray imaging and perhaps to Fresnel's original paper from 1818*, there is renewed interest in this idea for visible light imaging due to the need for compact form-factor cameras.

This 2020 article in the journal Light: Science and Applications by a team from Tsinghua University and MIT describes a lensless image sensor with a compressed-sensing style inverse reconstruction algorithm for high resolution color imaging.

Lensless imaging eliminates the need for geometric isomorphism between a scene and an image while allowing the construction of compact, lightweight imaging systems. However, a challenging inverse problem remains due to the low reconstructed signal-to-noise ratio. Current implementations require multiple masks or multiple shots to denoise the reconstruction. We propose single-shot lensless imaging with a Fresnel zone aperture and incoherent illumination. By using the Fresnel zone aperture to encode the incoherent rays in wavefront-like form, the captured pattern has the same form as the inline hologram. Since conventional backpropagation reconstruction is troubled by the twin-image problem, we show that the compressive sensing algorithm is effective in removing this twin-image artifact due to the sparsity in natural scenes. The reconstruction with a significantly improved signal-to-noise ratio from a single-shot image promotes a camera architecture that is flat and reliable in its structure and free of the need for strict calibration.








Full article is available here: https://www.nature.com/articles/s41377-020-0289-9

* "Calcul de l'intensité de la lumière au centre de l'ombre d'un ecran et d'une ouverture circulaires eclairés par un point radieux," in Œuvres Complètes d'Augustin Fresnel 1866-1870. https://gallica.bnf.fr/ark:/12148/bpt6k1512245j/f917.item

Go to the original article...

[Updated] 2022 International SPAD Sensor Workshop Final Program Available

Image Sensors World        Go to the original article...

About ISSW 2022

Devices | Architectures | Applications

The International SPAD Sensor Workshop focuses on the study, modeling, design, fabrication, and characterization of SPAD sensors. The workshop welcomes all researchers, practitioners, and educators interested in SPADs, SPAD imagers, and associated applications, not only in imaging but also in other fields.

The third edition of the workshop will gather experts in all areas of SPADs and SPAD related applications using Internet virtual conference technology.  The program is under development, expect three full days of with over 40 speakers from all over the world. This edition is sponsored by ams OSRAM.

Workshop website: https://issw2022.at/

Final program: https://issw2022.at/wp-content/uploads/2022/03/amsOSRAM_ISSW22_Program_3003.pdf











Go to the original article...

State of the Image Sensor Market

Image Sensors World        Go to the original article...

Sigmaintell report on smartphone image sensors

According to Sigmaintell, the global mobile phone image sensor shipments in 2021 will be approximately 5.37B units, a YoY decrease of about 11.8%; among which, the global mobile phone image sensor shipments in 4Q21 will be about 1.37B units, a YoY decrease. About 25.3%. At the same time, it is estimated that the global mobile phone image sensor shipments will be about 5.50B in 2022, a year-on-year increase of about 2.5%. In 1H21, due to the long ramp-up cycle of ultra-high pixel production capacity and the squeeze of low-end pixel production capacity by other applications, there was a short-term structural imbalance and market price fluctuations rose. In 2H21, the production capacity of Samsung and Sony’s external foundries was released steadily and significantly, but the sales in the terminal market were lower than expected and the stocking plan was lowered again, resulting in an oversupply in the overall image sensor market.





Business Korea report about Samsung CIS foundry capacity expansion


Samsung Electronics will expand its foundry capacity in legacy nodes starting in 2022. The move is aimed at securing new customers and boosting profitability by increasing the production capacity of mature processes for such items as CMOS image sensors (CISs), which are in growing demand due to a prolonged shortage. At the same time, Samsung Electronics is planning to start volume production of advanced chips on its sub-3nm fabrication process in 1H22. Samsung Electronics plans to secure up to 300 foundry customers by 2026 and triple production from the 2017 level. (Laoyaoba, Business Korea)



Yole announces a new edition of its "Imaging for Security" Market report

https://www.i-micronews.com/products/imaging-for-security-2022














Yole announces a new edition of its "Imaging for Automotive" market report

Flyer: https://s3.i-micronews.com/uploads/2022/03/YINTR22245-Imaging-for-Automotive-2022-Product-Brochure.pdf













Strategy Analytics estimates USD15.1B global smartphone image sensor market in 2021

According to Strategy Analytics, the global smartphone Image sensor market in 2021 secured a total revenue of USD15.1B. Strategy Analytics finds that the smartphone image sensor market witnessed a revenue growth of more than 3% YoY in 2021. Sony Semiconductor Solutions topped with 45% revenue share followed by Samsung System LSI and OmniVision in 2021. The top 3 vendors captured nearly 83% revenue share in the global smartphone image sensor market in 2021. In terms of smartphone multi-camera application, Image sensors for Depth and Macro application reached 30 percent share while those for Ultrawide application exceeded 15% share.




ijiwei Insights predicts drop in mobile phone camera prices

In 2022, some manufacturers will reportedly reduce the price of mobile phone camera CIS several times. Currently, the cost down of phone camera CIS has penetrated into the camera chip products of 2MP, 5MP and 8MP. Among them, the unit price of 2MP and 5MP mobile phone camera CIS fell by about 20% and more than 30% year-on-year, respectively. [source]

Go to the original article...

New 3D Imaging Method for Microscopes

Image Sensors World        Go to the original article...

New method for high resolution three dimension microscopic imaging being explored.


"This method, named bijective illumination collection imaging (BICI), can extend the range of high-resolution imaging by over 12-fold compared to the state-of-the-art imaging techniques," says Pahlevani

Fig. 1 | BICI concept. 
a, The illumination beam is generated by collimated light positioned off the imaging optical axis. 
b, The metasurface bends a ray family (sheet) originating from an arc of radius r by a constant angle β to form a focal point on the z axis. A family of rays originating from the same arc is shown as a ray sheet. 
c, Ray sheets subject to the same bending model constitute a focal line along the z axis. The focal line is continuous even though a finite number of focal points is illustrated for clarity. 
d, The collection metasurface establishes trajectories of collected light in ray sheets, as mirror images of illumination paths with respect to the x–z plane. This configuration enables a one-to-one correspondence, that is, a bijective relation between the focal points of the illumination and collection paths, to eliminate out-of-focus signals. The magnified inset demonstrates the bijective relation. 
e, Top view of the illumination and collection beams. 
f, Schematic of the illumination and collection beams and a snapshot captured using a camera from one of the lateral planes intersecting the focal line, illustrating the actual arrangement of illumination and collection paths. This arrangement allows only the collection of photons originating from the corresponding illumination focal point.


Metasurface-based bijective illumination collection imaging provides high-resolution tomography in three dimensions (Masoud Pahlevaninezhad, Yao-Wei Huang , Majid Pahlevani , Brett Bouma, Melissa J. Suter , Federico Capasso  and Hamid Pahlevaninezhad )

Go to the original article...

Photonics Spectra article about Gigajot’s QIS Tech

Image Sensors World        Go to the original article...

The March 2022 edition of Photonics Spectra magazine has an interesting article titled "Photon-Counting CMOS Sensors: Extend Frontiers in Scientific Imaging" by Dakota Robledo, Ph.D., senior image sensor scientist at Gigajot Technology.

While CMOS imagers have evolved significantly since the 1960s, photon-counting sensitivity has still requir