International Image Sensors Workshop (IISW) 2023 Program and Pre-Registration Open

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The 2023 International Image Sensors Workshop announces the technical programme and opens the pre-registration to attend the workshop.

Technical Programme is announced: The Workshop programme is from May 22nd to 25th with attendees arriving on May 21st. The programme features 54 regular presentations and 44 posters with presenters from industry and academia. There are 10 engaging sessions across 4 days in a single track format. On one afternoon, there are social trips to Stirling Castle or the Glenturret Whisky Distillery. Click here to see the technical programme.

Pre-Registration is Open: The pre-registration is now open until Monday 6th Feb. Click here to pre-register to express your interest to attend.

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2023 International Image Sensors Workshop – Call for Papers

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The 2023 International Image Sensors Workshop (IISW) will be held in Scotland from 22-25 May 2023. The first call for papers is now available at this link: 2023 IISW CFP.



2023 International Image Sensor Workshop

Crieff Hydro Hotel, Scotland, UK

22-25 May, 2023

The 2023 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. Now in its 35th year, the workshop will return to an in-person format. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is the tradition, the 2023 workshop will emphasize an open exchange of information among participants in an informal, secluded setting beside the Scottish town of Crieff. The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and poster papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Papers on the following topics are solicited:

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels and imagers
Techniques for increasing QE, well capacity, reducing crosstalk, and improving angular response
Front side illuminated, back side illuminated, and stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and 3D, CAD for design and simulation, improved models

Application Specific Imagers
Image sensors and pixels for range sensing: LIDAR, TOF,
RGBZ, Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging,
computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Backside thinning
New characterization methods
Defects & leakage current

On-chip optics and imaging process technology
Advanced optical path, Color filters, Microlens, Light guides
Nanotechnologies for Imaging
Wafer level cameras
Packaging and testing: Reliability, Yield, Cost
Stacked imagers, 3D integration
Radiation damage and radiation hard imager


General Workshop Co-Chairs
Robert Henderson – The University of Edinburgh
Guy Meynants – Photolitics and KU Leuven

Technical Program Chair
Neale Dutton – ST Microelectronics

Technical Program Committee
Jan Bogaerts - GPixel, Belgium
Calvin Yi-Ping Chao - TSMC, Taiwan
Edoardo Charbon - EPFL, Switzerland
Bart Dierickx - Caeleste, Belgium
Amos Fenigstein - TowerJazz, Israel
Manylun Ha -  DB Hitek, South Korea
Vladimir Korobov - ON Semiconductor, USA
Bumsuk Kim - Samsung, South Korea
Alex Krymski - Alexima, USA
Jiaju Ma - Gigajot, USA
Pierre Magnan - ISAE, France
Robert Daniel McGrath - Goodix Technology, US 
Preethi Padmanabhan - AMS-Osram, Austria
Francois Roy - STMicroelectronics, France
Andreas Suess - Omnivision Technologies, USA

IISS Board of Directors
Boyd Fowler – OmniVision
Michael Guidash – R.M. Guidash Consulting
Robert Henderson – The University of Edinburgh
Shoji Kawahito – Shizuoka University and Brookman Technology
Vladimir Koifman – Analog Value
Rihito Kuroda – Tohoku University
Guy Meynants – Photolitics
Junichi Nakamura – Brillnics
Yusuke Oike – Sony (Japan)
Johannes Solhusvik – Sony (Norway)
Daniel Van Blerkom – Forza Silicon-Ametek
Yibing Michelle Wang – Samsung Semiconductor

ISS Governance Advisory Committee:
Eric Fossum - Thayer School of Engineering at Dartmouth, USA
Nobukazu Teranishi - University of Hyogo, Japan
Albert Theuwissen - Harvest Imaging, Belgium / Delft University of Technology, The Netherlands

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[Updated] 2022 International SPAD Sensor Workshop Final Program Available

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About ISSW 2022

Devices | Architectures | Applications

The International SPAD Sensor Workshop focuses on the study, modeling, design, fabrication, and characterization of SPAD sensors. The workshop welcomes all researchers, practitioners, and educators interested in SPADs, SPAD imagers, and associated applications, not only in imaging but also in other fields.

The third edition of the workshop will gather experts in all areas of SPADs and SPAD related applications using Internet virtual conference technology.  The program is under development, expect three full days of with over 40 speakers from all over the world. This edition is sponsored by ams OSRAM.

Workshop website:

Final program:

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Telluride Neuromorphic Workshop 2022

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The 2022 edition of the Telluride Neuromorphic Workshop series will be held in-person June 26 to July 16 in beautiful Telluride, Colorado. The topics of interest are broadly in "neuromorphic engineering" with neuromorphic vision sensors (including event cameras and other "spiking"-based vision sensors) being key areas of interest.

Neuromorphic engineers design and fabricate artificial neural systems whose organizing principles are based on those of biological nervous systems. Over the past 27 years, the neuromorphic engineering research community focused on the understanding of low-level sensory processing and systems infrastructure; efforts are now expanding to apply this knowledge and infrastructure to addressing higher-level problems in perception, cognition, and learning. In this 3-week intensive workshop and through the Institute for Neuromorphic Engineering (INE), the mission is to promote interaction between senior and junior researchers; to educate new members of the community; to introduce new enabling fields and applications to the community; to promote ongoing collaborative activities emerging from the Workshop, and to promote a self-sustaining research field.

The workshop will be organized in four topic areas

  • Neuromorphic Tactile Exploration (Enhance the tactile exploration capabilities of robots)
  • Lifelong Learning at Scale: From Neuroscience Theory to Robotic Applications (Apply neuro-inspired principles of lifelong learning to autonomous systems.)
  • Cross-modality brain signals: auditory, visual and motor 
  • Neuromorphics Tools, Techniques and Hardware (SpiNNaker 2 and FPAAs)

Researchers from academia, industry and national labs are all encouraged to apply... 

... in particular if they are prepared to work on specific projects, talk about their own work or bring demonstrations to Telluride (e.g. robots, chips, software). 

An application is required to attend, and financial support is available. Application deadline is April 8, 2022.

Call for applications.

Application submission page.

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Phone photography tips

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Today's phones feature very respectable cameras that are capable of great results. Making the most of them involves a combination of applying traditional techniques and embracing modern technology. In my series of video tutorials, I'll show you how to take better photos with your phone! …

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South Africa Safari Photography

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A classic African safari is on the bucket list of many photographers, but it can be hard to return with images that do justice to your memories. In my workshop I'll share my tips to photographing wildlife in South Africa, and see how the latest technologies can make it easier.…

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