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BusinessWire: AEye, the developer of iDAR, announces the second close of its Series B financing, bringing the company’s total funding to over $60 million. AEye Series B round includes Hella Ventures, SUBARU-SBI Innovation Fund, LG Electronics, and SK Hynix. AEye previously announced that the round was led by Taiwania Capital along with existing investors Kleiner Perkins, Intel Capital, Airbus Ventures, R7 Partners, and an undisclosed OEM.

AEye's iDAR physically fuses the 1550nm solid-state LiDAR with a high-resolution camera to create a new data type called Dynamic Vixels. This real-time integration occurs in the IDAR sensor, rather than post fusing separate camera and LiDAR data after the scan. By capturing both geometric and true color (x,y,z and r,g,b) data, Dynamic Vixels uniquely mimic the data structure of the human visual cortex, capturing better data for vastly superior performance and accuracy.

“This funding marks an inflection point for AEye, as we scale our staff, partnerships and investments to align with our customers’ roadmap to commercialization,” said Luis Dussan, AEye founder and CEO. “The support we have received from major players in the automotive industry validates that we are taking the right approach to addressing the challenges of artificial perception. Their confidence in AEye and iDAR will be borne out by the automotive specific products we'll be bringing to market at scale in Q2 of 2019. These products will help OEMs and Tier 1s accelerate their products and services by delivering market leading performance at the lowest cost.”

Aeye AE110 iDAR is fusing 1550nm solid-state agile MOEMS LiDAR, a low-light HD camera, and embedded AI to intelligently capture data at the sensor level. The AE110’s pseudo-random beam distribution search option makes the system eight times more efficient than fixed pattern LiDARs. The AE110 is said to achieve 16 times greater coverage of the entire FOV at 10 times the frame rate (up to 100 Hz) due to its ability to support multiple regions of interest for both LiDAR and camera.

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VentureBeat: LightOn, a Paris, France-based AI startup, has closed a $3.3M (€2.9M) seed funding round. LightOn is developing a new optics-based data processing technology for AI. Leveraging compressive sensing, LightOn’s hardware and software can make Artificial Intelligence computations both simpler and orders of magnitude more efficient. The technology, licensed by PSL Research University, was originally developed at several of Paris’ leading research institutions.

For the past few months, LightOn has allowed access to their Optical Processing Units (OPU) to a select group of beta customers through the LightOn Cloud, thanks to a partnership with OVH, Europe’s leading cloud provider. First users from both Academia and Industry have already successfully demonstrated impressive results on this hybrid CPU/GPU/OPU server, outperforming silicon-only computing technology in a variety of large scale Machine Learning tasks. Typical use cases currently include transfer learning, change point detection, or time series prediction.

LightOn’s CEO, Igor Carron said, “It’s an exciting time as Artificial Intelligence develops rapidly. The requirements as usage scales necessitate improved power efficiency and performance. LightOn’s technology addresses these monumental challenges.“

LightOn's OPU technology has been presented in 2015 arxiv.org paper "Random Projections through multiple optical scattering: Approximating kernels at the speed of light" by Alaa Saade, Francesco Caltagirone, Igor Carron, Laurent Daudet, Angélique Drémeau, Sylvain Gigan, Florent Krzakala

"Random projections have proven extremely useful in many signal processing and machine learning applications. However, they often require either to store a very large random matrix, or to use a different, structured matrix to reduce the computational and memory costs. Here, we overcome this difficulty by proposing an analog, optical device, that performs the random projections literally at the speed of light without having to store any matrix in memory. This is achieved using the physical properties of multiple coherent scattering of coherent light in random media. We use this device on a simple task of classification with a kernel machine, and we show that, on the MNIST database, the experimental results closely match the theoretical performance of the corresponding kernel. This framework can help make kernel methods practical for applications that have large training sets and/or require real-time prediction. We discuss possible extensions of the method in terms of a class of kernels, speed, memory consumption and different problems."

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Himax December 2018 factsheet sets 3D imaging as one of the company's main growth opportunities:

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SenseTime Research and Tsinghua University publish arxiv.org paper "Very Power Efficient Neural Time-of-Flight" by Yan Chen, Jimmy S. Ren, Xuanye Cheng, Keyuan Qian, and Jinwei Gu.

"Time-of-Flight (ToF) cameras require active illumination to obtain depth information thus the power of illumination directly affects the performance of ToF cameras. Traditional ToF imaging algorithms is very sensitive to illumination and the depth accuracy degenerates rapidly with the power of it. Therefore, the design of a power efficient ToF camera always creates a painful dilemma for the illumination and the performance trade-off. In this paper, we show that despite the weak signals in many areas under extreme short exposure setting, these signals as a whole can be well utilized through a learning process which directly translates the weak and noisy ToF camera raw to depth map. This creates an opportunity to tackle the aforementioned dilemma and make a very power efficient ToF camera possible. To enable the learning, we collect a comprehensive dataset under a variety of scenes and photographic conditions by a specialized ToF camera. Experiments show that our method is able to robustly process ToF camera raw with the exposure time of one order of magnitude shorter than that used in conventional ToF cameras. In addition to evaluating our approach both quantitatively and qualitatively, we also discuss its implication to designing the next generation power efficient ToF cameras. We will make our dataset and code publicly available."

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FLIR (former Point Grey) publishes a Periodic Table of Image Sensors for industrial and machine vision applications - a nice attempt to make an order in somewhat messy product lines from different companies. The high resolution pdf files can be downloaded from December 2019 issue of FLIR Insights newsletter:

"With so many sensors coming from different manufacturers, it's hard to remember them all. To help with this, we are giving away a handy guide that organizes 120 sensors, from classic CCDs to the latest CMOS technology, based on resolution, readout method, speed, and FPS. We suggest downloading and laminating it, then pinning it on your wall for easy reference. You will never have to memorize sensor names again. Enjoy, and have a happy holiday!"

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SystemPlus Consulting publishes teardown report on Xiaomi Mi 8 Explorer Edition smartphone featuring Mantis Vision structured light 3D module on the front side:

"Xiaomi has chosen Mantis Vision’s solution and its coded structured light to provide the 3D sensing capability. The 3D systems comprise a dot projector and a camera module assembly configuration. On the receiver side, the near infrared (NIR) image is captured by a global shutter (GS) NIR camera module.

The front optical hub is packaged in one metal enclosure, featuring several cameras and sensors. The complete system features a red-green-blue (RGB) camera module, a proximity sensor and an ambient light sensor. The 3D depth sensing system comprises the NIR camera module, the flood illuminator and the dot projector.

All components are standard products that can be readily found in the market. That includes a GS image sensor featuring 3µm x 3µm pixels and standard resolution of one megapixel and two vertical cavity surface emitting lasers (VCSELs), one for the dot projector and one for the flood illuminator. Both are from the same supplier. Both the camera and dot projector use standard camera module assemblies with wire bonding and optical modules featuring lenses. In order to provide coded structured light features, a mask is integrated into the dot projector structure."

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Espros Photonics announces ToF Developers Conference to be held in San Francisco on January 29–31, 2019:

"A successful design of a 3D TOF camera for example needs a deep understanding of the underlying optical physics - theoretical and practical. In addition, the behavioral model of the imaging system and an excellent understanding of the sensing artifacts in real applications is key knowhow. And further more, thermal management is an issue because these cameras have an active illumination, typically quite powerful. And, as a consequence,
eye-safety becomes an issue as well. A TOF camera consist of 9 functional building blocks which have to be understood and fine-tuned carefully to create a powerful but cost effective design.

So, many more disciplines than just electronics and software are in the game. It's not rocket science, but the relevant understanding of these 9 blocks is a must to know if someone gets the duty to design a 3D TOF camera

There is, at least to our knowledge, no engineering school which addresses TOF and LiDAR as an own discipline. We at ESPROS decided to fill the gap with a training program called TOF Developer Conference. The objective is to provide a solid theoretical background, a guideline to working implementations based on examples and practical work with TOF systems. Thus, the TOF Developer Conference shall become the enabler for electronics engineers (BS and MS in EE engineering) to design working TOF systems. It is ideally for engineers who are or will be, involved in the design of TOF system. We hope that our initiative helps to close the gap between the desire of TOF sensors to massively deployed TOF applications.

Course topics:

TOF history; TOF principles; main parts of a TOF camera; relevant optical physics; light detection; receiver physics; noise considerations; SNR; light emission and light sources; eye safety; light power budget calculation; optics basics; optical systems and key requirements; bringing it all together; electronics, PCB layout guidelines; power considerations; calibration and compensation; filtering computing power requirements; interference detection and suppression; artifacts and how to deal with them; practical lab experiments; Q&A; much more…"


The next two ToF conferences are planned to be held in China: Shanghai on April 2, 2019 and Shenzhen on April 9, 2019.

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Sony announces the 1/1.55-inch, 5.4MP (effective) IMX490 CMOS sensor for automotive cameras. Sony will begin shipping samples in March 2019.

The new sensor simultaneously achieves HDR and LED flicker mitigation at what Sony calls the industry’s highest 5.4MP resolution in automotive cameras. Sony has also improved the saturation illuminance through a proprietary pixel structure and exposure method. When using the HDR imaging and LED flicker mitigation functions at the same time, this offers a wide 120dB DR (measured in accordance to the EMVA 1288 standard. 140dB when set to prioritize DR.) This DR is said to be three times higher than that of the previous product. This means highlight oversaturation can be mitigated, even in situations where 100,000 lux sunlight is directly reflecting off a light-colored car in the front, and the like, thereby capturing the subject more accurately even under road conditions where there is a dramatic lighting contrast such as when entering and exiting a tunnel.

Moreover, this unique method is said to prevent motion artifacts that occur when capturing moving subjects compared with other HDR technologies. The new sensor also improves the sensitivity by about 15% compared to that of the previous generation product, improving the capability to recognize pedestrians and obstacles in low illuminance conditions of 0.1 lux, the equivalent of moonlight.

This product is scheduled to meet the AEC-Q100 Grade 2 reliability standards for automobile electronic components for mass production. Sony has also introduced a development process compliant with ISO 26262 functional safety standards for automobiles to ensure that design quality meets the functional safety requirements for automotive applications, thereby supporting functional safety level ASIL D for fault detection, notification and control.*6 Moreover, the new sensor has security functions to protect the output image from tampering.

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BusinessWire: Ambarella introduces the CV22AQ automotive camera SoC, featuring the Ambarella CVflow computer vision architecture for powerful Deep Neural Network (DNN) processing. Target applications include front ADAS cameras, electronic mirrors with Blind Spot Detection (BSD), interior driver and cabin monitoring cameras, and Around View Monitors (AVM) with parking assist. Fabricated in advanced 10nm process technology, its low power consumption supports the small form factor and thermal requirements of windshield-mounted forward ADAS cameras.

The CV22AQ’s CVflow architecture provides computer vision processing in 8MP resolution at 30 fps, to enable object recognition over long distances and with high accuracy. CV22AQ supports multiple image sensor inputs for multi-FOV cameras and can also create multiple digital FOVs using a single high-resolution image sensor to reduce system cost.

“To date, front ADAS cameras have been performance-constrained due to power consumption limits inherent in the form factor,” said Fermi Wang, CEO of Ambarella. “CV22AQ provides an industry-leading combination of outstanding neural network performance and very low typical power consumption of below 2.5 watts. This breakthrough in power and performance, coupled with best-in-class image processing, allows tier-1 and OEM customers to greatly increase the performance and accuracy of ADAS algorithms.”

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SEMI: Total fab equipment spending in 2019 is projected to drop 8%, a sharp reversal from the previously forecast increase of 7% as fab investment growth has been revised downward for 2018 to 10% from the 14% predicted in August, according to the latest edition of the World Fab Forecast Report.

However, image sensor fab spending remains a bright spot: "Opto – especially CMOS image sensors – shows strong growth, surging 33 percent to US$3.8 billion in 2019:"

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IFNews: Credit Suisse report on mobile phone market analyses the market trends:

"The CIS business continues to see a shift toward higher resolutions and multi-camera phones. Multi-camera phones accounted for 65% of iPhone and 44% of Android phone production in Jul–Sep 2018 in an indication that the trend is accelerating. We now assume a multi-camera weighting of 40% (previously 35%) for 2018 and 50% (45%) for 2019, including an increase from 7% to 10% for triple-camera phones in 2019. This represents a tailwind for profits at Sony (6758), as do improvement in the sales mix accompanying the shift toward higher resolutions and larger sensors.

While the smartphone market is looking sluggish overall, we expect continued profit growth for Sony's CIS business in 2H FY3/19 and out as the number of sensors per smartphone increases, the sales mix improves (higher resolutions, larger sizes), and the company gains market share in supplying Chinese smartphone makers. We think the business could continue to drive companywide profits in FY3/20 and remain generally expectant of its potential.

TOF sensors: In our report on the previous survey, we said that some module makers think the 2019 models are likely to incorporate rear time-of-flight (TOF) sensors, but some device makers regard this as unlikely. However, based on the current survey, we now think TOF sensors will probably be first adopted in the 2020 models rather than the 2019 models.

We said in our previous survey report that Samsung was targeting a multi-camera weighting of 50% (triple camera 20%, dual camera 30%) in 2019, but our latest survey indicates a growing possibility of a 70% target triple/quadruple camera 20%, dual camera 50%). Samsung appears to be currently planning for around 10 triple- or quadruple-camera models as well as phones with 5x zoom folded optics cameras and pop-up cameras. The company is considering megapixel combinations of 48MP-16MP-13MP and 48MP-10MP-5MP for triple camera models while also looking at 48MP-8MP-5MP, 32MP-8MP-5MP, and 16MP-8MP-5MP.

In CY19, we think the smartphone manufacturers will adopt triple-camera and triple/quadruple-camera systems on a full scale, mainly in their high-end phones, and we expect them to also build large 48MP sensors into their phones. We believe companies like Huawei, Oppo, and Xiaomi will consider adopting 5x-zoom folding optics systems. Regarding OISs, we project that the smartphone manufacturers will use CIS technology in their main cameras and shift to shape memory alloy (SMA) OISs and away from VCM type OISs in response to the increase in lens size.

Sony will likely be the sole supplier of 48MP sensors for the spring models. Samsung LSI 12MP/48MP-sensor re-mosaic technology is lagging, and we project that it will be mid-CY19 at the earliest before it is adopted in high-end phones. Consequently, we think Samsung LSI CISs that are 48MP in the catalog specs but 12MP in actual image quality will probably be used in midrange spring models. We think that in China, demand for 24MP CISs, mainly for phones with two front-side cameras, has reached around 100mn units per year. We think that in CY19, demand for 48MP CISs for rear-side cameras could increase to roughly 150mn units.

CIS supplies remain tight, particularly for 2/5/8MP CISs manufactured using an 8-inch process. Tight supplies of CISs for high-end models in CY19, owing to the transition to large 48MP sensors, are a concern."

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This year, IEDM had quite a lot of image sensor papers. Some of them talking about HDR and GS are briefly reviewed below:

1.5µm dual conversion gain, backside illuminated image sensor using stacked pixel level connections with 13ke- full-well capacitance and 0.8e- noise
V. C. Venezia, A. C-W Hsiung, K. Ai, X. Zhao, Zhiqiang Lin, Duli Mao, Armin Yazdani, Eric A. G. Webster, L. A. Grant, OmniVision Technologies

Omnivision presented two stacked designs with pixel-level interconnects. Design A has been selected as a more optimal from the DR point of view:


A 0.68e-rms Random-Noise 121dB Dynamic-Range Sub-pixel architecture CMOS Image Sensor with LED Flicker Mitigation
S. Iida, Y. Sakano, T. Asatsuma, M. Takami, I. Yoshiba, N. Ohba, H. Mizuno, T. Oka, K. Yamaguchi, A. Suzuki, K. Suzuki, M. Yamada, M. Takizawa, Y. Tateshita, and K. Ohno, Sony Semiconductor

Sony presented its version of Big-Little PDs in a single pixel:


A 24.3Me- Full Well Capacity CMOS Image Sensor with Lateral Overflow Integration Trench Capacitor for High Precision Near Infrared Absorption Imaging
M. Murata, R. Kuroda, Y. Fujihara, Y. Aoyagi, H. Shibata*, T. Shibaguchi*, Y. Kamata*, N. Miura*, N. Kuriyama*, and S. Sugawa, Tohoku University, *LAPIS Semiconductor Miyagi Co., Ltd.

Tohoku University and LAPIS present an evolution of their LOFIC pixel with deeply depleted PDs on 1e12 cm-3 doped substrate:


HDR 98dB 3.2µm Charge Domain Global Shutter CMOS Image Sensor (Invited)
A. Tournier, F. Roy, Y. Cazaux*, F. Lalanne, P. Malinge, M. Mcdonald, G. Monnot**, N. Roux**, STMicroelectronics, **CEA Leti, **STMicroelectronics

ST and Leti explain their dual memory pixel architecture:


High Performance 2.5um Global Shutter Pixel with New Designed Light-Pipe Structure
T. Yokoyama, M. Tsutsui,Y. Nishi, I. Mizuno, V. Dmitry, A. Lahav, TPSCo & TowerJazz

TowerJazz and TPSCo show their latest generation small GS pixel available for the foundry customers:


Back-Illuminated 2.74 µm-Pixel-Pitch Global Shutter CMOS Image Sensor with Charge-Domain Memory Achieving 10k e- Saturation Signal
Y. Kumagai, R. Yoshita, N. Osawa, H. Ikeda, K.Yamashita, T. Abe, S. Kudo, J. Yamane, T. Idekoba, S. Noudo, Y. Ono, S.Kunitake, M. Sato, N. Sato, T. Enomoto, K. Nakazawa, H. Mori, Y. Tateshita, and K. Ohno, Sony Semiconductor

Sony presented its approach to shielding the storage nodes in BSI GS sensor:

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Ecns, ChinaDaily: China's Alipay announces a major upgrade to its 'Smile to Pay' service, aiming to make its facial recognition process more accessible to merchants and customers. The new version, called Dragonfly, is claimed to be just one-tenth the size of a traditional POS terminal. It includes a 3D structured light camera to improve facial recognition accuracy, and an upgraded processor to speed up payment time.

Tens of thousands of merchants across 300 cities in China offer Alipay's facial recognition payment.

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Melexis teases its 3rd generation ToF sensor to appear in 2019. It is promised to be single-chip ToF solutions with VGA resolution:


Lumileds, Melexis' ToF illumination source partner, publishes a white paper "Infrared Illumination for Time-of-Flight Applications" comparing LEDs with VCSELs:

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Lucid Vision presentations on Sony polarization sensors and ToF camera are published on Vimeo:

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MIPI Alliance releases MIPI I3C Basic v1.0, a subset of the MIPI I3C specification that bundles the most commonly needed I3C features for developers and other standards organizations. MIPI I3C Basic v1.0 provides 20 key features from MIPI I3C, including:

• Backward compatibility with I2C
• A multi-drop bus that, at 12.5 MHz, is over 12 times faster than I2C supports while using significantly less power
• In-band interrupts to allow slaves to notify masters of interrupts, a design that eliminates the need for a separate general-purpose input/output (GPIO) for each slave and thus reduces system cost and complexity
• Dynamic address assignment to avoid conflicting static addresses, providing flexibility and pin savings
• Standardized discovery, and bus configuration and control
• Uses standard low-cost pads and requires minimal cost in logic to support

“We have seen tremendous interest in I3C from the mobile ecosystem. Now, with I3C Basic, the broader developer community can immediately and efficiently begin using these capabilities as an alternative to I2C,” said Joel Huloux, chairman of MIPI Alliance. ”In addition, we are already working with several standards organizations to integrate I3C Basic into their specifications. We believe it provides tremendous value to mobile and many other industries in multiple ways.”

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PRNewswire: WiLAN, a Quarterhill company, is "one of the most successful patent licensing companies in the world and helps companies unlock the value of intellectual property by managing and licensing their patent portfolios."

Wi-LAN announces that its wholly-owned subsidiary, Collabo Innovations, has granted a non-exclusive license with respect to CMOS image sensor products sold by OmniVision. The consideration payable to Collabo by OmniVision and all other terms of the agreement are confidential.

"Since we acquired the Collabo portfolio from Panasonic Corporation in December of 2013, we have made substantial progress," said Keaton Parekh, WiLAN's President and CEO. "Licensees to Collabo's patents for CMOS Image Sensor and semiconductor packaging technologies include ON Semiconductor Corp., Toshiba Corporation, STATS Chip PAC Ltd., Powertech Technology Inc., and now OmniVision."

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Mediatek unveils its high end P90 application processor for smartphones, aimed to compete with Qualcomm's SD 855. The new processor has an impressive imaging capabilities:

"MediaTek Helio P90 lets you capture the best pictures ever with support for a supersized 48MP camera or 24+16 MP dual cameras, bringing consumers the highest resolution advanced smartphone photography. Users can capture at 48MP with up to 30 frames per second (FPS) with zero shutter delay, or enjoy super slow-motion at 480FPS in HD to capture every moment. MediaTek brings a resolution revolution to imaging with upgraded triple image signal processors (ISPs) capable of 14-bit RAW and 10-bit YUV processing so photography enthusiasts have even more flexibility to capture and process stunning photos.

The new ISP AI engine, specially designed to provide AI camera experiences, can accurately detect faces and scenes in real-time under low light and motion conditions, making a great shot easier than ever for any user."

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German startup K-Lens presents its lens extension that allows 3D depth image capture with a single lens and a sensor:

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9th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2018, being held these days in Taipei, Taiwan, publishes Sensor Creations Stefan Lauxtermann presentation on deep depleted pixel challenges and rewards:

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9th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, PIXEL2018, being held these days in Taipei, Taiwan, publishes Sensor Creations Stefan Lauxtermann presentation on deep depleted pixel challenges and rewards:

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PRNewswire: The rumor about dual display Vivo phone that eliminates the need in front selfie camera has been officially confirmed.

"With an additional 5.49-inch Super AMOLED display gracing the phone's back, NEX Dual Display Edition successfully delivers an unconventional smartphone experience by allowing greater flexibility in using the rear cameras. Snapping high-quality selfies is now easier than ever before, as users can simply use the main cameras along with the rear screen to get the perfect angles for selfies."

On the rear of the phone, there are 3 cameras:

"NEX Dual Display Edition's triple camera setup consists of a 12MP Dual-Pixel main camera (featuring a Sony IMX363 sensor and 4-axis OIS), a specialized Night Video Camera and an innovative Time of Flight (TOF) 3D Camera.

The three cameras make the perfect combination for capturing beautiful moments and taking selfies from any angle. The pro-level Night Video Camera helps users film clear and stable footage in motion and low-light environments, while the TOF 3D Camera empowers users to see the world with an added dimension. Its 3D sensing capabilities not only enables point-to-point distance measuring, but also supports 3D Modeling of the user's face for enhanced facial recognition, protection and personalized beautification."

PhoneArena publishes nice explanatory pictures of the new phone:

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DeviceSpecifications reports a rumor that Sony is about to announce 1/1.8-inch 38MP sensor for smartphones. The new sensor is said to have a number of interesting features:

• Quad Pixel Phase Detect AF (QP2DAF)
• Ambient Light Sensor (ALS)
• 24fps speed at full resolution
• Dual sensor synchronization
• Dual Bayer and White HDR coding pixel array

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Gigajot files a form on completion of $4m fundrising. Not much more info has been revealed so far.

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CEA-Leti Pixcurve technology flyer promotes the technology:

"Pixcurve is a proof of concept, introducing Leti’s latest curving technology for various optical components, such as visible imagers, µdisplays, bolometers and IR detectors. This technology addresses companies’ growing interest in a range of curved optical components that will help them achieve higher levels of performance and compensation for optical aberrations, while minimizing the vignetting effect and enhancing field of view. It makes cameras, imagers or microdisplays even more compact and easy to assemble."

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The Verge, Independent, Seattle Times: AI Now Institute consisting of Microsoft, Google and New York University employees publishes "AI Now Report 2018" talking about danger