ON Semi announces that it will be manufacturing image sensors in New York

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Press release: https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-commemorates-transfer-of-ownership-of-east-fishkill-new-york-facility-from-globalfoundries-with-ribbon-cutting-ceremony

onsemi Commemorates Transfer of Ownership of East Fishkill, New York Facility from GlobalFoundries with Ribbon Cutting Ceremony

  • Acquisition and investments planned for ramp-up at the East Fishkill (EFK) fab create onsemi’s largest U.S. manufacturing site
  • EFK enables accelerated growth and differentiation for onsemi’s power, analog and sensing technologies
  • onsemi retains more than 1,000 jobs at the site
PHOENIX – Feb. 10, 2023 – onsemi (Nasdaq: ON) a leader in intelligent power and sensing technologies, today announced the successful completion of its acquisition of GlobalFoundries’ (GF’s) 300 mm East Fishkill (EFK), New York site and fabrication facility, effective December 31, 2022. The transaction added more than 1,000 world-class technologists and engineers to the onsemi team. Highlighting the importance of manufacturing semiconductors in the U.S., the company celebrated this milestone event with a ribbon-cutting ceremony led by Senate Majority Leader Chuck Schumer (NY), joined by Senior Advisor to the Secretary of Commerce on CHIPS Implementation J.D. Grom. Also in attendance were several other local governmental dignitaries.

Over the last three years, onsemi has been focusing on securing a long-term future for the EFK facility and its employees, making significant investments in its 300 mm capabilities to accelerate growth in the company’s power, analog and sensing products, and enable an improved manufacturing cost structure. The EFK fab is the largest onsemi manufacturing facility in the U.S., adding advanced CMOS capabilities - including 40 nm and 65 nm technology nodes with specialized processing capabilities required for image sensor production - to the company’s manufacturing profile. The transaction includes an exclusive commitment to supply GF with differentiated semiconductor solutions and investments in research and development as both companies collaborate to build on future growth.

“With today’s ribbon cutting, onsemi will preserve more than 1,000 local jobs, continue to boost the state’s leadership in the semiconductor industry, and supply ‘Made in New York' chips for everything from electric vehicles to energy infrastructure across the country,” said Senator Schumer. “I am elated that onsemi has officially made East Fishkill home to its leading and largest manufacturing fab in the U.S. onsemi has already hired nearly 100 new people and invested committed $1.3 billion to continue the Hudson Valley’s rich history of science and technology for future generations. I have long said that New York had all the right ingredients to rebuild our nation’s semiconductor industry, and personally met with onsemi’s top brass multiple times to emphasize this as I was working on my historic CHIPS legislation. Thanks to my CHIPS and Science Act, we are bringing manufacturing back to our country and strengthening our supply chains with investments like onsemi’s in the Hudson Valley.”

The EFK facility contributes to the community by retaining more than 1,000 jobs. With the recent passage of the Federal CHIPS and Science Act as well as the New York Green CHIPS Program, onsemi will continue to evaluate opportunities for expansion and growth in East Fishkill and its contribution to the surrounding community. Earlier today, the Rochester Institute of Technology (RIT) announced that onsemi has pledged to donate $500,000 over 10 years to support projects and education aimed at increasing the pipeline of engineers in the semiconductor industry.

“onsemi appreciates Senate Majority Leader Schumer’s unwavering commitment to ensure American leadership in semiconductors and chip manufacturing investments in New York,” said Hassane El-Khoury, president and chief executive officer, onsemi. “With the addition of EFK to our manufacturing footprint, onsemi will have the only 12-inch power discrete and image sensor fab in the U.S., enabling us to accelerate our growth in the megatrends of vehicle electrification, ADAS, energy infrastructure and factory automation. We look forward to working with Empire State Development and local government officials to find key community programs and educational partnerships that will allow us to identify, train and employ the next generation of semiconductor talent in New York.”

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ST introduces new sensors for computer vision, AR/VR

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ST has released a new line of global shutter image sensors with embedded optical flow feature which is fully autonomous with no need for host computing/assistance. This can provide savings in power and bandwidth and free up host resources that would otherwise be needed for optical flow computations. From this optical flow data, it is possible for a host processor to compute the visual odometry (SLAM or camera trajectory), without the need for the full RGB image. The optical flow data can be interlaced with the standard image stream, with any of the monochrome, RGB Bayer or RGB-IR sensor versions. 

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Canon establishes security website for gathering information on product and service vulnerabilities, strengthens vulnerability countermeasures through CNA authorization

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Canon aids relief effort following earthquakes in the Republic of Turkey and the Syrian Arab Republic

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Canon Announces 148dB (24 f-stop) Dynamic Range Sensor

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Canon develops CMOS sensor for monitoring applications with industry-leading dynamic range, automatic exposure optimization function for each sensor area that improves accuracy for recognizing moving subjects


TOKYO, January 12, 2023—Canon Inc. announced today that the company has developed a 1.0-inch, back-illuminated stacked CMOS sensor for monitoring applications that achieves an effective pixel count of approximately 12.6 million pixels (4,152 x 3,024) and provides an industry-leading1 dynamic range of 148 decibels2 (dB). The new sensor divides the image into 736 areas and automatically determines the best exposure settings for each area. This eliminates the need for synthesizing images, which is often necessary when performing high-dynamic-range photography in environments with significant differences in brightness, thereby reducing the amount of data processed and improving the recognition accuracy of moving subjects.



With the increasingly widespread use of monitoring cameras in recent years, there has been a corresponding growth in demand for image sensors that can capture high-quality images in environments with significant differences in brightness, such as stadium entrances and nighttime roads. Canon has developed a new sensor for such applications, and will continue to pursue development of sensors for use in a variety of fields.

The new sensor realizes a dynamic range of 148 dB—the highest-level performance in the industry among image sensors for monitoring applications. It is capable of image capture at light levels ranging from approximately 0.1 lux to approximately 2,700,000 lux. The sensor's performance holds the potential for use in such applications as recognizing both vehicle license plates and the driver's face at underground parking entrances during daytime, as well as combining facial recognition and background monitoring at stadium entrances.

 1Among market for CMOS sensors used in monitoring applications. As of January 11, 2023. Based on Canon research.

 2Dynamic range at 30 fps is 148 dB. Dynamic range at approx. 60 fps is 142 dB.

In order to produce a natural-looking image when capturing images in environments with both bright and dark areas, conventional high-dynamic-range image capture requires taking multiple separate photos under different exposure conditions and then synthesizing them into a single image. Because exposure times vary in length, this synthesis processing often results in a problem called "motion artifacts," in which images of moving subjects are merged but do not overlap completely, resulting in a final image that is blurry. Canon's new sensor divides the image into 736 distinct areas, each of which can automatically be set to the optimal exposure time based on brightness level. This prevents the occurrence of motion artifacts and makes possible facial recognition with greater accuracy even when scanning moving subjects. What's more, image synthesizing is not required, thereby reducing the amount of data to be processed and enabling high-speed image capture at speeds of approximately 60 frames-per-second3 (fps) and a high pixel count of approximately 12.6 million pixels.

 3Dynamic range at 30 fps is 148 dB. Dynamic range at approx. 60 fps is 142 dB.

Video is comprised of a series of individual still images (single frames). However, if exposure conditions for each frame is not specified within the required time for that frame, it becomes difficult to track and capture images of subjects in environments with subject to significant changes in brightness, or in scenarios where the subject is moving at high speeds. Canon's new image sensor is equipped with multiple CPUs and dedicated processing circuitry, enabling it to quickly and simultaneously specify exposure conditions for all 736 areas within the allotted time per frame. In addition, image capture conditions can be specified according to environment and use case. Thanks to these capabilities, the sensor is expected to serve a wide variety of purposes including fast and highly accurate subject detection on roads or in train stations, as well as stadium entrances and other areas where there are commonly significant changes in brightness levels.

Example use case for new sensor
  • Parking garage entrance, afternoon: With conventional cameras, vehicle's license plate is not legible due to whiteout, while driver's face is not visible due to crushed blacks. However, the new sensor enables recognition of both the license plate and driver's face.
  • The new sensor realizes an industry-leading high dynamic range of 148 dB, enabling image capture in environments with brightness levels ranging from approx. 0.1 lux to approx. 2,700,000 lux. For reference, 0.1 lux is equivalent to the brightness of a full moon at night, while 500,000 lux is equivalent to filaments in lightbulbs and vehicle headlights.






Technology behind the sensor's wide dynamic range

With conventional sensors, in order to produce a natural-looking image when capturing images in environments with both bright and dark areas, high-dynamic-range image capture requires taking multiple separate photos under different exposure conditions and then synthesizing them into a single image. (In the diagram below, four exposure types are utilized per single frame).

With Canon's new sensor, optimal exposure conditions are automatically specified for each of the 736 areas, thus eliminating the need for image synthesis.




Technology behind per-area exposure

Portion in which subject moves is detected based on discrepancies between first image (one frame prior) and second image (two frames prior). ((1) Generate movement map).

In first image (one frame prior) brightness of subject is recognized for each area4 and luminance map is generated (2). After ensuring difference in brightness levels between adjacent areas are not excessive ((3) Reduce adjacent exposure discrepancy), exposure conditions are corrected based on information from movement map, and final exposure conditions are specified (4).

Final exposure conditions (4) are applied to images for corresponding frames.


4 Diagram below is a simplified visualization. Actual sensor is divided into 736 areas.





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New SWIR Sensor from NIT

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NSC2001 is the NIT Triple H SWIR sensor:
  • High Dynamic Range operating in linear and logarithmic mode response, it exhibits more than 120 dB of dynamic range
  • High Speed, capable of generating up to 1K frames per second in full frame mode, and much more with sub windowing
  • High Sensitivity and low noise figure (< 50e-)



NSC2001 fully benefits from NIT’s new manufacturing factory installed in their brand-new clean room, which includes their high-yield hybridization process. The new facility allows NIT to cover the entire design and manufacturing cycle of these sensors in volume with a level of quality never achieved before.

Moreover, NSC2001 was designed with the objective of addressing new markets that could not invest in expensive and difficult-to-use SWIR cameras. The result is that our WiDy SenS 320 camera based on NSC2001 exhibits the lowest price point on the market even in unit quantity.

Typical applications for NSC2001 are optical metrology and testing, additive manufacturing, welding, & laser communication, etc.

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Workshop on Infrared Detection for Space Applications June 7-9, 2023 in Toulouse, France

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CNES, ESA, ONERA, CEA-LETI, Labex Focus, Airbus Defence & Space and Thales Alenia Space are pleased to inform you that they are organising the second workshop dedicated to Infrared Detection for Space Applications, that will be held in Toulouse from 7th to 9th, June 2023 in the frame of the Optics and Optoelectronics Technical Expertise Community (COMET).

The aim of this workshop is to focus on Infrared Detectors technologies and components, Focal Plane Arrays and associated subsystems, control and readout ASICs, manufacturing, characterization and qualification results. The workshop will only address IR spectral bands between 1μm and 100 μm. Due to the commonalities with space applications and the increasing interest of space agencies to qualify and to use COTS IR detectors, companies and laboratories involved in defence applications, scientific applications and non-space cutting-edge developments are very welcome to attend this workshop.

The workshop will comprise several sessions addressing the following topics:

  • Detector needs for future space missions,
  • Infrared detectors and technologies including (but not limited to):
    • Photon detectors: MCT, InGaAs, InSb, XBn, QWIP, SL, intensified, SI:As, ...
    • Uncooled thermal detectors: microbolometers (a-Si, VOx), pyroelectric detectors ...
    • ROIC (including design and associated Si foundry aspects).
    • Optical functions on detectors
  • Focal Plane technologies and solutions for Space or Scientific applications including subassembly elements such as:
    • Assembly techniques for large FPAs,
    • Flex and cryogenic cables,
    • Passive elements and packaging,
    • Cold filters, anti-reflection coatings,
    • Proximity ASICs for IR detectors,
  • Manufacturing techniques from epitaxy to package integration,
  • Characterization techniques,
  • Space qualification and validation of detectors and ASICs,
  • Recent Infrared Detection Chain performances and Integration from a system point of view.

Three tutorials will be given during this workshop.

Please send a short abstract giving the title, the authors’ names and affiliations, and presenting the subject of your talk, to following contacts: anne.rouvie@cnes.fr and nick.nelms@esa.int.

The workshop official language is English (oral presentation and posters).

After abstract acceptance notification, authors will be requested to prepare their presentation in pdf or PowerPoint format, to be presented at the workshop. Authors will also be required to provide a version of their presentation to the organization committee along with an authorization to make it available for Workshop attendees and on-line for COMET members. No proceedings will be compiled and so no detailed manuscript needs to be submitted.







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Canon EOS R50 review

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The Canon EOS R50 is a tiny mirrorless camera aimed at those looking to raise their game from a phone or basic model, or anyone simply wanting one of the cutest little cameras around. Here's my review!…

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Canon EOS R8 review

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The Canon EOS R8 is a compact full-frame mirrorless camera that packs the photo, video and autofocus quality of the R6 II into a smaller, lighter and much more affordable body. There’s obviously sacrifices, but does it now become the best value full-framer? Find out in my review! …

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Sigma 50mm f1.4 DG DN Art review

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The Sigma 50mm f1.4 DG DN Art is a standard prime lens designed for full-frame mirrorless cameras and available for Sony e and Leica L mounts, the latter working on Panasonic Lumix S bodies. Is this the best mid-range 50? Find out in my full review!…

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Nikon releases the NIKKOR Z 85mm f/1.2 S, a fast mid-telephoto prime lens for the Nikon Z mount system

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Nikon releases the NIKKOR Z 26mm f/2.8, a slim wide-angle prime lens for the Nikon Z mount system

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Nikon releases a new black version of the Z fc APS-C size mirrorless camera

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Canon files new toner-cartridge-related patent infringement lawsuits against Print-Rite in U.S. and Germany

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Recent Industry News: Sony, SK Hynix

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Sony separates production of cameras for China and non-China markets

Link: https://asia.nikkei.com/Business/Electronics/Sony-separates-production-of-cameras-for-China-and-non-China-markets

Sony Group has transferred production of cameras sold in the Japanese, U.S. and European markets to Thailand from China, part of growing efforts by manufacturers to protect supply chains by reducing their Chinese dependence. Sony’s plant in China will in principle produce cameras for the domestic market. Sony offers the Alpha line of high-end mirrorless cameras. The company sold roughly 2.11M units globally in 2022, according to Euromonitor. Of those, China accounted for 150,000 units, with the rest, or 90%, sold elsewhere, meaning the bulk of Sony’s Chinese production has been shifted to Thailand. Canon in 2022 closed part of its camera production in China, shifting it back to Japan. Daikin Industries plans to establish a supply chain to make air conditioners without having to rely on Chinese-made parts within fiscal 2023.

TOKYO -- Sony Group has transferred production of cameras sold in the Japanese, U.S. and European markets to Thailand from China, part of growing efforts by manufacturers to protect supply chains by reducing their Chinese dependence.

Sony's plant in China will in principle produce cameras for the domestic market. Until now, Sony cameras were exported from China and Thailand. The site will retain some production facilities to be brought back online in emergencies. 

After tensions heightened between Washington and Beijing, Sony first shifted manufacturing of cameras bound for the U.S. The transfer of the production facilities for Japan- and Europe-bound cameras was completed at the end of last year. 

Sony offers the Alpha line of high-end mirrorless cameras. The company sold roughly 2.11 million units globally in 2022, according to Euromonitor. Of those, China accounted for 150,000 units, with the rest, or 90%, sold elsewhere, meaning the bulk of Sony's Chinese production has been shifted to Thailand. 

On the production shift, Sony said it "continues to focus on the Chinese market and has no plans of exiting from China."

Sony will continue making other products, such as TVs, game consoles and camera lenses, in China for export to other countries. 

The manufacturing sector has been working to address a heavy reliance on Chinese production following supply chain disruptions caused by Beijing's zero-COVID policy.

Canon in 2022 closed part of its camera production in China, shifting it back to Japan. Daikin Industries plans to establish a supply chain to make air conditioners without having to rely on Chinese-made parts within fiscal 2023.

Sony ranks second in global market share for cameras, following Canon. Its camera-related sales totaled 414.8 billion yen ($3.2 billion) in fiscal 2021, about 20% of its electronics business.


SK Hynix reshuffles CIS team to focus on high-end products

Link: https://www.thelec.net/news/articleView.html?idxno=4379

SK Hynix has reshuffled its CMOS image sensor (CIS) team in a bid to shift focus from expanding market share to developing high-end products, TheElec has learned.

Its CIS team was a singular organization prior to the changes, but the company has now created sub-teams that focus on specific functions and features of image sensors.

Overall, the team is now more of a research and development team rather than sales and marketing.

CIS is used widely in smartphones and IT products for its camera features.

Sony’s is the world’s largest producer of the component followed by Samsung.

The pair focuses on high resolution and multi-functions and controls between 70% to 80% of the market together __ Sony is the overwhelming leader with around 50% market share.

SK Hynix is a smaller player in the field and in the past had focused on low-end CIS with 20MP or below resolution.

The company has however started to supply its CIS to Samsung in 2021. It provided its 13MP CIS for Samsung’s foldable phones and last year provided 50MP sensors for the Galaxy A series.

Still, the overall demand for CIS has dropped in recent years as smartphones that mainly use them are suffering from a slowdown in demand.

This has been especially poignant for mid-tier phones due to their unit prices dropping in response to low consumer demand.

SK Hynix has been reducing its CIS output in light of this and is also reducing its inventory, the sources said.

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Call for Papers: IEEE International Conference on Computational Photography (ICCP) 2023

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Call for Papers: IEEE International Conference on Computational Photography (ICCP) 2023 


Submission Deadline: April 7, 2023
Contact: iccp2023programchairs@googlegroups.com

The ICCP 2023 Call-for-Papers is released on the conference website. ICCP is an international venue for disseminating and discussing new scholarly work in computational photography, novel imaging, sensors and optics techniques. 

As in previous years, ICCP is coordinating with the IEEE Transactions on Pattern Analysis and Machine Intelligence (PAMI) for a special issue on Computational Photography to be published after the conference. 

Learn more on the ICCP 2023 website, and submit your latest advancements by Friday, 7th April, 2023. 

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Global Image Sensor Market Forecast to Grow Nearly 11% through 2030

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Link: https://www.novuslight.com/global-image-sensor-market-forecast-at-17-6-billion-in-2020_N12654.html

The global image sensors market was calculated at ~US$17.6 billion in 2020. The market forecasts to reach ~US$48 billion in revenue by 2030 by registering a compound annual growth rate of 10.7% during the forecast period from 2021-2030.

Factors Influencing
The global image sensor market is expected to gain traction in the upcoming years because of the upscaling demand for image sensors technology in the automotive industry. Image sensors are highly useful in converting optical images into electronic ones. Thus, the demand for image sensors is expected to increase due to their applications in digital cameras.

Moreover, constant advancements in Complementary metal-oxide-semiconductor (CMOS) imaging technology would positively impact the growth of the global image sensors market. Recent advancements in CMOS technology have improved visualization presentations of the machines. Moreover, the cost-effectiveness of these technologies, together with better performance, would bolster the growth of the global image sensor market during the analysis period.

The growing adoption of smartphones and advancements in the industry are driving the growth of the global image sensor market. Dual camera trend in smartphones and tablets, forecast to accelerate the growth of the global image sensor market. In addition, excessive demand for advanced medical imaging systems would present some promising opportunities for the prominent market players during the forecast timeframe.

Various companies are coming up with advanced image sensors with Artificial Intelligence capabilities. Sony Corporation (Japan) recently launched IMX500, the world's first intelligent vision sensor that carries out machine learning and boosts computer vision operations automatically. Thus, such advancements are forecast to prompt the growth of the global image sensor market in the coming years.
Furthermore, the growing trend of smartphone photography has surged the demand for the image sensor to provide clear and quality output. Growing demand for 48 MP and 64 MP cameras would lead to the growth of the global image sensors market in the future.

Regional Analysis
Asia-Pacific forecasts to hold the maximum share with the highest revenue in the global image sensors market. The growth of the region is attributed to the increasing research and development activities. Moreover, the growing number of accident cases in the region is boosting the use of ADAS (advanced driver assistance system), together with progressive image sensing proficiencies. Thus, it would surge the demand for image sensors in the region during the forecast period.

Covid-19 Impact Analysis
The use of image sensors in smartphones has been the key reason for the growth of the market. However, the demand for smartphones severely declined during the pandemic. Thus, it rapidly slowed down the growth of the global image sensor market.

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International Image Sensors Workshop (IISW) 2023 Program and Pre-Registration Open

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The 2023 International Image Sensors Workshop announces the technical programme and opens the pre-registration to attend the workshop.

Technical Programme is announced: The Workshop programme is from May 22nd to 25th with attendees arriving on May 21st. The programme features 54 regular presentations and 44 posters with presenters from industry and academia. There are 10 engaging sessions across 4 days in a single track format. On one afternoon, there are social trips to Stirling Castle or the Glenturret Whisky Distillery. Click here to see the technical programme.

Pre-Registration is Open: The pre-registration is now open until Monday 6th Feb. Click here to pre-register to express your interest to attend.










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PhotonicsSpectra article on quantum dots-based SWIR Imagers

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Full article available here link: 
https://www.photonics.com/Articles/New_Sensor_Materials_and_Designs_Deepen_SWIR/a68543

Some excerpts below:




Cameras that sense wavelengths between 1000 and 2500 nm can often pick up details that would otherwise be hidden in images captured by conventional CMOS image sensors (CIS) that operate in the visible range. SWIR cameras can not only view details obscured by plastic sunglasses (a) and packaging (b), they can also peer through silicon wafers to spot voids after the bonding process (c). QD: quantum dot. Courtesy of mec.



A SWIR imaging forecast shows emerging sensor materials taking a larger share of the market, while incumbent InGaAs sees little gain, and the use of other materials grows at a faster rate. OPD: organic photodetector. Courtesy of IDTechEx.


Quantum dots act as a SWIR photodetector if they are sized correctly. When placed on a readout circuit, they form a SWIR imaging sensor.


The price for SWIR cameras today can run in the tens of thousands of dollars, which is too expensive for many applications and has inhibited wider use of the technology.

Silicon, the dominant sensor material for visible imaging, does not absorb SWIR photons without surface modification — and even then, it performs poorly. As a result, most SWIR cameras today use sensors based on indium gallium arsenide (InGaAs), ...

... sensors based on colloidal quantum dots (QDs) are gaining interest. The technology uses nanocrystals made of semiconductor materials, such as lead sulfide (PbS), that absorb in the SWIR. By adjusting the size of the nanocrystals used, sensor fabricators can create photodetectors that are sensitive from the visible to 2000 nm or even longer wavelengths.

... performance has steadily improved with the underlying materials and processing science, according to Pawel Malinowski, program manager of pixel innovations at imec. The organization’s third-generation QD-based image sensor debuted a couple of years ago with an efficiency of 45%. Newer sensors have delivered above 60% efficiency.

Fabricating QD photodiodes and sensors is also inexpensive because the sensor stack consists of a QD layer a few hundred nanometers thick, along with conducting, structural, and protective layers, Klem said. The stack goes atop a CMOS readout circuit in a pixel array. The technique can accommodate high-volume manufacturing processes and produce either large or small pixel arrays. Compared to InGaAs technology, QD sensors offer higher resolution and lower noise levels, along with fast response times.

Emberion, a startup spun out of Nokia, also makes QD-based SWIR cameras ... The quantum efficiency of these sensors is only 20% at 1800 nm... [but] ... at about half the price of InGaAs-based systems... .

[Another company TriEye is secretive about whether they use QD detectors but...] Academic papers co-authored by one of the company’s founders around the time that TriEye came into existence discuss pyramid-shaped silicon nanostructures that detect SWIR photons via plasmonic enhancement of internal photoemission.

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Canon’s activities lead to the removal of 1,202 listings from Amazon in Germany, Italy, Spain, the United Kingdom, France and The Netherlands

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106 listings removed from Amazon in Canada, Mexico and the United States of America after Canon files infringement reports

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Registrations Open for Harvest Imaging Forum (Apr 5-6, 2023)

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When: April 5 and 6, 2023
Where: Delft, the Netherlands
Forum Topic: Imaging Beyond the Visible
Speaker: Prof. dr. Pierre Magnan (ISAE-SUPAERO, France)
Registration link: https://harvestimaging.com/forum_registration_2023_new.php

More information can be found here: https://harvestimaging.com/forum_introduction_2023_new.php

After the Harvest Imaging forums during the last decade, a next and ninth one will be organized on April 5 & 6, 2023 in Delft, the Netherlands. The basic intention of the Harvest Imaging forum is to have a scientific and technical in-depth discussion on one particular topic that is of great importance and value to digital imaging. The forum 2023 will again be organized in a hybrid form:

  • You can attend in-person and can benefit in the optimal way of the live interaction with the speakers and audience,
  • There will be also a live broadcast of the forum, still interactions with the speakers through a chat box will be made possible,
  • Finally the forum also can be watched on-line at a later date.

The 2023 Harvest Imaging forum will deal with a single topic from the field of solid-state imaging and will have only one world-level expert as the speaker.

Register here: https://harvestimaging.com/forum_registration_2023_new.php

 

"Imaging Beyond the Visible"
Prof. dr. Pierre MAGNAN (ISAE-SUPAERO, Fr)
 

Abstract:
Two decades of intensive and tremendous efforts have pushed the imaging capabilities in the visible domain closer to physical limits. But also extended the attention to new areas beyond visible light intensity imaging. Examples can be found either to higher photon energy with appearance of CMOS Ultra-Violet imaging capabilities or even to other light dimensions with Polarization Imaging possibilities, both in monolithic form suitable to common camera architecture.

But one of most active and impressive fields is the extension of interest to the spectral range significantly beyond the visible, in the Infrared domain. Special focus is put on the Short Wave Infrared (SWIR) used in the reflective imaging mode but also the Thermal Infrared spectral range used in self-emissive ‘thermal’ imaging mode in Medium Wave Infrared (MWIR) and Long Wave Infrared (LWIR). Initially mostly motivated for military and scientific applications, the use of these spectral domains have now met new higher volume applications needs.

This has been made possible thanks to new technical approaches enabling cost reduction stimulated by the efficient collective manufacturing process offered by the microelectronics industry. CMOS, even no more sufficient to address alone the non- visible imaging spectral range, is still a key part of the solution.

The goal of this Harvest Imaging forum is to go through the various aspects of imaging concepts, device principles, used materials and imager characteristics to address the beyond-visible imaging and especially focus on the infrared spectral bands imaging.

Emphasis will be put on the material used for both detection :

  • Germanium, Quantum Dots devices and InGaAs for SWIR,
  •  III-V and II-VI semiconductors for MWIR and LWIR
  •  Microbolometers and Thermopiles thermal imagers

Besides the material aspects, also attention will be given to the associated CMOS circuits architectures enabling the imaging arrays implementation, both at the pixel and the imager level.
A status on current and new trends will be provided.
 

Bio:
Pierre Magnan graduated in E.E. from University of Paris in 1980. After being a research scientist involved in analog and digital CMOS design up to 1994 at French Research Labs, he moved in 1995 to CMOS image sensors research at SUPAERO (now ISAE-SUPAERO) in Toulouse, France. The latter is an Educational and Research Institute funded by the French Ministry of Defense. Here Pierre was involved in setting up and growing the CMOS active-pixels sensors research and development activities. From 2002 to 2021, as a Full Professor and Head of the Image Sensor Research Group, he has been involved in CMOS Image Sensor research. His team worked in cooperation with European companies (including STMicroelectronics, Airbus Defense& Space, Thales Alenia Space and also European and French Space Agencies) and developed custom image sensors dedicated to space instruments, extending in the last years the scope of the Group to CMOS design for Infrared imagers.
In 2021, Pierre has been nominated Emeritus Professor of ISAE-Supaero Institute where he focuses now on Research within PhD work, mostly with STMicroelectronics.

Pierre has supervised more than 20 PhDs candidates in the field of image sensors and co-authored more than 80 scientific papers. He has been involved in various expertise missions for French Agencies, companies and the European Commission. His research interests include solid-state image sensors design for visible and non-visible imaging, modelling, technologies, hardening techniques and circuit design for imaging applications.

He has served in the IEEE IEDM Display and Sensors subcommittee in 2011-2012 and in the International Image Sensor Workshop (IISW) Technical Program Committee, being the General Technical Chair of 2015 IISW. He is currently a member of the 2022 IEDM ODI sub-committee and the IISW2023 Technical Program Committee.



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Samsung Tech Blog about ISOCELL Color, HDR and ToF Imaging

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Link: https://semiconductor.samsung.com/newsroom/tech-blog/how-isocell-unlock-the-future-of-camera-experiences/

Some excerpts below.

The science of creating pixels has made substantial progress in recent years. As a rule, high resolution image sensors need small, light-sensitive pixels. To capture as much light as possible, the pixel structure has evolved from front-side illumination (FSI) to a back-side illumination (BSI). This places the photodiode layer on top of the metal line, rather than below it. By locating the photodiode closer to the light source, each pixel is able to capture more light. The downside of this structure is that it creates higher crosstalk between the pixels, leading to color contamination.

“To remedy such a drawback, Samsung introduced ISOCELL, its first technology that isolates pixels from each other by adding barriers. The name ISOCELL is a compound word from the words “isolate’ and ‘cell,’” Kim explained. “By isolating each pixel, ISOCELL can increase a pixel’s full well capacity to hold more light and reduce crosstalk from one pixel to another.”




With ISOCELL technology, ISOCELL image sensors have very high full well capacity. Pixels in the newest ISOCELL image sensor have up to 70,000 electrons, allowing the sensor to reach huge signal range.  ... “To reduce noise, we perform two readouts: One with high gain to show the dark details and another with low gain to show the bright details. The two readouts are then merged in the sensor. Each read out has 10-bits. With the high conversion gain readout at 4x, it adds an additional 2-bits, producing 12-bit HDR image output. This technology is called Smart-ISO Pro also known as iDCG (intra-scene Dual Conversion Gain).”



Samsung has a plan to release a new generation of iToF sensor that has an image signal processor (ISP) integrated. The whole processing of depth information is done on the ISP within the sensor, rather than delegating to the SoC, so that the overall operation uses lower power consumption. In addition, the new solution offers improved depth quality even in scenarios such as low light environment, narrow objects or repetitive patterns. For future applications, Samsung’s ISP integrated ToF will help provide high quality depth image with little to no motion blur or lagging, at a high frame rate.




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SD Optics releases MEMS-based system "WiseTopo" for 3D microscopy

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SD Optics has released WiseTopo, a MEMS-based microarray lens system that transforms a 2D microscopes into 3D. 
 
Attendees at Photonics West can see a demonstration at their booth #4128 between Jan 31 to Feb 2, 2023 at the Moscone Center in San Francisco, California.
 


SD OPTICS introduces WiseTopo with our core technology Mals lens, the Mems-based microarray lens system. WiseTopo transforms a 2D microscope into a 3D microscope with a simple plug-in installation, and it fits all microscopes. The conventional system has a limited depth of field, so a user has to adjust the focus manually by moving the z-axis. It is difficult to identify the exact shape of the object instantly.  The manual movements can cause deviations in the observation, missing information, incomplete inspection, and an increase in user work load. SD Optics' WiseTopo is the most innovative 3D microscope module empowered with the patented core technology Mals. WiseTopo converts a 2D microscope into a 3D microscope by replacing the image sensor. With this simple installation, WiseTopo resolves the depth-of-field issue without Z-axis movement. Mals is an optical Mems-based, ultra-fast variable focusing lens that implements curvature changes in the lens with the motion of individual micro-mirrors. Mals moves and focuses at a speed of 12Khz without z-axis mechanical movement. It is a semi-permanent digital lens technology that operates at any temperature and has no life cycle limit. WiseTopo provides ideal features in combination with our developed software. These features let users have a better understanding of an object in real time. WiseTopo provides an All-in-focus function where everything is in focus. The Auto-focus function automatically focuses on the Region of Interest Focus lock maintains focus when multiple focus ROIs are set in the z-axis, multi-focus lock stays in focus even when moving the X- and Y-axis. Auto-focus lock retains auto-focus during Z-axis movement and others. These functions maximize user convenience. WiseTopo and its 3D images will reveal necessary information that is hidden when using a 2D microscope. WiseTopo obtains in-focused images with fast varying focus technology and processes many 3D attributes such as shape matching and point cloud instantly. WiseTopo supports various 3D data formats for analysis. For example, a comparison between the reference 3D data with the real-time 3D data can be performed easily. In the microscope, objective lenses with different magnifications are mounted on the turret. Wisetopo provides all functions even when the magnification is changed. Wisetopo provides all 3D features in any microscope and can be used with all of them, regardless of the brand
3D images created in Wisetopo can be viewed in AR/VR. This will let users feel and observe 3D data in the metaverse space.
 

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poLight’s paper on passive athermalisation of compact camera/lens using its TLens® tunable lens

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Images defocus over wide temperature range is a challenge in many applications. poLight's TLens technology behaves the opposite of plastic lenses over temperature, so just adding it to the optics stack addresses this issue.

A whitepaper is available here: [link]

Abstract: poLight ASA is the owner of and has developed the TLens products family as well as other patented micro-opto-electro-mechanical systems (MOEMS) technologies. TLens is a focusable tunable optics device based on lead zirconium titanate (PZT) microelectromechanical systems (MEMS) technology and a novel optical polymer material. The advantages of the TLens have already been demonstrated in multiple products launched on the market since 2020. Compactness, low power consumption, and fast speed are clear differentiators in comparison with incumbent voice coil motor (VCM) technology, thanks to the patented MEMS architecture. In addition, the use of TLens in the simple manner by adding it onto a fixed focus lens camera, or inserting the TLens inside the lens stack, enables stable focusing over an extended operating range. It has been demonstrated that the TLens passively compensates the thermal defocus of the plastic lens stack/camera structure. The fixed focus plastic lens