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IFNews quotes HSBC report showing Samsung CIS capacity expanison chart:
SPAD Super-Resolution Sensing
January 19, 2021 By Leave a Comment
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Nature publishes a joint paper of Bonn University, Germany, and Glasgow University, UK, "Super-resolution time-resolved imaging using computational sensor fusion" by C. Callenberg, A. Lyons, D. den Brok, A. Fatima, A. Turpin, V. Zickus, L. Machesky, J. Whitelaw, D. Faccio, and M. B. Hullin."Imaging across both the full transverse spatial and temporal dimensions of a scene with high precision in all three coordinates is key to applications ranging from LIDAR to fluorescence lifetime imaging. However, compromises that sacrifice, for example, spatial resolution at the expense of temporal resolution are often required, in particular when the full 3-dimensional data cube is required in short acquisition times. We introduce a sensor fusion approach that combines data having low-spatial resolution but high temporal precision gathered with a single-photon-avalanche-diode (SPAD) array with data that has high spatial but no temporal resolution, such as that acquired with a standard CMOS camera. Our method, based on blurring the image on the SPAD array and computational sensor fusion, reconstructs time-resolved images at significantly higher spatial resolution than the SPAD input, upsampling numerical data by a factor 12×12, and demonstrating up to 4×4 upsampling of experimental data. We demonstrate the technique for both LIDAR applications and FLIM of fluorescent cancer cells. This technique paves the way to high spatial resolution SPAD imaging or, equivalently, FLIM imaging with conventional microscopes at frame rates accelerated by more than an order of magnitude."
Brigates Prepares $207M IPO at Shanghai Stock Exchange
January 18, 2021 By Leave a Comment
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EastMoney, CapitalWhale, ElecFans: Yet another China-based image sensor company prepares an IPO at Shanghai Stock Exchange - Brigates (Chinese name - Ruixinwei or Ruixin Micro-Tech Innovation or Kunshan Ruixin.)"The IPO of the Science and Technology Innovation Board intends to raise 1.347 billion yuan for the R&D and industrialization projects of high-end image sensor chips and movement, as well as development and technology reserve funds.
So, what is the advantage of Ruixinwei?
The prospectus declares that: the company’s technologies and products in the field of high-end image chip customization and high-sensitivity camera cores have reached the domestic leading and internationally advanced level; “has a number of domestic leading and internationally advanced core technologies” and “breaks through foreign countries. "The technology monopoly of giants", "The company has become one of the few companies in the world that master ECCD technology", "It has replaced and surpassed similar foreign products, and filled many gaps in the field of domestic image sensors", "A few global suppliers Business One", "in a dominant position."
The Shanghai Stock Exchange took note of the company's above statement and requested the company to list the basis for its described market position.
In the reply letter, Ruixin Micro stated that it has revised "replacement and surpasses similar foreign products" in the prospectus to "partially replace similar foreign products", and at the same time, it will "achieve a subversive replacement of vacuum analog signal device technology." "Modified to "Realize the renewal of vacuum analog signal device technology".
For other statements, Ruixinwei believes that the statement is well-founded. In particular, the company mentioned that it is "the few companies in the world that master ECCD technology."
“The MCCD and ECCD technology independently developed by Ruixin Micro is helpful to improve the imaging quality of the image sensor.”
“At present, CMOS image sensor is the mainstream technology route, accounting for nearly 90% of the image sensor market. Ruixin Micro is equivalent to taking a new technological path. Ruixin Micro has developed a high-sensitivity camera core with MCCD technology as its core, has achieved industrialization. However, ECCD process development is very difficult, and currently there are relatively few publicly available materials."
Luminar CES Presentation Compares LiDAR Approaches
January 18, 2021 By Leave a Comment
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Luminar publishes its presentations at CES2021. The first one done by Matt Weed compares the LiDAR technologies:
In its investor presentation, Luminar also shows its single-pixel InGaAs sensor integrated onto a Si ROIC and costing $3:
Modeling of Current-Assisted Photonic Demodulator for ToF Sensor
January 17, 2021 By Leave a Comment
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Hong Kong University publishes a video presentation "Compact Modeling of Current-Assisted Photonic Demodulator for Time-of-Flight CMOS Image Sensor" by Cristine Jin Delos Santos. The work has won Best Student Paper Award at IEEE Student Symposium on Electron Devices and Solid-State Circuits (s-EDSSC) in October 2020.Review of SPAD Photon-to-Digital Converters
January 16, 2021 By Leave a Comment
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MDPI paper "3D Photon-to-Digital Converter for Radiation Instrumentation: Motivation and Future Works" by Jean-François Pratte, Frédéric Nolet, Samuel Parent, Frédéric Vachon, Nicolas Roy, Tommy Rossignol, Keven Deslandes, Henri Dautet, Réjean Fontaine, and Serge A. Charlebois from Université de Sherbrooke, Canada, reviews the new opportunities coming from SPAD stacked chip integration."Analog and digital SiPMs have revolutionized the field of radiation instrumentation by replacing both avalanche photodiodes and photomultiplier tubes in many applications. However, multiple applications require greater performance than the current SiPMs are capable of, for example timing resolution for time-of-flight positron emission tomography and time-of-flight computed tomography, and mitigation of the large output capacitance of SiPM array for large-scale time projection chambers for liquid argon and liquid xenon experiments. In this contribution, the case will be made that 3D photon-to-digital converters, also known as 3D digital SiPMs, have a potentially superior performance over analog and 2D digital SiPMs. A review of 3D photon-to-digital converters is presented along with various applications where they can make a difference, such as time-of-flight medical imaging systems and low-background experiments in noble liquids. Finally, a review of the key design choices that must be made to obtain an optimized 3D photon-to-digital converter for radiation instrumentation, more specifically the single-photon avalanche diode array, the CMOS technology, the quenching circuit, the time-to-digital converter, the digital signal processing and the system level integration, are discussed in detail."
Comments on Hamamatsu Patents Ownership Transfer to Sionyx
January 16, 2021 By Leave a Comment
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It appears that Federal Circuit decision to transfer an ownership of a number of Hamamatsu patents to SiOnyx has attracted quite a lot of attention from lawyers.Troy & Schwartz comments: "These days, Non-Disclosure Agreement (NDA) templates are readily available on-line, often free-of-charge, making them an attractive alternative for many. The problem with these templates is they are not necessarily applicable to the contracting parties’ unique circumstances and/or do not properly anticipate dealings between the parties. A poorly drafted, one-size-fits-all NDA can make or break a patent-infringement case many years into the future.
The outcome may well have been different had the NDA not “directed” the ownership of all future patents emanating from Sionyx’s confidential information to Sionyx. Furthermore, any resulting patent relying on confidential information emanating from both parties should have designated both Cary and an Hamamtsu inventor as joint inventors no matter where the patent applications were filed. Inventorship does not, however, mean that the inventor(s) is also the owner(s) of the patent.
As this case illustrates, an NDA can be a critical factor in determining patent (and other IP) ownership. An NDA should be tailor-made for the particular situation at hand with particular emphasis on protecting the disclosing party which is often an individual inventor or a small start-up company."
Finnegan comments: "So, even though both parties ended up with co-inventors on the disputed US and foreign patents, SiOnyx ended up as the sole owner of all those patents. The proofs established that confidential information relating to the patents came solely from SiOnyx. Hence, the terms of the NDA led to SiOnyx being the sole owner of all disputed patents."
Oliff writes: "Hamamatsu argued on appeal that because the district court acknowledged that Hamamatsu's personnel were co-inventors of the patents, it should have at most granted SiOnyx co-ownership rights. The Federal Circuit stated that inventorship was irrelevant to the issue of ownership, and that the terms of the NDA stated that when patents arose from a party's confidential information, that party would fully own such patents."
Apple iPhone 12 Cameras are Cheaper than iPhone 11’s
January 15, 2021 By Leave a Comment
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Counterpoint Research says that iPhone 12 cameras cost $3.6 less than iPhone 11's:
ToF News: Chronoptics, Opnous, Microsoft
January 15, 2021 By Leave a Comment
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Chronoptics announces its ToF noise filter and ToF camera based on Melexis VGA sensor:
Opnous OPNM8518A VGA camera module consumes 500mW typ and has a range of 1.2m:
MDPI paper "Evaluation of the Azure Kinect and Its Comparison to Kinect V1 and Kinect V2" by Michal Tölgyessy, Martin Dekan, Ľuboš Chovanec, and Peter Hubinský from Institute of Robotics and Cybernetics, Slovakia shows Microsoft progress over the years.
"The Azure Kinect is the successor of Kinect v1 and Kinect v2. In this paper we perform brief data analysis and comparison of all Kinect versions with focus on precision (repeatability) and various aspects of noise of these three sensors. Then we thoroughly evaluate the new Azure Kinect; namely its warm-up time, precision (and sources of its variability), accuracy (thoroughly, using a robotic arm), reflectivity (using 18 different materials), and the multipath and flying pixel phenomenon. Furthermore, we validate its performance in both indoor and outdoor environments, including direct and indirect sun conditions. We conclude with a discussion on its improvements in the context of the evolution of the Kinect sensor. It was shown that it is crucial to choose well designed experiments to measure accuracy, since the RGB and depth camera are not aligned. Our measurements confirm the officially stated values, namely standard deviation ≤17 mm, and distance error <11 mm in up to 3.5 m distance from the sensor in all four supported modes. The device, however, has to be warmed up for at least 40–50 min to give stable results. Due to the time-of-flight technology, the Azure Kinect cannot be reliably used in direct sunlight. Therefore, it is convenient mostly for indoor applications."
Samsung Adds 4th Sensor to its 108MP Lineup
January 14, 2021 By Leave a Comment
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BusinessWire: Samsung introduces its latest 108MP mobile sensor, the 0.8um 1/1.33-inch ISOCELL HM3. This is the 4th 108MP sensor in the company's lineup after HMX, HM1, and HM2.“Samsung has been at the forefront of bringing the most pixels to mobile image sensors as well as various supporting technologies that take sensor performances to the next level,” says Duckhyun Chang, EVP of the sensor business at Samsung Electronics. “The ISOCELL HM3 is the culmination of Samsung’s latest sensor technologies that will help deliver premium mobile experiences to today’s smart-device users.”
For faster AF, the HM3 integrates an improved Super PD Plus feature. Super PD Plus adds AF-optimized micro-lenses over the phase detection focusing agents, increasing measurement accuracy of the agents by 50%.
The HM3 also adopts Smart ISO Pro, HDR technology which uses an intra-scene dual conversion gain (iDCG) solution. Smart ISO Pro simultaneously captures a frame in both high and low ISO, then merges them into a single image in 12-bit color depth and with reduced noise. As Smart ISO Pro does not require multiple exposure shots to create a standard HDR image, it can significantly reduce motion-artifacts. In addition, with a low-noise mode, it improves the light sensitivity by 50% over its predecessor.
The HM3’s pixel layout is arranged in three-by-three single color structures suitable for nine-pixel binning. By merging nine neighboring pixels, the 108Mp HM3 mimics a 12Mp image sensor with large 2.4μm-pixels. With an improved binning hardware IP, the HM3 supports seamless transitions between 108MP and 12MP resolutions.
Design of the new sensor has also been optimized to reduce power in preview mode by 6.5%.
Samsung ISOCELL HM3 is currently in mass production.
CES News: Intel Demos Realsense ID and MEMS LiDAR
January 14, 2021 By Leave a Comment
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Intel posted two videos with demos of its recently announced Realsense ID and L515 MEMS LiDAR:CES News: Trieye, Orbbeck, Guide Sensmart, Sense Photonics, Innolux, Nuralogix, Opsys, Pioneer, Ibeo
January 14, 2021 By Leave a Comment
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Trieye presents the recent progress with its low-cost SWIR sensor, including DMS application:
Orbbec presents its first ToF camera with VGA resolution:
Wuhan Guide Sensmart Tech Co, a subsidiary of Guide Infrared, presents its compact thermal imaging modules for smartphones:
Sense Photonics presents its flash LiDAR components:
Innolux presents its under-display camera design and full-screen optical fingerprint sensor:
Nuralogix presents Anura applications claiming to be able to measure blood pressure with a smartphone selfie camera:
Opsys presents its modular LiDAR architecture:
Pioneer presents its MEMS-based LiDAR:
Ibeo presents its sequential flash LiDAR:
MIPI A-PHY Gears
January 13, 2021 By Leave a Comment
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MIPI publishes an article talking about the A-PHY standard gears. The scaling is quite impressive: speeds up to 16Gbps per lane with PAM4, 8, and 16(!) modulation schemes. The symbol rate stays at 4Gs/s, apparently limited by the long physical link bandwidth:
Sony FE 35mm f1.4 GM review
January 13, 2021 By Leave a Comment
The FE 35mm f1.4 G Master is a high-end wide-angle prime lens for Sony’s e-mount mirrorless system and one that’s corrected for full-frame bodies. It’s Sony’s fourth 35 in the native e-mount, but the first to join the flagship G-Master series. Find out why it’s their best 35 yet in my full review!…
CES News: NII, AIStorm, Innovusion, Brightway, Mcnex
January 13, 2021 By Leave a Comment
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Japan National Institute of Informatics provides a protection from fingerprint recognition from camera images:
AIStorm presents its sensors without saying much about the underlying technology:
BrightWay Vision presents its VISDOM automotive gated vision camera performance:
"Independent tests performed under the DENSE European Research project evaluated the performance of the various available optical sensing technologies, including visual cameras, thermal imagers, and LiDARs, under adverse weather conditions. The project team concluded that the GatedVision sensor is the only one that could see all the tested targets, through dense fog and throughout the entire range tested. All other sensors were found limited to only half the range and limited types of objects detected."
Mcnex presents a scanning automotive camera:
A Conversation with Eric Fossum
January 12, 2021 By Leave a Comment
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Youtube channel Reliability Matters publishes "Episode 59: A Conversation with CMOS Image Sensor Inventor Dr. Eric Fossum."Omnivision Unveils 1080p60 Sensor for Mainstream Security Cameras
January 12, 2021 By Leave a Comment
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BusinessWire: OmniVision announces the OS02H10, a 2.9um, 1080p image sensor adding the NIR and low light performance of its Nyxel and PureCel Plus technologies to mainstream surveillance cameras. This sensor also offers multiple HDR options at 60 fps. Additionally, when paired with the designer’s selected platform, the OS02H10 can enable a system ultra low power mode for battery-powered cameras with AI functionality.“Mainstream surveillance camera designers are looking for the ideal the combination of low power consumption and high performance over a wide range of lighting conditions, to enable AI algorithm recognition of faces and objects,” said Cheney Zhang, senior marketing manager for the security segment at OmniVision. “The OS02H10 provides a high value option for adding premium NIR, ultra low light and HDR performance to high volume, mainstream security systems with AI functionality, along with an ultra low power mode that consumes 97.7% less power than the normal mode to support long battery life.”
Samples of the OS02H10 image sensor are available now.
ToF Sensor with Delta-Sigma Feedback
January 12, 2021 By Leave a Comment
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MDPI paper "High-Linearity High-Resolution Time-of-Flight Linear-Array Digital Image Sensor Using Time-Domain Feedback" by Juyeong Kim, Keita Yasutomi, Keiichiro Kagawa, and Shoji Kawahito from Shizuoka University, Japan, presents a sigma-delta feedback approach to linearize a ToF sensor response:
"This paper presents a high-linearity high-resolution time-of-flight (ToF) linear-array digital image sensor using a time-domain negative feedback technique. A coarse ToF measurement loop uses a 5-bit digital-to-time converter (DTC) and a delayed gating-pulse generator for time-domain feedback to find the zero of the difference between ToF and the digital estimate of the gating-pulse delay while maintaining a constant operating point of the analog readout circuits. A fine ToF measurement uses a delta-sigma modulation (DSM) loop using the time-domain feedback with a bit-stream signal form. Because of the self-contained property of the DSM for low distortion and noise exploited by the oversampling signal processing, the proposed technique provides high-linearity and high-range resolution in the fine ToF measurement. A prototype ToF sensor of 16.8 × 16.8 μm2 two-tap pixels and fabricated in a 0.11 μm (1P4M) CMOS image sensors (CIS) process achieves +0.9%/−0.47% maximum nonlinearity error and a resolution of 0.24 mm (median) for the measurement range of 0–1.05 m. The ToF sensor produces an 11-bit fully digital output with a ToF measurement time of 22.4 ms."
AI Sensor with In-Pixel Charge Domain Processing
January 12, 2021 By Leave a Comment
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Arxiv.org paper "An Ultra Fast Low Power Convolutional Neural Network Image Sensor with Pixel-level Computing" by Ruibing Song, Kejie Huang, Zongsheng Wang, Haibin Shen from Zhejiang University, China, is also published in IEEE Transactions on Circuits and Systems in December 2020.
"The separation of the data capture and analysis in modern vision systems has led to a massive amount of data transfer between the end devices and cloud computers, resulting in long latency, slow response, and high power consumption. Efficient hardware architectures are under focused development to enable Artificial Intelligence (AI) at the resource-limited end sensing devices. This paper proposes a Processing-In-Pixel (PIP) CMOS sensor architecture, which allows convolution operation before the column readout circuit to significantly improve the image reading speed with much lower power consumption. The simulation results show that the proposed architecture enables convolution operation (kernel size=3*3, stride=2, input channel=3, output channel=64) in a 1080P image sensor array with only 22.62 mW power consumption. In other words, the computational efficiency is 4.75 TOPS/w, which is about 3.6 times as higher as the state-of-the-art."
CES News: Intel Shows its FMCW LiDAR
January 12, 2021 By Leave a Comment
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BusinessWire: Intel-Mobileye CTO Amnon Shashua shows the company FMCW LiDAR named EyeC. Its mass production is expected to start in 2025:"Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip. “This is really game-changing,” Shashua said of the lidar SoC expected in 2025. “And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that's very, very rare. So this gives Intel a significant advantage in building these lidars.”
CES News: Intel Shows its FMCW LiDAR
January 12, 2021 By Leave a Comment
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BusinessWire: Intel-Mobileye CTO Amnon Shashua shows the company FMCW LiDAR named EyeC. Its mass production is expected to start in 2025:"Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip. “This is really game-changing,” Shashua said of the lidar SoC expected in 2025. “And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that's very, very rare. So this gives Intel a significant advantage in building these lidars.”