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Albert Theuwissen continues his review of 2014 Electronic Imaging Conference papers. In the second part, CEA-Leti noise analysis of 4T pixel is presented, with recommendations on the noise reduction. IMSE-CNM paper on imagers ADC architectures, and Shuzuoka University no-STI pixel paper are reviewed too.

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BAE Fairchild Imaging presents its sCMOS 2.0 imager at Photonics West show in San Francisco. The 4.2MP SCI2020 sensor is supposed to be available in June 2014. Here is its flyer scan:


My first impressions:

• 3% RMS PRNU is quite high for such a large pixel. Not clear why it's that high.
• 30,000e- full well over 2e- read noise does not make 87db DR, like the table states. May be achieved at slower speeds when the read noise is lower
• -0.4V supply voltage is used for Tx gate bias during integration, I guess.

Thanks to BP for the info!

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Albert Theuwissen begins to publish a review of papers from the SPIE Electronic Imaging Conference. The first part talks about a fast CCD CMOS pixel design with transfer time of just 5ns, and the two time-to-saturation pixel papers.

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Tech-On reports that University of Tokyo, Kyushu University and NMEMS Technology Research Organization presented a new technology of improving the sensitivity of Si-based NIR sensor at IEEE MEMS 2014 conference conference held in San Francisco on Jan 26-30, 2014. Isao Shimoyama (University of Tokyo), Chihaya Adachi (Kyushu University), Yoshiharu Ajiki (exchange researcher at NMEMS Technology Research Organization, Olympus Corp)etc. extended the sensitivity to 1.2um "by adding 10nm-class metal nano structures to Si to increase electric current generated by receiving lights with certain wavelengths such as infrared light":

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ARM publishes a CES 2014 demo video of a gesture control software running on its Mali GPU:

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Invisage publishes a promotional Youtube video. The rumor is that the company is to launch its 13MP INV1310 QuantumFilm sensor this spring, targeting high-end smartphones.

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Pressebox: Japan-based Taiyo Yuden announces a new type of copper-core embedded-parts multilayer wiring substrate “EOMIN” with a cavity formation technology that enables the creation of a depression in a part of the substrate:


A multilayer wiring substrate for camera modules mounted in compact mobile devices such as smartphones and wearable devices. Thinner camera modules can be realized by mounting an image sensor in the cavity.

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Vision Systems Design: Varioptic and Datalogic announce the availability of Datalogic’s Matrix 300 barcode reader and PowerScan PD9500 HP mobile scanner with variable focus liquid lenses from Varioptic. Matrix 300 barcode readers are intended for marking applications including those in manufacturing, electronics, automotive, medical device traceability, food and beverage, and clinical lab automation applications. PowerScan PBT9500 HP 2D handheld area imagers are aimed to mobile scanning in warehouses, logistics, and manufacturing applications. Both of these devices feature a Varioptic liquid lens for variable focus from 5 cm to infinity. In addition, the lenses enable lower power consumption and higher shock resistance.

If I'm not mistaken, Datalogic is worldwide #2 in barcode readers, after Motorola Symbol. "The addition of Varioptic’s liquid lens with no moving parts to the PowerScan imager’s other advanced features allows us to offer an even more reliable product with higher performance levels," said Giulio Berzuini, VP and GM for the Hand Held Scanners Business Unit of Datalogic.

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Kotaku, Forbes and other sites quote Korean-language newspaper Hankooki saying that Kinect-based system identifies the objects crossing the DMZ between South and North Koreas. It can discern the difference between animals and humans. If the system detects a human, it will alert the nearby outpost. Further details are sparse, supposedly because this involves South Korea national security.

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PR Newswire: Plastic Logic and ISORG picked up the award for their large area flexible image sensor at the FlexTech Conference in Phoenix, Arizona.

The collaboration is based on the deposition of organic printed photodetectors (OPD) by ISORG, onto a plastic organic thin-film transistor (OTFT) backplane by Plastic Logic, to create a flexible sensor with a 4x4 cm active area, 375um pitch (175um pixel size with 200um spacing) and 94 x 95 = 8930 pixel resolution. This award recognises the potential of the technology in a range of applications and the competitive advantages of such products. The range of new applications is in digital image sensing, including smart packaging and sensors for medical equipment and biomedical diagnostics, security and mobile commerce (user identification by fingerprint scanning), environmental and other industrial uses. Most exciting of all is the ability to enable scanning surfaces and novel 3D interactive (gesture based) user interfaces for consumer electronics, including printers, smartphones and tablets.

Indro Mukerjee, CEO of Plastic Logic said "The collaboration with ISORG has showcased the exciting potential of combining two disruptive technologies and we plan to work together to bring new applications to market. This again underlines the real impact of plastic electronics as it starts to go mainstream in consumer markets." Jean-Yves Gomez, CEO of ISORG, stated "This collaboration demonstrates the versatility of organic electronics to combine two different technologies to create new and disruptive products for a broad range of markets. The first large area image sensor on plastic has already attracted strong interest from industry and consumer electronics leaders for new applications and functionalities."

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Samsung published a Youtube video promoting its ISOCELL technology:

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PR Newswire: Frost & Sullivan released "Strategic Analysis of the World Optical and Image Sensors Market". A few of their market observations:

• Maintaining a balance between high image quality, technology, and price is the biggest challenge for the industry.
• It is difficult for smaller manufacturers to differentiate their products by any factor, other than price. This deters their entry into high-volume applications markets.
• Shortening the development time for optical and image sensors is important because of the short product life cycles of the consumer market where they are primarily targeted.

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UCLA Extension offers two courses on image sensors in March 2014:

March 10-12: "Fundamentals of CCD and CMOS Imagers and Camera Systems" by James Janesick, SRI
March 13-14: "Applications, Design, and Testing of CMOS and CCD Sensors and Camera Systems" by Terrence Lomheim, The Aerospace Corp.

The detailed program of the courses can be seen on the links above.

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Japanese language Egami blog noticed Sony patent application proposing to use nano-carbon film that apparently changes its transparency with applied electrical field. It looks like the transparency is modulated only in IR band, but Sony considers it significant enough to apply for an IR shutter patent.

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2015 International Image Sensor Workshop (IISW) will be held on June 8-11, 2015 in Kasteel Vaalsbroek (Vaals, The Netherlands):


General Workshop Co-Chairs:
Johannes Solhusvik - OmniVision
Albert Theuwissen – Harvest Imaging & Delft Univ. of Technology

Technical Program Chair:
Pierre Magnan – Institut Supérieur de l'Aéronautique et de l'Espace

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Sharp published a page explaining its iSHCCD and iSHCCDII improvements in the recently announced iSHartina line. iSHCCD features an improved microlens shape:


iSHCCD-II features improved IR sensitivity achieved by the deeper photodiode implants:


These two modifications give iSHCCD a significant QE improvement over the non-iSHartina CCDs:


Sharp also announces a new member of iSHCCD II family - a 1.3MP/30fps RJ33J3CA0DT.

Update: The links above have been changed to English version.

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Samsung patent application US20140014818 "Pixel array, image sensor including the same, and method of compensating for local dark current" by Young Sung Cho, Dong Jae Lee, Tae Chan Kim, and Tomer Livneh propose a simple approach to compensate the black level variations across the pixel array. The idea is simple: a number of dark, light-shielded pixels is distributed in random or not-so-random way across the array, and their interpolated output is used for local black level calculations:


There are few modifications that need to be added to that application:

• Light leaks or photoelectrons diffusion to the shielded pixels can distort the black level measurements. Unless this is completely resolved in the company's ISOCELL technology, one might need to light-block the larger groups of pixels.
• dark current varies a lot on pixel-by-pixel basis. So, it needs to be somehow averaged across the neighboring dark pixels
• there are hot pixels, whose dark current is just abnormally high and carries no information about other pixels in the area. They need to be excluded from the dark current calculation process.

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Sony patent application US20140022430 "Solid-state imaging device and manufacturing method" by Yosuke Ueno, Natsuko Seino, and Kenichi Takamiya discusses a crosstalk challenge between the adjacent column-parallel ramp ADCs. As pixel size shrinks, the column pitch becomes smaller, the neighboring comparator's transistors are closer and coupling capacitance becomes more of the issue. One possible solution is to add metal shields between columns. However, the shield takes a significant column area. So, Sony proposes to re-arrange the comparator transistors in the neighboring columns in such a way that part of the crosstalk is compensated:

Column Ramp ADC (background info, nothing new)

Column comparator input stage (background info, nothing new)

The capacitive coupling problem shown (background info, nothing new)

Coupling caps from the above shown in schematics (nothing new so far)

One of the improvement proposals, coupling is partially compensated

Schamatics of the compensated layout, Note that each half-nmos gets couping to the opposite side of the neighboring diff pair

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Point Grey releases the charts comparing its different cameras based on CCD and global and rolling shutter sensors. Few interesting charts comparing monochrome sensors (see color sensors in another doc):


Thanks to MJ for the info!

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Cypress EZ-USB CX3 camera controller allows simple mobile image sensors connection to PC. CX3 has a 4-lane CSI-2 receiver with up to 1 Gbps on each lane, and supports video data formats such as RAW8/10/12/14, YUV422 (CCIR/ITU 8/10-bit), RGB888/666/565 and User-Defined 8-bit. CX3 has integrated the USB 3.0 and USB 2.0 PHYs along with a 32-bit ARM926EJ-S microprocessor for data processing and for building custom applications.

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Tech-On reports that Shinko Optical Co was able to make an endoscope based on Hitachi Kokusai Electric 8K video camera (8K x 4K resolution). Tech-On thinks that 8k video might be widely adopted in the medical industry earlier than in the TV broadcasting. The more detailed video is said to eliminate the need in surgical loupes and maintains the details from farther distance. No info is given on the 8k sensor size or its pixel size.

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Sony announces the acquisition of Renesas Tsuruoka Fab. Once the transaction is closed on March 31, 2014, Sony will establish Sony Yamagata Technology Center ("Yamagata TEC").

Last year, there were media reports that Renesas is going to close its Tsuruoka fab. The fab used to make chips for Nintendo game console, whose sales were sluggish.

Yamagata TEC will serve as a new production site for CMOS image sensors, and Sony plans to engage in capital investment from the first half of the fiscal year ending March 31, 2015 ("FY14") through the second half of the fiscal year ending March 31, 2016 ("FY15") in order to increase image sensor production capacity. This planned investment is a part of Sony's mid- to long-term plan to increase its total production capacity for image sensors from the current capacity of approximately 60,000 wafers per month to approximately 75,000 wafers per month (in 300mm wafer equivalents). Sony intends to convert part of the semiconductor manufacturing equipment that Sony is scheduled to acquire from Renesas to CMOS image sensor manufacturing, and also to install new equipment for CMOS image sensors. Yamagata TEC will primarily engage in the manufacture of photodiodes and wiring processes for stacked CMOS image sensors.

Sony will position Yamagata TEC as a new site for one phase of the image sensor wafer production process, alongside its existing Kagoshima Technology Center, Kumamoto Technology Center, and Nagasaki Technology Center sites. By doing so, Sony aims to strengthen its capacity to supply stacked CMOS image sensors.

The total investment amount is expected to be approximately 35 billion yen, comprising (i) approximately 7.5 billion yen to acquire Renesas Yamagata Semiconductor's Tsuruoka Factory assets in the fiscal year ending March 31, 2014 ("FY13"), and (ii) approximately 27.5 billion yen for planned capital investment to be carried out during FY14-FY15.

Update: Semicon portal published a nice graphics on the recent Japanese fabs acquisitions. The portal also says that Tsuruoka fab has 40nm process, a nice advance for Sony. There are some challenges for Sony in this deal:

"Renesas moved some of the production equipment to the Naka fab, its main fab, so that it could continue manufacturing game-use system-on-chip LSIs, the Tsuruoka fab's principal products. Sony, therefore, would have to install some production equipment following the contemplated acquisition. This would increase the aggregate investment related to the Tsuruoka fab. Opinion on the advisability of the acquisition is divided within Sony.

From Sony's perspective, another drawback of the Tsuruoka fab is that the production line is not fully automated. Originally designed for high-mix low-volume production, the fab has poor automatic conveyor systems. Therefore, the line could fall short of what is required for highly efficient high-volume manufacturing of CMOS image sensors by Sony."

Update #2: Sony publishes a map of its image sensor production facilities:

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PMD posted Youtube video showing 3D scanner application based on its recent CamBoard pico XS:

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IEEE Tech Insider opens registration for a free Samsung webinar on Feb 11, 2014: "
Samsung presenters will share with the audience how ISOCELL:

• Decreases crosstalk by approximately 30%, resulting in higher color fidelity
• Increases the full well capacity by 30%, leading to greater dynamic range
• Features a 20% wider chief ray, reducing the height of the camera module

They also talk about specific challenges in developing ISOCELL and the solutions that will benefit camera module designs and, ultimately, the end camera applications.

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GEO Semiconductor introduces the GC6500 family of programmable video processors, integrating GEO’s eWARP core, Apical HDR ISP pipeline, MIPI D-PHY Input, stereo recording path, H.264 Codec, Tensilica XTENSA HIFI CPU and USB2.0 interfaces. Integrated DCDC converters and LDOs provide all necessary system voltages. The eWARP Geometric Processor supports correction for wide field of view lens (180/360). It also supports custom maps for panoramic and zero-content loss views, multiple virtual cameras with perspective correction and ePTZ (electronic Pan, Tilt and Zoom). The processor supports up to 5MP sensor resolution at 30fps and 1080p60 video.

Paul Russo, CEO of GEO Semiconductor says, "There is an explosion of uses for ultra-wide field of view or ‘fisheye’ applications for consumer and industrial markets, such as home security, automotive, cloud and wearable cameras. All of these segments require intense geometric image processing as well as multi-stream compression support. The programmability of the GC6500 provides customers ultimate flexibility and offers H.264 video compression, WDR ISP support in a highly integrated low power IC to enable emerging camera markets. GEO has developed complete software stacks, including iOS and Android applications, to provide superior hardware and software support to its customers and shorten their time to market."

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Fermilab publishes Eric Fossum's presentation "CMOS Image Sensors: Tech Transfer from Saturn to your Cell Phone", including an interesting Q&A section in the end, presented on Nov 18, 2013 (via Nuit Blanche blog):

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Cnet, Luminous Landscape, Digital Transitions report that the new Phase One IQ250 medium format digital camera back features 50MP Sony CMOS sensor. The sensor size is 44mm x 33mm (1.3x MF crop factor)and it offers 14-stops DR.

Luminous Landscape also says that the Hasselblad H5D-50C uses the same Sony sensor.

Phase One's Youtube video talks about the new CMOS sensor:

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Brigates (Chinese name - Rui Kunshan Microelectronics Inc.) announces BG0601 and BG0631 MCCD sensors for PAL-resolution security cameras. MCCD is a CMOS sensor which has CCD-compatible external interface. It be used in place of CCD in security camera, with some modifications: AFE is integrated onto the sensor and HV driver is not needed:

Brigates Chairman Luo Wenzhe presents MCCD technology

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e2v published a PR on its 106 CCDs imager inside the European Space Agency space observatory Gaia on a five year mission to map the galaxy. e2v has implemented different functionalities in each of these CCDs, like charge injection, antiblooming and TDI gate structures to meet the specific needs of the mission. There are three variants of the CCD91-72, each optimised for different wavelengths in the range 250 to 1,000nm. The CCD package is 3 sided buttable, to minimise the dead space between CCDs when they are tiled together in the mosaic and all CCDs have been through e2v’s back thinning process.

Hans Faulks, General Business Unit Manager for Space and Astronomy commented: "We are immensely proud and excited to finally see our image sensors embark on this mission. All the hard work, dedication and expertise that has been put into our sensors and into the mission will finally come to fruition. Our products will now play their part in history as we help increase our understanding of our universe."

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Pelican Imaging started the new year with quite a few news. First, its website is updated with special emphasis on depth-enabled features:


Second, the company publishes its CTO and co-founder Kartik Venkataraman's keynote on the future of mobile imaging presented at the International Conference on Consumer Electronics (ICCE) on January 12 in Las Vegas, NV. The keynote addresses some of the concerns about the array camera resolution (click to enlarge):


The presentation also talks about the depth-enabled features, after-the-fact focus, background blurring and substitution, videoconferencing, and more. The depth map is not bad for such a small camera:


Third news is that Pelican Imaging's technology has been nominated for a 2014 Edison Award - the nominee #181 out of 309. The winners will be announced on April 30.

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