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DxO announces that it has licensed its Electronic Image Stabilization (DxO EIS) technology to ALCATEL ONETOUCH, a division of TCL Communication (Shenzhen, China), the world’s fifth-largest handset manufacturer. "The embedded imaging technology DxO will now deliver into our handsets sets a new benchmark in putting high image quality and professional-looking video results into the hands of our consumers, delivering an incredible camera experience. This is integral to our vision of creating smartphones that combine simplicity of use with best in class functionality,” says Dan Dery, CMO ALCATEL ONETOUCH.
"We are very keen on partnering with ALCATEL ONETOUCH to bring our leading video stabilization solution to new markets," says Jerome Meniere, CEO of DxO. "Consumers are increasingly turning to their mobile phones as their primary video camera. While the visual quality of a video is driven by a number of factors, image stability adds significantly to the overall user experience. DxO EIS offers full steadicam-like image stabilization, comparable to professional camcorder devices, without the use of mechanical parts."

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NHK Broadcast Technology Magazine No.55, Winter 2014 presents a CIGS-based "photoconductive film capable of multiplying the original charges generated by the incident light by many times simply with a low applied voltage" which can be deposited on top of image (charge) sensor to improve its low-light sensitivity:


The feature article talks about the progress in 8K UHDTV image sensors:


Another feature article talks about NHK R&D on high speed image sensors. "It is currently possible to purchase a monochrome camera with a resolution of 100,000 pixels that can capture video at up to ten million frames per second."

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Samsung Tomorrow blog introduces new flashes for smartphones and tablets. The new reflector-integrated flash LED ─ the 3432 1.8t (FH341A) delivers over 165 lux at 1A and a minimum CRI (Color Rendering Index) of 80. Another reflector integrated LED 3432 1.4t (FH341B) is specifically designed for extra-slim LED mobile solutions. The 3432 1.4t package includes a reflector and is only 1.4mm thick, fitting to smartphones and tablets thinner than 7mm. In addition, it provides a minimum illuminance level of 165 lux.

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Panasonic publishes a flyer presenting MN34210PL and MN34219PL sensors for security and surveillance applications. The sensors feature:

• Able to capture sharp and vivid color images at 0.05 lux
• High speed, up to 120fps
• New Wide Dynamic Range function supports high speed and high sensitivity movie
• Industry’s leading low noise sensor (no numbers)
• Industry’s leading low power consumption sensor (no numbers)

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ST presented its view on image sensor market at Leti Imaging workshop on June 28, 2013: "CMOS image sensors fish market : Catch of the day" by Marc Vasseur. Few interesting slides from the presentation:

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Maru LSI posted another video showing how its VIPS IR/RGB sensor can eliminate the background with a pulsed IR source:

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IEEE Spectrum, Mashable, Wall Street Journal write about Google project Tango allowing 3D mapping with a compact IR 3D sensor based on unknown technology. The 3D computer vision processing uses Movidius chip. Google Youtube video shows Project Tango in action:

The 3D IR sensor is on the bottom of the phone

Update: Cnet publishes an interview with Remi El-Ouazzane, Movidius CEO. Few quotes:

"Over multiple iterations, we developed an architecture optimized for computer vision. The architecture favors parallelism, and not frequency. We're running [the Project Tango phone] on hundreds of megahertz, using a mix of hardware and programmable resources. On today's battery, running our processor will divide your battery power by a factor of 10."

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Albert Theuwissen continues his "How to Measure..." series of tutorials. The latest one describes the detailed procedure for measuring a Modulation Transfer Function (MTF). This is the first post in MTF series, to be continued.

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Business Wire: Toshiba announces T4K82, a 13MP, 1.12um BSI pixel CMOS sensor that allows smartphones and tablets to record 1080i video at 240fps, said to be the industry’s highest frame rate.

High speed video recording requires a high frame rate with short exposure time, resulting in underexposed images. T4K82 incorporates "Bright Mode" technology that boosts imaged brightness up to four times. The sensor also adopts a newly developed low power circuit design that reduces power consumption to 82% that of T4K37, a 13MP/1.12um sensor in mass production. Although the full resolution mode speed is the same 30fps as its predecessor, the new sensor's video modes are much faster:


Other than interlaced to progressive conversion, the sensor features HDR and Color Noise Reduction (CNR) modes, lens shading correction, and many other functions:


Sample shipments are scheduled to start in March, with mass production to start in Sept 2014 with projected volume 2 million per month.

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Sony 1/2-inch 12.40MP BSI CMOS sensor, IMX226CQJ, features a new 1.85um pixel with very wide optical acceptance angle, in comparison with the older 2.8um pixel IMX136:


"These characteristics are extremely important for security camera which often opens lens diaphragm during night-time shooting" (see Axis Communications' paper at IISW'2013).

The new sensor is quite fast at 40fps at full resolution or 60fps in 4K mode:


and sensitive (again, compared with 2.8um pixel):

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Pelican Imaging CEO Chris Pickett explains array camera advantages in this Youtube video:

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EETimes-Asia & EETimes-Europe give few numbers from Microsoft ToF sensor presentation at ISSCC 2014: "The image sensor is a 512x424 CMOS 3D time-of-flight with multi-frequency demodulation up to 130MHz at 2GSPS ADC. The device is reported to have a depth accuracy of 0.5 per cent at a range of between 0.8m and 4.2m." Microsoft announced that an enhanced sensor for Kinect for Windows will be available in summer 2014.

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Grand View Research publishes "Image Sensors Market Analysis And Segment Forecasts To 2020."

Key findings from the report:

• The global market for image sensors is expected to reach USD 12,028.2 million by 2020
• Global image sensor shipments were estimated to be 1,797.9 million units in 2012; they are expected to reach 3,009.2 million units by 2020, growing at a CAGR of 6.7% from 2014 to 2020.
• CMOS image sensors dominated the market in 2012, accounting for 83.2% of total shipments.
• Contact image sensors (CIS) segment is estimated to grow at a CAGR of 4.4% from 2014 to 2020.
• Digital camera segment, including DSLR, was valued at USD 4,479.3 million in 2012.
• Medical applications are expected to be the fastest growing segment, with an estimated CAGR of 9.2% in terms of shipments from 2014 to 2020.
• Asia Pacific is expected to be the largest and fastest growing regional market during the forecast period. It accounted for 35.9% of the global shipments in 2012 and is expected to grow at a CAGR of 7.4% from 2014 to 2020.

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Lapis Semiconductor (Oki Semi spin-off) comes with a low-cost and low resolution thermopile-based image sensor, the ML8540WD:


Meanwhile, for quite a some time Melexis has been selling its own low-cost IR sensor, the 16 x 4 pixel MLX90620. The sensor features in Youtube video:



MicroMountains Applications AG, Germany publishes a popular review of low-cost 3D and IR sensor technologies. Here is the comparison of thermal IR approaches:


Update: Another view on IR imaging market from Schneider Electric presentation in Leti, June 2013:

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Business Wire: At Mobile World Congress at Barcelona, Spain on Feb. 24─27, 2014, Aptina is to showcase advancements in its mobile imaging solutions including clear pixel Clarity+ technology and video quality MobileHDR. Additionally, Aptina will demonstrate its 8MP, 13MP, 18MP image sensors as well as its next-generation high-performance image sensor along with 4K video for mobile devices. No further details on MobileHDR is reported.

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Image Sensor Conference to be held in London, UK on March 18-20 publishes Renato Turchetta, Rutherford Appleton Laboratory, answers on high speed imaging questions. Renato is going to lead a pre-conference workshop on "A Million Images per Second and Beyond." A quote: "It looks like this field has suddenly started to move rapidly, so it wouldn't be unreasonable to expect more developments in the near future. By the way, one of the new approaches uses CCD in CMOS and other applications are emerging for this 'new' technology. So are CMOS image sensors dinosaurs? And CCD as well?"

Another publication of the conference is sort of a review of automotive ADAS market: "The market for ADAS systems is growing; analysis of the market has revealed possible growth at a rate of over 50% CAGR until 2018. Market value may also rise from the current value of around $18.5bn, to $165bn in the next five years."

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Albert Theuwissen reviews ISSCC 2014 imaging session. The review goes into detail on Samsung ISOCELL presentation, covering DTI and vertical TG. Also, the new Microsoft Kinect ToF sensor presentation is discussed.

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Altasens patent application "Optical black pixel readout for image sensor data correction" by Gaurang Patel proposes average black pixel outputs in analog domain before the ADC:


The intention of the proposal is to save the digital image processing resources. However, the necessity to deal with hot and bad pixels in dark rows makes the invention so complex that its analog implementation advantages are in doubt:


Rambus application "Image sensor with a split-counter architecture" by Jie Shen proposes a way to reduce the data throughput problem in photon-counting pixel array. The idea is to locate only a small counter in each pixel and count an overflow signal outside of the array:


TSMC keeps working on various stacked sensor ideas. Two of the stacked sensor applications were published this week. One of them, the US20140035083, talks about raised photodiode with Tx gate structure, while ther rest of pixel transistors are located on the logic chip: "Elevated Photodiode with a Stacked Scheme" by Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung.


Another TSMP application, US20140035013 "Novel CMOS Image Sensor Structure" by Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Wen-De Wang, talks about a bonding of a regular and SOI wafer with hydrogen implant:


Forza patent application US20140027609 "Implement Multiple Pixel Output for Photodiode Size Pixels" by Guang Yang, Loc Truong proposes to add more transfer gates on different sides of a large pixels to speed up its charge transfer:


Another Forza application US20140027615 "Driving Global Digital Signals Across Large Arrays" by Barmak Mansoorian, Daniel vanBlerkom proposes to improve the speed of signal propagation along the long metal lines in stitched sensors:

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Korean image sensor company Maru LSI publishes a Youtube demo of its VIPS (Vertically Integrated Photodiode Structure) sensor. The sensor was presented in IISW 2007 paper and has deep PD underneath RGB PDs:


In the video, the left picture shows the image from Color CCD camera and the right one shows the results from VIPS image sensor. VIPS image shows the shrunk RGB image and IR image at the bottom and composed image in VGA size. The composition rule is simple addition of two images when the RGB level is lower than the preset threshold:

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PR Newswire: PixArt announces a design engagement with Pantech to offer a gesture motion capability for their IM-A880S (VEGA LTE-A) smart phone. The phone will feature PixArt Gesture Sensor PAC7620. The IR image-based PAC7620 Gesture Sensor creates a three-dimensional gesture space extending 6 inches above the phone to allow the user to interact with their phone by the nine user gestures (up, down, left, right, wave, forward, backward, clockwise, and counterclockwise).

"Our company vision is to develop innovative human/machine interface solutions with our advanced imaging technologies. Providing the capability for users to easily operate their phones with simple hand movements creates a smooth, intuitive interaction for users to heighten their enjoyment of advanced technologies," said Dennis Lo, President, PixArt Imaging USA. "We believe this gesture sensor will help to spur new innovative trends in user gestures for application not only in smart phones but also in other devices as well."

Currently, the Pantech IM-A880S (VEGA LTE-A) user gestures include:

• Basic navigation (Up, Down, Left, Right) for browsing or scrolling Web pages
• Zoom In/Out function for pictures or 3-D space movement
• Scroll gestures for forward and reverse movement and volume control through video or music
• Motion detection for phone wake-up or silence applications

The PixArt Gesture Engine integrates into existing smart phones designs with its small form factor and standard I2C interface. The PAC7620 is said to provide a better gestures recognition in comparison to simple photodiode approaches. The PAC7620 also has lower power consumption and latency when compared to conventional cameras solutions paired with software gesture recognition.

A Youtube video shows Pixart prototype in action (has already been shown in the Nov. 2013 post):

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Himax publishes its Q4 2013 results. The company’s President and CEO, Jordan Wu, says on the CIS business progress:

“Our CMOS image sensors delivered a phenomenal growth in 2013 and will continue to be a fast growing area for us in 2014. 2013 was the year when we positioned ourselves as one of the high-end image sensor providers by launching our first 8 mega-pixel sensor product in Q4. Currently, our sensor products range from entry level QVGA and VGA to higher-end 8 mega pixel sensor products, targeting smartphone, tablet, laptop, IP Cam, surveillance and automotive markets. The first quarter revenue prospect for CMOS image sensor looks positive, but gross margin of this product line will be dampened by inventory correction of some mid to low-end products. We are confident that gross margin will improve overtime once we resolve the inventory issue and certain new products with higher margin start to account for a larger proportion of sales for this product line.”

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Android Authority publishes Samsung slides. The web site says that "ISOCELL is actually the commercial name of what Samsung calls 3D-Backside Illuminated Pixel with Front-Side Deep-Trench Isolation (F-DTI) and Vertical Transfer Gate (VTG)." The slides below refer to a pixel size of 1.12um. More slides are at Android Authority site.

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IMEC publishes Vimeo video demo of its HSI multispectral camera (which could be compared to 65 000 spectroscope spatially capturing the spectral signature of 32 points):



Recently, IMEC announced that its multispectral imagers are adapted by several camera manufacturers:

"We are excited to announce the successful integration of our first generation hyperspectral image sensor prototypes by several camera vendor companies. These strategic partnerships on different applications highlight the broad potential of this unique optical-filter-on-chip sensor solution," said Rudi Cartuyvels, SVP of smart systems at imec. "Our technology expertise will enable our partners to add new range of products to their offering, effectively opening up new markets in the booming field of imaging spectroscopy."

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Business Wire: Heptagon announces the general availability of its TrueD H2 array camera, the first in a series of advanced 3D imaging and depth sensing micro systems that Heptagon is introducing to the market. The TrueD H2 camera has one of the smallest form factors currently available for mass production, measuring just 5.9mmx5.8mmx2.25mm.

Heptagon’s TrueD H2 array camera captures additional short-range depth information for gesture and user recognition, background removal, and enhanced imaging. Its key features are typically used for front-facing smart device cameras, but can also add value as an assisting camera to the smart device’s primary camera. The TrueD H2 array camera is the result of integration of its image sensor, module, optics, algorithms, and software.

"Smart device innovations continue at warp speed, transforming the ways people interact with their devices. So, our challenge is to deliver micro imaging and sensing systems for these devices with enhanced capabilities, ultra high quality, ever-shrinking form factor and optimal cost," said Rene Kromhof, Heptagon’s VP of sales and marketing. "With the TrueD H2 array camera, we have proven our ability to innovate rapidly and produce high-volume, market-ready solutions that meet customers’ unique and demanding requirements."

In addition to depth mapping, low z-height, and low power consumption, the TrueD H2 array camera features a unique, patented focus correction packaging (FCP) that accelerates low cost, high quality production. FCP enables high-throughput, low cycle time module assembly, without the need for active alignment systems or barrel-mount solutions. In addition to faster line production, FCP also drives higher yield and therefore lower overall unit costs – important benefits for rapid, high volume manufacturing of smart devices.

The TrueD H2 2x2 array camera is the result of more than three years of development efforts from Heptagon. The 2014-15 pipeline will include new array formats, lens enhancements, higher resolution, and additional sensing system innovations.

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PR Newswire: China-based Wafer Level Chip Scale Package (WLCSP) has been listed on the Shanghai Stock Exchange and has raised US$118M with an IPO price of US$780M - not a bad valuation for a company that begun as an image sensor packaging house. The company started in 2005, when essentially all Shellcase manufacturing business was moved to China. Shellcase R&D team was sold to Tessera for $33M in 2006, while WLCSP manufacturing in China grew into a large business, although still remaining in 8-inch wafer realm:

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Nikkei article says that "Apple is likely looking to switch to Sony sensors for the secondary camera on the screen side, used for taking self-portraits." Up to now, most of the front sensors for iPhone were sourced from Omnivision. So far Sony only supplied high resolution rear sensor to Apple. If the report is true, then either Apple is going to switch its front sensor to higher resolution, like some Chinese smartphone vendors, or Sony is moving to capture some of the lower end sensor market. The former might be more probable, as Nikkei says that Apple asked Sony to double image sensor production.

Nikkei claims that "A request from Apple [to increase CMOS sensors supply] was the reason for its January decision to purchase a plant from Japanese chipmaker Renesas Electronics, according to a source involved in the negotiations." "Sony is a supplier for Samsung Electronics, the world's top smartphone seller, and No. 3 Huawei Technologies, as well as Apple." "Sony's image sensor sales, chiefly CMOS sensors, are expected to total about 360 billion yen ($3.47 billion) this fiscal year. It held the largest share of the global CMOS sensor market in 2012 at 32.1%, according to Techno Systems Research."

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Invisage apparently prepares the public to a release of its first product later this year. Invisage CTO and Founder, Ted Sargent, posts in the company blog:

"InVisage’s QuantumFilm offers consistently maximal fill factors for all pixel sizes—today’s leading-edge 1.1 um pixels. QuantumFilm enables 100% fill factor by virtue of its being continuous. The entire area of the imaging array is occupied by a medium whose sole purpose is light sensing. At the same time, 100% of each pixel is also available to the silicon beneath for rendering beautiful color images."

"New features enabled by InVisage’s advance include ultra-high sensitive, ultra-wide dynamic range, and ultra-high resolution imaging. New capabilities include the first shutter capability built into the image sensor itself, and reach into the spectral regimes invisible to silicon."

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Sigma announces "Foveon X3 Quattro direct image sensor" with top blue sensing layer split into four pixels, on top of the single green and read pixels:

The new 1:1:4 structure (bottom 1: middle 1: top 4) offers higher resolution that is equivalent to 39 megapixels for conventional color filter array sensors. In addition to the higher resolution, the sensor offers enhanced noise characteristics and faster processing and writing to memory of high-volume image data.

The new split-blue approach is said to increase the sonsor's resolution by 30% to be equivalent of that of 39MP Bayer sensor.

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Yole Developpement publishes the 2012 market shares, based on revenue (click to enlarge):

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BDTI publishes an article on Imagination Technology's Raptor ISP IP, announced in Nov. 2013. Imagination got into ISP technology with Nethra acquisition in June 2012. The company claims a number of advantages  of moving the ISP functionality from image sensor to an application processor:

• No functional constraints that might be caused by the image sensor's or standalone chip's comparatively conservative manufacturing process
• Higher performance due to the application processor's same process advantages
• Access to main system memory for enhanced functionality, and
• Reduced cost and increased flexibility in image sensor choice

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