Image Sensors World Go to the original article...
Ultra-Thin Image Sensor Chip Embeded Foil
Author: Shuo Wang{2}, Björn Albrecht{1}, Christine Harendt{1}, Jan Dirk Schulze Spüntrup{1}, Joachim Burghartz{1}
Affiliation: {1}Institut für Mikroelektronik Stuttgart, Germany; {2}Institut für Nano- und Mikroelektronische Systeme, Germany
Abstract: Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. This paper focuses on the embedding and characterization of a bendable ultra-thin image sensor in flexible polymer foil.
Leave a Reply