Videos du jour 2022-09-28: Teledyne, amsOSRAM, IEEE Sensors

Image Sensors World        Go to the original article...

Teledyne e2v's Topaz series of industrial CMOS sensors include 2MP (1920 x 1080) and 1.5MP (1920 x 800) resolution devices. The sensors use state-of-the-art low noise, global-shutter pixel technology to offer powerful solutions and enable compact designs for many applications.

Optimom™ 2M is the first in a range of MIPI CSI-2 optical modules. Powered by Teledyne e2v’s proprietary image sensor technology, Optimom has been thoughtfully designed to ensure there is minimum development effort required for vision-based embedded systems for robotics, logistics, drones, or laboratory equipment. Find out more

Time-of-Flight (ToF) sensors from ams enable highly accurate distance measurement and 3D mapping and imaging. Time-of-Flight (ToF) sensors from ams OSRAM are based on proprietary SPAD (Single Photon Avalanche Photodiode) pixel design and time-to-digital converters (TDCs) which have an extremely narrow pulse width. They measure in real time the direct time-of-flight (dToF) of a 940nm VCSEL (laser) emitter’s infrared ray reflected from an object. Accurate distance measurements are used in many applications e.g. presence detection, obstacle avoidance & ranging.

Title: Processing and Chracterisation of an Ultra-Thin Image Sensor Chip in Flexible Foil System
Author: Shuo Wang, Jan Dirk Schulze Spüntrup, Björn Albrecht, Christine Harendt, Joachim Burghartz
Affiliation: Institut für Mikroelektronik Stuttgart IMS CHIPS, Germany

Abstract: Unlike most image sensors, which are planar and inflexible, in this work, an ultra-thin image sensor is performed as a Hybrid System in Foil (HySiF) by using Chip-Film Patch technology, which is a concept for high-performance and ultra-thin flexible electronics. In order to characterize this image sensor embedded in foil, an adapter board for the Andvantest 93000SOIC test system was developed. This paper demonstrates production process of the HySiF and its´ behavior and performance. In addition, the applications and future work of this bendable image sensor in foil system is discussed.

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