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MacRumors: Corephotonics has filed a lawsuit against Apple alleging that the iPhone 7 Plus and iPhone 8 Plus infringe upon four of its patents: US 9,402,032, US 9,568,712, US 9,185,291, and US 9,538,152.

The two iPhones are accused in using patented telephoto lens design, optical zoom method, and a method for fusing images from the wide-angle and telephoto lenses. From the lawsuit:

"As one of its first acts as a company, Corephotonics reached out to Apple in the hopes of establishing a strategic partnership. Corephotonics received many encouraging reports and positive feedback from Apple about its technology, but the parties never concluded a license to the Corephotonics technology.

In fact, after one failed effort to negotiate a license, Apple's lead negotiator expressed contempt for Corephotonics’ patents, telling Dr. Mendlovic and others that even if Apple infringed, it would take years and millions of dollars in litigation before Apple might have to pay something."

Meanwhile, Corephotonics site publishes a comparison of its newer folded optical zoom camera images with ones of iPhone 7+ and other popular smartphones:

Corephotonics Hummingbird reference design

Corephotonics Hawkeye folded optics zoom reference design

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Image Sensors Europe to be held on March 14-15, 2018 in London, UK unveiled its preliminary agenda with many interesting presentations:

• Understanding the future of the image sensors market
  Ronald Mueller, Associate Consultant and CEO, Vision Markets of Smithers Apex
• Intel RealSense camera technology
  Roi Zeiss, Intel RealSense Group Marketing Leader, Intel (Invited - TBC)
• 3D machine vision platform and trend
  Luke Liu, President & CEO of LIPS Corporation
• 3D ToF SPAD imaging – performance and system designs; a look under the hood
  Carl Jackson, CTO and Founder and Wade Appelman, VP of Sales and Marketing, SensL Technologies
• 3D sensing modules for applications in consumer devices
  Mathias Schulz, Design Engineering Manager of Jabil Optics Germany
• Achieving mass commercialisation: what will it take for autonomous driving to go mainstream?
  Oren Rosenzweig, Chief Business Officer & Co-Founder of Innoviz Technologies
• Designing ultra-high resolution/high-speed image sensors for 8K slow-motion system
  Toshio Yasue, Research Engineer of NHK (Japan Broadcasting Corporation)
• Space imaging
  Dirk Viehmann, Airbus Defence and Space of Detector Engineering & System Engineering
• Time-of-flight (TOF) range image sensors for VR/AR applications
  Shoji Kawahito, Professor, Research Institute of Electronics, Shizuoka University and CTO of Brookman Technology
• Global shuttering for industrial application
  Xinyang Wang, Founder and CEO of GPixel
• Why hybrid imagers have a hard time beating monolithic CMOS image sensors
  Albert Theuwissen, Founder of Harvest Imaging
• Multispectral time delay integration line scan imagers using CCD-in-CMOS technology
  Piet De Moor, Senior Business Development Manager Imagers of IMEC
• Single photons: imaging beyond imagination
  Matteo Perenzoni, Head of IRIS Research Unit of Fondazione Bruno Kessler (FBK)
• Accelerated image sensor production using machine learning and data analytics
  Daniel Van Blerkom, CTO & Co-Founder of Forza Silicon
• Efficient vision systems thanks to event-based sensors
  Raphael Berner, Co-Founder and Head of Chip Design of Insightness
• Polarization imaging
  Harald Neubauer, Head of Department Integrated Sensorsystems of Fraunhofer Institute for Integrated Circuits

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BusinessWire: ON Semi introduces a 1/4-inch, 1MP (1280H x 800V) CMOS sensor featuring innovative global shutter pixel with high shutter efficiency and SNR and minimal ghosting and noise effects. The 3.0 μm pixel AR0144 is available in monochrome and color. Bar code scanners, drones and 3D camera for AR/VR and named among the possible applications for the new sensor.

Gianluca Colli, VP and GM of Consumer Imaging Solutions at ON Semiconductor, says: "The need for vision-based sensing and control is increasing with many new and diverse applications emerging and rapid growth in areas such as surveillance. The novel global shutter and class-leading performance of the AR0144 achieved in a very small package represent an enabling technology that will help designers bring compelling new products to market that are able to work in the most challenging operating environments.”

Mordor Intelligence forecasts that the global image sensors market will increase to $12.67 billion by 2018 with a CAGR of 7.69% over the period 2014-2020. The AR0144 is available now in 5.6 mm x 5.6 mm 69-ball CSP packaging and also as a bare die. The AR0144 monochrome device is in production now, with the color version available later this year.

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TechInsights compares Huawei Mate 10, Apple iPhone 8 and Samsung Galaxy S8 smartphones costs. It appears that Huawei invests most in cameras - 12% of the total cost, while iPhone 8 is 7% and Galaxy S8 is 8%:

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SeekingAlpha publishes ON Semi Q3 2017 earnings call transcript. Few quotes:

"As we announced last quarter, we have monetized our mobile CMOS image sensor IP, and another announcement related to divestiture of another business should come out shortly.

Third quarter communications revenue was negatively impacted by our exit from the mobile image sensor market in the second quarter of 2017.

We are seeing strong growth for our PYTHON line of image sensors for machine vision applications."

Then, in the Q&A session:

Vivek Arya - Bank of America Merrill Lynch:

...in terms of the competitive landscape, we have heard more noise coming out of Sony in terms of their intention to compete in the automotive image sensor market. I understand these relationships with customers tend to be long-term, so there's probably no change in the near-term. But just longer term, how do you see your technology position in the automotive image sensor market versus Sony or any other competitor?

Keith D. Jackson - CEO, ON Semi:

Yes. We continue to drive technologies specific to automotive that we think are a competitive advantage across the board. We also have many years of experience in automotive reliability and quality, along with cyber security and functional security. So, we think we've got a lead there that we can maintain with continued investments specific to the automotive industry.

Vivek Arya - Bank of America Merrill Lynch:

And the same question from a cost perspective, how do you think your cost basis compares with some of your competitors who might have higher volumes just because they are engaged in the smartphone industry?

Keith D. Jackson - CEO, ON Semi:

Yes. We believe we continue to be cost-competitive there, having driven like we do in all of our product lines, very good supply chains, and very good manufacturing efficiencies.

Shawn M. Harrison - Longbow Research LLC:

How much of just walking away from mobile image sensor business did that cost you into the September quarter?

Keith D. Jackson - CEO, ON Semi:

...the direct revenue quarter-on-quarter between two and three was a $12 million reduction that we saw in that. From a year earlier, it was much higher but quarter-on-quarter about $12 million.

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MediSens conference to be held on February 26-27, 2018 in London, UK, publishes its agenda. While most of the presentations are coming from clinicians and radiologists, some talk about image sensor technology:

- CMOS-based mammography detector by Inge Peters, Dalsa
- Be inspired by optical technologies for new X-ray imaging modalities by Peter Seitz, Hamamatsu:

• Time-of-flight X-ray imaging enabled by carbon-nanotube based cold-cathode X-ray sources
• Direct X-ray photon detection with high energy resolution through semiconductors and perovskites
• Dark-field X-ray imaging based on phase contrast techniques
• X-ray spectroscopy for element-sensitive X-ray radiography and CT imaging
• Triboluminescence for X-ray photon generation

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Dongbu CIS wafer foundry changes its name to DB Hitek:

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Yole Developpement report "Camera Module Industry Market and Technology Trends 2017" has quite a lot of observations and forecasts:

Mobile rear photography camera is still the main driver of the camera module industry that reached $23.4 Billion in 2016 and that will reach $46.8 Billion by 2022.

• VCM players producing the autofocus (AF) and optical image stabilization (OIS) mechanisms have had to adapt to the huge production volume and low cost requested by the smartphone industry. This led to a huge restructuring effort that resulted in a move from Japan and Korea to China and Vietnam. Companies like New Shiko and TDK were the big winners, but this activity’s attractiveness has since declined.
• For image-sensor makers and lens-set makers, the situation is reversed. In these sub-markets, leaders Sony and Largan have enjoyed quasi-monopolies. This situation is ending though, since the competition is now catching up in terms of technology.
• Camera module makers have thrived, but are hugely dependent on customer loyalty. For example, LG Innotek reclaimed its crown this year, but feared a collapse when it lost Apple orders.
• One last trend in the ecosystem is illumination modules’ emergence. Since some of the new camera modules now require active illumination, they must be combined with an LED or structured light emitter. This is a new technology set for acquisition by camera module makers.

The average cost for a mobile camera module has remained relatively constant, but complexity has risen dramatically, with high-end VCMs and active alignment now mandatory on the latest modules. Currently, total camera module value per phone is almost proportional to the number of cameras; two cameras is $16, three cameras is around $24, and the cost for four cameras exceeds $30 per handset.

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CEI-Europe announces the 100th Anniversary Digital Image Sensors Course by Professor Albert J.P. Theuwissen. Since 1999, Professor Theuwissen has trained and helped engineers across the world to enhance their skills and know-how about Solid-State Imaging, Image Sensors Technology, and Digital Camera Systems.

On November 13-15, 2017 in Barcelona, Spain (or in Catalonia?), he will train the 100th group of engineers for CEI-Europe.

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Huaian Imaging Device Manufacturer Corporation (HIDM) is a new image sensor startup in China that starts big - from building its own 12-inch CIS wafer fab. The CEO and founder of HIDM is ST Hsia, previously served as Global VP of SMIC, VP of NEC, CEO of Ether, and Chief Director of PROMOS & VIS. There is very little known about the new company founded on Jan. 19, 2016:

"Startup Huaian Imaging Device Manufacturer (HIDM) plans to build a 12-inch fab in Huaian, Jiangsu province, with production capacity set at 20,000 wafers monthly. Founded in 2016, HIDM specializes in the design and manufacture of CMOS image sensor devices."

Apparently, it is the licensee of ON Semi discontinued mobile products and the related IP:

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IC Insights report on optoelectronics market predicts an acceleration in image sensor sales growth:

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iFixit publishes a nice video analyzing iPhone X Face ID operation in IR light and attempts to trick it:

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TechInsights is quick to publish iPhone X Face ID hardware internals, with more details to follow:


iFixit too publishes its first teardown pictures, including well-cushioned dual rear camera:


iFixit publishes an IR video showing how the IR pattern projector flashes:

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Engadget: Sony develops "New Concept Cart SC-1" equipped with image sensors on all four sides of the vehicle. These 35mm full-frame BSI sensors are said to be able to see better than the human eye and open up a number of special features. Their ultra-high sensitivity is said to give the driver an unobstructed view even when driving at night without headlights. The image sensors allow users to take in their surroundings, eliminating the need for windows. SC-1's integrated image sensors provide a 360-degree view of all directions to give awareness of the car environment.

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Korea-based Nextchip publishes a video about its automotive imaging and vision processor:

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Embedded Vision Alliance publishes a preview of LG Senior Director of Technology and Product Planning Paul Gallagher talk on "Coming Shift from Image Sensors to Image Sensing":


TechInsights publishes a teardown report of Huawei flagship smartphone Mate 10. Its cameras cost about 12% of the total cost, not including a ToF module:

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Luminous Landscape publishes an article by Doug Peterson on the recently announced Phase One Trichromatic image sensor explaining the science behind it. There is a striking difference between the marketing presentation and what has been really done.

Here is how Phase One marketing presents Trichromatic color filter:


However, the real color response looks quite different:


The main color filter improvements developed together with Sony are:

• The amount of overlap between the red, green, and blue spectral responses is decreased and is steeper
• The improved “tail clipping” cleans color contamination
• Near-UV cut
• Colors balanced with respect to how much light pixels see

Thanks to TG for the pointer!

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HRL Laboratories receives an award from the Intelligence Advanced Research Projects Activity (IARPA), within the Office of the Director of National Intelligence, to develop spherically curved short-wave (SWIR) and medium wave (MWIR) infrared image sensors. This research will build on curved visible-light image sensor technology developed at HRL. The goal of the 12-month program is to develop fundamental technology and gain a better understanding of the effects of the bending process on the performance of III-V semiconductor SWIR and MWIR image sensors.

"Infrared sensors and their optics have different challenges than visible light imagers,” said Geoff McKnight, HRL’s principal investigator on the project. “One of which is that they often must be operated at very low temperatures, which introduces thermal stresses from the contraction of the sensors. After curving the sensors, we will have to cool them to cryogenic temperature for operation, and the combination of the thermal stresses and bending stresses may potentially degrade or fracture the detectors.”

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Fujitsu develops 3D camera to improve scoring in gymnastics, as shown in the company's Youtube video:

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Imec Magazine article "Image sensor combining the best of different worlds" by Jonathan Borremans and Piet De Moor presents the BSI TDI image sensor based on CCD-in-CMOS process:

TDI principle, using 8 rows of pixels

Time delay integration using CCD-in-CMOS

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AutoSens TV Youtube channel publishes interviews from demo session at the conference. Some interesting examples:

Beat de Coi, CEO of ESPROS Photonics:



SensL's Edel Cashman explains how SiPM sensors could be used in lidar of the future:



Tarek Lule and Sylvie Gounet from ST demonstrate LED flicker-free imaging solutions:



Chronocam CEO Luca Verre talks about the company and the technology:



Geoff Ballew from On Semi talks about sensor fusion:

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Oprics.org: Ford autonomous driving division Argo.ai acquires LiDAR startup Princeton Lightwave developing "Geiger-mode" flash LiDAR.

Argo's CEO Bryan Salesky says: "We can’t talk about a future of self-driving cars without mentioning LiDAR technology — and we won’t be able to build that future without it. These sensors are crucial to creating a three-dimensional view of the world that helps autonomous vehicles find where they are on the road and detect other vehicles, pedestrians and cyclists.

To accelerate our mission to realize the self-driving future, Argo has acquired Princeton Lightwave, a company with extensive experience in the development and commercialization of LiDAR sensors."

The receive side of GeigerCruiser ADAS LiDAR is based on an array of "Geiger-mode avalanche photodiode (GmAPD)" working in 1.06um and 1.55um bands:

"The camera can collect sub-nanosecond resolution timestamps for arbitrarily long periods of time as well as emulate gated (framed) operation, and the sensor can generate timestamps at rates of nearly 1 Gsamples/second. The sensor engine of the camera is a focal plane array (FPA) with hexagonal geometry pixels on a 65.8 µm pixel pitch formatted in a rectangular imaging area of 2.1 mm x 1.8 mm. The FPA is assembled by flip-chip bonding an InP/InGaAsP GmAPD detector array to a custom CMOS readout integrated circuit (ROIC) and then attaching a GaP microlens array to the GmAPD array to provide a high optical fill factor. The hermetically sealed FPA housing has an integrated two-stage thermoelectric cooler to maintain appropriate operating temperature with closed-loop feedback adjustment."

The company presents a video demo of the ADAS LiDAR: "The video contains point clouds collected and processed in real-time from the GeigerCruizer Demo System as it was driven in the vicinity of our headquarters in Cranbury NJ. Objects are detected beyond 300 meters and at reflectances of 10%, with angular resolutions to 1 mrad. In addition, imaging is shown in inclement weather conditions, such as snow and fog, as well as through obscurants such as water and dirt on the GeigerCruizer’s window."



PRNewswire: In another LiDAR news, MEMS scanning LiDAR startup Innoviz expands its series B investing round by $8m with Samsung Catalist and Korean branch of SoftBank joining this round. Together this brings the B round to $73m, added to $9m raised in round A.

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Sony reports quarterly earning results with a nice increase in its image sensors sales and outlook:

"We have upwardly revised our sales forecast by 20 billion yen due to an increase in our forecast for unit sales of image sensors for mobile products, compared with the August forecast. Primarily due to this increase in sales, we have upwardly revised our forecast for operating income by 20 billion yen to 150 billion yen."


Sony specifically emphasizes the automotive image sensor it has introduced recently:

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MEMS Drive publishes a short video on its OIS operation:

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GlobeNewsWire: TowerJazz partners with Changchun Changguang Yuanchen Microelectronics Technology Inc. (YCM), a BSI process manufacturer based in Changchun, China to provide the BSI processing for CMOS sensor wafers manufactured by TowerJazz. This is the first time BSI will be offered by a foundry to the high-end photography market, including large formats requiring stitching.

The partnership will allow TowerJazz to serve its customers with BSI technology in mass production, at competitive prices, starting in the middle of 2018. The new BSI technology is aimed to high-end photography, automotive, AR/VR, and other CIS markets. YCM provides the BSI processing for both 200mm and 300mm CIS wafers.

The new partnership also provides the roadmap for wafer stacking, including state-of-the-art pixel level wafer stacking.

"TowerJazz is recognized worldwide as the leader of CMOS image sensor manufacturing platforms for high-end applications," said Dabing Li, YCM CEO. "The collaboration with TowerJazz will certainly allow us to bring unique and high value technology to the market quickly and in high volume, especially to the growing Chinese market where TowerJazz already plays a significant role."

"I am thrilled with the capabilities we developed with YCM, supporting our continued leadership in many different high-end growing markets. In addition, the excellent collaboration with YCM enables us further penetration into this very fast growing high-end CMOS camera market in China," said Avi Strum, SVP and GM, CMOS Image Sensor Business Unit. "I have very high confidence in the technical capabilities of this partnership."

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New Zealand-based Chronoptics releases PixelScope instrument measuring pixel timing response parameters:

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Mobileye CTO Amnon Shashua talks about autonomous car sensing and processing of the data to ensure the safety at 2017 World Knowledge Forum in Seoul, South Korea. The talk does not directly refer to the imaging but rather presents the way to overcome the processing of the huge amount of imaging data over 30 billion of miles while still ensuring the safety of autonomous driving:

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