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CIS shipments for smartphones shrank in 2022 and 2023
Available: a Ph.D. Scholarship under Prof. Guy Meynants
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KU Leuven
PhD on temporal noise reduction in CMOS image sensors Geel, Belgium Link
Toppan shifts image sensor production to China
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From Nikkei Asia news: https://asia.nikkei.com/Business/Tech/Semiconductors/Japan-s-Toppan-shifts-image-sensor-component-production-to-China
Japan's Toppan shifts image sensor component production to China
TOKYO -- Japan's Toppan Holdings has moved production of components for CMOS image sensors from Japan to China, aiming to boost local production 40% as Beijing looks to bolster its supply chains for related technologies.
CMOS -- complementary metal-oxide semiconductor -- sensors convert light captured by camera lenses into electrical signals. Among CMOS components, Toppan produces on-chip color filters (OCF) that colorize captured images and microlenses that increase light-gathering power. Without OCF, CMOS can only detect differences in light level.
Toppan brought related equipment from its plant in Japan's Kumamoto prefecture to a facility in Shanghai and increased production lines from five to seven. They do not fall under U.S. export restrictions targeting China for advanced chipmaking equipment.
The Kumamoto plant will be used for research and development and its approximately 370 employees will be maintained.
The global CMOS market in 2022 was around $21.2 billion, according to French research firm Yole Intelligence. Sony Group leads with a 42% market share, followed by Samsung Electronics with 19% and U.S.-based Omnivision with 11%.
China's presence among top companies is limited to seventh-place GalaxyCore with 4% and eighth-place SmartSens with 2%. While Sony and Samsung manufacture OCF in-house, Chinese manufacturers mainly procure from outside sources.
In China, demand is increasing for CMOS related to automobiles, smartphones, surveillance cameras and other fields. Toppan will strengthen sales to local CMOS sensor manufacturers by producing near areas of demand.
Toppan's move comes as Beijing is spending more than $1.75 billion a year on subsidies to boost domestic semiconductor production, according to the South China Morning Post.
The U.S. has placed restrictions on the export of chipmaking equipment to China out of concerns the technology could be diverted for military purposes, making it difficult for the country to produce advanced chips.
Among chips in practical use, the most advanced level is currently said to be 3 nanometers. In general, the smaller the nanometer level for a logic chip, the more powerful it is.
Amid U.S. restrictions, China is focusing on CMOS, which differ from logic chips in manufacturing method and the definition of advanced products. Most CMOS can be manufactured using mature technology of 28 nm or greater, with the production equipment falling outside of the U.S. restrictions.
China's share based on production capacity of all 28-nm or greater so-called legacy chips is expected to reach 33% of the world's total in 2027, up 4 percentage points from 2023, according to Taiwan research firm TrendForce.
Beijing announced its "Made in China 2025" high-tech industry development plan in 2015, choosing semiconductors as a priority area. Two large government funds have been set up so far to help boost the domestic chip industry.
Plans for a third phase have recently emerged. Bloomberg reported this month that China was raising more than $27 billion from local governments and state-owned enterprises for a chip fund, the biggest of its kind.
Investment in mature technology other than CMOS is also increasing in China, and Japanese and U.S. manufacturing equipment makers are increasing sales in this field as well.
The value of chipmaking equipment shipments to China reached a record high of over $30 billion in 2023, up 6% from 2022 and putting the country first ahead of Taiwan and South Korea in imports, according to industry group SEMI.
STMicroelectronics and CEA LETI develop microlenses for SPADs
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In a preprint titled "Metasurface-based planar microlenses for SPAD pixels", J. Vaillant et al. of STMicroelectronics and CEA LETI write:
In this paper we present two design generations of metasurface-based planar microlenses implemented on Front-Side Illumination SPAD pixels. This kind of microlens is an alternative to conventional reflow microlens. It offers more degrees of freedom in term of design, especially the capability to design off-axis microlens to gather light around the SPAD photodiode. The two generations of microlenses have been fabricated on STMicroelectronics SPAD and characterized. We validated the sensitivity improvement offered by extended metasurface-based microlens. We also confirmed the impact of lithography capability on metasurface performances, highlighting the need have access to advance deep-UV lithography.
Job Postings – Week of 31 March 2024
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Microsoft Hardware Test Engineer - Hololens |
Fort Collins, Colorado, USA |
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Vanderbilt University Postdoctoral Candidate - The Caldwell Infrared Nanophotonic Materials and Devices Laboratory |
Nashville, Tennessee, USA |
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Cisco Meraki MV Hardware Engineer |
San Francisco, California, USA |
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National University of Singapore Research Fellow (Integrated photonics) |
Kent Ridge, Singapore |
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RTX - Raytheon Advanced Materials - Associate Director, Engineering |
Andover, Massachusetts, USA |
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NASA-JPL Advanced Technology Development for Future UV Missions |
Pasadena, California, USA |
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Prime Robotics SLAM Engineer |
Lakewood, Colorado, USA |
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Oxa Sensor Engineer |
Oxford, England, UK |
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European XFEL Detector Support Scientist |
Schenefeld, Germany |
Two jobs in Italy submitted by Sony EUTDC
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Sony Semiconductor Solutions Europe
Senior Top AMS Verification Engineer Trento, Italy Link
Senior Digital Physical Implementation Engineer Trento, Italy Link
Paper on SPADs at the NATO Science & Technology organization meeting
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A paper titled "SPAD Image Sensors for Quantum and Classical Imaging" by Prof. Edoardo Charbon was published in the STO Meetings proceedings in January 2024.
Abstract:
Single-photon avalanche diodes (SPADs) have been demonstrated on a variety of CMOS technologies since the early 2000s. While initially inferior to their counterparts implemented dedicated technologies, modern CMOS SPADs have recently matched them in sensitivity, noise, and timing jitter. Indeed, high time resolution, enabled by low jitter, has helped demonstrate the most impressive developments in fields of imaging and detection, including fluorescence lifetime imaging microscopy (FLIM), Förster resonance energy transfer (FRET), fluorescence correlation spectroscopy (FCS), time-of-flight positron emission tomography (TOF-PET), and light detection and ranging (LiDAR), just to name a few. The SPAD’s power of detecting single photons in pixels that can be replicated in great numbers, typically in the millions, is currently having a major impact in computational imaging and quantum imaging. These two emerging
disciplines stand to take advantage of larger and larger SPAD image sensors with increasingly low jitter and noise, and high sensitivity. Finally, due to the computational power required at pixel level, power consumption must be reduced; we thus advocate the use of in situ computational engines, which, thanks of CMOS’ economy of scale and 3D-stacking, enable vast computation density. Some examples of this trend are given, along with a general perspective on SPAD image sensors.
11 Canon printing products earn EPEAT Climate+ designation for meeting rigorous evaluation criteria for climate change initiatives
Fujifilm instax mini 99 review
Nikon Z 28-400mm f4-8 VR review so far
Canon Publishes Annual Report for the Year Ended December 31, 2023
Sony releases 247MP sensors
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Sony recently released a new 247MP rolling shutter CIS available in monochrome and color variants: IMX811-AAMR and IMX811-AAQR.
Canon U.S.A., Inc. Named a 2024 ENERGY STAR® Partner of the Year for Sustained Excellence by the EPA
Canon U.S.A., Inc. Named a 2024 ENERGY STAR® Partner of the Year for Sustained Excellence by the EPA
Sigma 50mm f1.2 DG DN Art review
Job Postings – Week of 24 March 2024
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CEA-IRIG Permanent Researcher in Ultra-Wide-Bandgap Semiconductors |
Grenoble, France |
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Apple Camera Electrical Engineer - Camera Hardware |
Cupertino, California, USA |
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University of Hawaii Advanced detector development – Postdoc |
Honolulu, Hawaii, USA |
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Samsung Semiconductor Senior Program Manager, Image Sensors |
San Jose, California, USA |
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CERN Applied Physicist for Pixel-Detector Hybridisation and Testing |
Geneva, Switzerland |
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General Motors Design Release Engineer - Image Quality |
Detroit, Michigan, USA |
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NASA Far-Infrared Detectors for Space-Based Low-Background Astronomy – Postdoc |
Greenbelt, Maryland, USA |
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Lockheed Martin Systems Integration Test Engineer/Infrared Testing |
Goleta, California, USA |
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Sony Automotive Image Sensor Account Manager |
Novi, Michigan, USA |
Four new videos about the industry
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Here are few new videos from image sensor companies.
Two about new hardware built around image sensors:
- Trinamix-ST under-OLED face recognition camera
- Prophesee AR glassses demo
One about new facilities:
- An official opening of TSMC-Sony plant in Kumamoto where Sony will manufacture its new image sensors:
And one about a new sensor series:
- Omnivision presents its new generation of automotive HDR sensors:
A Job Opening with Euresys
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Euresys
Sales Manager - Europe Liège, Belgium or Schongau, Germany Link
A Job Opening with Euresys
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Euresys
Sales Manager - Europe Liège, Belgium or Schongau, Germany Link
Artilux announces room temperature GeSi SPAD
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The research work, led by Dr. Neil Na, CTO of Artilux, has unveiled a CMOS-compatible GeSi SPAD operated at room temperature and elevated temperatures, featuring a noise-equivalent power improvement over previously demonstrated Ge-based SPADs by several orders of magnitude. The paper showcases key parameters of the GeSi SPAD, including dark count rate, single-photon detection probability at SWIR spectrum, timing jitter, after-pulsing characteristic time, and after-pulsing probability, at a low breakdown voltage and a small excess bias. As a proof of concept, three-dimensional point-cloud images were captured with TOF (direct time-of-flight) technique using the GeSi SPAD. "When we started the project, there were overwhelming evidence in the literature indicating that a room-temperature operation of GeSi SPAD is simply not possible," said Dr. Na, "and I am proud of our team turning the scientific research into a commercial reality against all odds."
The findings set a new milestone in CMOS photonics. The potential deployment of single-photon sensitive SWIR sensors, imagers, and photonic integrated circuits shall unlock critical applications in TOF sensors and imagers, LiDAR (light detection and ranging), bio-photonics, quantum computing and communication, artificial intelligence, robotics, and more. Artilux is committed to continuing its leadership in CMOS photonics technology, aiming to further contribute to the scientific community and photonics industry.
The ability to detect single photons has led to the advancement of numerous research fields. Although various types of single-photon detector have been developed, because of two main factors—that is, (1) the need for operating at cryogenic temperature and (2) the incompatibility with complementary metal–oxide–semiconductor (CMOS) fabrication processes—so far, to our knowledge, only Si-based single-photon avalanche diode (SPAD) has gained mainstream success and has been used in consumer electronics. With the growing demand to shift the operation wavelength from near-infrared to short-wavelength infrared (SWIR) for better safety and performance, an alternative solution is required because Si has negligible optical absorption for wavelengths beyond 1 µm. Here we report a CMOS-compatible, high-performing germanium–silicon SPAD operated at room temperature, featuring a noise-equivalent power improvement over the previous Ge-based SPADs by 2–3.5 orders of magnitude. Key parameters such as dark count rate, single-photon detection probability at 1,310 nm, timing jitter, after-pulsing characteristic time and after-pulsing probability are, respectively, measured as 19 kHz µm−2, 12%, 188 ps, ~90 ns and <1%, with a low breakdown voltage of 10.26 V and a small excess bias of 0.75 V. Three-dimensional point-cloud images are captured with direct time-of-flight technique as proof of concept. This work paves the way towards using single-photon-sensitive SWIR sensors, imagers and photonic integrated circuits in everyday life.
Nikon to acquire RED.com
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From Nikon newsroom: https://www.nikon.com/company/news/2024/0307_01.html
Nikon to Acquire US Cinema Camera Manufacturer RED.com, LLC
March 7, 2024
TOKYO - Nikon Corporation (Nikon) hereby announces its entry into an agreement to acquire 100% of the outstanding membership interests of RED.com, LLC (RED) whereby RED will become a wholly-owned subsidiary of Nikon, pursuant to a Membership Interest Purchase Agreement with Mr. James Jannard, its founder, and Mr. Jarred Land, its current President, subject to the satisfaction of certain closing conditions thereunder.
Since its establishment in 2005, RED has been at the forefront of digital cinema cameras, introducing industry-defining products such as the original RED ONE 4K to the cutting-edge V-RAPTOR [X] with its proprietary RAW compression technology. RED's contributions to the film industry have not only earned it an Academy Award but have also made it the camera of choice for numerous Hollywood productions, celebrated by directors and cinematographers worldwide for its commitment to innovation and image quality optimized for the highest levels of filmmaking and video production.
This agreement was reached as a result of the mutual desires of Nikon and RED to meet the customers’ needs and offer exceptional user experiences that exceed expectations, merging the strengths of both companies. Nikon's expertise in product development, exceptional reliability, and know-how in image processing, as well as optical technology and user interface along with RED’s knowledge in cinema cameras, including unique image compression technology and color science, will enable the development of distinctive products in the professional digital cinema camera market.
Nikon will leverage this acquisition to expand the fast-growing professional digital cinema camera market, building on both companies' business foundations and networks, promising an exciting future of product development that will continue to push the boundaries of what is possible in film and video production.
Job Postings – Week of 17 March 2024
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WeRide Camera Sensor Engineer |
San Jose, California, USA |
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ISDI Image Sensor Engineer |
London, England, UK |
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HRL Laboratories Focal Plane Engineer |
Camarillo, California, USA |
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HRL Laboratories Senior Infrared Detector Research Scientist |
Camarillo, California, USA |
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Paul Scherrer Institute Postdoctoral Fellow in detector development |
Villigen, Switzerland |
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Kappa Optronics Engineer for image sensor and camera technology |
Göttingen, Germany |
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Caeleste Characterization Engineer |
Mechelen, Belgium |
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University of Amsterdam - NIKHEF Postdoc position in ALICE and Detector R&D for Experimental Particle Physics |
Amsterdam, Netherlands |
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GE Healthcare Detector Mechanical Engineer |
Hino, Tokyo, Japan |
Three New Videos from Photonis
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Photonis has released new videos describing the latest improvements in its image intensifiers.
A little background might be useful to those with little exposure to image intensifiers.
First, Photonis itself. Those of you who are interested in the whole complex story can find it here. The original Photonis was a renamed spinoff of Philips that subsequently acquired a few other companies including Burle, the renamed spinoff of RCA's vacuum tube operation. Recently, the Photonis Group renamed itself Exosens but still uses Photonis as the brand for its image intensifiers.
Image intensifiers are vacuum tubes that have at one end a surface that emits electrons on receipt of photons, some sort of acceleration and electron multiplication mechanism and a phosphor at the other end to produce a brighter visible image. As new developments have been applied to intensifiers, various generations have been assigned.
Gen 0 - See this (somewhat irreverent) link. (Not real, of course.) Sometimes the first low-gain tubes are called Gen 0.
Gen
1 - Light hitting an alkali photocathode produces electrons that are
accelerated and electrostatically focused by a metal cone on to a curved
phosphor. These invert the image, which is reverted by the optics - 1930s - 1960s.
Gen
2 - Proximity-focused electrons from the photocathode hit a
microchannel plate in which they are multiplied. The electron output is
proximity-focused on a flat phosphor. Some of these still have the
focusing cone to provide image inversion. 1970s
Gen 3 - The alkali photocathode is replaced by a cesium-coated gallium arsenide membrane. 1970s-1990s
Gen 4 - Photocathode improvements of various types and, typically, electronic gating. Strictly speaking, these are still Gen 3. 2000s+
The videos showing tubes Photonis characterizes as Gen 4+:
1 - Demonstration of electronic gating
2 - Demonstration of performance
3 - Demonstration of halo improvements
IEEE ICCP 2024 Call for Papers, Submission Deadline March 22, 2024
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Call for Papers: IEEE International Conference on Computational Photography (ICCP) 2024
https://iccp-conference.org/iccp2024/call-for-papers/
Submission Deadline: March 22, 2024 @ 23:59 CET
ICCP is an international venue for disseminating and discussing new scholarly work in computational photography, novel imaging, sensors and optics techniques. This year, ICCP will take place in EPFL, Lausanne Switzerland, on July 22-24th!
As in previous years, ICCP is coordinating with the IEEE Transactions on Pattern Analysis and Machine Intelligence (PAMI) for a special issue on Computational Photography to be published after the conference.
ICCP 2024 seeks novel and high-quality submissions in all areas of computational photography, including, but not limited to:
- High-performance imaging.
- Computational cameras, illumination, and displays.
- Advanced image and video processing.
- Integration of imaging, physics, and machine learning.
- Organizing and exploiting photo / video collections.
- Structured light and time-of-flight imaging.
- Appearance, shape, and illumination capture.
- Computational optics (wavefront coding, digital holography, compressive sensing, etc.).
- Sensor and illumination hardware.
- Imaging models and limits
- Physics-based rendering, neural rendering, and differentiable rendering.
- Applications: imaging on mobile platforms, scientific imaging, medicine and biology, user interfaces, AR/VR systems.
Learn more on the ICCP 2024 website, and submit your latest advancements by Friday, 22nd March, 2024.
The call for posters and demo will be published soon with a deadline end of April. It will also be a great opportunity to advertise your work.
Sigma 500mm f5.6 DG DN Sports review
Prophesee Qualcomm demo at Mobile World Congress
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Prophesee and Qualcomm recently showcased their "blur free" mobile photography technology at the Mobile World Congress in Barcelona.
February 27, 2024 – Paris, France - Prophesee SA, inventor of the most advanced neuromorphic vision systems, today announced that the progress achieved through its collaboration with Qualcomm Technologies, Inc. has now reached production stage. A live demo during Mobile World Congress Barcelona is showcasing Prophesee’s native compatibility with premium Snapdragon® mobile platforms, bringing the speed, efficiency, and quality of neuromorphic-enabled vision to cameras in mobile devices.
Prophesee’s event-based Metavision sensors and AI, optimized for use with Snapdragon platforms now brings motion blur cancellation and overall image quality to unprecedented levels, especially in the most challenging scenarios faced by conventional frame-based RGB sensors, fast-moving and low-light scenes.
“We have made significant progress since we announced this collaboration in February 2023, achieving the technical milestones that demonstrate the impressive impact on image quality our event-based technology has in mobile devices containing Snapdragon mobile platforms. As a result, our Metavision Deblur solution has now reached production readiness,” said Luca Verre, CEO and co-founder of Prophesee. “We look forward to unleashing the next generation of Smartphone's photography and video with Prophesee's Metavision.”
“Qualcomm Technologies is thrilled to continue our strong collaboration with Prophesee, joining efforts to efficiently optimize Prophesee’s event-based Metavision technology for use with our flagship Snapdragon 8 Gen 3 Mobile Platform. This will deliver significant enhancements to image quality and bring new features enabled by event cameras’ shutter-free capability to devices powered by Snapdragon mobile platforms,” said Judd Heape, VP of Product Management at Qualcomm Technologies, Inc.
How it works
Prophesee’s breakthrough sensors add a new sensing dimension to mobile photography. They change the paradigm in traditional image capture by focusing only on changes in a scene, pixel by pixel, continuously, at extreme speeds.
Each pixel in the Metavision sensor embeds a logic core, enabling it to act as a neuron.
They each activate themselves intelligently and asynchronously depending on the amount of photons they sense. A pixel activating itself is called an event. In essence, events are driven by the scene’s dynamics, not an arbitrary clock anymore, so the acquisition speed always matches the actual scene dynamics.
High-performance event-based deblurring is achieved by synchronizing a frame-based and Prophesee’s event-based sensor. The system then fills the gaps between and inside the frames with microsecond events to algorithmically extract pure motion information and repair motion blur.
Learn more: https://www.prophesee.ai/event-based-vision-mobile/
Preprint on "Skipper-in-CMOS" image sensor
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A recent preprint on ArXiv https://arxiv.org/abs/2402.12516 titled presents a new CMOS image sensor designed to achieve sub-electron read noise and photon number resolving capability.
Skipper-in-CMOS: Non-Destructive Readout with Sub-Electron Noise Performance for Pixel Detectors
Abstract: The Skipper-in-CMOS image sensor integrates the non-destructive readout capability of Skipper Charge Coupled Devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode in a CMOS imaging process, while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a 15 x 15 um^2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor's commercial 180 nm CMOS Image Sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep sub-electron noise of 0.15rms e-, demonstrating the charge transfer operation from the pinned photodiode and the single photon counting operation when the sensor is exposed to light. The article also discusses new testing strategies employed for its operation and characterization.
Job Postings – Week of 10 March 2024
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Qualcomm ADAS camera Engineer |
Farnborough, UK |
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Onsemi Product Engineer |
Meridian, Idaho, USA |
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University of Warwick Towards Silicon Photonics Based Gas Sensors |
Coventry, UK |
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Johnson & Johnson Sr. Manager Visualization Hardware |
Santa Clara, CA, USA |
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NASA Development of infrared detectors and focal plane arrays for space instruments |
Pasadena, CA, USA |
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Apple Hardware Sensing Systems Engineer |
Cupertino, CA, USA |
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Sony Software Engineer/Researcher for Image Sensors |
Tokyo, Japan |
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Meta Image Sensor Architect |
Redmond, Washington, USA |
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Queen Mary University Silicon Detector Technician |
London, England, UK |
Samsung defends AI editing on photos
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From TechRadar: https://www.techradar.com/phones/samsung-galaxy-phones/there-is-no-such-thing-as-a-real-picture-samsung-defends-ai-photo-editing-on-galaxy-s24
"There is no such thing as a real picture": Samsung defends AI photo editing on Galaxy S24
Like most technology conferences in recent months, Samsung’s latest Galaxy Unpacked event was dominated by conversations surrounding AI. From two-way call translation to gesture-based search, the Samsung Galaxy S24 launched with several AI-powered tricks up its sleeve – but one particular feature is already raising eyebrows.
Set to debut on the Galaxy S24 and its siblings, Generative Edit will allow users to artificially erase, recompose and remaster parts of an image in a bid to achieve photographic perfection. This isn’t a new concept, and any edits made using this generative AI tech will result in a watermark and metadata changes. But the seamlessness with which the Galaxy S24 enables such edits has understandably left some Unpacked-goers concerned.
Samsung, however, is confident that its new Generative Edit feature is ethical, desirable and even necessary in today’s misinformation-filled world. In a revealing interview with TechRadar, Samsung’s Head of Customer Experience, Patrick Chomet, defended the company’s position on AI and its implications.
“There was a very nice video by Marques Brownlee last year on the moon picture,” Chomet told us. “Everyone was like, ‘Is it fake? Is it not fake?’ There was a debate around what constitutes a real picture. And actually, there is no such thing as a real picture. As soon as you have sensors to capture something, you reproduce [what you’re seeing], and it doesn’t mean anything. There is no real picture. [...] You can try to define a real picture by saying, ‘I took that picture’, but if you used AI to optimize the zoom, the autofocus, the scene – is it real? Or is it all filters? There is no real picture, full stop.”
“But still, questions around authenticity are very important,” Chomet continued, “and we [Samsung] go about this by recognizing two consumer needs; two different customer intentions. Neither of them are new, but generative AI will accelerate one of them.
“One intention is wanting to capture the moment – wanting to take a picture that’s as accurate and complete as possible. To do that, we use a lot of AI filtering, modification and optimization to erase shadows, reflections and so on. But we are true to the user's intention, which was to capture that moment.
“Then there is another intention, which is wanting to make something. When people go on Instagram, they add a bunch of funky black and white stuff – they create a new reality. Their intention isn’t to recreate reality, it’s to make something new. So [Generative Edit] isn’t a totally new idea. Generative AI tools will accelerate that intention exponentially in the next few years [...] so there is a big customer need to distinguish between the real and the new. That’s why our Generative Edit feature adds a watermark and edits the metadata, and we’re working with regulatory bodies to ensure people understand the difference.”
On the subject of AI regulation, Chomet said that Samsung "is very aligned with European regulations on AI," noting that governments are right to express early concerns around the potential implications of widespread AI use.
"The industry needs to be responsible and it needs to be regulated," added Chomet, noting that Samsung is actively working on that. "Our new technology is amazing and powerful – but like anything, it can be used in good and bad ways. So, it’s appropriate to think deeply about the bad ways.”
As for how Generative Edit will end up being used on Samsung's new Galaxy phones, only time will tell. Perhaps the feature will simply help average smartphone users (i.e. those unfamiliar with Photoshop) get the photos they really want, rather than facilitate mass photo fakery. Indeed, it still remains to be seen whether generative AI tech as a whole will be a benefit or a hindrance to society as we know it.





