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Autosens publishes "Global M&A in the ADAS and Autonomous technology space" presentation by Rudy Burger, Managing Partner, Woodside Capital. One of the claims is that there are too many LiDAR companies and too much investment in LiDAR technology:


Newsight Imaging is presenting its Enhanced Time-Of-Flight (eToF) LiDAR:

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AutoSens Detroit publishes Aeye VP of Engineering, Barry Behnken, presentation of the adaptive scanning iDAR. Aeye says that in SNR-starved environment, it does not make sense to spend the precious laser photons on "uninteresting" objects, such as sky, empty road, top floors of buildings, etc. Rather, the company proposes to concentrate them on the object that a regular 2D camera points as "interesting." The 2D camera info can be combined with other sources of info, such as radar, ultrasonic sensors, GPS, etc.

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GlobeNewsWire: Himax responds "to a false and misleading article, Why Himax Technologies Is Struggling, published by Motley Fool, an online stock commentary blog, dated September 6, 2018. The article has subsequently been picked up by major public portals such as Nasdaq, Yahoo Finance, etc, and spread out in the investor community. The Company cautions investors that the Motley Fool article contains false and misleading information."

The original Motley Fool article has been removed, as of now, but Yahoo Finance still has its copy. The article speculates that Himax 3D imaging initiatives will not be successful in the long run and questions whether Himax WLO would stay in the next iPhone 3D camera.

The company responds: "Himax expects its WLO shipment to its anchor customer will increase substantially throughout the second half of this year and represent significant growth versus 2H17 and sequentially, versus the first half of 2018. Contributing to its growth expectations, Himax citied its strong pipeline of new WLO R&D projects with the anchor customer and other tier-1 customers.

For Android smartphones, Himax also believes its recently announced Active Stereo Camera (ASC) 3D sensing solution, jointly developed with MediaTek and Megvii for mass market models, and the Qualcomm/Himax jointly developed structured light 3D sensing solution for high end smartphone models will facilitate a broader adoption of 3D sensing on Android smartphones during 2019. The Company targets to begin 3D sensing product shipment towards the end of the year or early 2019 with major ramp in 2019."

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Synopsys demos the capabilities of its RSoft silicon photonics simulation platform using CFA as an example:

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Sony publishes flyers of 6 new global shutter sensors based on 3.45um pixels: IMX367LLA, IMX342LQA, IMX392LQR, IMX305LQR, IMX304LLR/LQR, IMX267LLR/LQR. The new sensors span from 2.35MP 1/2.3-inch IMX392LLR/LQR to 31.5MP APS-C IMX342LLA/LQA:

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Tematys presentation at Swiss Photonics event in June 2018 attemps to answer on question "Which LIDAR technology(ies) will win the race towards autonomous driving?"

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AutoSens publishes Valeo Senior Expert on Image Quality, Brian Deegan, presentation on LED flicker, based on the his paper here:

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Nikkei: A long time Canon research project, the full-frame 2MP sensor with 19um pixels, has been finally released into production. The new 35MMFHDXSCA is targeted at astronomical observation, monitoring of a natural disaster, industrial use, etc.

One of the features of the new sensor is a reduced dark current at low temperature: "By devising the driving method of the peripheral circuit, this product realizes reduction of dark current noise that still occurs even in low temperature condition. This makes it possible to use it for astronomical observation of a star with a slight brightness on the order of 10 stars and so on."

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Counterpoint Research publishes its estimation on automotive image sensor market shares: "The automotive camera sensor market is consolidated with ON Semiconductors accounting for around 50% of market share, followed by Omnivision, Sony and Toshiba, each accounting for 12-18% of market share. Other important players in the market includes Gentex and Melexis. The competition in the market is increasing with players introducing technologically advanced sensors."

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DeviceSpecifications quotes Finish-language site teknavi.fi showing a photo of the oncoming Nokia phone with multiple cameras:

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Autosens publishes FLIR presentation in Detroit in May 2018:

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BusinessInsider quotes TF International Securities analyst Ming-Chi Kuo forecasting that as many as 170m Android phones with under-display fingerprint sensor will be sold next year: "All main Android brands currently treat [fingerprint-on-display] as the important function to differentiate themselves from the iPhone."

Synaptics has been first on the market with its optical fingerprint solution developed in cooperation with Oxi. However, the cheaper next generation devices are predicted to use neither Synaptics nor Oxi technology. Instead, Goodix and Silead are predicted to take the lead:

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Autosens publishes a short video about Oryx LiDAR based on nano-antenna imaging in 10um band:

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DeviceSpecifications quotes Chinese-language site ITHome saying that HMD Global, the owner of Nokia smartphone brand, works on 5-camera smartphone. The company has already manufactured a small-scale production batch in April 2018. The site sources were able to take a picture of the back side of the new Nokia-branded phone:

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BGR reports that Intel-written part has been found inside Android "Add face authentication framework" code. This supports a rumor that the upcoming Google Pixel 3 smartphone might use a Realsense-based FaceID camera.

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Globenewswire: Himax announces a collaboration with MediaTek and Megvii, the Chinese developer of the world’s biggest open platform of face recognition known as Face++, to offer what it says the industry’s first Active Stereo Camera (ASC) 3D sensing reference design targeting facial recognition and secure online payment for Android smartphone.

The ASC 3D sensing solution combines MediaTek’s stereo matching depth engine, Megvii’s Face++ AI-based computer vision algorithm with Himax’s projector, sensor and laser driver. The critical technologies provided by Himax include DOE and collimator utilizing its world leading WLO technology in the projector, a high efficiency laser driver IC, high precision active alignment for the projector assembly, and two high sensitivity near-infrared CMOS image sensors in the receiver. Compared with the structured light technology, the ASC is said to be a lower cost 3D sensing solution for mass market smartphones for facial recognition, secure online payment and AI-based photo enhancement.

The key features of the ASC 3D sensing solution include:

• Customized infrared projector with patterned DOE and collimator: Between 7,000 - 10,000 invisible dots to build sophisticated 3D depth map
• High QE sensor at 940nm band
• Superior sensing capability in both indoor/outdoor environments
• Glass broken detection: Patented glass broken detection mechanism enabled by tailor made laser driver in the projector whereby laser is shut down instantaneously in the event of broken glass in the projector
• Eye safety: Certified for IEC 60825 Class 1, the international standard governing laser product safety under all conditions of normal use with naked eyes
• Compact form factor and power-efficient

“We are pleased to partner with MediaTek and Megvii. This strong alliance ensures that 3D sensing is affordable for Android mass market and can be easily adopted by smartphone makers to create exciting user experience. I believe ASC will facilitate a broader adoption of 3D sensing on Android smartphone during 2019,” said Jordan Wu, President and CEO of Himax.

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Teledyne e2v announces that its Emerald 12MP and 16MP CMOS sensors for optical inspection and factory automation have now gone into mass production and are available for high volume purchase.

These two sensors are members of Teledyne e2v’s Emerald family and feature a small 2.8μm low-noise global shutter pixel, which is produced using a 110nm wafer manufacturing process from TowerJazz in its Arai, Japan fab. The sensors special features include HDR modes with up to 120dB DR and also a unique ROI mode which allows multiple images to be captured, under different exposure conditions, in a single high resolution shot.

Rafael Romay, VP of Professional Imaging at Teledyne e2v, said “We are delighted that Emerald 12M and 16M, the original members of our Emerald sensor family, are entering mass production. We’ve recently expanded this successful family, with the addition of Emerald 67M, which provides customers with high speed and high resolution.”

Dr. Avi Strum, TowerJazz SVP and GM of CMOS Image Sensor Business Unit said, “Working together for over a decade, Teledyne e2v and TowerJazz have leveraged our combined expertise to bring to market top notch industrial sensors. The Emerald family is the newest, most advanced one based on our global shutter offering in 110nm with a state of the art small pixel of 2.8um. We look forward to further collaboration with Teledyne e2v to serve the growing machine vision market.”

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Autosens publishes a video of Omnivision CTO Boyd Fowler presentation of Nyxel IR sensing technology at May 2018 conference in Detroit:

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Calcalist: Mantis Vision has completed the acquisition of Israeli AI startup BrainVu Ltd. The financial terms of the acquisition were not publicly disclosed.

Founded in 2016, BrainVu’s develops machine vision-based technology to determine a person's mental state from a stream of smartphone camera images. The technology combines eye movement tracking and functional magnetic resonance imaging (fmri), which measures brain activity by detecting changes associated with blood flow. The “unique physiological biomarkers in eye dynamics” can help identify mental states such as alertness, attention, stress and mental effort.

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Counterpoint Research: "Almost 42% of smartphones sold globally in July 2018 sported two or more rear camera (dual+) sensors and this dual+ camera sensors adoption in smartphones is estimated to grow to 60% of total smartphone sales by the end of 2018."

• In just 12 months, dual+ camera penetration has gone from 15% to 42% and in 24 months from 3% to 42%.
• The new affordable premium “$300-$599” & high-tier “$200-$299” segments have grown the fastest adopting dual cameras.
• The mid-premium “$600-$700” has seen lower than expected adoption due to iPhone 8 but this adoption is way higher in Android smartphones.
• The super-premium “800+” segment is approaching ~100% penetration.
• OnePlus is leading the charge, closely followed by Huawei and with Apple at 49%.
• Google still has no dual cameras on its flagship Pixel phones and were relying on the stellar image quality thus far. However, with the premium segment heating up with dual camera sensors, Google will be under pressure to integrate this into their upcoming flagships.
• OEMs will also be keen to incorporate specialty cameras in order to stand out from the current crop of dual camera smartphones i.e. like Huawei has done with its P20 Pro by incorporating a stand alone black and white sensor.

Via IFNews

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The Korea Herald reports that "Most major smartphone makers, including Samsung Electronics, Apple and LG Electronics, are reportedly preparing to roll out smartphones fitted with three rear-facing camera modules in a bid to step ahead in the premium segment.

On the price front, triple-lens camera modules are more expensive than the single- or dual-lens counterparts.

If a single-lens camera module costs, say, US$10 per unit to produce, then the dual- and triple-lens camera modules cost US$30 and US$50, respectively."

Samsung says that "around 10 percent of its smartphones next year are likely to embrace the tri-camera system to provide consumers differentiating features."

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PRNewswire: ActLight, the developer of Dynamic PhotoDiodes (DPDs), announces that it has signed an agreement with a top semiconductor company for the integration and licensing of the DPD into their ASIC for vital signs monitoring, to be used in the next generation of wearable devices.

"The demand for vital signs monitoring sensors is growing at an accelerated pace with a need for innovative sensor technologies," said Serguei Okhonin, ActLight Co-Founder and CEO. "The collaboration with this prestigious semiconductor company is expected to deliver to the market the new, world-class sensing solution that will enhance the vital signs monitoring experience of the wearable device's users."

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TrendForce reports that "The development of fingerprint sensor technologies has been previously restricted by low yield rate and insufficient investment from the supply chain, says TrendForce. However, with the increasing demand for fingerprint sensors from smartphone vendors like Vivo, the design houses have invested heavily to increase yield rates and seek more cost-effective solutions. The cost of the optical in-display fingerprint sensor of Synaptics was US$12~15 each in 2017, but has a chance to decrease to lower than US$8 in 2019, as Goodix, Silead and other companies in turn enter the field. At that time, brands may also embed in-display fingerprint sensors in their mid and high-end models, instead of only in flagships, so as to fit in the design of full-screen."

For some reason, TrendForce does not mention that Synaptics has stopped its optical fingerprint R&D.

"3D sensing technology is still favored by flagships of major brands, and has been constantly improved in terms of costs, design, and algorithm. In addition to Apple’s large-scale adoption of Face ID in 2019, major Android brands will also adopt 3D face recognition in their flagship models. In the long run, 3D sensing will be embedded in middle and high-end smartphones, while 2D face recognition will penetrate into the middle and low-end segments which are more sensitive to costs."

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"3D Imaging based on Depth Measurement Technologies" preprint by Ni Chen, Chao Zuo, Edmund Y. Lam, and Byoungho Lee from Seoul National University, Nanjing University of Science and Technology, and The University of Hong Kong reviews some of 3D imaging techniques:

"This paper presents an overview of 3D imaging from depth measurements, and provides a summary of the connection between these the ray-based and wavefront-based 3D imaging techniques."

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Samsung shows how face recognition can be used to control smart home devices:

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Japanese Journal of Applied Physics publishes a paper "Photosensing circuit using thin-film transistors for retinal prosthesis" by Keisuke Tomioka, Kohei Miyake, Keigo Misawa, Kohei Toyoda, Toshio Ishizaki, and Mutsumi Kimura from Ryukoku University, Otsu, Japan.

"A photosensing circuit using thin-film transistors (TFTs) for a retinal prosthesis has been developed. First, the TFTs that are low-temperature polycrystalline silicon (poly-Si) TFTs are fabricated on a transparent substrate, which enables us to build an epiretinal implantation system without using any extracorporeal cameras. Then, the photosensing circuit is fabricated by connecting a p/i/n-type phototransistor and a ring oscillator, which provides stimulating current pulses with an oscillation frequency dependent on light illuminance. In particular, the device structure of the p/i/n-type phototransistor is designed well on the basis of device physics, and the configuration of the photosensing circuit on the basis of device characteristics. Subsequently, a wireless power transfer system is architected by magnetic resonance coupling. Finally, a retinal prosthesis is produced by assembling the photosensing circuit and wireless power transfer system, and the stimulating performance is confirmed in an in vitro experiment, which suggests a future possibility of this retinal prosthesis."

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EETimes reports that EEMBC consortium develops ADASMark to compare different ADAS processors between them. The new ADASMark appears to be heavily biased toward image processing with less emphasis on Radars and Lidars:

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