IR Sensor Consumes No Power till Specific Wake-up Scene Detected

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IEEE Spectrum, DARPA: Northeastern University, Boston, MA researchers publish Nature Photonics paper "Zero-power infrared digitizers based on plasmonically enhanced micromechanical photoswitches" by Zhenyun Qian, Sungho Kang, Vageeswar Rajaram, Cristian Cassella, Nicol McGruer & Matteo Rinaldi.

"It consists of a tiny, micromechanical switch that controls the connection to a battery. Only when the switch is activated by the infrared radiation does it move to close the gap between itself and its battery, triggering the wake-up signal.

The switch contacts are supported by beams made out of a two-material stack. When the temperature of this structure increases, one material expands more than the other, and therefore the beams bend,” Rinaldi explains. That bending allows the switch to make contact with the battery and spit out a signal.
"


What is really interesting about the Northeastern IR sensor technology is that, unlike conventional sensors, it consumes zero stand-by power when the IR wavelengths to be detected are not present,” said Troy Olsson, manager of the N-ZERO Program in DARPA’s Microsystems Technology Office. “When those IR wavelengths are present and impinge on the Northeastern team’s IR sensor, the energy from the IR source heats the sensing elements which, in turn, causes physical movement of key sensor components. These motions result in the mechanical closing of otherwise open circuit elements, thereby leading to signals that the target IR signature has been detected.

The technology features multiple sensing elements—each tuned to absorb a specific IR wavelength,” Olsson noted. “Together, these combine into complex logic circuits capable of analyzing IR spectrums, which opens the way for these sensors to not only detect IR energy in the environment but to specify if that energy derives from a fire, vehicle, person or some other IR source.

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40 Years in Imaging

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Albert Theuwissen writes about his early CCD projects in 1970s and what was considered to be the cutting edge in imaging in that time.

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Yole Thoughts on iPhone X 3D Camera

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EETimes' Junko Yoshida interviews Pierre Cambou, activity leader for imaging and sensor at Yole Développement:

"Cambou acknowledged that he was surprised to see the solution “way more complex than initially envisioned.” Building blocks inside the iPhone X, designed to enable Apple’s TrueDepth camera, include a structured light transmitter, a structure light receiver on the front camera and a time-of- flight/proximity sensor. Cambou said, “Apple managed to have so many technologies, and players behind those technologies, to work together for a very impressive result.”

Cambou said, “Well done indeed, if they were able to do such complex assembly.”

The Yole analyst suspects that STMicroelectronics is supplying the infrared camera and the proximity sensor. Apple might have sourced the front camera and the dot projector from AMS, he added.

While admitting that Apple isn’t — after all — using in iPhone X “ST’s SPAD imager as I dreamed,” Cambou conceded, “Apple combined admirably all the available technologies.

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Automotive LiDAR Market Overview

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Semiconductor Engineering publishes an article "LiDAR Market Continues To Percolate." Few quotes:

"It’s too early to tell how market share for automotive LiDAR is shaping up, as the bigger vendors are still working to make sensors cost-efficient for use in advanced driver-assistance systems and automated driving.

Market research firms are issuing hockey-stick analyses on the LiDAR market’s potential growth. Grand View Research forecasts the worldwide automotive LiDAR market will be worth $223.2 million by 2024.

BIS Research estimates the automotive LiDAR market was worth $65 million last year. It will show double-digit compound annual growth over the next decade, according to the firm.
"

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PhaseOne Trichromatic MF Sensor

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Working closely with Sony, Phase One introduces IQ3 101MP Trichromatic medium format digital back. It uses "a new CMOS sensor and Bayer Filter color technology, available only through Phase One, we have given the photographer 101-megapixels of creative possibility in never-before possible color definition." It is said to be capable of replicating, closer than ever, the color definition that the human eye sees.

"Designed around the concept of mimicking the dynamic color response of the human eye, we have physically customized the Color Bayer Filter on the 101-megapixel sensor to tailor the color response. This allows the Digital Back to capture color in a new way, unlike anything else.

The Phase One Trichromatic Philosophy is a promise that where color and quality can expand, while others may be satisfied with what they have, Phase One will always strive for perfection.
"

There is not much more info released about the new image sensor:

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PMD and SensibleVision Present 3D Face Authentication Solution for Smartphones

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PMD and SensibleVision announced a technology partnership to create a modern, mobile 3D facial recognition platform.

With our leading 3D facial authentication solution, all handset makers can now transform the way people access and interact with their devices – and keep pace with or even move ahead of Apple,” says George Brostoff, co-founder and CEO of SensibleVision. “The quality of the data from the pmd ToF technology is amazing. Combing our 3D recognition with the 3D sensors allows perfect operation in the brightest sunlight and the darkest rooms with amazing speed and accuracy.

The combination of all the partner’s skills lead to an astonishing small, robust, fast and effective 3D authentication solution for mobile devices. As Apple seems to predefine the future of innovative authentication solutions, we’re thrilled to enable OEMs with pmd depth sensors and SensibleVision’s 3DVerify solution to a rapid and efficient integration into their devices,” says Bernd Buxbaum, founding CEO of pmdtechnologies.

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More Details on iPhone X 3D Camera

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From Apple iPhone X official video:


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Apple iPhone X Official Details

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Mashable: Apple officially unveils its iPhone X featuring "True Depth Camera System" based on structured light and Face ID unlock. A double tap on the side button is necessary to activate Face ID system. The chances for unlocking for a wrong face are said to be 1:1,000,000:

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Espros Ports its CCD on CMOS Process to TSMC Fab

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ESPROS Photonics announces the manufacturing process for its generation of ToF and spectral sensing chips from ESPROS Photonics has been finalized and frozen for mass production effective August 15 2017. This completes a customization project conducted during the last 18 months of the future ToF sensors epc660, epc635 and epc611 among a series of ESPROS customer specific imagers at SSMC, a TSMC affiliated fab.

ESPROS Photonics has developed BSI technology for high QE in the NIR and high performance CCD on a CMOS process. The achieved QE is almost 90% at 850nm and 75% at 905nm. ESPROS line of products with 8×8, 160×60 and 320×240 pixel resolution is based on the same pixel and process. The production of these imagers is now established in the TSMC facility and released by ESPROS.

ESPROS CEO and founder Beat De Coi states: «After an intensive technology research & development, product design and market introduction effort, our next goal for the time-of-flight sensor products was to establish a robust supply chain, which would be able to handle the projected industry growth. With the completion of the customization project and the accomplishment of the process freeze with the global foundry leader TSMC, we are concluding a many year effort to establish this product portfolio. This is a major milestone in the development of our young company and for our customers success.»

Maria Marced, President TSMC Europe adds: «We are proud to support ESPROS with this customization project, and together we have successfully achieved Process Release to Production. TSMC’s strength in Analog, Mixed Signal and Sensor manufacturing has enabled us to achieve this milestone in the shortest possible time. We are now ready for mass production and we look forward to a long and successful collaboration with ESPROS.»

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TrendForce Forecasts 3D Sensing Market Explosion

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TrendForce anticipates that from 2017 onward, the market for 3D sensing solutions in mobile devices will witness leaping growth. The total value of the global market for 3D sensing modules used in mobile devices is estimated to reach $1.5b in 2017 and is forecast to grow at a massive CAGR of 209% to around $14b in 2020.

Based on an analysis model that includes iPhone-driven demand, the global market for 3D sensing modules used in mobile devices is projected to register a spectacular annual growth rate of 703% in the total value for 2017,” said TrendForce analyst Jason Tsai. iPhone with 3D sensing would generate significant interests in the related hardware from Samsung, Huawei and other smartphone brands. “As 3D sensing apps mature, smartphone makers will also accelerate the incorporation of related hardware into their mainstream offerings. TrendForce therefore expects another demand surge in the mobile 3D sensing market in 2019.

Tsai added that the 3D sensing feature on smartphones is currently used mainly for tasks that involve facial recognition of the user, such as unlocking the device and mobile payment.

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SmartSens Improves Its Sensors Sensitivity

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China-based SmartSens reports that it has improved NIR sensitivity of its 5MP 2um TSI pixel SC5035 sensor:


Also, SmartSens announces a new ILLUMi low-light technology:

"ILLUMi is an innovative pixel technology that has more than twice the sensitivity of ordinary sensors in visible and near infrared light areas and can be used to capture stunning high-quality full-color images. SmartSens Technology's three star-level products can be used to capture color images in very dark light, while the minimum illumination required to take black and white images close to 0Lux, which means iLLUMi can be invisible in the human eye can not see the night Shoot video."

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KGI on Apple iPhone "Face ID" Internals

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AppleInsider quotes KGI analyst Ming-Chi Kuo on the oncoming iPhone "Face ID" design. It employs 4 cameras: a regular front camera, structured light 3D camera and proximity ToF sensor:


"According to Kuo, Apple's system relies on four main components: a structured light transmitter, structure light receiver, front camera and time of flight/proximity sensor.

Kuo points out that structured light transmitter and receiver setups have distance constraints. With an estimated 50 to 100 centimeter hard cap, Apple needs to include a proximity sensor capable of performing time of flight calculations. The analyst believes data from this specialized sensor will be employed to trigger user experience alerts. For example, a user might be informed that they are holding an iPhone too far or too close to their face for optimal 3D sensing.
"

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Inuitive Introduces NU4000 3D Vision Processor

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PRNewswire: Inuitive introduces the NU4000, a multi-core vision processor that supports 3D Imaging, Deep Learning and Computer Vision processing for AR and VR, Drones, Robots and other applications. This next generation processor enables high quality depth sensing, "On-chip SLAM," Computer Vision and Deep Learning (CNN) capabilities.

NU4000 provides computing power exceeding a total of 8 Terra OPS, said to be the most powerful vision processor available:
  • 3 Vector Cores that provide 500 Giga OPS
  • A dedicated CNN processor that exceeds 2 Terra OPS enabling deep neural networks such as VGG16 reaching 40 frames (ROIs) per second at 10 times less power of the equivalent GPU, DSP or FPGA implementations
  • 3 Powerful CPU Cores that provide more than 13,000 CoreMark
  • Depth processing engine that delivers a throughput of 120Mp/s and supports multiple simultaneous streams of stereo and structured light
  • SLAM engine enabling accurate key point extraction at 120fps from 2 cameras simultaneously
  • Advanced Time-Warp HW engine that reduces the Motion-to-Photon latency to 1msec for extensive VR and MR use cases
  • More than 3MB of on-chip SLAM servicing the vision cores
  • High throughput LPDDR4 interface that reduce external memory access bottlenecks
  • Connects to 6 cameras and 2 displays
  • Chip area 7 x 8mm2 in 12nm process

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Dual Camera Trend Reaches Extreme Low-End Smartphones

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DeviceSpecifications: These days, dual rear camera is used even in very low end phones, such as this one:

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Mapping Imaging Array Temperature

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TU Delft and Harvest Imaging publish an open access paper "Temperature Sensors Integrated into a CMOS Image Sensor" by Accel Abarca, Shuang Xie, Jules Markenhof, and Albert Theuwissen. Apparently, the paper is a continuation of the MSc thesis "Integrating a Temperature Sensor into a CMOS Image Sensor."

"The test image sensor consists of pixels and temperature sensors pixels (=Tixels). The size of the Tixels is 11 μm × 11 μm. Pixels and Tixels are placed next to each other in the active imaging array and use the same readout circuits. The design and the first measurements of the combined image-temperature sensor are presented."

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Can Machine Learning Overcome Absence of Lens?

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Researches from University of Utah at Salt Lake City proved that AI can be somewhat successful in distinguishing between the digits as seen by image sensor with no lens. "Lensless-camera based machine learning for image classification" paper by Ganghun Kim, Stefan Kapetanovic, Rachael Palmer, and Rajesh Menon is published by arxiv.org. From the abstract:

"Finally, we demonstrated that the trained ML algorithm is able to classify the digits with accuracy as high as 99% for 2 digits. Our approach clearly demonstrates the potential for non-human cameras in machine-based decision-making scenarios."

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SEMI European Imaging & Sensors Summit 2017

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SEMI European Imaging & Sensors Summit 2017 is to be held on September 20-22 in Grenoble, France. The summit agenda has many interesting presentations:

  • Sensor as a solution
    Chae Lee, Senior VP, LG Electonics
  • In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
    Marie Noelle Semeria, CEO, Cea-Leti
  • 3D Time-of-Flight Cameras in Industrial Applications
    Thomas Kuhnke, Senior Electronics Design Engineer, 3D Business, Basler AG
  • Hybrid semiconductor direct conversion CMOS x-ray imaging detectors with application examples
    Tuomas Pantsar, Chief Technology Officer / Charge Integration, Oy Ajat
  • CMOS based microdisplays, imager and sensors enhanced by OLED/OPD integration
    Philipp Wartenberg, IC Design Engineer and Project Manager / Deputy head of department IC and System Design, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
  • TSMC Imaging Technology to Enable Innovation in AR/VR Applications
    Tripti Bhanti, Senior Technical Manager, TSMC Europe BV
  • Fusion Bonding Enabler for Backside Illuminated Image Sensors - What’s Next
    Thomas Uhrmann, Director of Business Development, EVG
  • Technological Trends in Thermal Image Sensors
    Christel-loic Tisse, Technical & Innovation Director, ULIS
  • Packaging of Image Sensors and Devices
    Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH
  • Image Fusion: How to Best Utilize Dual Cameras
    Roy Fridman, Director of Product Marketing, Corephotonics
  • High Performance CMOS Integrated Graphene Photodetectors
    Tapani Ryhänen, CEO, Emberion
  • CMOS image sensor for bio-medical and scientific applications
    Renato Turchetta, CEO, IMASENIC
  • New developments in logarithmic pixels and sensors
    Yang Ni, Founder & CTO, NIT
  • Colour X-ray Imaging Solutions for Non-Destructive Testing based on Photon Counting Technology
    Juha Kalliopuska, Chief Executive Officer and Co-founder, ADVACAM
  • High resolution global shutter image sensors for machine vision and 8K video
    Guy Meynants, Engineering Fellow, ams/CMOSIS
  • VTT’s hyperspectral imaging technology - from high-performance applications towards volume scalability
    Anna Rissanen, Research Team Leader, VTT
  • Image Sensors for Future VR
    Yiwan Wong, Partnership Lead, Oculus Research
  • Ambient Sensing – New ways how intelligent devices can cope with the environment
    Roland Helm, Segment Head Sensors, Infineon Technologies AG

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Leti Announces High Resolution Fingerprint Pressure Sensing Technology

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Leti announces readiness of the new technology of very high-resolution (>1000 dpi) fingerprint sensor based on a matrix of interconnected piezoelectric ZnO nanowires:

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Sony CineAlta Venice Features Full-Frame 4K 60fps Sensor

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Sony announces Venice - the next generation digital cinema camera featuring 4K full-frame sensor capable of 60fps or 6K at 30fps speed. Venice is said to have a high speed readout which minimizes the jello effects typical in the CMOS sensors. The new sensor DR is promised to achieve 15+ stops.

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Automotive LiDAR Companies Raise $216M in One Month

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Recently, automotive LiDAR startups attract a lot of VC money:

LeddarTech announces a combined investment of US$101m led by Osram and including Delphi, Magneti Marelli and Integrated Device Technology as strategic investors, as well as Fonds de solidarité FTQ. This round of funding will allow LeddarTech to enhance its ASIC development efforts, expand its R&D team, and accelerate ongoing LiDAR development programs with select Tier-1 automotive customers for rapid market deployment.

We are thrilled to welcome such an influential group of companies as strategic investors, with whom we share a common goal of making mobility safer and more efficient,” stated Charles Boulanger, LeddarTech’s CEO. “Their strong endorsement is a testament to the maturity of the Leddar technology and the credibility of our product roadmap to support the ongoing development of autonomous driving. This positions LeddarTech as the definitive reference in solid-state LiDAR and validates our Tier-1 partnership business model to rapidly deploy LiDARs on a commercial scale in automotive applications. We believe this announcement represents a major stepping stone towards achieving market-share leadership in the multibillion-dollar automotive LiDAR market by 2020.


PRNewswire: Innoviz has raised $65m in Series B funding as its LiDAR moves into mass production. Delphi Automotive PLC and Magna International participated in the round, along with additional new investors including 360 Capital Partners, Glory Ventures, Naver and others. All Series A investors, including Zohar Zisapel, Vertex Venture Capital, Magma Venture Partners, Amiti Ventures and Delek Motors, participated in this round. A second closing of this round is expected to be announced soon, introducing additional strategic partners.

"As the autonomous driving market matures, Innoviz has clearly established itself among industry leaders not only as the best-in-class LiDAR solution but also as an integral part of the overall autonomous vehicle stack," said Omer Keilaf, Co-founder and CEO of Innoviz. "Today's financing from strategic partners such as Magna and Delphi demonstrates their support for Innoviz as the industry's leading option for high-performing LiDAR and is further proof that we have moved into the next phase of our growth. Given both Magna's and Delphi's unwavering commitment to high performance and high safety standards, investing in and partnering with Innoviz is a natural choice. With their joint efforts, we will be able to scale more quickly and put autonomous driving technology on the road much faster."

Innoviz technology that leverages the company's proprietary System, MEMS and Detector designs to give autonomous vehicles sensing capabilities even in challenging environments such as bright direct sunlight, varying weather conditions and multi-LiDAR environments.



Oryx Vision announces a $50m Series B funding round. Third Point Ventures and WRV led the round, which was joined by Union Tech Ventures, and existing investors Bessemer Venture Partners, Maniv Mobility and Trucks VC. A mere 15 months after its first funding round, this fundraise brings the total investment in Oryx to $67M.

Oryx will use the new funds to accelerate its development activities and to intensify its commercial engagements with car OEMs, tier-1 supplier and technology players. Having demonstrated the unique capabilities of its technology over the past year, the company expects to ship units for car-mounted testing in the second half of 2018.

Oryx is building the first solution that will meet all the key requirements of automotive LiDARS – high performance, car durability and low price – without a tradeoff. We are delighted to receive a vote of confidence in our vision from such sophisticated investors, and to have the resources to bring this technology to market quickly and at the highest quality,” says Rani Wellingstein, Oryx co-founder and CEO.

From Oryx Vision presentation:

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On the Use of White Light Source for Imager Spectral Response Measurements

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Aphesa publishes a blog post "Why You Can't Use A White (Broad Spectrum) Light Source For Your Spectral Measurements." Few quotes:

"The R, G, B or the monochrome curve is not the response curve of the sensor but only some information about it.

First of all, it is usually only measured for an incident beam perpendicular to the sensor, or in other words at a zero chief ray angle. But we know that the spectral response varies in intensity and in shape with the angle of incidence.

Secondly, it is a noisy measurement and therefore the precision depends on the number of samples taken. The measurement is noisy because the amount of light after the monochromator is limited as only a tiny fraction of the source's spectrum reaches the sensor. Therefore the signal level is small and its SNR is therefore low.

The shape of the spectrum also depends on the bandwidth of the measuring instrument. As the response spectrum can exhibit oscillations at several scales (see this other publication about spectral response), only a very small bandwidth, i.e. a narrow monochromator lid, can reproduce the actual shape of the response curve, any other approach will only produce a smoothed curve without any detail.

Finally, the wide band light source will change over time and its spectrum will change over temperature, therefore requiring regular calibration.

The light source that we use is based on a femtosecond laser and a supercontinuum.

The femtosecond laser is a solid laser that provided very high power light pulses with a duration in the range of the femtosecond. Lasers are known to provide coherent, repeatable and high intensity light. Our laser is red and the laser has the size of a small table.

The role of the supercontinuum is to turn the monochromatic laser light into a wide spectrum by a collection of non-linear processes. The supercontinuum is a long microstructured optical fiber. The fiber seems red at its beginning and is white in the end as the spectrum broadens along the fiber.
"

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Sony Fab Tour

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Dave Etchells from Imaging Resource publishes a nice overview of Sony image sensor fab. It describes a process of growing the silicon boules by Czochralski method in great details, then gets sketchy on photolitography and other FEOL and BEOL steps, then again goes into much more details on dicing, wire bonding, and packaging. While very simplistic, the article describes quite a complete process flow at Sony Kumamoto fab.

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Emberion Startup Promises Graphene Image Sensors

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Espoo-Finland and Cambridge, UK-based startup Emberion is a spin-off of Nokia. The new company works to commercialize graphene-based microbolometric image sensors:


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Intelligence in Smart CMOS Image Sensors

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Fayçal Saffih from University of Waterloo, Canada publishes his video lecture on "Implementations of Intelligence on Smart CMOS Image Sensors" given on Sept. 1, 2017 in York University:

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Huawei Kirin 970 Features AI Co-Processor

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Huawei unveils Kirin 970 mobile SoC "combining the power of the cloud with the speed and responsiveness of native AI processing."

"Mobile AI = On-Device AI + Cloud AI. HUAWEI is committed to developing smart devices into intelligent devices by building end-to-end capabilities that support coordinated development of chips, devices, and the cloud. The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition," says Richard Yu, CEO of Huawei Consumer Business Group.

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ST Presentation on Automotive HDR Processing Pipeline

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Autosens publishes ST presentation on its HDR ISP for automotive cameras from the converence in Detroit in May 2017:

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Teledyne DALSA Introduces WLP to its LWIR Imaging Platform

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Teledyne DALSA demonstrates its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer. Why is it such a big deal? The vacuum packaging cost is a major contributor to the micorbolometer imager price and its reduction is a breakthrough for the whole industry.

The company says: "Our novel wafer-level packaging (WLP) approach to microbolometer manufacturing in an optimized MEMS infrastructure gives us the ability to dramatically alter the traditional price-performance tradeoff.

Our advanced capabilities in wafer processing allows us to bond multiple 200 mm wafers precisely in a 3D stack that eliminates the need for external chip packaging--packaging which can account for 75% or more of device cost.

By stacking a cap wafer, using world-leading vacuum sealing technology, onto a CMOS high-speed readout circuit (ROIC) wafer populated with VOx pixels, we deliver smaller, lighter devices with leading edge performance and game-changing lower costs, enabling compact detectors with advanced integrated features that will drive the next phase in the evolution of uncooled IR imaging.
"

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Teledyne DALSA on Growth Potential

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Photonics.com publishes Teledyne DALSA article "Sensor Market Set to Soar." It nicely re-arranges the IC Insights data to show the growth potential of different markets:

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Renesas is Back in Image Sensor Business!

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Renesas has been formed from combined semiconductor businesses of Mitsubishi, Hitachi and NEC, all of them used to be image sensor manufacturers in the past. However, up to now, Renesas was not in image sensor business. This was especially surprising as the company kept filing for new image sensor patents and publishing papers over all these years while having no image sensing products in its portfolio. Now, this paradox has been resolved...

BusinessWire: Renesas announces a new high-sensitivity 8.48MP CMOS sensor (RAA462113FYL) for 4K security cameras. The company also talks about existing 2.12MP product that is already in mass production, but has never been widely announced.

The new sensor supports a line-by-line HDR mode in which long exposure data and short exposure data are output separately for each line. This allows video capture for high-contrast scenes. Samples of the RAA462113FYL are now available and mass production is scheduled to begin in December 2017.

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Corephotonics on Smartphone Zoom Evolution

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EETimes publishes Corephotonics article "Evolution of Zoom Camera in Smartphones." Few quotes:

"The future of mobile dual cameras is brighter than ever. Adoption rates surpassed analysts' predictions, and all major OEMs plan to launch or have already launched handsets with zoom dual cameras. Now the race begins for higher zoom factors, better optical stabilization, lower Z-heights and better low-light performance — anything that improves the overall camera and handset user experience. In this paper, we discussed some ways to increase the zoom factor and reduce the Z-height while maintaining superior image quality."

Oppo camera with 5x folded zoom and 2 axes OIS is said to represent the latest advances in smartphone zooms:

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