Cista Develops CIS on SMIC 130nm BSI Platform

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GlobeNewsWire: Cista Design is developing its next generation mobile sensors on SMIC 130nm BSI platform. Wilson Du, CEO and President of Cista System Corp. stated, “The low leakage SMIC process uses three aluminum metal layers for reduced cost and supports pixel sizes down to 1.4-micron for implementing our 8MP resolution CIS. We needed a reliable intellectual property vendor of OTP NVM for the SMIC 130nm BIS process node. We chose Kilopass because of its availability on the SMIC process and their reputation as a vendor with a breadth of offerings on the major foundries worldwide."

Possibly, Cista talks about C8390 sensor:

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