Omnivision Announces 140dB HDR Automotive Sensor and DMS Wafer-Level Camera

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BusinessWire: OmniVision announces the OX03C10 ASIL-C automotive sensor that combines a large 3.0um pixel size with HDR of 140dB and the LED flicker mitigation (LFM) for viewing applications with minimized motion artifacts. The new image sensor delivers 1920x1280p resolution at 60 fps with HDR and LFM. Additionally, the OX03C10 is said to have the lowest power consumption of any LFM image sensor with 2.5MP resolution—25% lower than the nearest competitor—along with the industry’s smallest package size, enabling the placement of cameras that continuously run at 60 fps in even the tightest spaces.

Basic image processing capabilities were also integrated into this sensor, including defect pixel correction and lens correction. The integration of OmniVision’s HALE (HDR and LFM engine) combination algorithm uniquely provides top HDR and LFM performance simultaneously.

Many stakeholders in the viewing automotive camera market are asking for higher performance, such as increased resolution, 140dB HDR and top LFM performance,” explained Pierre Cambou, Principal Analyst, Imaging from Yole Développement. “In particular, these performance increases are needed for high end CMS, also called e-Mirror, which is growing in popularity.

The OX03C10 uses our Deep Well, dual conversion gain technology to provide significantly lower motion artifacts than the few competing sensors that offer 140dB HDR,” said Kavitha Ramane, staff automotive product marketing manager at OmniVision. “Additionally, our split-pixel LFM technology with four captures provides the best performance over the entire automotive temperature range. This combination of the industry’s top HDR and LFM with a large 3.0 micron pixel enables automotive viewing system designers with the greatest image quality across all lighting conditions and in the presence of flickering LEDs from headlights, road signs and traffic signals.

OmniVision’s PureCel Plus-S stacked architecture enables pixel performance advantages over non-stacked technology. For example, 3D stacking allowed OmniVision to boost pixel and dark current performance, resulting in a 20% improvement in the signal-to-noise ratio over the prior generation of its 2.5MP viewing sensors. The OX03C10 also features 4-lane MIPI CSI-2 and 12-bit DVP interfaces.

The new OX03C10 image sensor is planned to be AEC-Q100 Grade 2 certified, and is available in both a-CSP and a-BGA packages.


BusinessWire: OmniVision announces the OVM9284 CameraCubeChip module—the world’s first automotive-grade, wafer-level camera. This 1MP module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with flexibility on placement within the cabin while remaining hidden from view. Additionally, it has the lowest power consumption among automotive camera modules—over 50% lower than the nearest competitor—which enables it to run continuously in the tightest of spaces and at the lowest possible temperatures for maximum image quality.

The OVM9284 is built on OmniVision’s OmniPixel 3-GS global-shutter pixel architecture, which is said to provide best-in-class QE at the 940nm. The new sensor has a 3um pixel and a 1/4" optical format, along with 1280 x 800 resolution.

The accelerated market drive for DMS is expected to generate a 43% CAGR between 2019 and 2025,” asserted Pierre Cambou. “DMS is probably the next growth story for ADAS cameras as driver distraction is becoming a major issue and has brought regulator attention.

Most existing DMS cameras use glass lenses, which are large and difficult to hide from drivers to avoid distraction, and are too expensive for most car models,” said Aaron Chiang, marketing director at OmniVision. “Our OVM9284 CameraCubeChip module is the world’s first to provide automotive designers with the small size, low power consumption and reflowable form factor of wafer-level optics.

The OVM9284’s integration of OmniVision’s image sensor, signal processor and wafer-level optics in a single compact package reduces the complexity of dealing with multiple vendors, and increases supply reliability while speeding development time. Furthermore, unlike traditional cameras, all CameraCubeChip modules are reflowable. This means they can be mounted to a printed circuit board simultaneously with other components using automated surface-mount assembly equipment, which increases quality while reducing assembly costs.


A virtual demo and Q&A for the both new products will be available at AutoSensONLINE’s virtual demo sessions, on Friday, June 12th at 10:40am (Eastern). Registration is free at: ttps://auto-sens.com/autosens-online-tickets

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