Omnivision to Increase its Wafer Testing Capacity by 420,000 12-inch Wafers per Year

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Rising Sun Mobile News reports that Will Semi, Omnivision's mother company, intends to issue 2.69 billion yuan (approx. $400M) of convertible corporate bonds to build a wafer testing and reconstruction facility in Shanghai for Omnivision.  After the project is completed and put into production, 420,000 additional 12-inch wafers will be tested per year.

After the construction is completed, Omnivision would test and reconstruct wafers and sub-assembly of high-MP imagers on its own. This is expected to reduce processing costs and improve products more comprehensively. Also, it would reduce the proportion of the outsourced processing and associated supply chain risks.

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