Evolution of Scientific Image Sensors – Past, Present, and Future

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IEEE Buenaventura Section publishes a presentation "Evolution of Scientific Image Sensor ICs - Past, Present, and Future" by Atul Joshi , CEO and chief innovation officer of SAAZ Micro Inc.

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Terranet Develops Event Camera-Based LiDAR

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Terranet CTO Nihat Kücük presents BlincVision combining structured light 3D imaging with event-driven sensor:


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Event-Based Structured Light 3D Imaging

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ETH Zurich publishes "ESL: Event-based Structured Light" project page by M. Muglikar, G. Gallego, and D. Scaramuzza.

"We propose a novel structured-light system using an event camera to tackle the problem of accurate and high-speed depth sensing. Our setup consists of an event camera and a laser-point projector that uniformly illuminates the scene in a raster scanning pattern during 16 ms. Previous methods match events independently of each other, and so they deliver noisy depth estimates at high scanning speeds in the presence of signal latency and jitter. In contrast, we optimize an energy function designed to exploit event correlations, called spatio-temporal consistency. The resulting method is robust to event jitter and therefore performs better at higher scanning speeds. Experiments demonstrate that our method can deal with high-speed motion and outperform state-of-the-art 3D reconstruction methods based on event cameras, reducing the RMSE by 83% on average, for the same acquisition time."

A Youtube video presentation describes the ETH approach:

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Tamron 35-150mm f2-2.8 Di III review

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Tamron's 35-150mm f2-2.8 Di III is a unique proposition for full-frame mirrorless cameras, combining an unusually bright aperture with a useful 4.3x range from mild wide-angle to telephoto. Find out how it performs in our in-depth review!…

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Imec SWIR Plans

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 Imec has updated its page on SWIR imagers, including a new Vimeo video:

The Pixel Technology Explore activity is looking at two methods for cost-effective uncooled IR detection:

  1. thin film on silicon – Materials such as organic and colloidal quantum dots offer low-cost synthesis, compatibility with a variety of substrates and processing feasibility on a large area. This article gives you an in-depth view.
  2. hybrid infrared imagers – Both III-V hetero-epitaxy on silicon and III-V material transfer on silicon are compatible with processing in a silicon wafer fab and reduce the manufacturing costs of IR sensors.


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Luminar CTO Explains Major Advantages of InGaAs Sensors in LiDARs

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Luminar co-founder and CTO Jason Eichenholz discusses the company’s acquisition of its exclusive InGaAs sensor provider and advantages of the SWIR LiDAR photon budget:

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SiLC Unveils First Commercial-grade FMCW LiDAR

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BusinessWireSiLC launches the new Eyeonic LiDAR providing accurate instantaneous depth, velocity, and dual-polarization intensity information while enabling immunity to multi-user and environmental interference. No performance data has been released.

Eyeonic will be transformational to many industries across the globe by enabling the anticipated mass migration to coherent imaging,” explained Mehdi Asghari, founder and CEO, SiLC. “Our unique technology and innovative manufacturing process puts SiLC in the optimal position to provide the key building blocks needed for this next wave of significant innovation – at a competitive price.


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MIPI D-PHY Introduction

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MIPI publishes a video introduction into different D-PHY standards:


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Canon to Start Mass Production of Low-Light SPAD Sensor for Security Cameras in 2022, Builds New CIS Fab in 2023

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Nikkei-Asia: Canon plans to start mass-production of the 3.2MP SPAD sensor for security cameras in 2022. The sensor is said to provide a color night vision, as well as ToF feature:

"The sensor can recognize light at one-tenth the brightness conventional sensors need, lending itself to a range of industrial applications such as driving and surveillance.

The number of pixels in a sensor is key to image clarity, and Canon's SPAD sensor boasts 3.2 million, making it the world's densest, more than three times the number of the company's conventional sensor. It can recognize the time of light returning in units of less than a nanosecond, allowing for more accurate object recognition.

Canon's factory in Kawasaki will begin mass-producing the new sensor in the second half of 2022. The company plans to install the sensors in its own security cameras that it is to introduce by the end of next year. It will also market the sensors to other companies.

In 2023, Canon will invest more than 21 billion yen ($185 million) to build a new image sensor plant in the Kanagawa Prefecture city of Hiratsuka, where it plans to gradually increase production of the sensor. The sensor can be made with the production technology used for CMOS sensors and at around the same cost."

Update: Few slides from the company's 2020 presentation:

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Sony SPAD Presentation

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Build the fastest portable SSD

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Portable drives are invaluable and in this guide I’ll show you how to build the fastest one I’ve ever tested - and it only took two parts and a few minutes to assemble! …

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Sony SWIR Presentation

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Lucid Vision presents its SWIR camera based on Sony SenSWIR InGaAs stacked sensor:


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Q3 Smartphone Sensor Shipments Drop by 24% YoY

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Aiji Micro App: According to Qunzhi Consulting’s (English name Sigmaintell) market report, global smartphone CIS shipments in Q3 2021 were approximately 1.21B, a YoY decline of approximately 24.0%. Qunzhi Consulting estimates that global smartphone image sensor shipments in 2021 will be approximately 5.05B, a YoY decrease of 10.3%:

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Samsung, DxOMark, and Counterpoint on Mobile Camera Innovations and Trends

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Tecno Mobile publishes a webinar "Mobile Camera Trends 2022: Innovation Talk:"


Among other things, Samsung presents a 64MP GWB mobile sensor:

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Sony SenSWIR White Paper

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Sony publishes a white paper promoting its InGaAs SWIR sensors:

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MIPI CSE Adds Functional Safety to Automotive Image Sensor Interface

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MIPI Alliance has recently released the Camera Service Extensions (MIPI CSESM) v1.0 specification, which enhances the MIPI Camera Serial Interface 2 (MIPI CSI-2) image sensor interface with end-to-end functional safety and other features for automotive applications:

  • A cyclic redundancy check (CRC-32) to detect data transmission errors, ensuring the image data captured by the sensor is accurate when received at the ECU
  • A frame counter to detect frame loss or duplication, with its accuracy verified by the CRC, ensuring the continuity of video streams from cameras to ECU
  • A message counter that can be used as a timeout checker to detect any loss of data caused by a stopped or stuck transmission between an image sensor and ECU
  • Service Extension Packet (SEP) functionality is implemented over the entire PHY link, which provides packetization and uniform delivery of image data.

While the initial release of CSE provides the functional safety enabling features described above, the next version is already under development. CSE v2.0 will add security features to CSE_i and CSE_c, and will work with the upcoming MIPI Security specification to bring end-to-end security to the MASS framework. Version 2.0 is expected to be completed in mid-2022.

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Pixart Unveils Distance Sensors

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EETimes: Pixart launches Single-Axis Distance Sensor (SAS) product line based on the optical-geometric technology.  There are two sensors in the new product line: PAC7088J1 is a middle-range version and PAC7088J2 is s short range one.

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Photon Counting Camera Use Cases

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Hamamatsu publishes a new flyer for its Orca-Quest qCMOS camera with example applications for its photon resolving capability:

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Image Sensors and AI Processors

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PRNewswire: Xailient announces face recognition AI for Sony's intelligent vision sensor IMX500 with 97.8% accuracy up to 3 meters distance. On the IMX500, Xailient claims to provide the world's most power-efficient Face Recognition AI.

Shivy Yohanandan, Chief Scientist and co-founder of Xailient, says, "The IMX500 is a game-changer for the smart camera market. Delivering the image sensor and AI processing on a single chip has dramatic power efficiency benefits, which is important to extending battery life."

Ray Edwards, Xailient's VP of Market Development, says, "This should sell like hotcakes! Anyone building a smart camera system would be nuts not to consider the IMX500. This is the new standard."


SynSense and Prophesee announced a partnership. The two companies leverage their respective expertise in sensing and processing to develop ultra-low-power solutions for implementing intelligence on the edge for event-based vision applications.

The partnership combines in one single chip SynSense’s low-power vision SNN processor DYNAP-CNN with Prophesee’s event-based Metavision sensors, and is focused on developing a line of cost-efficient modules that can be manufactured at high volume.

As IoT applications in smart homes, offices, industries and cities proliferate, there is an increasing need for more intelligence on the edge. Our experience in implementing neuromorphic enabled vision sensing with smart pixel methods complements SynSense’s expertise in neuromorphic processing to make implementing high performance vision more practical. Together we can drive the development of highly efficient, lower cost products that provide more visibility, safety and productivity in a wide range of use cases.” said Luca Verre, CEO and co-founder of Prophesee.

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Image Sensors at ISSCC 2022

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 ISSCC publishes its 2022 Agenda. There are 13 image sensor-related papers:

  1. Charge-Domain Signal Compression in Ultra-High-Speed CMOS Image Sensors
    Keiichiro Kagawa,
    Shizuoka University, Hamamatsu, Japan
  2. A 0.37W 143dB-Dynamic-Range 1Mpixel Backside-Illuminated Charge-Focusing SPAD Image Sensor with Pixel-Wise Exposure Control and Adaptive Clocked Recharging
    Y. Ota, K. Morimoto, T. Sasago, M. Shinohara, Y. Kuroda, W. Endo, Y. Maehashi, S. Maekawa, H. Tsuchiya, A. Abdelghafar, S. Hikosaka, M. Motoyama, K. Tojima, K. Uehira, J. Iwata, F. Inui, Y. Matsuno, K. Sakurai, T. Ichikawa,
    Canon, Kanagawa, Japan
  3. A 64×64-Pixel Flash LiDAR SPAD Imager with Distributed Pixel-to-Pixel Correlation for Background Rejection, Tunable Automatic Pixel Sensitivity and First-Last Event Detection Strategies for Space Applications
    E. Manuzzato, A. Tontini, A. Seljak, M. Perenzoni
    Fondazione Bruno Kessler, Trento, Italy; Jozef Stefan Institute, Ljubljana, Slovenia
  4. An 80×60 Flash LiDAR Sensor with In-Pixel Histogramming TDC Based on Quaternary Search and Time-Gated Δ-Intensity Phase Detection for 45m Detectable Range and Background Light Cancellation
    S. Park, B. Kim, J. Cho, J-H. Chun, J. Choi, S-J. Kim
    Ulsan National Institute of Science and Technology, Ulsan, Korea; SolidVue, Suwon, Korea, Sungkyunkwan University, Suwon, Korea
  5. A 38μm Range Precision Time-of-Flight CMOS Range Line Imager with Gating Driver Jitter Reduction Using Charge-Injection Pseudo Photocurrent Reference
    K. Yasutomi, T. Furuhashi, K. Sagawa, T. Takasawa, K. Kagawa, S. Kawahito
    Shizuoka University, Hamamatsu, Japan
  6. A 1/1.57-inch 50Mpixel CMOS Image Sensor with 1.0μm All-Directional Dual Pixel by 0.5μm-Pitch Full-Depth Deep-Trench Isolation Technology
    T. Jung, M. Fujita, J. Cho, K. Lee, D. Seol, S. An, C. Lee, Y. Jeong, M. Jung, S. Park, S. Baek, S. Jung, S. Lee, J. Yun, E. S. Shim, H. Han, E. Park, H. Sul, S. Kang, K. Lee, J. Ahn, D. Chang
    Samsung Electronics, Hwasung, Korea
  7. A 4.9Mpixel Programmable-Resolution Multi-Purpose CMOS Image Sensor for Computer Vision
    H. Murakami, E. Bohannon, J. Childs, G. Gui, E. Moule, K. Hanzawa, T. Koda, C. Takano, T. Shimizu, Y. Takizawa, A. Basavalingappa, R. Childs, C. Cziesler, R. Jarnot, K. Nishimura, S. Rogerson, Y. Nitta,
    Sony
  8. A Fully Digital Time-Mode CMOS Image Sensor with 22.9pJ/frame∙pixel and 92dB Dynamic Range
    S. Kim, T. Kim, K. Seo, G. Han,
    Yonsei University, Seoul, Korea
  9. A 64Mpixel CMOS Image Sensor with 0.56μm Unit Pixels Separated by Front Deep-Trench Isolation
    S. Park, C. Lee, S. Park, H. Park, T. Lee, D. Park, M. Heo, I. Park, H. Yeo, Y. Lee, J. Lee, B. Lee, D-C. Lee, J. Kim, B. Kim, J. Pyo, S. Quan, S. You, I. Ro, S. Choi, S-I. Kim, I-S. Joe, J. Park, C-H. Koo, J-H. Kim, C. K. Chang, T. Kim, J. Kim, J. Lee, H. Kim, C-R. Moon, H-S. Kim,
    Samsung Electronics, Hwaseong, Korea
  10. A 200 x 256 Image Sensor Heterogeneously Integrating a 2D Nanomaterial-Based Photo-FET Array and CMOS Time-to-Digital Converters
    H. Hinton, H. Jang, W. Wu, M-H. Lee, M. Seol, H-J. Shin, S. Park, D. Ham
    Harvard University, Cambridge, MA; Samsung Advanced Institute of Technology, Suwon, Korea
  11. A 0.8V Intelligent Vision Sensor with Tiny Convolutional Neural Network and Programmable Weights Using Mixed-Mode Processing-in-Sensor Technique for Image Classification
    T-H. Hsu, G-C. Chen, Y-R. Chen, C-C. Lo, R-S. Liu, M-F. Chang, K-T. Tang, C-C. Hsieh
    National Tsing Hua University, Hsinchu, Taiwan
  12. Augmented Reality – The Next Frontier of Image Sensors and Compute Systems
    C. Liu, S. Chen, T-H. Tsai, B. De Salvo, J. Gomez
    Meta Reality Labs, Redmond, WA
  13. Concepts, Architectures and Circuits for Sub-THz Sensing and Imaging
    A. Stelzer,
    Linz University, Linz, Austria

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EDoF-ToF Paper

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Rice University publishes an OSA Optica paper "EDoF-ToF: extended depth of field time-of-flight imaging" by Jasper Tan, Vivek Boominathan, Richard Baraniuk, and Ashok Veeraraghavan.

"Conventional continuous-wave amplitude-modulated time-of-flight (CWAM ToF) cameras suffer from a fundamental trade-off between light throughput and depth of field (DoF): a larger lens aperture allows more light collection but suffers from significantly lower DoF. However, both high light throughput, which increases signal-to-noise ratio, and a wide DoF, which enlarges the system’s applicable depth range, are valuable for CWAM ToF applications. In this work, we propose EDoF-ToF, an algorithmic method to extend the DoF of large-aperture CWAM ToF cameras by using a neural network to deblur objects outside of the lens’s narrow focal region and thus produce an all-in-focus measurement. A key component of our work is the proposed large-aperture ToF training data simulator, which models the depth-dependent blurs and partial occlusions caused by such apertures. Contrary to conventional image deblurring where the blur model is typically linear, ToF depth maps are nonlinear functions of scene intensities, resulting in a nonlinear blur model that we also derive for our simulator. Unlike extended DoF for conventional photography where depth information needs to be encoded (or made depth-invariant) using additional hardware (phase masks, focal sweeping, etc.), ToF sensor measurements naturally encode depth information, allowing a completely software solution to extended DoF. We experimentally demonstrate EDoF-ToF increasing the DoF of a conventional ToF system by 3.6 ×, effectively achieving the DoF of a smaller lens aperture that allows 22.1 × less light. Ultimately, EDoF-ToF enables CWAM ToF cameras to enjoy the benefits of both high light throughput and a wide DoF."

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Sony – Qualcomm Joint Lab to Work on Image Sensor and Processing Optimizations

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During the recent Qualcomm's mobile processor announcements, there was a part on establishing a joint lab with Sony in San Diego working on image sensor and processor co-optimization:

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BAE Presents 12MP 240fps APS-C Sensor

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BAE (Fairchild Imaging) presents 12MP 240fps APS-C sensor LTN4625A with global and rolling shutter modes:

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Advantest Speeds Up its CIS Production Tester

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GlobeNewswire: Advantest has begun shipping the fourth generation of its high-speed image-processing engine that applies heterogeneous computing technology to detect defects in the data output from CMOS image sensors. When integrated on the proven T2000 ISS platform, the new T2000 IP Engine 4 (Image Processing Engine 4) system provides the means of evaluating the latest high-resolution, high-speed CIS devices used in advanced smart phone cameras.

The new T2000 IP Engine 4 features enhanced computing power to handle huge volumes of imaging data while also reducing test times and the cost of test. Used along with Advantest’s 4.8GICAP image capture module, the new tester can perform high-volume, at-speed testing of the most advanced mobile CIS including 3.5-Gsps C-PHY and 4.8-Gbps D-PHY devices. Image-processing accelerators enable fast testing of high-resolution CIS with more than 200MP.

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Qualcomm Snapdragon 8 Gen 1 Camera Features

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Qualcomm announces its next generation mobile processor Snapdragon 8 Gen 1:

"Snapdragon Sight Technology includes the first commercial 18-bit mobile ISP, capturing over 4000x more camera data than its predecessor for extreme dynamic range, color, and sharpness at staggering speeds up to 3.2 gigapixels per second. This is also the first 8K HDR video capture in a mobile platform and it’s capable of capturing in the premium HDR10+ format that’s loaded with over a billion shades of color. Video will look even more stunning thanks to the new Bokeh Engine which adds beautiful soft backgrounds to videos; it’s like Portrait Mode for video capture. Snapdragon 8 also includes a fourth separate ISP, the new Always-On ISP, which allows the camera to run with extremely low power consumption so users can experience always-on face unlocking and locking if your face isn’t present for heightened privacy."


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Canon announces conclusion of toner cartridge patent lawsuit in China

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Tyrafos Raises "Hundreds of Millions of RMB" in Round A+

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iNews, Lieyunwang, iFeng: Guangzhou Tyrafos (Chinese name Guangzhou Yinxin Semiconductor Technology Co., Ltd.) announces the A+ round of financing led by Yunqi Capital. By the end of this round of financing, Yinxin Semiconductor is expected to receive hundreds of millions of yuan in the near future.

Tyrafos also announces announced the release of "the world's first non-single photon dToF" (possibly, they mean dToF that is not based on SPADs) and ELISA molecular biological detection solution basedon image sensors.

"The world's first non-single-photon dToF released by Yinxin Semiconductor is the world's first technical solution to achieve direct ToF using CMOS process. Not only the accuracy and resolution are several times higher than the existing SPAD (Single Photon Avalanche Diode) solution. In addition, the overall power consumption of the laser light source at the transmitting end and the sensor at the receiving end has been reduced by 90%, catching up with the core technology of foreign manufacturers such as Apple and STMicroelectronics in this field, and the underlying architecture and circuit IP are independently developed by Yinxin Semiconductor, it solves the technical problem of the neck stuck in the field of 3D perception, and is a milestone breakthrough in the field of 3D perception."

"In the field of fingerprints under the optical screen, Yinxin Semiconductor adopts the innovative design of pixel architecture level to break through the area and cost limits. The chip area is 30%~50% smaller than that of competing products, and the module volume is more than half smaller than that of competing products. It has an ultra-high cost performance. Competitive advantage, in 2019, through cooperation with customers, it became the first optical under-screen fingerprint recognition solution certified by South Korea's Samsung mobile phone. At present, Yinxin Semiconductor has reached an agreement with 4-5 global leading fingerprint solution providers to purchase under-screen fingerprint chips. Intentional orders are expected to contribute hundreds of millions of yuan in revenue."

"The world's first digital ELISA molecular biological detection solution released by Yinxin Semiconductor is the world's first digital solution that directly performs molecular biological detection on the surface of an image sensor. Enzyme Linked Immunosorbent Assay (Enzyme Linked Immunosorbent Assay, abbreviated ELISA or ELASA) refers to a qualitative and quantitative detection method that combines soluble antigens or antibodies on solid-phase carriers such as polystyrene, and uses antigen-antibody specific binding for immunoreaction. . Taking advantage of the company's advantages in high-speed and high-sensitivity image sensors, Yinxin Semiconductor has created a complete set of micro-molecular biological detection equipment based on ELISA standards, achieving a zero breakthrough in this field, and surpassing the United States in detection accuracy and speed. NASDAQ listed company Quanterix (the core technology comes from the Harvard University technical team, the technology founder David Walt is an academician of the American Academy of Engineering and the Medical School, and is also the scientific founder of Illumina) SiMoA (Single-molecule Array) system, and Yinxin Semiconductor In terms of equipment cost and consumables cost, the digital ELISA technology of the company has a significant improvement over Quanterix's SiMoA system technology. The sensitivity of the digital ELISA technology is more than 1000 times higher than that of the traditional ELISA. Its appearance brings protein detection technology directly into the era of single-molecule and digital detection, becoming the true king in the field of fg-level ultra-low abundance protein detection. The optimization of detection accuracy, speed and cost is more conducive to application promotion. In the future, it will have great application potential in the fields of coronavirus detection, influenza virus detection, and early cancer screening."

Tyrafos has been established in May 2019 and its core team coming from TI, Omnivision, Samsung, Himax, TSMC, Mediatek, ASE, Foxconn, and Chi Mei. The company has >90 full-time R&D and operations employees. The core members of the team have 15-20 years experience in the semiconductor industry. The company names Sony and Samsung as its strategic partners, and TSMC, Samsung, and Tower as its foundries.

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Canon PowerShot Pro1 retro review

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Canon’s PowerShot Pro1 launched in February 2004 as the pinnacle of its fixed-lens prosumer camera series, featuring 8 Megapixels, a flip-out screen, and the first PowerShot lens branded by the red ring of the flagship L-series. 18 years later I take it out for a retro review!…

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Sony Automotive Sensor Explained

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 Lucid Vision Labs publish an explanatory video about Sony IMX490 5.4MP automotive sensor:

Lucid Vision Labs also publishes a measured EMVA1288 performance of the sensor:

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SWIR Quantum Dot Triodes

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Nature paper "Silicon: quantum dot photovoltage triodes" by Wen Zhou, Li Zheng, Zhijun Ning, Xinhong Cheng, Fang Wang, Kaimin Xu, Rui Xu, Zhongyu Liu, Man Luo, Weida Hu, Huijun Guo, Wenjia Zhou & Yuehui Yu from Chinese Academy of Sciences and ShanghaiTech University presents a concept of 1550nm photodetector with internal gain:

"Silicon is widespread in modern electronics, but its electronic bandgap prevents the detection of infrared radiation at wavelengths above 1,100 nanometers, which limits its applications in multiple fields such as night vision, health monitoring and space navigation systems. It is therefore of interest to integrate silicon with infrared-sensitive materials to broaden its detection wavelength. Here we demonstrate a photovoltage triode that can use silicon as the emitter but is also sensitive to infrared spectra owing to the heterointegrated quantum dot light absorber. The photovoltage generated at the quantum dot base region, attracting holes from silicon, leads to high responsivity (exceeding 410 A·W−1 with Vbias of −1.5 V), and a widely self-tunable spectral response. Our device has the maximal specific detectivity (4.73 × 1013 Jones with Vbias of −0.4 V) at 1,550 nm among the infrared sensitized silicon detectors, which opens a new path towards infrared and visible imaging in one chip with silicon technology compatibility."

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