Image Sensors World        Go to the original article...

European Photonics Industry Consortium (EPIC) Meeting on LiDAR held at Eindhoven, The Netherlands on October 30-31, 2019, publishes many of its presentations. Few random slides:

Go to the original article...

Image Sensors World        Go to the original article...

As a part of the first ever Sony Technology Day held at Sony City Osaki in Tokyo, Japan, on Sept. 18, 2019, the company announced SOE Awards. SOE stands for Sony Outstanding Engineer, the highest form of individual recognition for Sony Group engineers. Quite a few of the Awards went to image sensor designers:

• Yoshihisa Kagawa for "Development of Novel Stacked CMOS Image Sensor with Cu-Cu Direct Bonding"
• Jun Komachi for "Scientific Method for Image Quality Improving"
• Masaki Sakakibara for "Development and Improvement of Pixel-Parallel 14-bit ADC for CMOS Image Sensor"
• Daniel Van Nieuwenhove for "3D ToF (Time of Flight) Sensor and System Used in Cars and Mobile Applications"

Go to the original article...

Image Sensors World        Go to the original article...

SET, Smart Equipment Technology announces the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). NEO HB is suitable for direct hybrid bonding processes.

The first of a new line of SET flip-chip bonders dedicated entirely to production, the tool combines high precision, flexibility, short cycle time, and creative design. It was developed in collaboration with CEA-Leti as part of IRT Nanoelec’s 3D integration program.

“SET joined IRT Nanoelec in 2016 with the goal to develop a brand-new tool for direct-bonding applications that delivered high accuracy and high throughput, and a high level of cleanliness,” said Pascal Metzger, CEO of SET. “That ambition required a strong collaboration among experts from different disciplines. Today, SET’s team is proud to commercially launch NEO HB, which meets the initial technical targets and will address development and production needs for tomorrow’s chips.”

Go to the original article...

Image Sensors World        Go to the original article...

Espros distributors Pacer (UK) and Aprizes (China) publish Espros application notes on ToF camera calibration. Almost everything affects the ToF measurements, some factors have quite a dramatic influence:

The main error sources which affect the accuracy of distance measurement are:

• Distance response non-uniformity DRNU of the sensor
• Temperature drift
• Ambient light
• The magnitude of the signal amplitude

Under the term DRNU, we treat all factors that lead to a different distance reading between any of the pixels in the pixel-field looking to the inside of a sphere. These factors are sensor/camera related and include:

• Flat-field error of the pixel-field
• Column A/D converter differences
• Row addressing differences
• Fixed-pattern noise caused by manufacturing tolerances
• 4th order harmonics distortion of the demodulation algorithm

Another Espros presentation gives more info on ToF error sources:

Go to the original article...

Image Sensors World        Go to the original article...

IC Insights Research Bulletin says that Sony is the best performing semiconductor company: "The largest move upward in the ranking is forecast to come from Sony, which is expected to move up four spots to the 11th position on the strength of extremely strong image sensor sales."

Go to the original article...

Image Sensors World        Go to the original article...

Analog Devices' Fellow Ron Kapusta presents the company's solutions for LiDARs:

Go to the original article...

Image Sensors World        Go to the original article...

ETH Zurich published PhD Thesis "Unconventional Processing with Unconventional Visual Sensing: Parallel, Distributed and Event Based Vision Algorithms & Systems" by Julien N.P. Martel.

"Through this work we will specifically consider CMOS sensors that place intelligent circuits directly in the pixel. Coupling sensors with processors allows us to report new visual quantities as processing can interact, in a closed loop, with sensing. Besides, deporting processing closer to the sensor alleviates classical bottleneck issues in conventional vision sensors, as most of the information can stay and be processed directly on the sensor while only “relevant" visual quantities can be output. Indeed, blurring the frontier between sensing and processing using such sensor-processors on the hardware side calls for new algorithms that can run directly in the pixels and hence must be distributed, parallel and eventually triggered upon the arrival of an event.

Considering these first three principles 1) the joint inference of visual quantities, 2) “starting" by the observation of other visual information than direct correlates of illuminance 3) thanks to sensors that have more “intelligence” in-pixel suggests 4) to design vision systems more holistically. This ultimately means: from the physics of the transduction of a photon in the device up to its contribution to the inference of high-level visual quantities. A red-thread in this work has been the design of algorithmic solutions that try to exploit the peculiarities of the devices we used: not only this aims at creating high-performance systems, but also aims at exploring a new design space, building, for instance, systems that process visual information as exposure is happening.

This thesis demonstrates through various examples the practice of those unconventional sensors coupled with in-pixel circuitry and the kind of new algorithms it is possible to design for those. Examples include applications such as high dynamic range imaging and tone mapping, depth reconstruction from focal sweeps as well as tracking in the focal plane. These examples show how such sensor-processors simplify the design of systems that report other visual quantities than illuminance.

Then, this work takes a step back and suggests processing frameworks that can help guiding us in the design of algorithms for these parallel, distributed and eventually event-based devices. Specifically, we instantiate the idea of jointly inferring visual quantities in a more formal computing framework. Finally, considering vision systems holistically a need is to build tools that allow the use of these new kind of unconventional sensing and processing devices."

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: IDTechEx Research publishes its view on LiDAR approaches and comparisons. Few interesting points:

IDTechEx believes that non-rotating mechanical LiDARs is the cheapest technology today, but MEMS-based scanning LiDARs overtake them as the cheapest option after 2020:


The technological options are quite diverse:


106 LiDAR companies are spread across the globe: 34 players headquartered in Asia (20 start-ups in China), 19 players headquartered in Europe, 48 players headquartered in North America and 5 players headquartered in the rest of the world (ROW).

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: Viavi Solutions files a patent infringement complaint with the U.S. International Trade Commission ("ITC") to initiate an investigation against LG Electronics, LG Electronics U.S.A., LG Innotek, and Optrontec.

VIAVI is a pioneer in the field of 3D motion sensing technology, including VIAVI's optical filters. In a typical gesture-recognition system, a light source emits near-infrared light towards a user and an optical filter is used to transmit the emitted light that is reflected by the user to a 3D image sensor, while substantially blocking ambient light. The patented VIAVI optical filters achieve superior optical performance, a desired reduction in filter thickness, and a reduced center wavelength shift with a change in incidence angle of the reflected light.

Mobile device manufacturers like LG Electronics, and its suppliers including LG Innotek and Optrontec, have incorporated VIAVI's patented optical filter design into their optical filters and components to produce high-end mobile phones and tablet computers featuring facial and gesture recognition technology. In the ITC, VIAVI seeks relief, including an exclusion order preventing Defendants from importing the infringing electronic devices into the United States. In the California litigation, VIAVI seeks damages and injunctive relief, including a permanent injunction prohibiting Defendants from importing the infringing electronic devices into the United States.

Go to the original article...

Image Sensors World        Go to the original article...

PRNewswire: OmniVision announces the PureCel Plus-S stacked pixel-based OC0SA CameraCubeChip wafer-level camera modules for medical applications. This new module offers a 800x800 resolution with frame rate of 60fps, or 400x400 resolution at 90fps, for blur-free images and video. Additionally, the OC0SA provides a compact size of 2.6x1.6mm and an integrated IR cut filter. With 120° and 90° field of view options for diagnosis and therapeutic applications, respectively, this cost-effective module offers a combination of resolution, size and viewing angle for disposable endoscopes, providing doctors, veterinarians and industrial applications with the very best image quality. It has low power consumption of 82.2 mW to reduce heat at the distal tip of the endoscope for enhanced patient comfort.

"Existing medical cameras are either too large, in the case of reusable cameras, or their disposable counterparts are lacking in resolution for medical procedures such as gastrointestinal, laparoscopy and airway management. Doctors and clinicians require smaller size and increased resolution during these procedures, for better diagnosis and greater surgical precision," said Aaron Chiang, marketing director at OmniVision. "We are building on the success of our widely adopted CameraCubeChip line of wafer-level camera modules by doubling the resolution while maintaining an extremely small form factor, which is essential for these disposable applications."

OC0SA samples are available now.

Go to the original article...

Image Sensors World        Go to the original article...

SPi Infrared updates its web page on X27 color night vision system with the new info and video:



"The X27 is the highest performing true gen 4 color night vision low light sensor imaging system. The low noise real time 60hz HD detector is the first of its kind breakthrough technology that offers day like imagery in the darkest of environments. The X27 color low light camera images from 390 nm to 1.2 um and sees IR military spot lasers. The Sensitivity outperforms the latest image intensified tube night vision technology and does so in full color. The X27 is available in hand held imaging systems and camera core engines for integration into military grade day/night imaging systems.

The X27 utilizes newly advanced BSTFA (Broad Spectrum Thin Film Array) Technology.

The digital X27 ColorVision (TM) reconnaissance LLL (Low Light Level) true Color night vision VIS-NIR sensor is a technological breakthrough in night vision technology. High performance, low noise, high sensitivity & an incredible 5000000 equivalent ISO rating are just a few features offered by the system.

The SWaP ColorVision sensor can be integrated into night vision sights, scopes, monoculars, binoculars, drivers aid, UAV, UAS, unmanned and a wide array of defense, homeland security, border, ground, mobile, marine, airborne, military, wildlife, documentary, specialty combat camera photography, Astro/aerial/airborne/space remote imaging, aurora borealis, security and surveillance applications."


The company also announces its next generation product:

"Now In Development:

X28 HD 1600 Nm Real time imaging system, full true COLOR day night imaging system with 1550 Nm IR Laser Detection response. The absolute most sensitive night imaging system available for next generation night vision applications."

Another interesting article at SPi site is "History of night vision and IR thermal imaging equipment" starting from 1950s.

Go to the original article...

Image Sensors World        Go to the original article...

University of Trento, Italy, publishes PhD Thesis "Application of Avalanche Detectors in Scientific and Industrial Measurement Systems" of Andrea Ficorella. The thesis overviews APD and SPAD operation and discusses ToF measurements with them:

"Geiger-Mode avalanche photodiodes (GM-APDs) are diodes designed to operate at a reverse voltage that exceeds the breakdown voltage (VBD). Their ability to detect single photons combined with their excellent timing resolution make them ideal for applications in which low amplitude signals need to be detected with sub-ns timing resolution. In the research activity reported in this dissertation two different applications of Geiger-Mode Avalanche Photo Diode arrays have been analysed: a two-tier GM-APD array with inpixel coincidence for particle tracking and a direct Time-of-Flight range meter with a SiPM-based receiver."

Go to the original article...

Image Sensors World        Go to the original article...

EETimes: Sony launches Sony AI, a new organization to pursue advanced R&D in artificial intelligence. The AI research sites will be in Tokyo, Austin, Texas, and an unnamed city in Europe. Sony AI identified three “flagship” projects for its debut, in “gaming, imaging & sensing, and gastronomy,” according to the company.

Hiroaki Kitano, president and CEO, Sony Computer Science Laboratories, will run Sony AI globally. The US site’s chief will be Peter Stone, professor of Computer Science at the University of Texas at Austin.

Update: Sony official announcement is here.

Go to the original article...

Image Sensors World        Go to the original article...

Cern publishes LFoundry presentation "Technology development of CMOS Image sensors" by Andrea Del Monte. The presentation starts with the company somewhat entangled history leading to the recent acquisition by Wuxi Xichanweixin Semiconductor:

Go to the original article...

Image Sensors World        Go to the original article...

Global Semiconductor Alliance (GSA) announces its 2019 award nominations with Goodix listed for Most Respected Public Semiconductor Company Achieving $500M to $1B in Annual Sales:

Go to the original article...

Image Sensors World        Go to the original article...

IFNews quotes Macquarie Research "surveyed a total of 132 smartphones launched in 2019 by the top 6 vendors – Samsung, Huawei, Apple, OPPO / Realme, vivo and Xiaomi. There are 489 cameras in total or an average of 3.7 cameras per device, with 1.0 front camera and 2.7 back cameras. About 45% of the 132 new devices adopted triple cameras, while quad camera penetration reached 18%."

Go to the original article...

Image Sensors World        Go to the original article...

Yole Developpement publishes "Hybrid Bonding: Patent Landscape Analysis" report:

"Generally, 2.5D-3D stacking was achieved thanks to Through Silicon Via (TSV) technology. However, TSVs are large and using them limits efforts to reach very dense architectures. Furthermore, filling TSVs with metals is complex and requires significant know how. To overcome these limitations, players have started to look at other solutions. A first step toward a new way of 3D stacking is ZiBond, developed by Ziptronix, a company founded in 2000 as a spin-out of Research Triangle Institute. ZiBond is an enhanced version of direct oxide bonding that involves wafer-to-wafer processing at low temperatures, from 150-300°C, to initiate high bond strengths, rivaling silicon. The next step was to combine the dielectric bond with embedded metal to simultaneously bond wafers or bond dies to wafers and form the interconnects. ZiBond is the dielectric bond that forms the basis for direct bonding interconnect (DBI) technology developed in 2005. Tessera, now called Xperi, acquired Ziptronix in 2015 and ZiBond and DBI were integrated in the Invensas subsidiary’s portfolio. This hybrid bonding technology is quickly becoming recognized as the preferred permanent bonding path to form high-density interconnects in heterogeneous integration applications, from 2D enhanced, to 3D stacking with or without TSVs, as well as MEMS.

After entering the CMOS Image Sensor (CIS) market in 2016, hybrid bonding technology has started to be investigated by other industries, such as memory. However, the hybrid bonding market’s growth follows Xperi’s developments. The company has adopted an aggressive strategy to assert its patents. Yet in parallel with the market and Xperi’s growth, some other players, like YMTC, Sony, Samsung and TSMC, have developed their own patent portfolios and strategies and are on the edge of releasing their first products using hybrid bonding processes. Understanding the IP landscape is becoming key to evaluate the risks and opportunities that go with the development and use of hybrid bonding technology."

Go to the original article...

Image Sensors World        Go to the original article...

Albert Theuwissen makes his 1995 book "Solid-State Imaging with Charge-Coupled Devices" available for a free download on this link.

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: Ouster introduces the OS1-32, said to be the world’s most affordable 32-channel lidar. "Higher resolution sensors at an affordable price are critical for moving computer vision from simple obstacle avoidance to more advanced perception, and for moving projects from R&D to commercial viability," says Ouster CEO and co-founder Angus Pacala. "The OS1-32 gives customers what they ask for the most: higher resolution at an affordable price."

OS1-32 is priced at $8,000 for commercial applications (with volume pricing available) and $6,000 for non-profit university research.




BusinessWire: Velodyne introduces Alpha Prime, the next generation lidar with surround view.

The Alpha Prime’s features include:

• Superior field-of-view: 360-degree surround view perception and a 40-degree vertical field-of-view.
• High resolution of 0.2° x 0.1°
• Long range:
  10% reflective targets >220m typical
  5% reflective targets >150m typical
  Ground plane hits >90m typical
• Outstanding performance in a wide variety of lighting conditions, including retro reflectors and sunlight mitigation.
• Exceptional detection of dark or low reflectance objects at long distances, such as tires, dark vehicles, low reflectivity pavement and low visibility pedestrians.
• Advanced negative obstacle perception, such as potholes and cracks in the road.
• The highest resolution along with robust reflectivity returns from over 4.8 million points per second, simplifying detection and tracking of vehicles, pedestrians and other obstructions.
• High resolution and laser calibration enable the sensor to easily localize vehicles — outdoors or indoors — without a GPS, for precise positioning.
• Improved efficiency for extended vehicle operating time within broad temperature and environmental ranges without the need for active cooling.
• Advanced sensor-to-sensor interference mitigation.
• Automotive mass production options from multiple sources for qualified programs.

“The Alpha Prime is a significant step forward in enabling the advancement of the autonomous vehicle and robot industries,” said Anand Gopalan, CTO, Velodyne Lidar. “With its breadth of best-in-class features, the Alpha Prime is a marked advancement in sensor performance for real world conditions. Here at Velodyne, we take pride in listening to our customers and delivering innovative and high-performance products. We believe Velodyne’s versatility and agility extend our leadership status in the lidar business to empower autonomous solutions on a global scale.”

Go to the original article...

Image Sensors World        Go to the original article...

TrinamiX publishes a promotional video of its 3D imager:

"trinamiX 3D Imaging is based on patented Beam Profile Analysis technology. Beam profile analysis is an active measuring principle, that means that the object to be measured is illuminated with a light source emitting a regular dot pattern. The reflection of each light spot is captured by a sensor (e.g. a CMOS camera) and its beam profile is then being analyzed. From the specific beam profile, we extract the distance and information about the material of the measured object. This novel approach enables having an extra channel of information for improving decision making, robustness across platforms and reducing computational need over traditional technologies."

Go to the original article...

Image Sensors World        Go to the original article...

China-based IRay publishes a short video from its 12um pixel microbolometric thermal sensor:

Go to the original article...

Image Sensors World        Go to the original article...

IEEE Solid-State Circuits Society publishes a short tutorial "Circuit Configurations on stacked CMOS Image Sensor" presented at 2019 VLSI Conference by Yusuke Oike, Deputy Senior General Manager and Distinguished Engineer at Sony:

Go to the original article...

Image Sensors World        Go to the original article...

Espros ToF imagers show a remarkable range of 65m in absence of sunlight:

Go to the original article...