Hamamatsu Develops World’s First THz Image Intensifier

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Hamamatsu Photonics has developed the world’s first terahertz image intensifier (THz image intensifier or simply THz-I.I.) by leveraging its imaging technology fostered over many years. This THz-I.I. has high resolution and fast response which allows for real-time imaging of terahertz wave (*) pulses transmitted through or reflected from target objects.

This THz-I.I. will be unveiled at “The 69th JSAP (Japan Society of Applied Physics) Spring Meeting” held at the Sagamihara Campus of Aoyama Gakuin University (in Sagamihara City, Kanagawa Prefecture, Japan) for 5 days from Tuesday, March 22 to Saturday, March 26.
 

Terahertz waves are electromagnetic waves near a frequency of 1 THz and have the properties of both light and radio waves.








 


 

 Full press release: https://www.hamamatsu.com/content/dam/hamamatsu-photonics/sites/documents/01_HQ/01_news/01_news_2022/2022_03_14_en.pdf

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Lensless camera for in vivo microscopy

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A team comprised of researchers from Rice University and Baylor College of Medicine in Houston, TX has published a Nature Biomedical Engineering article titled "In vivo lensless microscopy via a phase mask generating diffraction patterns with high-contrast contours."

Abstract: The simple and compact optics of lensless microscopes and the associated computational algorithms allow for large fields of view and the refocusing of the captured images. However, existing lensless techniques cannot accurately reconstruct the typical low-contrast images of optically dense biological tissue. Here we show that lensless imaging of tissue in vivo can be achieved via an optical phase mask designed to create a point spread function consisting of high-contrast contours with a broad spectrum of spatial frequencies. We built a prototype lensless microscope incorporating the ‘contour’ phase mask and used it to image calcium dynamics in the cortex of live mice (over a field of view of about 16 mm2) and in freely moving Hydra vulgaris, as well as microvasculature in the oral mucosa of volunteers. The low cost, small form factor and computational refocusing capability of in vivo lensless microscopy may open it up to clinical uses, especially for imaging difficult-to-reach areas of the body.

 


 


 


 

Link to full article (open access): https://www.nature.com/articles/s41551-022-00851-z

Press release: https://www.photonics.com/Articles/Lensless_Camera_Captures_Cellular-Level_3D_Details/a67869

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Lensless Imaging with Fresnel Zone Plates

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Although the idea of Fresnel zone plates is not new and can be traced back several decades to X-ray imaging and perhaps to Fresnel's original paper from 1818*, there is renewed interest in this idea for visible light imaging due to the need for compact form-factor cameras.

This 2020 article in the journal Light: Science and Applications by a team from Tsinghua University and MIT describes a lensless image sensor with a compressed-sensing style inverse reconstruction algorithm for high resolution color imaging.

Lensless imaging eliminates the need for geometric isomorphism between a scene and an image while allowing the construction of compact, lightweight imaging systems. However, a challenging inverse problem remains due to the low reconstructed signal-to-noise ratio. Current implementations require multiple masks or multiple shots to denoise the reconstruction. We propose single-shot lensless imaging with a Fresnel zone aperture and incoherent illumination. By using the Fresnel zone aperture to encode the incoherent rays in wavefront-like form, the captured pattern has the same form as the inline hologram. Since conventional backpropagation reconstruction is troubled by the twin-image problem, we show that the compressive sensing algorithm is effective in removing this twin-image artifact due to the sparsity in natural scenes. The reconstruction with a significantly improved signal-to-noise ratio from a single-shot image promotes a camera architecture that is flat and reliable in its structure and free of the need for strict calibration.








Full article is available here: https://www.nature.com/articles/s41377-020-0289-9

* "Calcul de l'intensité de la lumière au centre de l'ombre d'un ecran et d'une ouverture circulaires eclairés par un point radieux," in Œuvres Complètes d'Augustin Fresnel 1866-1870. https://gallica.bnf.fr/ark:/12148/bpt6k1512245j/f917.item

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[Updated] 2022 International SPAD Sensor Workshop Final Program Available

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About ISSW 2022

Devices | Architectures | Applications

The International SPAD Sensor Workshop focuses on the study, modeling, design, fabrication, and characterization of SPAD sensors. The workshop welcomes all researchers, practitioners, and educators interested in SPADs, SPAD imagers, and associated applications, not only in imaging but also in other fields.

The third edition of the workshop will gather experts in all areas of SPADs and SPAD related applications using Internet virtual conference technology.  The program is under development, expect three full days of with over 40 speakers from all over the world. This edition is sponsored by ams OSRAM.

Workshop website: https://issw2022.at/

Final program: https://issw2022.at/wp-content/uploads/2022/03/amsOSRAM_ISSW22_Program_3003.pdf











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State of the Image Sensor Market

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Sigmaintell report on smartphone image sensors

According to Sigmaintell, the global mobile phone image sensor shipments in 2021 will be approximately 5.37B units, a YoY decrease of about 11.8%; among which, the global mobile phone image sensor shipments in 4Q21 will be about 1.37B units, a YoY decrease. About 25.3%. At the same time, it is estimated that the global mobile phone image sensor shipments will be about 5.50B in 2022, a year-on-year increase of about 2.5%. In 1H21, due to the long ramp-up cycle of ultra-high pixel production capacity and the squeeze of low-end pixel production capacity by other applications, there was a short-term structural imbalance and market price fluctuations rose. In 2H21, the production capacity of Samsung and Sony’s external foundries was released steadily and significantly, but the sales in the terminal market were lower than expected and the stocking plan was lowered again, resulting in an oversupply in the overall image sensor market.





Business Korea report about Samsung CIS foundry capacity expansion


Samsung Electronics will expand its foundry capacity in legacy nodes starting in 2022. The move is aimed at securing new customers and boosting profitability by increasing the production capacity of mature processes for such items as CMOS image sensors (CISs), which are in growing demand due to a prolonged shortage. At the same time, Samsung Electronics is planning to start volume production of advanced chips on its sub-3nm fabrication process in 1H22. Samsung Electronics plans to secure up to 300 foundry customers by 2026 and triple production from the 2017 level. (Laoyaoba, Business Korea)



Yole announces a new edition of its "Imaging for Security" Market report

https://www.i-micronews.com/products/imaging-for-security-2022














Yole announces a new edition of its "Imaging for Automotive" market report

Flyer: https://s3.i-micronews.com/uploads/2022/03/YINTR22245-Imaging-for-Automotive-2022-Product-Brochure.pdf













Strategy Analytics estimates USD15.1B global smartphone image sensor market in 2021

According to Strategy Analytics, the global smartphone Image sensor market in 2021 secured a total revenue of USD15.1B. Strategy Analytics finds that the smartphone image sensor market witnessed a revenue growth of more than 3% YoY in 2021. Sony Semiconductor Solutions topped with 45% revenue share followed by Samsung System LSI and OmniVision in 2021. The top 3 vendors captured nearly 83% revenue share in the global smartphone image sensor market in 2021. In terms of smartphone multi-camera application, Image sensors for Depth and Macro application reached 30 percent share while those for Ultrawide application exceeded 15% share.




ijiwei Insights predicts drop in mobile phone camera prices

In 2022, some manufacturers will reportedly reduce the price of mobile phone camera CIS several times. Currently, the cost down of phone camera CIS has penetrated into the camera chip products of 2MP, 5MP and 8MP. Among them, the unit price of 2MP and 5MP mobile phone camera CIS fell by about 20% and more than 30% year-on-year, respectively. [source]

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New 3D Imaging Method for Microscopes

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New method for high resolution three dimension microscopic imaging being explored.


"This method, named bijective illumination collection imaging (BICI), can extend the range of high-resolution imaging by over 12-fold compared to the state-of-the-art imaging techniques," says Pahlevani

Fig. 1 | BICI concept. 
a, The illumination beam is generated by collimated light positioned off the imaging optical axis. 
b, The metasurface bends a ray family (sheet) originating from an arc of radius r by a constant angle β to form a focal point on the z axis. A family of rays originating from the same arc is shown as a ray sheet. 
c, Ray sheets subject to the same bending model constitute a focal line along the z axis. The focal line is continuous even though a finite number of focal points is illustrated for clarity. 
d, The collection metasurface establishes trajectories of collected light in ray sheets, as mirror images of illumination paths with respect to the x–z plane. This configuration enables a one-to-one correspondence, that is, a bijective relation between the focal points of the illumination and collection paths, to eliminate out-of-focus signals. The magnified inset demonstrates the bijective relation. 
e, Top view of the illumination and collection beams. 
f, Schematic of the illumination and collection beams and a snapshot captured using a camera from one of the lateral planes intersecting the focal line, illustrating the actual arrangement of illumination and collection paths. This arrangement allows only the collection of photons originating from the corresponding illumination focal point.


Metasurface-based bijective illumination collection imaging provides high-resolution tomography in three dimensions (Masoud Pahlevaninezhad, Yao-Wei Huang , Majid Pahlevani , Brett Bouma, Melissa J. Suter , Federico Capasso  and Hamid Pahlevaninezhad )

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Photonics Spectra article about Gigajot’s QIS Tech

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The March 2022 edition of Photonics Spectra magazine has an interesting article titled "Photon-Counting CMOS Sensors: Extend Frontiers in Scientific Imaging" by Dakota Robledo, Ph.D., senior image sensor scientist at Gigajot Technology.

While CMOS imagers have evolved significantly since the 1960s, photon-counting sensitivity has still required the use of specialized sensors that often come with detrimental drawbacks. This changed recently with the emergence of new quanta image sensor (QIS) technology, which pushes CMOS imaging capabilities to their fundamental limit while also delivering high-resolution, high-speed, and low-power linear photon counting at room temperature. First proposed in 2005 by Eric Fossum, who pioneered the CMOS imaging sensor, the QIS paradigm envisioned a large array of specialized pixels, called jots, that are able to accurately detect single photons at a very fast frame rate . The technology’s unique combination of high resolution, high sensitivity, and high frame rate enables imaging capabilities that were previously impossible to achieve. The concept was also expanded further to include multibit QIS, wherein the jots can reliably enumerate more than a single photon. As a result, quanta image sensors can be used in higher light scenarios, versus other single-photon detectors, without saturating the pixels. The multibit QIS concept has already resulted in new sensor architectures using photon number resolution, with sufficient photon capacity for high-dynamic-range imaging, and the ability to achieve competitive frame rates.





The article uses "bit-error-rate" metric for assessing image sensor quality.


The photon-counting error rate of a detector is often quantified by the bit error rate. The broadening of signals associated with various photo charge numbers causes the peaks and valleys in the overall distribution to become less distinct, and eventually to be indistinguishable. The bit error rate measures the fraction of false positive and false negative photon counts compared to the total photon count in each signal bin. Figure 4 shows the predicted bit error rate of a detector as a function of the read noise, which demonstrates the rapid rate reduction that occurs for very low-noise sensors. 

 


The article ends with a qualitative comparison between three popular single-photon image sensor technologies.



Interestingly, SPADs are listed as "No Photon Number Resolution" and "Low Manufacturability". It may be worth referring to previous blog posts for different perspectives on this issue. [1] [2] [3]

Full article available here: https://www.photonicsspectra-digital.com/photonicsspectra/march_2022/MobilePagedReplica.action?pm=1&folio=50#pg50



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Axcelis to ship its processing tool to multiple CMOS image sensor manufacturers

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BEVERLY, Mass., March 17, 2022 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped multiple Purion VXE™ high energy systems to multiple leading CMOS image sensor manufacturers located in Asia. The Purion VXE is an extended energy range solution for the industry leading Purion XE™ high energy implanter.

President and CEO Mary Puma commented, "We continue to maintain a leading position in the image sensor market. Our growth in this segment is clear and sustainable, and is tied to long-term trends in demand for products in the growing IoT, mobile and automotive markets. The Purion VXE was designed to address the specific needs of customers developing and manufacturing the most advanced CMOS image sensors, and has quickly become the process tool of record for image sensor manufacturers."

Source: https://www.prnewswire.com/news-releases/axcelis-announces-multiple-shipments-of-purion-high-energy-system-to-multiple-cmos-image-sensor-manufacturers-301504815.html

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CMOS SPAD SoC for Fluorescence Imaging

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Hot off the press! An article titled "A High Dynamic Range 128 x 120 3-D Stacked CMOS SPAD Image Sensor SoC for Fluorescence Microendoscopy" from the research group at The University of Edinburgh and STMicroelectronics is now available for early access in the IEEE Journal of Solid-State Circuits.

A miniaturized 1.4 mm x 1.4 mm, 128 x 120 single-photon avalanche diode (SPAD) image sensor with a five-wire interface is designed for time-resolved fluorescence microendoscopy. This is the first endoscopic chip-on-tip sensor capable of fluorescence lifetime imaging microscopy (FLIM). The sensor provides a novel, compact means to extend the photon counting dynamic range (DR) by partitioning the required bit depth between in-pixel counters and off-pixel noiseless frame summation. The sensor is implemented in STMicroelectronics 40-/90-nm 3-D-stacked backside-illuminated (BSI) CMOS process with 8-μm pixels and 45% fill factor. The sensor capabilities are demonstrated through FLIM examples, including ex vivo human lung tissue, obtained at video rate.














Full article is available here: https://ieeexplore.ieee.org/document/9723499 

Open access version: https://www.pure.ed.ac.uk/ws/portalfiles/portal/252858429/JSSC_acceptedFeb2022.pdf

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Future Era of Robotics and Metaverse

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SK hynix discusses what a robotic future may look like and the role of ToF imaging.

"We will soon witness an era where all households will have at least one robot that looks like it appeared in the scenes of a sci-fi movie like Star Wars."

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Image Sensors Europe – Event Agenda Announcement

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The Image Sensor  Europe team announced details about the upcoming event.

 2022 Event Topics Include (agenda link):

    Topic Speaker
    IMAGE SENSOR MANUFACTURING TRENDS AND BUSINESS UPDATES Markus Cappellaro
    Emerging from the global semiconductor shortage, what is the near-term outlook of the CIS industry? Florian Domengie
    Sony's contribution to the smarter industry - technology trends and future prospects for imaging and sensing devices Amos Fenigstein Ph.D.
    Panel discussion: how is the IS supply chain responding to sustainability and the green agenda?
    TECHNOLOGY FUTURES – LOOKING OUTSIDE THE BOX Anders Johannesson
    Efficiently detecting photon energy. The spin out from astronomy to industry has been paradigm shifting in the past – will this happen again? Kieran O'Brien
    Angular dependency of light sensitivity and parasitic light sensitivity Albert Theuwissen
    Augmented reality – the next frontier of image sensors and compute systems Dr Chiao Liu
    Sensing solutions for in cabin monitoring Tomas Geurts
    Global shutter sensors with single-exposure high dynamic range Dr. Guang Yang
    High resolution 4K HDR image sensors for security, VR/AR, automotive, and other emerging applications David Mills
    Bringing colour night vision and HDR image sensors to consumers and professionals Dr Saleh Masoodian
    Spectral sensing for mobile devices Jonathan Borremans
    Making infrared imaging more accessible with quantum dots Jiwon Lee
    Release 4 of the EMVA 1288 standard: adapted and extended to modern image sensors Prof. Dr. Bernd Jähne
    Design, characterisation and application of indirect time-of-flight sensor for machine vision Dr. Xinyang Wang
    Addressing the challenges in sustainability and security with low-power depth sensing Dr Sara Pellegrini, Cedric Tubert
    Establishing LiDAR standards for safe level 3 automated driving Oren Buskila
    Modelling and realisation of a SPAD-based LIDAR image sensor for space applications Alessandro Tontini
    Low-power Always-on Camera (AoC) architecture with AP-centric clock and 2-way communications Soo-Yong Kim
    Resolution of cinesensors: why higher resolution does not always improve image quality Michael Cieslinsk
    Latest developments in high-speed imaging for industrial and scientific applications Jeroen Hoet
    Event-based sensors – from promise to products Luca Verre
    Development of OPD innovative application, such as fingerprint behind display or standalone biometry solutions Camille Dupoiron
    Medical applications roundtable Renato Turchetta



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Sony standardization efforts

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Sony presents its effort to make its proprietary image sensor interface SLVS-EC a new international standard. Here's an excerpt from a recently published interview with K. Koide, M. Akahide, and H. Takahashi of the Sony Semiconductor Solutions group.  

Koide:I work in the standardization for the mobility area. Products in this category, such as automobiles, are strictly regulated by laws and regulations because of their immediate implications to society, the natural environment, and economic activities as well as to people’s lives and assets. Therefore, products that fail to comply with these laws and regulations cannot even make it to the market. On top of the compliance as a prerequisite, safety must be ensured. This “safety” requires cooperation of diverse stakeholders, from those who are involved in car manufacturing, automotive components, and transport infrastructure such as road systems to road users and local residents. My responsibilities include identifying the rules to be established in order to ensure safety as well as considering the domains and technology relevant to the rules where SSS Group can make its contributions and preparing our business strategies ready for the implementation.

Takahashi:I am involved in the standardization concerning the telecommunication of mobile devices like smartphones and automotive mobility devices. The telecommunication requires the transmitter and the receiver of signals use the same language, and standardization is essential for this reason. The telecommunication subgroup is standardizing the protocol, process, and electronic signal concerning the communication between an image sensor and processor.

Akahide:Like Takahashi-san, I am working on the standardization of image sensor interfaces. This is intended for image sensors for industrial applications. I was invited to work with the Japan Industrial Imaging Association (JIIA) on standardization because they wanted to standardize our SLVS-EC, a high-speed interface which SSS Group developed. As mentioned earlier, interfaces would be worth very little if they were not adopted widely. I believe that this standardization is very important for us, too, so that our high-speed interface will be diffused. At the same time, it is also important to develop a strategy for the future success of the product by determining what to be made open and what should be kept closed.

Koide:The world is growing more complex, and the COVID-19 pandemic is causing more uncertainties. Against this backdrop, there are serious discussions in progress about digitizing road systems, realizing zero-emission vehicles, and so on. The mobility industry is now experiencing a major social paradigm shift. At times like these, what we have for solidarity is order and rules to attain a better world. It is very important to understand these order and rules without prejudice, and to do this, we must engage with the world outside our boundaries, observing and understanding the world from their point of view. I believe that the activities with the mobility industry, including the initiative for developing the international standards, are valuable for me in this sense. For I am engaged in activities for the mobility industry, providing society with safety and security should be my priority. I will therefore continue my best efforts in this standardization initiative while also contributing to the business growth of our company.

Takahashi:For me, it will be making appropriate rules. There is a well-known episode about the washing machines. In 2001, Singapore suspended importing Japanese top-loading washing machines with a spinning drum. The reason for this was that these products did not comply with the international standards. They surely complied with the Japanese industrial standards, but not the international standards, which were based on IEC standards for front-loading single-drum machines popular in Europe and America. Rules have the power to control. As a chair, I would like to pursue making rules that are appropriate and that do not work against SSS Group.
From a more specific viewpoint, there is the issue concerning image sensors. They are increasingly sophisticated that captured image data can be edited easily, boosting the added value of the sensors. However, there was a problematic incident. When a major earthquake hit Kumamoto, someone uploaded on social media a fake video footage of a lion set loose from the local zoo, which many people believed. Security will be important about camera information in the future, and it is necessary to be able to verify the authenticity of images. I hope that new standards will be established to help prevent fake images such as this from being circulated.

Akahide:Joining the SDO has made me realize that everyone has high hopes for SSS Group. My next step will be dedicated to the standardization of our technology and, also as a vice leader of the Global Standardization Advancement Committee, I should be making contributions to the machine vision sector.

 

The interview does not provide any technical information about SLVS-EC and how it differs from the MIPI M-PHY standard.

Full interview available here: https://www.sony-semicon.co.jp/e/feature/2022031801.html

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Weekly Updates

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Nikon Designs Sensor That Has Both a Global and Rolling Shutter

Nikon has filed a patent for a new type of sensor that would allow it to perform both a rolling and global shutter operation. It’s not the first time the company has proposed such a design, but it expands on the use case of a previous filing. ...


Programmable Black Phosphorus Image Sensor For Broadband Optoelectronic Edge Computing

Image sensors with internal computing capability enable in-sensor computing that can significantly reduce the communication latency and power consumption for machine vision in distributed systems and robotics. Two-dimensional semiconductors have many advantages in realizing such intelligent vision sensors because of their tunable electrical and optical properties and amenability for heterogeneous integration. ...


Samsung Quietly Unveils The Galaxy A73 5G, Its First Mid-Range Phone with a 108MP Camera


In 2020, Samsung introduced the Galaxy S20 Ultra to the market, and its main selling point was an all-new 108MP rear sensor. The camera experience was a little rough around the edges, but it improved a bit in the Note20 Ultra and the S21 Ultra and even more in this year's S22 Ultra. Up to this point, those 108MP cameras had remained a selling point of the Ultra range, as other S devices didn't get them. But now Samsung has unveiled the Galaxy A73 5G, the phone that's breaking that trend for the first time. ...


Intel Investing $100 Million in Semiconductor Education

"Our goal is to bring these programs and opportunities to a variety of two-year and four-year colleges, universities, and technical programs, because it is critical that we expand and diversify STEM education." An additional $50 million will be matched by the U.S. National Science Foundation (NSF), which will be asking for proposals from educators for a curriculum that aims to improve STEM education at two-year colleges and four-year universities. ...


The Neon Shortage Is a Bad Sign: Russia's war against Ukraine has ramifications for the chips that power all sorts of tech

Neon, a colorless and odorless gas, is typically not as exciting as it sounds, but this unassuming molecule happens to play a critical role in making the tech we use every day. For years, this neon has also mostly come from Ukraine, where just two companies purify enough to produce devices for much of the world, usually with little issue. At least, they did until Russia invaded. ...


Patent Tip, Based on a True Story: Contour IP Holdings, LLC v. GoPro

"Patent Owners should avoid describing and claiming the advance over the prior art in purely functional terms, in a result-oriented way that amounts to encompassing the abstract solution no matter how implemented. Instead, Patent Owners should describe and claim technical details for tangible components in the claimed system, showing that such components are technologically innovative and not generic. For computer-implemented inventions, this may include a specific set of computer digital structures to solve a specific computer problem." ...

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In the News: Week of March 14, 2022

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China COVID spike may affect image sensor supply

Digitimes Asia reports: "A spike in COVID-19 cases in Hong Kong and other Chinese cities is disrupting handset CMOS image sensor (CIS) shipments, as well as deliveries of related modules and other devices, according to industry sources." [source]


Luminous Computing Appoints Michael Hochberg as President

EETimes reports: "Luminous Computing, a machine learning systems company based in California, announced today the appointment of Michael Hochberg as president. Hochberg will lead engineering and operations at Luminous to develop what the company claims is the world’s most powerful artificial intelligence (AI) supercomputer to market, driven by silicon photonics technology. [source]

 

James Webb Telescope Camera Outperforming Expectations  

NASA reports: "On March 11, the Webb team completed the stage of alignment known as “fine phasing.” At this key stage in the commissioning of Webb’s Optical Telescope Element, every optical parameter that has been checked and tested is performing at, or above, expectations. The team also found no critical issues and no measurable contamination or blockages to Webb’s optical path. The observatory is able to successfully gather light from distant objects and deliver it to its instruments without issue." [source]

DSLR Confusion

Poking fun at a recent NYPost shopping guide on "Best DSLRs" list that contains mirrorless cameras, PetaPixel reports: "People Have No Idea What a DSLR Actually Is" [source] 

If you have any interesting news articles and other tidbits worth sharing on this blog please email ingle dot atul at ieee dot org.

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trinamiX Face Authentication Tech Receives IIFAA Certificate

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trinamiX Face Authentication fulfills the biometric security requirements defined by the International Internet Finance Authentication Alliance (IIFAA). After recently announcing the fulfilment of the FIDO Alliance and Android Biometric Security standards, the German tech company is now topping it off with their newest certification. trinamiX GmbH, a subsidiary of BASF SE, has thereby proven to be suited for integration in digital payment processes with particularly high security demands. Their solution is the first to pass these tests while the hardware is invisibly mounted behind OLED. IIFAA’s standard is adhered to by leading players in the FinTech industry and has the widest market coverage in China.

trinamiX Face Authentication became the world’s first to pass all these tests and to provide “financial-level security”2 while all hardware was integrated behind a full-screen display. “We’ve finally received living proof of our capability to raise the bar of biometric security,” Stefan Metz, Director 3D Imaging Business at trinamiX, stated. “Our solution can mean a breakthrough to the world of digital payment, allowing users to better trust in and benefit from digital financial services.” The innovative strength of this solution unveils itself through a closer look into the underlying technology: trinamiX Face Authentication introduces a one-of-a-kind liveness check to the authentication process in order to tell whether the object in front of the camera is an actual human-being. In addition to checking the presented face for three-dimensional depth, it reliably detects skin versus other materials. Thanks to skin detection, not even a hyperrealistic replica of a user’s face can trick the system – while common biometric authentication solutions are still prone to these fraud attempts.

The latest test result of trinamiX Face Authentication, issued by IIFAA’s testing agency, certifies that the solution complies with the IIFAA Biometric Face Security Test Requirement, which is an established authentication standard for digital financial services.

Full article: https://trinamixsensing.com/news-events/press/trinamix-face-authentication-behind-oled-earns-international-biometric-security-certificate-by-iifaa/

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SmartSens 50MP Ultra-High-Resolution Image Sensor

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SmartSens has launched an ultra high resolution image sensor based on a 22nm process. SC550XS is their first 50MP ultra-high resolution image sensor with a 1.0μm pixel size. The new product adopts the advanced 22nm HKMG Stack process as well as SmartSens’ multiple proprietary technologies, including SmartClarity®-2 technology, SFCPixel® technology and PixGain HDR® technology to enable excellent imaging performance. In addition, it can achieve 100% all pixel all direction auto focus coverage via AllPix ADAF® technology and is equipped with MIPI C-PHY 3.0Gsps high-speed data transmission interface. The product is designed to address the requirements of flagship smartphone main camera in terms of night vision full-color imaging, high dynamic range, and low power consumption.










Full press release: https://www.smartsenstech.com/en/page?id=179

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Low Power Edge-AI Vision Sensor

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Another interesting article from the upcoming tinyML conference. This one is titled "P2M: A Processing-in-Pixel-in-Memory Paradigm for Resource-Constrained TinyML Applications" and is work done by a team from University of Southern California.

The demand to process vast amounts of data generated from state-of-the-art high resolution cameras has motivated novel energy-efficient on-device AI solutions. Visual data in such cameras are usually captured in the form of analog voltages by a sensor pixel array, and then converted to the digital domain for subsequent AI processing using analog-to-digital converters (ADC). Recent research has tried to take advantage of massively parallel low-power analog/digital computing in the form of near- and in-sensor processing, in which the AI computation is performed partly in the periphery of the pixel array and partly in a separate on-board CPU/accelerator. Unfortunately, high-resolution input images still need to be streamed between the camera and the AI processing unit, frame by frame, causing energy, bandwidth, and security bottlenecks. To mitigate this problem, we propose a novel Processing-in-Pixel-in-memory (P2M) paradigm, that customizes the pixel array by adding support for analog multi-channel, multi-bit convolution and ReLU (Rectified Linear Units). Our solution includes a holistic algorithm-circuit co-design approach and the resulting P2M paradigm can be used as a drop-in replacement for embedding memory-intensive first few layers of convolutional neural network (CNN) models within foundry-manufacturable CMOS image sensor platforms. Our experimental results indicate that P2M reduces data transfer bandwidth from sensors and analog to digital conversions by ~21x, and the energy-delay product (EDP) incurred in processing a MobileNetV2 model on a TinyML use case for visual wake words dataset (VWW) by up to ~11x compared to standard near-processing or in-sensor implementations, without any significant drop in test accuracy.






arXiv preprint: https://arxiv.org/pdf/2203.04737.pdf

tinyML conference information: https://www.tinyml.org/event/summit-2022/

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A Curious Observation about 1-bit Quanta Image Sensors Explained

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Dr. Stanley Chan (Purdue University) has a preprint out titled "On the Insensitivity of Bit Density to Read Noise in One-bit Quanta Image Sensors" on arXiv. This paper presents a rigorous theoretical analysis of an intuitive but curious observation that was first made in the paper by E. Fossum titled "Analog read noise and quantizer threshold estimation from Quanta Image Sensor Bit Density."

Why is the quanta image sensor bit density insensitive to read noise at high enough exposure values?

The one-bit quanta image sensor is a photon-counting device that produces binary measurements where each bit represents the presence or absence of a photon. In the presence of read noise, the sensor quantizes the analog voltage into the binary bits using a threshold value q. The average number of ones in the bitstream is known as the bit-density and is often the sufficient statistics for signal estimation. An intriguing phenomenon is observed when the quanta exposure is at unity and the threshold is q=0.5. The bit-density demonstrates a complete insensitivity as long as the read noise level does not exceeds a certain limit. In other words, the bit density stays at a constant independent of the amount of read noise. This paper provides a mathematical explanation of the phenomenon by deriving conditions under which the phenomenon happens. It was found that the insensitivity holds when some forms of the symmetry of the underlying Poisson-Gaussian distribution holds.



The paper concludes:

The insensitivity of the bit density of a 1-bit quanta image sensor is analyzed. It was found that for a quanta exposure θ = 1 and an analog voltage threshold q = 0.5, the bit density D is nearly a constant whenever the read noise satisfies the condition σ ≤ 0.4419. The proof is derived by exploiting the symmetry of the Gaussian cumulative distribution function, and the symmetry of the Poisson probability mass function at the threshold k = 0.5. An approximation scheme is introduced to provide a simplified estimate where σ ≤ 1/√2π = 0.4. In general, the analysis shows that the insensitivity of the bit density is more of a (very) special case of the 1-bit quantized Poisson-Gaussian statistics. Insensitivity can be observed when the quanta exposure θ is an integer and the threshold is q = θ−0.5. As soon as the pair (θ, q) deviates from this configuration, the insensitivity will no longer appear.

Complete article can be downloaded here: https://arxiv.org/pdf/2203.06086

An early-access version of Eric's paper is available here: https://ieeexplore.ieee.org/document/9729893

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High Resolution MEMS LiDAR Paper in Nature Magazine

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Researches from the Integrated Photonics Lab at UC-Berkeley recently published a paper titled "A large-scale microelectromechanical-systems-based silicon photonics LiDAR" proposing a CMOS-compatible high-resolution scanning MEMS LiDAR system.

Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world. The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller. In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam divergence (0.050° × 0.049°) and a random-access beam addressing with sub-MHz operation speed. The 128 × 128-element focal plane switch array (FPSA) of grating antennas and microelectromechanical systems (MEMS)-actuated optical switches are monolithically integrated on a 10 × 11-mm2 silicon photonic chip, where a 128 × 96 subarray is wire bonded and tested in experiments. 3D imaging with a distance resolution of 1.7 cm is achieved with frequency-modulated continuous-wave (FMCW) ranging in monostatic configuration. The FPSA can be mass-produced in complementary metal–oxide–semiconductor (CMOS) foundries, which will allow ubiquitous 3D sensors for use in autonomous cars, drones, robots and smartphones.



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Ultra-Low Power Camera for Intrusion Monitoring

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An interesting paper titled "Millimeter-Scale Ultra-Low-Power Imaging System for Intelligent Edge Monitoring"  will be presented at the upcoming tinyML Research Symposium. This symposium is colocated with the tinyML Summit 2022 to be held from March 28-30 in Burlingame, CA (near SFO).

Millimeter-scale embedded sensing systems have unique advantages over larger devices as they are able to capture, analyze, store, and transmit data at the source while being unobtrusive and covert. However, area-constrained systems pose several challenges, including a tight energy budget and peak power, limited data storage, costly wireless communication, and physical integration at a miniature scale. This paper proposes a novel 6.7×7×5mm imaging system with deep-learning and image processing capabilities for intelligent edge applications, and is demonstrated in a home-surveillance scenario. The system is implemented by vertically stacking custom ultra-low-power (ULP) ICs and uses techniques such as dynamic behavior-specific power management, hierarchical event detection, and a combination of data compression methods. It demonstrates a new image-correcting neural network that compensates for non-idealities caused by a mm-scale lens and ULP front-end. The system can store 74 frames or offload data wirelessly, consuming 49.6μW on average for an expected battery lifetime of 7 days.

Preprint is up on arXiv: https://arxiv.org/abs/2203.04496



Personally, I find such work quite fascinating. With recent advances in learning based approaches for computer vision, we're seeing a "race to the top" --- larger neural networks, humongous datasets, and even beefier GPUs drawing 100's of watts of power. But, on the other hand, there's also a "race to the bottom" driven by edge computing/IoT applications that are extremely resource constrained --- microwatts of power, low image resolutions, and splitting hairs over every bit, every byte of data transferred.

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Artilux Announces CMOS IR Sensor for Mobile Digital Health Applications

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Hsinchu, Taiwan, March 8th 2022 – Artilux, the leader in CMOS-based SWIR optical sensing technology, demonstrated a multi-spectral optical sensing platform compatible with NIR/SWIR vertical-cavity surface-emitting laser (VCSEL) arrays, light emitting diodes (LED), and CMOS-based GeSi (Germanium-Silicon) sensors. This compact optical sensing platform is the industry-leading solution targeted to embrace the rapidly growing TWS and wearables markets in addition to unlock diversified scenarios in digital health.

In light of the increasingly popular wide spectrum (NIR/SWIR) optical sensing applications starting from vital sign monitoring in smartwatches to skin detection in TWS earbuds, cost-effective and energy-efficient optical components including LED, VCSEL, edge-emitting lasers, and SWIR sensors have become the crucial factors to meet such rising user demands. The widely discussed skin detection function in TWS earbuds requires SWIR sensors to perform precise in-ear detection and to deliver seamless listening experiences, while at the same time sustaining long battery life. Such product requires SWIR wavelength, lower power-consumption, lower cost, smaller size with higher sensitivity. The announcement aims to deliver a compact and cost-effective multi-spectral optical sensing solution, by incorporating Artilux’s CMOS-based ultra-sensitive SWIR GeSi sensors with the capability to integrate AFE (analog front end) and digital function into a single chip, together with high-performance VCSEL arrays at 940nm and 1380nm supplied by Lumentum.

 

Although the press release does not mention any technical specifications it may be worth referring to an ISSCC paper from 2020 published by a team from Artilux that described a Ge-on-Si technology. The paper is titled "An Up-to-1400nm 500MHz Demodulated Time-of-Flight Image Sensor on a Ge-on-Si Platform" (https://doi.org/10.1109/ISSCC19947.2020.9063107).

 




Press Release: https://www.artiluxtech.com/resources/news/1014


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Telluride Neuromorphic Workshop 2022

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The 2022 edition of the Telluride Neuromorphic Workshop series will be held in-person June 26 to July 16 in beautiful Telluride, Colorado. The topics of interest are broadly in "neuromorphic engineering" with neuromorphic vision sensors (including event cameras and other "spiking"-based vision sensors) being key areas of interest.

Neuromorphic engineers design and fabricate artificial neural systems whose organizing principles are based on those of biological nervous systems. Over the past 27 years, the neuromorphic engineering research community focused on the understanding of low-level sensory processing and systems infrastructure; efforts are now expanding to apply this knowledge and infrastructure to addressing higher-level problems in perception, cognition, and learning. In this 3-week intensive workshop and through the Institute for Neuromorphic Engineering (INE), the mission is to promote interaction between senior and junior researchers; to educate new members of the community; to introduce new enabling fields and applications to the community; to promote ongoing collaborative activities emerging from the Workshop, and to promote a self-sustaining research field.

The workshop will be organized in four topic areas

  • Neuromorphic Tactile Exploration (Enhance the tactile exploration capabilities of robots)
  • Lifelong Learning at Scale: From Neuroscience Theory to Robotic Applications (Apply neuro-inspired principles of lifelong learning to autonomous systems.)
  • Cross-modality brain signals: auditory, visual and motor 
  • Neuromorphics Tools, Techniques and Hardware (SpiNNaker 2 and FPAAs)

Researchers from academia, industry and national labs are all encouraged to apply... 

... in particular if they are prepared to work on specific projects, talk about their own work or bring demonstrations to Telluride (e.g. robots, chips, software). 

An application is required to attend, and financial support is available. Application deadline is April 8, 2022.

Call for applications.

Application submission page.

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Privacy-Aware Cameras for Human Pose Recognition

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Carlos Hinojosa, Juan Carlos Niebles and Henry Arguello published an article titled "Learning Privacy-preserving Optics for Human Pose Estimation" in the 2021 International Conference on Computer Vision which was held virtually in October 2021. This is a collaboration between Universidad Industrial de Santander (Colombia) and Stanford University (USA).




The widespread use of always-connected digital cameras in our everyday life has led to increasing concerns about the users’ privacy and security. How to develop privacy-preserving computer vision systems? In particular, we want to prevent the camera from obtaining detailed visual data that may contain private information. However, we also want the camera to capture useful information to perform computer vision tasks. Inspired by the trend of jointly designing optics and algorithms, we tackle the problem of privacy-preserving human pose estimation by optimizing an optical encoder (hardware-level protection) with a software decoder (convolutional neural network) in an end-to-end framework. We introduce a visual privacy protection layer in our optical encoder that, parametrized appropriately, enables the optimization of the camera lens’s point spread function (PSF). We validate our approach with extensive simulations and a prototype camera. We show that our privacy-preserving deep optics approach successfully degrades or inhibits private attributes while maintaining important features to perform human pose estimation.


They take a "deep-optics" approach --- a learning-based approach where a neural network is used not only to recognize the human pose, but also to train a privacy-preserving point-spread-function (PSF). The neural network is trained to strike a balance between two competing requirements: (a) hiding scene information so that human aces are not recognizable in the RGB images (even after image deblurring), while ensuring that (b) the PSF distortions aren't so strong that the pose-estimation task becomes impossible.



Their results look quite promising, and they even built a proof-of-concept hardware prototype using a wavefront modulator. Notice that the human faces are not recognizable in the RGB images, but the "match-stick" skeletons are still reliably picked out by the algorithm.




More details are in the open access paper and accompanying supplementary document and video available here: https://carloshinojosa.me/project/privacy-hpe/ 

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Privacy-Aware Cameras for Human Pose Recognition

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Carlos Hinojosa, Juan Carlos Niebles and Henry Arguello published an article titled "Learning Privacy-preserving Optics for Human Pose Estimation" in the 2021 International Conference on Computer Vision which was held virtually in October 2021. This is a collaboration between Universidad Industrial de Santander (Colombia) and Stanford University (USA).




The widespread use of always-connected digital cameras in our everyday life has led to increasing concerns about the users’ privacy and security. How to develop privacy-preserving computer vision systems? In particular, we want to prevent the camera from obtaining detailed visual data that may contain private information. However, we also want the camera to capture useful information to perform computer vision tasks. Inspired by the trend of jointly designing optics and algorithms, we tackle the problem of privacy-preserving human pose estimation by optimizing an optical encoder (hardware-level protection) with a software decoder (convolutional neural network) in an end-to-end framework. We introduce a visual privacy protection layer in our optical encoder that, parametrized appropriately, enables the optimization of the camera lens’s point spread function (PSF). We validate our approach with extensive simulations and a prototype camera. We show that our privacy-preserving deep optics approach successfully degrades or inhibits private attributes while maintaining important features to perform human pose estimation.


They take a "deep-optics" approach --- a learning-based approach where a neural network is used not only to recognize the human pose, but also to train a privacy-preserving point-spread-function (PSF). The neural network is trained to strike a balance between two competing requirements: (a) hiding scene information so that people's faces are not recognizable in the RGB images (even after image deblurring), while ensuring that (b) the PSF distortions aren't so strong that the pose-estimation task becomes impossible.



Their results look quite promising, and they even built a proof-of-concept hardware prototype using a wavefront modulator. Notice that the human faces are not recognizable in the RGB images, but the "match-stick" skeletons are still reliably picked out by the algorithm.




More details are in the open access paper and accompanying supplementary document and video available here: https://carloshinojosa.me/project/privacy-hpe/ 

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New Author Introduction – Atul Ingle

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Atul Ingle has kindly agreed to help me publishing the posts and also give his unique view on image sensor from computer vision developer point of view.

Atul Ingle is an Assistant Professor in the Department of Computer Science at Portland State University. His research interests are in the fields of computational imaging, computer vision and signal processing. His current research involves co-design of imaging hardware and algorithms for single-photon image sensors. More broadly, he is interested in both passive and active 3D imaging applications that are severely resource-constrained in terms of power, bandwidth, and compute. Atul holds a PhD in Electrical and Computer Engineering from University of Wisconsin-Madison.

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New Author Introduction – Saleh Masoodian

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I'd guess many of you know Saleh Masoodian, CEO of Gigajot. I'm happy to announce that Saleh has kindly agreed to join the authors of the blog.

With Mark and Saleh, the new blog would offer quite diverse views on the industry.

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Optimizing Machine Vision Lenses For Different Wavelengths

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 Quality Magazine publishes an article covering consideration when Optimizing Machine Vision Lenses For Different Wavelengths.

"Lenses play a crucial role in the quality of the images produced by a machine vision system since they determine the sharpness of the image on the camera sensor. Lenses can influence image quality in a variety of ways:
  • Reduced light transmission due to lens surface reflections
  • Spherical, chromatic and defect aberrations preventing all rays of light from a single point on the object being focused to a single point on the image
  • Reduced light intensity towards the edge of the image
  • Spatial distortion of the image

By choosing the appropriate lens construction, all of these effects can be minimized. This article highlights some of the considerations when selecting a lens for your particular needs."


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New Author Introduction – Mark Sapp

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Dear Image Sensors World Blog readers,

Let me introduce Mark Sapp who kindly offered a help with posting the image sensor news in the blog. Mark is an electrical engineer working in the industry for 15 years and an enthusiast for cutting edge imaging technology, located in Austin, Texas. Mark, welcome to the community!

If somebody wants to post more news in the blog, please let me know and I'd gladly add you to the list of authors. I hope that this enriches the blog content and add more diverse views from the different branches of the industry.

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Suspension of the Blog

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Due to a large workload, I'm unable to continue publishing the blog. So, the blog is suspended for the time being.

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303-Megaframes-per-Second Image Sensor

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MDPI starts publishing a Special Issue on Recent Advances in CMOS Image Sensor with a paper "A Dual-Mode 303-Megaframes-per-Second Charge-Domain Time-Compressive Computational CMOS Image Sensor" by Keiichiro Kagawa, Masaya Horio, Anh Ngoc Pham, Thoriq Ibrahim, Shin-ichiro Okihara, Tatsuki Furuhashi, Taishi Takasawa, Keita Yasutomi, Shoji Kawahito, and Hajime Nagahara from Shizuoka University and Osaka University.

"An ultra-high-speed computational CMOS image sensor with a burst frame rate of 303 megaframes per second, which is the fastest among the solid-state image sensors, to our knowledge, is demonstrated. This image sensor is compatible with ordinary single-aperture lenses and can operate in dual modes, such as single-event filming mode or multi-exposure imaging mode, by reconfiguring the number of exposure cycles. To realize this frame rate, the charge modulator drivers were adequately designed to suppress the peak driving current taking advantage of the operational constraint of the multi-tap charge modulator. The pixel array is composed of macropixels with 2 × 2 4-tap subpixels. Because temporal compressive sensing is performed in the charge domain without any analog circuit, ultrafast frame rates, small pixel size, low noise, and low power consumption are achieved. In the experiments, single-event imaging of plasma emission in laser processing and multi-exposure transient imaging of light reflections to extend the depth range and to decompose multiple reflections for time-of-flight (TOF) depth imaging with a compression ratio of 8× were demonstrated. Time-resolved images similar to those obtained by the direct-type TOF were reproduced in a single shot, while the charge modulator for the indirect TOF was utilized."

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