Archives for November 2013

Pixart Reports Q3 2013 Results, Shows Gesture Sensor

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Pixart concisely reports its Q3 2013 results saying that the revenue increased by 15.6% QoQ to NT$1,350.7M (45.8M USD). The gross margin was improved to 42.8% in Q3 2013 from 40.9% in Q2 mainly due to a more favorable product mix. The company posted a Youtube presentation showing that optical mouse is still the main application for its sensors:


Another recent Pixart's video shows a gesture recognition sensor, a new product for the company:

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Himax Reports Strong CMOS Sensor Sales

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Himax reports Q3 2013 results. The company says about its image sensor business:

"CMOS images sensors' third quarter sales were supported by shipments of Himax's 1 mega-pixel sensor for tier-one laptop customers and growing demand for its 2 and 5 mega-pixel sensors from smartphone and tablet makers. The Company will launch a new 8 mega-pixel sensor this quarter targeting higher-end smartphone and tablet markets. The release of this product positions Himax as the pioneer of high-end image sensors among Taiwanese and Chinese suppliers, advancing it to one of the leaders in the world market."

Himax Nov. 2103 investor presentation shows image sensor as a company growth area:

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Toshiba Starts Mass Production of 8MP 1.12um Pixel Sensor

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Business Wire: Toshiba's 8MP, 1.12um pixel T4K35, announced in January 2013, now goes into mass production. The 1/4-inch sensor features HDR and Color Noise Reduction (CNR). The mass production shipments will start on November 15.

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Omnivision Announces 10.5MP 30fps Sensor

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PR Newswire: Omnivision announces the OV10822, a new 10.5MP CameraChip sensor that brings DSC-level performance to smartphones and tablets. As a native 16:9 sensor, the OV10822 offers instant transition between video and image capture modes to capture still images while simultaneously recording HD video without any change in FOV. The 1/2.6-inch OV10822 utilizes 1.4um OmniBSI-2 pixel with improved high- and low-light performance, as well as alternate row HDR functionality. It records full-resolution 10.5MP (4320 x 2432 pixels) video at 30fps, as well as 4K2K (3840 x 2160 pixels) at 30fps with full horizontal FOV. Additionally, the OV10822 can support 1080p HD video at 60fps while maintaining FOV with binning functionality for RAW output.

The OV10822 features 4-lane MIPI interface, and fits into a camera module of 10 x 10 x 6.5 mm. With advancements in lens designs and autofocus actuator technology, the OV10822 will soon be fitting into camera modules that are under 6 mm in height. The OV10822 is currently available for sampling and is expected to enter volume production in Q1 2014.

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Axelis on Image Sensor Manufacturing Challenges

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Axelis published a nice video lecture on high energy implants in image sensor manufacturing:

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Omnivision Announces 4MP/90fps 2um Pixel HDR Sensor

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PR Newswire: Omnivision announces the OV4689, a 4MP SOC sensor in a native 16:9 format for surveillance and security applications. Built on the 2um OmniBSI-2 pixel architecture, the OV4689 captures full-resolution 4-megapixel HD video at 90fps, 1080p HD at 120fps with electronic image stabilization (EIS), and 720p HD at 180fps. The OV4689's line-based staggered HDR ensures smooth motion capture under extreme variations of bright and dark conditions. Furthermore, the sensor's narrow CRA has been optimized specifically for security and surveillance applications.

"The OV4689 comes to market at a time when security and surveillance camera systems are transitioning from analog CCTV to high quality digital solutions," said Hasan Gadjali, VP of worldwide marketing and business development at OmniVision. "With its best-in-class low-light sensitivity, HDR and OmniBSI-2 pixel performance, the OV4689 sets a new benchmark in digital imaging for IP and security cameras. It is designed to meet customers' desire for higher resolution image capturing in the standard 1/3-inch optical size, while also providing superior low-light performance."

The 1/3-inch OV4689 is available in a 6.6 x 5.8 mm CSP package. It is currently being sampled and is expected to enter mass production in Q1 2014.

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Kinect-2 Challenges Story

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The Official Microsoft Blog tells how the new ToF Kinect has been developed, largely based on ex-Canesta Cyrus Bamji sayings:

"When we take a relatively new technology, such as time-of-flight, and put it into a commercial product, there are a whole bunch of things that happen. There are things that we didn’t know how important they were until the product was made. For example, we know theoretically that motion blur in time of flight is a big problem, but just how important is only discoverable when you’re building a product with it and that product needs to deliver an excellent experience."

"We knew our time was limited. But we also had the advantage of being able to tap into Microsoft Research’s deep reservoir of technical expertise to get expert advice and help solve the various problems we encountered with new, cutting-edge solutions."

"It wasn’t like consultant mode, where we asked something and the researchers gave us an opinion. They really took charge of the project. They did all the tests. They built a whole infrastructure of software to deliver us a complete solution. Essentially, they took charge. We’re really grateful for that."

Via 123Kinect forum.

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ULIS Appoints CTO

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ULIS announces the appointment of Dr. Christel-Loic (Chris) Tisse as CTO. French-Australian Dr. Tisse, 37, brings 13 years of specialist knowledge in optical (visible-light & thermal) imaging science to ULIS. Tisse joins ULIS from MTech-Imaging Pte Ltd., a Singapore-based company he cofounded that specializes in offering innovative low-light, night-vision and thermal infrared imaging technologies. He served as CTO for three years, where he raised more than EUR2.5M in research funding. He also grew the company from a 2-man start-up to a highly skilled team of 15.

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Heptagon is Expanding

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Heptagon announces that it increases its operations, process and production engineering capacity in Singapore.

Heptagon also announces that Ohad Meitav has joined the company as CTO. Mr. Meitav is based in Heptagon’s Silicon Valley office (Mountain View, CA), where currently he is adding dedicated specialists to its system, software and imaging teams. Meitav joined Heptagon from Zoran, where he collaborated with leading imaging, camera, mobile, and consumer electronics companies.

In addition, Markus Rossi has been appointed as Chief Innovation Officer, with a greater concentration on future technologies and related intellectual property expansion. Rossi has been with Heptagon since its acquisition of CSEM in 2000. Rossi will now lead Heptagon’s innovation efforts with an increased focus on augmenting its intellectual property assets.

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Nikon COOLPIX P520 review – 42x super-zoom with GPS

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The Nikon COOLPIX P520 is a super-zoom camera with a 42x stabilised range and an 18.1 Megapixel sensor. It replaces last year's COOLPIX P510, keeping the 24-1000mm f3-5.9 zoom lens and built-in GPS receiver, but now coupling them with an updated sensor that adds two Megapixels to the resolution. The screen is now also larger and fully-articulated. As one of the longer zoom cameras on the market I've compared it against the current King of super-zooms, Panasonic's Lumix FZ70 / FZ72 with its monstrous 60x range. Find out how it compares in my Nikon P520 review and see if it deserves its high sales position!

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IMEC Hyperspectral Imagers Presentartion

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Trillion Sensors Summit 2013 published IMEC's presentation on the hyperspectral imagers:


Another interesting presentation is one by Rambus on disposable endoscope image sensor, the PicoCam, covered in an earlier post.

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Nikon Df Retro styled digital SLR released

On November 5th Nikon released the Nikon Df. It is a retro styled DSLR following the hype of manufacturers going back to their tested film days body design. Many photographers welcome this with praise and  so these cameras are selling well. No wonder Nikon decided to join the game. Yet it is somewhat strange that they did not decide to give the body a sensor of at least the resolution of the D610. People look at the resolution of bodies and 16MP is not an outstanding resolution nowadays. Yet Nikon is aware of this, so could this be the first camera of a line of retro styled Nikon’s. Just as Fuji has a few to fit everyone’s budget. We will see…

For now all we know is this press release:

Nikon Press release
November 5, 2013

The fusion of responsive, intuitive dial operation and “flagship D4 image quality” in the smallest and lightest FX-format body

Df_ambience_5b_sm.lowTOKYO – Nikon Corporation is pleased to announce the release of the Df, a Nikon FX-format digital SLR camera.

The Df combines intuitive, worry-free dial operation with superior image quality over a broad range of sensitivities in the smallest and lightest FX-format body, making the camera extremely portable. Large metal mechanical dials on the top of the camera enable direct, intuitive operation, offering tactile pleasure of shooting with precision mechanics, and allowing users to feel the joy of creating images that reflect their individual intent. The camera also provides a system that allows users to focus on shooting with the security that comes from visual confirmation of ISO sensitivity, shutter speed, and exposure compensation values, as well as the convenience of direct adjustment of settings at any time, even when the camera is turned off.

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Nikon Df preview – nostalgia gone too far?

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The Nikon Df is a retro-styled DSLR which pays homage to Nikon's iconic film SLRs of the Seventies. It takes the 16.2 Megapixel full-frame sensor of the flagship D4 and houses it in an unashamedly old-fashioned body with physical dials and levers for the shooting mode, release mode, shutter speed, ISO and exposure compensation. The Df also becomes Nikon's first DSLR to include a collapsing coupling lever allowing full aperture metering with old non-AI lenses. I got to try out the new Df at a Nikon event - find out if it’s the camera for you or an exercise in nostalgia that's gone too far in my Nikon Df hands-on preview!

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How to Measure FWC

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Albert Theuwissen continues his educational series of posts, now talking about full well capacity measurements: part 1 and part 2. The second part explains the difference between the cases when the saturation is caused by clipping the signal in ADC or readout chain and cases when the pixel limits the signal.

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Gesture Recognition Sensor by Samsung

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UBM Techonline published Samsung's whitepaper "Gesture Sensor for Mobile Devices" (requires registration to download). The paper reviews the 3D vision gesture technologies:


Then Samsung presents its own Dynamic Vision Sensor (DVS), "the most promising device for gesture sensor." While there is no explanation how DVS works, Samsung says:

DVS can effectively detect a moving object in a cost-effective way with fast response by providing events asynchronously on its edges:


The DVS sensor is said to have a resolution of 128 x 128, 40um pixel pitch and consume 23mW of power. Since only the edges are transmitted to the output, rather than full frames, image processing can be simplified and power reduced by using edge-detected images:


The dynamic range of DVS extends to 120 dB, so that DVS can detect the moving object in extreme low light and ultra high light, including outdoors.

Thanks to DM for the link!

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Sony Cyber-shot RX10 sample images – a classy high-end super-zoom!

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Sony's Cyber-shot RX10 is a high-performance zoom camera. It sports a fairly average sounding 8.3x zoom range (24-200mm equivalent), but makes it much more exciting with a constant f2.8 aperture and a larger than average sensor behind it. So rather than the usual 1/2.3in sensors of most super-zooms, the RX10 employs the same 1in 20 Megapixel sensor of the RX100 II that's over four times larger! I've been testing a final production RX10 and ahead of my in-depth review I'd like to share a wide selection of sample images and movies! Check out my Sony RX10 review-in-progress!

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Zeiss Otus 55 1.4 extended preview/ Medium format in a 35mm body? Yes, with the right lens.

Zeiss Otus 1.4 55mm ZE

Zeiss Otus 1.4 55mm ZE

Every now and then a piece of gear appears, which changes not only the photo gear landscape and forces the competition to alter their plans, but also pushes photographers into working differently using new equipment. The Fuji X system managed to do this, with lots of people switching to this system. The Nikon D800/e had a similar effect just as Canon 5D. And so we come to the Zeiss Otus 55mm 1.4, which might also be such a game changer, although matching its qualities will be very difficult for the other lens makers.  For now let us look at the basics.

Construction

Looking at the cosmetics, the lens has a modern look, an all metal barrel and a rubber like focusing ring, which is easy to detect with your fingers when looking through the viewfinder, easy to read distance and depth of field scales. Apart from the brilliant design (it won the 2013 IF product design award) the first thing you notice is the sheer size of this prime. It is after all a standard lens. It’s not a 50mm nor a 45mm, which is in fact closer to the diagonal 43.3mm, but a 55mm, yet the size and weight is much closer to a medium format 80mm, then the standard fifties we are used to.

All of this has a reason. The Otus, with the diastagon optical construction, is a very complex lens; 12 elements in 10 groups with floating elements design. The specialists at Zeiss worked on the whole project for 3 years, but the time from starting the work to building the first prototype was just one year. According to Dr. Nasse, scientist from Carl Zeiss and one of the first people to shoot with the lens, this was possible thanks to the extensive experience in building high performance cine lenses.

zeiss otus construction

zeiss otus construction

When designing the lens, the engineers and scientists had a totally free hand, not restricted neither by size, weight nor cost. Richard Schleuning from Zeiss says this was a new approach, as normally these restrictions are a part of every project of a new lens. This time there were no compromises with just one goal in mind, the absolutely best lens for 35mm.

The diastagon is normally used for wide angle lenses, it is a more complex, but also gives a possibility of correcting both for chromatic aberrations and field curvature. Schleuning claims both of these parameters are controlled across the whole aperture spectrum, if so, this is an amazing achievement.

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Image Sensors in Electronic Imaging 2014 Program

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Electronic Imaging 2014 program has been published and has many nice image sensor papers. An incomplete sample of them is below:

A statistical evaluation of effective time constants of random telegraph noise with various operation timings of in-pixel source follower transistors
Akihiro Yonezawa, Rihito Kuroda, Toshiki Obara, Akinobu Teramoto, Shigetoshi Sugawa, Tohoku Univ. (Japan)

Abstract:

"RTN (Random Telegraph Noise) causes the image degradation in CMOS image sensor (CIS). At readout operation in CIS, the row selected pixel-SFs (source follower) turn on and not selected pixel-SFs operate at different bias conditions depending on the select switch position. In this work, we extract RTN time constants and amplitude with various pixel-SFs duty ratios and cyclic periods statistically. Some MOSFETs have RTN in different duty ratios. However other MOSFETs with RTN do not observed in different duty ratio. For MOSFETs which have large RTN amplitude in different duty ratios, the MOSFETs with RTN have almost the same RTN amplitude. It is considered that the RTNs of same MOSFET in different duty ratio caused by same oxide trap. The scatter plot of average time constant ratio (<τc> / <τe>) of different duty ratio widely distributed. Especially, when duty ratio = 1, the distribution of <τc> / <τe> at duty ratio = 1 tend to be smaller than that of <τc> / <τe> at duty ratio =7.1 times 10^-3. The probability of capture and emission of the carrier changes depending on the pixel-SF operation duty ratio. These results are important for the detection and analysis of in pixel-SF with RTN."

Pixel structure with 10 nsec fully charge transfer time for the 20M frame per second burst CMOS image sensor
Ken Miyauchi, Tohru Takeda, Katsuhiko Hanzawa, Yasuhisa Tochigi, Shin Sakai, Rihito Kuroda, Tohoku Univ. (Japan); Hideki Tominaga, Ryuta Hirose, Kenji Takubo, Yasushi Kondo, Shimadzu Corp. (Japan); Shigetoshi Sugawa, Tohoku Univ. (Japan)

Abstract:

"In this paper, we demonstrate the technologies related to the pixel structure achieving the fully charge transfer time of less than 10 nsec for the 20M frame per second burst CMOS image sensor. In the 30.0 umH X 21.3 umV fully-depleted pinned photodiode (PD), the floating diffusion (FD) and the transfer-gate-electrode (TG) are placed at the bottom center of the PD. The n-layer for the PD consists of the semicircular regions centered on the FD and the sector-shaped portions extending the edges of the semicircular regions. To create an electric field greater than average of 400 V/cm toward the FD direction in the entire PD region, the n-layer width of the sector-shaped portions becomes narrower from the proximal-end to the distal-end. We designed the PD structure, which included the n-layer shape and the PD dopant profile with the condition of three times n implantation, and the TG structure. An ultra-high speed CMOS image sensor with the abovementioned pixel structure has been fabricated. Through the experiments, we confirmed two key characteristics as follows; firstly, the entire PD area had sensitivity. Secondly, image lag was below the measurement limit."

Novel CMOS time-delay summation using single-photon counting for high-speed industrial and aerospace applications
Munir M. El-Desouki, King Abdulaziz City for Science and Technology (Saudi Arabia)

Abstract:

"Time-delay integration (TDI) is a popular imaging technique that is used in many applications such as machine vision, dental scanning and satellite earth observation. One of the main advantages of using TDI imagers is the increased effective integration time that is achieved while maintaining high frame-rates. Another use for TDI imagers is with moving objects, such as the earth's surface or industrial machine vision applications, where integration time is limited in order to avoid motion blurs. Such technique may even find its way in mobile and consumer based imaging applications where the reduction in pixel size can limit the performance during low-light and high speed applications. Until recently, TDI was only used with charge-coupled devices (CCDs) mainly due to their charge transfer characteristics. CCDs however, are power consuming and slow when compared to CMOS technology and are no longer favorable for mobile applications. In this work, we report on novel architectures that use single-photon counting based TDI techniques that are implemented in standard CMOS technology allowing for complete camera-on-a-chip solutions. The imager was fabricated in a standard CMOS 150 nm 5-metal digital process from LFoundry."

Pixel structure for asymmetry removal in ToF 3D camera
Byong Min Kang, Jungsoon Shin, Jaehyuk Choi, Dokyoon Kim, Samsung Advanced Institute of Technology (Korea, Republic of)

Abstract:

"Most of time-of-flight (ToF) cameras have a two-tap pixel structure for demodulating a reflected near infrared (NIR) from objects. In order to eliminate the asymmetry between two taps in the pixel, a ToF camera needs another measurement, which collects photo-generated electrons from reflected NIR by inverting the phase of clock signals to transfer gates. This asymmetry removal needs additional frame memories and suppresses the frame rate due to the additional timing budget. In this paper, we propose novel asymmetry removal scheme without timing and area overheads by employing 2×2 shared two-tap pixels with cross-connected transfer gates. The 2-tap pixel is shared with neighbor pixels and transfer gates in the pixel are cross-connected between upper and lower pixels. In order to verify the proposed pixel architecture, we designed the prototype sensor chip and the camera system, which generates color and depth images alternately.. The sensor with cross-connected transfer gates has 1280×960 pixels (640×480 with 2×2 binning), which has been fabricated using 0.11 μm CMOS process. The camera system mounting the sensor chip uses 16 MHz modulation frequency, f/1.6 lens, NIR LED array with 850 nm, and 20 msec integration time."

Review of ADCs for imaging
Juan A. Leñero-Bardallo, Jorge Fernández-Berni, Ángel B. Rodríguez-Vázquez, IMSE-CNM (Spain), Univ. de Sevilla (Spain)

Abstract:

"The presentation will be focus on ADCs for imaging. We will describe the state-of-the-art and discuss the special specifications that ADCs for vision sensors must satisfy. Firstly, we will establish what are the ADCs requirements for modern imaging: number of bits, area, fix pattern noise, and power consumption. We will discuss how some of these specifications can be relaxed, depending on the application, to save power or area consumption. We will review briefly the main ADCs topologies employed for imaging nowadays: SAR, cyclic, slope, and SD. Their advantages and disadvantages will be discussed. Their limitations depending on the desired frame rate, the required conversion speed, and area consumption will be explained. Examples of how a bad design of an ADC for imaging can degrade image quality will be shown. Thirdly, we will mention the most relevant recent publications. Their performance will be compared based on a FOM. The main trends in ADC for imaging will be presented. Some design considerations for future ADC integration in 3D technologies will be explored. Finally, we will draw some conclusions about the current and future trends of ADC design for imaging. We will conclude justifying the need of designing specific ADCs for imaging."

A high fill-factor low dark leakage CMOS image sensor with shared-pixel design
Min-Woong Seo, Keita Yasutomi, Keiichiro Kagawa, Shoji Kawahito, Shizuoka Univ. (Japan)

Abstract:

"We have proposed and evaluated the high-responsivity and low dark leakage CMOS image sensor with the ring-gate shared-pixel design. A ring-gate shared-pixel design with a high fill-factor makes it possible to achieve the low-light imaging. As eliminating the shallow trench isolation (STI) in the proposed pixel, the dark leakage current is significantly decreased because one of major dark leakage sources is removed. By sharing the in-pixel transistors such as a reset (RT), select (SL) transistors and source follower (SF) amplifier, each pixel has a high fill-factor of 43 % and high sensitivity of 144.6 ke-/lx•sec and its conversion gain is a 22.9-μV/e-. In addition, the effective number of transistors per pixel is 1.75. The proposed imager achieved the relatively low dark leakage current of about 104.5 e-/s (median), corresponding to a dark current density J [proposed] of about 30 pA/cm^2. In contrast, the conventional type test pixel has a large dark leakage current of 2450 e-/s (median), corresponding to J [conventional] of about 700 pA/cm^2. Both pixels have a same pixel size of 7.5×7.5 μm^2 and are fabricated by a same process."

A CMOS time-of-flight range image sensor using draining only modulation structure
Sangman Han, Keita Yasutomi, Keiichiro Kagawa, Shoji Kawahito, Shizuoka Univ. (Japan)

Abstract:

"This paper presents new structure and method of charge modulation for CMOS TOF range image sensor using pinned photodiodes. Proposed pixel structure allows us to achieve high-speed charge transfer by generating lateral electric field from the pinned photo-diode (PPD) to the pinned storage-diode (PSD). And generated electrons by PPD are transferred to the PSD or drained off through the charge draining gate (TXD). This structure allows us to realize a trapping less when the charges transfer between PPD and PSD. Therefore, it can reduce the noise that is caused by a transfer gate (TX). The pixel consists of a PPD, a PSD, a TXD, a TX for readout between the PSD and the floating diffusion (FD) with MOS capacitor for increasing the full well capacity, a reset transistor and a source follower amplifier transistor. A TOF range imager prototype is designed and implemented with 0.11um CMOS image sensor. The accumulated signal intensity in PSD as a function of the TD gate voltage is measured. The ratio of the signal for the TD off to the signal for the TD on is 33:1. And the response of the pixel output as a function of the light pulse delay has been also measured."

Thanks to AT for giving me a heads-up!

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Sharp Reports Image Sensor Sales Growth

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Sharp reports a 26% growth of its image sensor sales for Apr 1 - Sept 30, 2013 period, the first half of its financial year (the last line in the table below, note the relative scale with respect to other businesses):


The company also reports "strong sales of camera modules for mobile devices" although no numbers are given.

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SMPTE Meeting on Wider Color Gamuts

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AV Science publishes a report from SMPTE Annual Meeting mostly talking about UHD/4K issues: "many presenters agreed that increasing the resolution has less impact than other factors on the viewing experience. What's more important—what produces a real "wow" factor—is increasing the dynamic range, color gamut, color subsampling, color bit depth, and frame rate." The color gamut extension was the hot topics at the meeting. The current HDTV's Rec.709 gamut is extended to UHD's Rec.2020 one:


Some propose to extend it even farther to XYZ one to cover all visible colors and beyond: "the system would be entirely future-proof, accommodating any display technology that might be developed without having to create a new system all over again."


For image sensors, these wider gamuts are quite incompatible with small pixels due to a higher color crosstalk. If wider gamuts indeed manage to produce the "wow" factor, it could become a boost for a new generation of low-crosstalk pixels and color filter technology.

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iPad Air Uses Omnivision’s Image Sensors

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Chipworks reverse engineering revealed that both front and rear cameras in the new Apple iPad Air use Omnivision's image sensors: 5MP 1.4um pixel in the rear and 1.2MP 1.75um pixel in the front ones:

iSight Camera
FaceTime Camera

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Mainstream Smartphones to Have above 10MP Camera in 2014

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Digitimes: Above 10MP will become the mainstream resolution level for camera modules in smartphones and tablets in 2014, Largan CEO Lin En-ping said at an October 31 investors conference.

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