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SK Hynix has updated its image sensor product page showing its current offerings and plans:

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Techcrunch video shows Qualcomm SnapDragon 805 photography capabilities, one of them being Lytro-like re-focus feature:

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Business Wire: Dongbu has begun supplying CCTV image sensors to Brigates, a fabless Chinese company. Currently supplying Brigates with D1 resolution sensors (0.44MP), Dongbu expects to develop higher HD 720P resolution sensors with Brigates in the second half of this year.

China’s interest in CCTV surveillance may be increasing due in part to the mainland hosting more and more international events such as Shanghai Expo and the Guangzhou Asian Games. According to some estimates, the Chinese CCTV market has steadily grown from 47.5 billion yuan in 2009 to 65 billion yuan (about US$10.7 billion) in 2012.

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JungChak Ahn, image sensor technology leader at Samsung, and a member of Image Sensor Workshop and ISSCC technical committees has been promoted to VP position at Samsung, as his LinkedIn page updates. JungChak will present at Image Sensors conference in London in March 2013.

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GeekBeatTV published a Youtube video interview with Chris Pickett, CEO of Pelican Imaging:

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The 7th Fraunhofer IMS Workshop on CMOS Imaging takes place in Duisburg, Germany, on May 20-21, 2014. The content of the workshop is thematically dedicated to extended spectrum imagers, SPADs, detector technologies, as well as cameras and applications. Fraunhofer IMS is expecting about 100 participants from all over the world who are active in all fields of CMOS imaging. Visit of Fraunhofer IMS wafer fab is possible. The list of presentations is below:

• Fundamentals of CMOS Imaging: the Pinned Photodiode
  Albert Theuwissen, Harvest Imaging
• Evolution and Limitations for Mobile Image Sensors
  Robert Gove, Aptina
• CMOS Imagers for Digital Still Cameras
  Guy Meynants, CMOSIS
• SWIR InGaAs FPAs for Passive and Active Day & Night Vision
  Jan Vermeiren, Xenics
• Hyperspectral Imagers
  Piet de Moor, IMEC
• SPADs for Single-Photon Imaging in the Near Infrared
  Alberto Tosi, Politecnico di Milano
• CMOS Technology for SPAD/SiPM
  Daniel Durini, FZ Jülich
• SPAD-Based ToF-Imaging for Automotive Safety Applications
  Christiano Niclass, Toyota Central R&D Labs
• CMOS Spectroscopy Using LDPDs
  Werner Brockherde, Fraunhofer IMS
• Silicon X-Ray Detectors - in Heaven and on Earth
  Lothar Strüder, PNSensor
• Merging Technologies for Multi-Aperture Cameras
  Andreas Bräuer, Fraunhofer IOF
• Lightfield Cameras
  Christian Perwaß, Raytrix
• Computational Imaging for Industrial Applications
  Svorad Štolc, AIT Austrian Institute of Technology
• Industrial Cameras
  Jochem Herrmann, Adimec
• High Resolution Earth Observation Cameras
  Andreas Eckart, DLR

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NPD DisplaySearch analysts believe that nearly 330M smart devices with gesture-sensing will be shipped in 2015, about 70% increase over the 2014 forecast and a doubling of shipments in 2013. The adoption of 3D depth sensing becomes more accurate and affordable, not only on smartphones and tablets, but also on smart TVs, all-in-one PCs, and other large-screen devices.

Shipment Forecast for Gesture Sensing Solutions for Smart Devices. Source: NPD DisplaySearch

"Gesture sensing is the next critical user interface trend, designed to improve the usefulness of, and user experience on, smart TVs and other large smart devices," says Calvin Hsieh, research director at NPD DisplaySearch.

The recent and planned use of 3D gesture-sensing technologies in connected smart devices includes the following:

• Mobile devices have touch screens and microelectromechanical systems (MEMS) as major user interfaces, but gesture sensing exists as a supportive user interface.
• Smart TVs and other larger devices cannot leverage touch screens, which is why Samsung and other TV makers are now beginning to offer gesture sensing technologies in upcoming products.
• Game consoles (e.g., Xbox and PlayStation 4) already rely primarily on 3D gesture-sensing controls.
• PCs have not leveraged gesture sensing widely. However, Intel has proposed perceptual computing as the next dynamic for PCs in 2012.

Over the past year alone, Intel acquired Omek (gesture middleware vendor); Microsoft released the new Kinect with TOF technology for Xbox One; Sony adopted stereo vision for the new PS Camera for PlayStation 4; Apple acquired PrimeSense for its structured light technology, which could be used on future Apple TVs; and Google acquired Flutter. Also, Samsung has been applying gesture sensing to their smart TVs for the past two years.

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Point Grey's December 2013 newsletter promotes its new 1920x1200 camera with Sony IMX174 global shutter sensor, for the first time featuring in Grasshopper3 GS3-U3-23S6M-C camera:


"To achieve optimal imaging performance, Sony’s special “analog memory” perfectly stores and shields the light collected in the photodiode. This technology minimizes common global shutter CMOS artifacts such as fixed pattern noise and dramatically lowers read noise levels to just 7 electrons (e-). The IMX174 sensor further boasts saturation (full well) capacity of 32,000 electrons (e-), dynamic range of 73 dB, and peak quantum efficiency of 76% at 525 nm."

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VentureBeat: Intel presents its own 3D depth sensing camera at CES, called RealSense 3D, a part of Perceptual Computing program. Little is said about the camera technology. Intel just says that it features "full 1080p color and a best-in-class depth sensor, the camera gives PCs and tablets 3D vision for new, immersive experiences. Interact more intuitively with facial recognition, emotion tracking, 3D scanning, and background extraction, or use 10-finger gesture recognition for agile device control." VentureBeat publishes a blurry picture of the camera board:

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A funny item is being sold on Amazon: "2gig Image Sensor Digital Still Camera" for $108.97. 2gig is a name of the company. The actual resolution is QVGA.

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PR Newswire: SoftKinetic's DepthSense 3D ToF USB camera and iisu gesture recognition middleware have been integrated with the NVIDIA Tegra NOTE 7 tablet platform, and the platform is available to developers to create 3D depth sensor-enabled applications for the mobile world. The Tegra NOTE 7 is powered by the Tegra 4 mobile processor, which features a 72 custom core GPU and quad-core ARM Cortex-A15, plus a second-generation battery-saver core. SoftKinetic's middleware and camera hardware will enable Tegra NOTE 7 to provide short range 3D gesture tracking and real-time 3D depth sensing, as close as 6 inches away at up to 60 fps.

PR Newswire: SoftKinetic unveiles an in-vehicle, gesture-based infotainment solution based on SoftKinetic technologies and Freescale silicon. "Freescale is committed to providing the most innovative embedded processing solutions for the automotive industry, and gesture recognition is a vital part of that strategy," said Rajeev Kumar, director of marketing and business development with Freescale's MCU business. "SoftKinetic's solutions for 3D vision offer the extremely sophisticated capabilities which help our shared customers innovative 3D embedded automotive solutions."

PR Newswire: MakerBot, the leader in desktop 3D printing, and SoftKinetic jointly announce a strategic partnership. This partnership is expected to help MakerBot expand its 3D Ecosystem and 3D Printing Platform, and enhance the ease of use and connectivity of MakerBot Replicator Desktop 3D Printers and Scanners. SoftKinetic will enhance its 3D camera technology for 3D scanning. SoftKinetic is focused on the development of next generation 3D cameras based on its technology for inclusion in future MakerBot 3D scanning products.

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PR Newswire: OmniVision announces immediate availability of OV480, a distortion correction chip for wide FOV automotive applications. It is currently shipping to multiple global tier-1 automotive suppliers. The OV480 can correct lens distortion of up to 195-degrees and enable rear-view and 360-degree surround view systems. Additionally, the OV480 supports a cross-traffic view, which allows drivers to view traffic from both sides of the vehicle.

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DXO Labs announces that it has licensed its ISP to Korea-based Anapass Inc.

"We are very pleased to team up with DxO Labs, the reference company for image quality, to bring up Anapass application processors," says Kyeong Ho Lee, CEO, Anapass Inc. "The DxO ISP will offer to our mobile application customers its high-performing image pipeline along with his great expertise, delivering cameras with stunning images and great quality videos."

"We are excited to partner with Anapass to bring to market our latest generation of DxO ISP camera image processing hardware" says Jerôme Ménière, Chairman and CEO of DxO Labs. "The camera system is an essential feature of a mobile device. End-users are now considering their smartphones as their primary camera. Only DxO, with its years-long experience in designing imaging pipelines for DSLR, digital compact and smartphone cameras, can deliver a complete high-end solution for mobile device’s camera sub-system."

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FLIR announces FLIR One - a $350 thermal imaging camera that clips on back of iPhone 5 or 5s:


The camera has two sensors - an IR one with unknown resolution and a visible light VGA sensor that "adds visible spectrum detail to thermal images and enhances resolution":


A promotional Youtube video talks about the new camera applications:



Thanks to SF for the link!

Update: FLIR also announces Lepton thermal imaging camera core - similar in size, weight, and power consumption to a conventional CMOS cell phone camera module, said to be the world's smallest microbolometer-based thermal imaging camera core currently available. Lepton is used in FLIR One camera. It has "a breakthrough lens fabricated in wafer form, a microbolometer FPA, and advanced thermal image processing on an ASIC. Lepton is fully compatible with FLIR’s patented multi-spectral imaging (MSX) technology, which allows visible and thermal image streams to be combined for sharper, more visually pleasing hybrid images."

FLIR Lepton Module

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PR Newswire: AltaSen will soon offer its first 1080p60 WDR sensor fully meeting all specifications at operational temperatures up to 85°C.
The AL30205C-85 and its supporting ASIC have already been fully qualified to JESD-47 along with Qualification of Integrated Circuits and elements per JESD22, JESD85, and JESD78, and will be fully qualified by early 2014 to AEC-Q100 Grade 3. Sensors and ASICs qualified from zero to 60°C are already in mass production.

The HD chipset delivers WDR HD video at 1080p30 through 1080p60 with up to 120 dB dynamic range with a minimum of motion artifacts as enabled by its U.S. Pat. No. 8,605,177.

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Business Wire, PR Newswire: Toshiba announces “Bright Mode” CMOS image sensor technology that allows smartphones and tablets to record Full HD video at 240fps, the industry’s highest frame rate, according to the company. Regular high frame rate requires a short exposure time, resulting in underexposed images. “Bright Mode” technology doubles the exposure time by adopting interlaced video output, instead of a progressive one. Toshiba will also provide an interlace-progressive conversion program to make high quality progressive video with low deterioration, without changing frame rate.

“Bright Mode” also employs charge binning, which doubles the electrical charge of each pixel. The technology also realizes 240 fps equivalent Full HD video recording. “Bright Mode” sensors can playback high quality video in slow motion at one-eighth standard speed, bringing new dimensions to imaging.

Sample sensors incorporating “Bright Mode” will be available in Q1 2014.

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Business Wire: Aptina announces the 1/5-inch VGA ASX350AT SOC and the 1/4-inch 1MP AR0140AT image sensor for automotive applications. The VGA-resolution 3.75um pixel ASX350AT SOC is aimed to cost effective single-chip rear view cameras (RVC) to comply with potential requirements from the NHTSA. It supports NTSC/PAL interfaces and features dynamic overlay capability, an on-chip temperature sensor for system feedback and additional optical pixels to assist lens alignment during camera manufacturing. The sensor features DR-Pix dual gain pixel technology with responsivity of 6.67 V/lux-s in high gain mode and 2.44 V/lux-s in low gain mode (at 550nm). The DR is 82.2dB.

Aptina ASX350AT SOC

The 1MP AR0140AT provides tier-1 auto manufacturers with HDR capture of up to 96dB or linear capture, and a low light sensitive 3.0-µm pixel with DR-PIX technology. The on-chip statistics engine and temperature monitoring improves overall camera system control and protection. When combined with Aptina’s co-processor, the AP0100AT, the AR0140AT enables a 720p rear view camera solution with multiple dynamic colored overlays, perspective and lens distortion correction, extended de-warp capabilities with options for front/side viewing and images to assist the driver that are split into three sections (Triptych viewing).

The ASX350AT and the AR0140AT are AEC-Q100 qualified with an operating temperature range of -40ºC to +105ºC and are in production now.

PR Newswire: OmniVision announces the OV10626 AutoVision sensor for advanced driver assistance systems (ADAS). The OV10626 supports both NTSC analog and digital outputs, as well as dual dynamic overlay functions. The sensor has color HDR mode of up to 120 dB and low-light sensitivity of 15 V/Lux-sec.

"Conventionally, HDR and high sensitivity have been mutually exclusive in automotive imaging. With the OV10626, however, we now offer both features in a compact, single-chip solution," said Inayat Khajasha, senior product marketing manager for automotive products at OmniVision.

The OV10626 is packaged in OmniVision's proprietary AutoVision chip-scale package (aCSP), which is said to be the industry's most compact and efficient package available.


PR Newswire: Omnivision also announces the 720p30 OV9762 CameraChip for front-facing cameras in smartphones and tablets, featuring OmniVision's first 1.87um OmniBSI-2 pixel. The OV9762 records 1.3MP (1376 x 960 pixel ) video at 30fps, or 720p30 HD video with EIS. "By using this new, slightly larger pixel, we developed an image sensor that offers dramatically improved HD video in a package that is pin-to-pin compatible with the previous generation OV9760," said Archie de Guzman, senior product marketing manager at OmniVision.

The OV9762 fits into a 4.3 x 4.1 mm package and is currently in volume production.

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Sony Imaging Technology web page says: "Sony is the world's No. 1 manufacturer of image sensors for digital cameras and video recorders (based on Sony research from April 2012 to March 2013 that shows Sony has a 50% market share)."

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PriorSmart: In Sept. 2013, California Institute of Technology filed a lawsuit against OmniVision on the infringement of its 8 patents:

• 6,570,617: "CMOS active pixel sensor type imaging system on a chip" by Fossum et. al. Filed 1/2/2001 & Granted 5/27/2003.
• 7,369,166: "Single substrate camera device with CMOS image sensor" by Fossum et. al. Filed 4/15/2003 & Granted 5/6/2008.
• 5,841,126: "CMOS active pixel sensor type imaging system on a chip" by Fossum et. al. Granted 11/24/1998.
• 5,990,506: "Active pixel sensors with substantially planarized color filtering elements" by Fossum et. al. Granted 11/23/1999.
• 6,549,235: "Single substrate camera device with CMOS image sensor" by Fossum et. al. Filed 7/21/1998 & Granted 4/15/2003.
• 7,615,808: "Structure for implementation of back-illuminated CMOS or CCD imagers" by Pain et. al. Granted 11/10/2009.
• 7,749,799: "Back-illuminated imager and method for making electrical and optical connections to same" by Pain. Granted 7/6/2010.
• 6,606,122: "Single chip camera active pixel sensor" by Shaw et. al. Granted 8/12/2003.

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EETimes Europe reports that LFoundry Rousset, France fab has been declared bankrupt and closed. Its 600 employees have been laid off. The fab used to offer 0.15um and 0.11um CIS processes:


Lfoundry bought the Rousset plant from Atmel in 2010 for €1, and Atmel was the main customer for Rousset until mid-2013. Now, the only active LFoundry's fab is the one in Avezzano, Italy, bought from Micron in June 2013. The Avezzano fab offers CIS process to customers. It also enjoys a 4 years wafer supply agreement with Aptina. It's a 50:50 joint venture between LFoundry Europe and Marsica Innovation SpA, a company owned by the Italian fab's management.

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Law360: ON Semiconductor sues CMOSIS and others for allegedly infringing four of its patents covering image sensor technology, including two patents by one of CMOSIS's co-founders, Guy Meynants, according to the court documents. The U.S. patents are 5933190, 6011251, 7408195 and 7608516.

Update: ON Semi also sued San Diego-based AlliedSens LLC, CMOSIS distributor in the US, and German Leica Camera AG, which uses CMOSIS sensors into one of its cameras. ON Semiconductor sent CMOSIS a cease-and-desist letter in late September 2013, but the CMOSIS denied that its products infringe the asserted patents, the complaint says.

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EETimes Europe: Edinburgh, Scotland-based Pyreos announces its first gesture control products using PIR image sensors. The PY01430 a dedicated mobile application solution, enables gesture commands at up to 20cm and comes in a very small consumer electronics friendly package for ease of integration. The PY01471 enable the use of very low cost Fresnel lens to extend the range of the gesture sensor to greater than 1 meter whilst consuming the same low power as it sister device PY01430. The sensors are said to consume microwatts of power.

Jeff Gray, VP of Sales and Marketing says: "I believe we have truly opened the door for our customers to simply make the right decision to use gesture sensors in their mobile devices without the concern of significant battery drain, caused by LED based gesture sensors. Our customer have long since told us that the biggest concern with gesture was power consumption based on their test of a number of LED based solution, this has cause a delay in adopting gesture technology, they further state that they would not be able to offer the consumer true gesture functionality because of this. Well today that all changes thanks to Pyreos new gesture family of products. The ability to offer significantly low power features like always on and wake on motion, will at last give the consumer a true touchless experience."

The company announces a new funding round of $4M, led by Robert Bosch Venture Capital, Seraphim Capital, Siemens Technology Accelerator and the Scottish Investment Bank (SIB).

A Youtube video explains Pyreos' approach:



A year-old company presentation emphasizes the strong points of the technology:

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