Archives for September 2015

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Sony, Olympus, and their medical joint venture - Sony Olympus Medical Solutions Inc. - announce that their jointly developed 4K surgical endoscopy system will be commercialized since early October 2015. Sony Olympus Medical Solutions has brought together the core technologies and expertise of Sony (image sensors, image and signal processing, optical transmission, 4K imaging) and Olympus (medical products R&D, deep understanding of the needs of the medical community) and combined them to create a powerful technological base and image processing system for medical devices.

Sony contributed its technology and expertise in 4K and digital imaging. For the 4K camera head, Sony provided its 4K Exmor R CMOS image sensor, image and signal processing technologies, and miniaturization technologies, which - taken together - make for very high image clarity and advanced functionality. In addition, Sony's 4K image transmission technologies made possible the nearly latent-free delivery of 4K visuals from the endoscope to the monitor.

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After LG G3 smartphone has presented ST ToF sensor-assisted AF last year and G4 is following its path this year, there are few more smartphone makers adopting ST ToF solution. One of them is the recently announced Oppo R7 Plus: "With a laser focus technology to quickly capture the focal point within 0.3 seconds, a RGBW sensor that is able to shoot high-clarity photos in low-light environments <..> to capture <..> sports events."


Another recent smartphone with ST VL6180 ToF sensor is OnePlus 2: "The 2015 flagship model, OnePlus 2, relies on ST sensors for its superior camera system performance that includes an ultra-fast 0.2s “human-eye” -grade focus time and advanced optical anti-shake technology that delivers a 20% improvement in effective image resolution, as well as a 55% reduction in power consumption compared with standard optical anti-shake mobile-camera systems."


Asus Zenphone 2 Laser too features ToF sensor AF: "The brand-new laser-autofocus feature greatly reduces blurring and enhances image stabilization..."


There are few more models from LG and Asus, as well as Lenovo Vibe Shot, and Meizu MX5. There is even a rumor that the next generation Google Nexus will have the ToF AF too:

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SpectroNet publishes a video presentation "Multi/Hyper-Spectral Imaging Applications" by Vivek Sharma - KU Leuven / IMEC:

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PRNewswire: OmniVision announces the OV8856, a 1/4-inch 8MP, 1.12um pixel PureCel sensor for mainstream mobile devices.

"The global market for 8-megapixel sensors is booming, with analysts expecting over one billion in annual unit sales by 20171. A vast number of mainstream mobile handsets are already using 8-megapixel cameras for their rear-facing cameras. Looking forward, industry observers expect a strong trend toward an ever-increasing number of mobile handsets with their former 1/4-inch 5-megapixel cameras upgraded to 1/4-inch 8-megapixel cameras2," said Arun Jayaseelan, product marketing manager at OmniVision. "The capabilities and compactness of the OV8856 address the increasing consumer demand for higher resolution and more advanced features in mobile front- and rear-facing cameras."

The OV8856 captures full-resolution 8MP images and video at 30fps, and 1080p video at 60fps. The sensor also supports interlaced HDR (iHDR) for HDR video. The OV8856 is said to be one of the smallest 8MP sensors in the market today, and is approximately 15 percent smaller than OmniVision's previous generation OV8858 image sensor. It can fit into a 6.5 mm x 6.5 mm fixed focus module with a z-height of approximately 4 mm.

OmniVision also announces the OV8855, a variation of the OV8856 with PDAF. Both sensors are currently available for sampling, and are expected to enter volume production in the fourth quarter of 2015.

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While Canon is first to unveil its plans to commercialize the first affordable 8K Cinema camera, NHK is already talking about 8K HDR system at IBC 2015 being held these days in Amsterdam, the Netherlands.

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SPIE publishes a video of SPIE Optics + Photonics 2015 conference plenary talk "Extreme Imaging and Beyond" by Keisuke Goda of the University of Tokyo:

Thanks to AS for the SPIE video link!

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SPI Infrared Corp. presents The X26 Hyper Fidelity Intensified Sensor (HFIS) camera. It's said to be "a state of the art, cutting edge digital HD High Definition Camera that utilizes Advanced BsTFA (Broad spectrum Thin Film Array). The X26 Low Light Imaging Camera works in day or night. Its stellar night time capabilities are where the X26 really performs. The ultra sensitive chip outperforms currently fielded and widely used military issue Image Intensified night vision systems which are analog, The X26 is fully digital and images to 1100 nanometers, at this range the X26 low light night vision CMOS is able to see battlefield 1064NM lasers and all IR sources up to 1100 NM. The X26 is a tiny (1″ Cube) extremely efficient, low power consuming, no maintenance true digital image intensified night vision sensor which offers incredible High Resolution image quality never seen before in any low light level night vision or CMOS imaging technology."

"The X26 Broad Spectrum Thin Film Array is the absolute best low light digital imaging military grade night vision solution that offers exceptionally better night vision capabilities over SWIR, SCmos, CNV, EMCCD, EBAPS, E2V, Nocturn and all other current CCD/CMOS chip / intensified cameras, and low lux light sensor technologies which are also extremely expensive & power hungry."

"Unlike other low light technologies, the x26 DOES NOT slow down its frame rate to compensate for darker scenes, and retains full frame rate imaging, this is another area where the HFIS BsTFA excels dramatically over any other low light night / low lux technology available ANYWHERE."

SPI Corp's X26 brochure shows the new sensor picture with iStock watermarks for some reason:

SPI HFiS X26 sensor

The company's Youtube and Vimeo videos show the new sensor capabilities:




Thanks to YN for the link!

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European Doctorate in Image Sensors and Optical Nanotechnology (EDISON) at the University of Oxford, UK is organizing a free workshop on September 28-29. The 1st Workshop on Advancements in Circuits and Imaging program is:

• Larger and faster: CMOS Image Sensors for scientific applications at the Rutherford Appleton Laboratory, Dr. Renato Turchetta, Rutherford Appleton Labs, UK
• High Performance Detectors, Prof. Daniela Bortoletto, Oxford Physics, UK
• Silicon Retina Technology, Prof. Tobias Delbruck, ETH, Zurich, Switzerland
• CMOS image sensor technologies for high dynamic range capture, Dr. Johannes Solhusvik, Omnivision, Norway
• Efficient Feature Extraction in CMOS Vision Sensors, Prof. Ricardo Carmona Galán, Institute of Microelectronics, Seville, Spain
• Direct Interpolation ADCs and DACs, Prof. Allan Belcher, Signal Conversion,UK
• Extended Counting: a very efficient improved incremental A/D conversion technique, Prof. Pieter Rombouts, Ghent University, Belgium
• Metal oxide nanowires integrated on silicon micromachined or flexible polymeric substrates for resistive or optical gas sensing, Prof. Eduard Llobet, Universitat Rovira i Virgili, Spain
• Delta-sigma modulators, compressive sensing: Collaborative Possibilities, Dr. Jaswinder Lota, University of East London, UK
• Miniaturization trends in medical imaging enabled by full wafer level integration of micro camera modules, Martin Wäny, Awaiba, Portugal
• Challenges and Opportunities in 3D IC stacking, Dr. Vasilis Pavlidis, University of Manchester, UK
• Development of organic circuitry for low-cost smart sensor systems, Dr. Munira Raja, Liverpool University, UK

Thanks to AB for the link!

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IEEE Spectrum reports that multi-thousand-dollar laser ranging (lidar) systems that most self-driving cars rely on to sense obstacles can be hacked by a setup costing just $60, according to a security researcher.

“I can take echoes of a fake car and put them at any location I want,” says Jonathan Petit, Principal Scientist at Security Innovation, a software security company. “And I can do the same with a pedestrian or a wall.” Using such a system, attackers could trick a self-driving car into thinking something is directly ahead of it, thus forcing it to slow down. Or they could overwhelm it with so many spurious signals that the car would not move at all for fear of hitting phantom obstacles.

The lidar laser pulses were not encoded or encrypted, which allowed him to simply replay them at a later point. “The only tricky part was to be synchronized, to fire the signal back at the lidar at the right time,” Petit says. “Then the lidar thought that there was clearly an object there.”

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BusinessWire: Freescale acquires Ottawa, Canada-based CogniVue, a developer of image cognition IP for automotive and consumer applications used in Freescale ADAS processors. “The acquisition of CogniVue accelerates our autonomous vehicles portfolio with leading-edge vision processing IP,” said Bob Conrad, SVP and GM of Freescale’s Automotive MCU group. “With the exceptional market response to our S32V234 vision processor, as well as demand for our next generation vision solutions, this acquisition places Freescale in a position to supply highly automated car applications with the requisite performance, safety, security and reliability those systems require.”

CogniVue vision processing IP is already available in multiple Freescale products, including the S32V processor announced in March 2015, as well as other offerings.

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Image Sensors Americas 2015 to be held in Berkeley, CA on November 17-19, published its agenda:

Future Outlook for CIS Technology and Markets:

• Image Sensors for the Next Generation of Globally Connected Technology, Ron Tussy, President and Principal Analyst, The Imerge Group
• Image Sensor Market Overview and Major Trends, Pierre Cambou, Activity Leader - Imaging, Yole Developpement
• Title TBC, Tsutomu Haruta, Senior Manager, Sony
• Objective Image Quality Testing and Standards – Implications for New Sensor Applications, Jackson Roland, Imaging Science Engineer, Imatest

Small Form Factor Cameras – Creating New Opportunities with Ever Smaller Imagers:

• Imaging in Small Spaces, Lou Hermans, COO, CMOSIS
• The Need for Highly Efficient and Automated Assembly - Enabling Technologies, Ignazio Piacentini, Director of Business Development, FiconTEC
• Introducing Low Cost MIPI Cameras to Clamshell Form Factors, Rich Hicks, Imaging Architect, Intel
• Slim Form Factor Cameras for Mobile Applications, Speaker TBC

Advances in Image Processing for Growing Applications:

• 360° Image Quality Tuning Using Panomorph Technology, Patrice Roulet, Director of Engineering and Co-Founder of Technology, ImmerVision
• Computer Vision - Review of the Latest Developments in Industry and Academia, Ashok Veeraraghavan, Assistant Professor of Electrical and Computer Engineering, Rice University
• Deep Learning - Impacts on Sensor Design. Yair Siegel, Director of Product Marketing, Imaging & Vision, CEVA DSP

Sensor Innovations and Novel Applications:

• Monolithic Deep Depletion CMOS Imagers on High Resistivity Silicon, Stefan Lauxtermann, President and Founder, Sensor Creations
• Integrated CMOS Spectral and 3D Depth Sensors, Steve Saxe, Product Line Manager - Optical Security and Performance Products, Viavi Solutions
• Optogenetics and Computational Diffractive Sensing for Novel Brain Interfaces, David Stork, Fellow, Rambus
• Novel CMOS Technology for Superior Low Light Performance, Speaker TBC

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Canon announces that it is developing a Cinema EOS System 8K camera and a still-image 120MP DSLR camera.

The Cinema EOS System 8K camera being developed will be equipped with a Canon Super 35 mm-equivalent CMOS sensor with 8,192 x 4,320 pixel (approximately 35.39 million effective pixels) resolution, and a full resolution frame rate of 60fps with 13 stops of DR.

Another product in development is a DSLR camera featuring a resolution of approximately 120 effective megapixels, that "will incorporate a Canon-developed high-pixel-density CMOS sensor within the current EOS-series platform."

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Imaging Resource reports that a 12MP image sensor inside iSight cameras on the new iPhone 6S and 6S Plus feature two new technologies:

"The first of these is the decision to move the color filter that normally sits above the sensor directly onto top of the pixels, leaving less room for error. The second technology is the use of what Apple calls ‘Deep Trench Isolation’, which puts small dividers between the pixels to prevent light from bouncing around unnecessarily."


A Youtube video from today's Apple event shows the camera part of the presentation, starting from time 1:25:

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Yole Developpement publishes few more details from its 2015 Camera Module Industry Report. This time, Yole highlights the CCM price increase: “This trend is a real surprise. Indeed, at Yole, we follow the electronic components market for the mobile phones industry for a long time and we know the strategic importance of price in this sector”, comments Pierre Cambou, Activity Leader at Yole.

This market demand is partly answered by the penetration of Auto Focus (AF) and the Optical Image Stabilization (OIS) application reaching US$ 5.5 billion in 2020, with 21% CAGR between 2015 and 2020. Such figure highlights the strategic importance of the AF & OIS applications in the mobile phones sector and the possible implication of those technologies in future sensing applications.

“There is a different market trajectory for the lens and sensor markets, which are now maturing at approximately 14% CAGR with the emergence of giant billion-dollar companies”, explain Yole’s analysts. CCM and auto-focus manufacturing markets, which are still very fragmented and growing at roughly 20% CAGR, should experience consolidation over the next five years.

Automotive camera module revenue reached US$1.2 billion in 2014, and growing at a CAGR of 36% should reach US$7.9 billion by 2020. This growth has mainly benefited the CCM industry’s second-tier players, but the response of market leaders will be worth watching.

Few more slides from Yole's Slideshare presentation:

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Aphesa organizes an image sensor and camera technology training tour between October 2015 and November 2016. The training sessions are organized as three days per location and split over several courses, it is possible to subscribe for a single course, multiple courses or the full session.

The courses are introductory to mid-level, with some advanced topics, and are designed for engineers who are new to the field of imaging or non-engineering personnel who needs a more in-depth understanding of the technology. It is also a good refresher course for experienced engineers and a good introductory course for sales, marketing and support personnel. Each course is accompanied by a question and answer session and an open discussion session.

The course agenda:

– Monday, October 12th:

• Introduction to imaging (light, light spectrum, light sources, scene, behavior of light, basic radiometry and photometry, lighting techniques, polarization, filters, optical basics, MTF, camera basics, color issues, multispectral and hyperspectral imaging, camera interfaces, photography and imaging terms, lens standards, camera interface standards)
• Introduction to CMOS image sensors (photodiodes, pixels, arrays, readout circuits, ADC circuits, architectures, spatial and temporal noise sources and noise compensation, color filters, microlenses, dark current, defect pixels, ageing, temperature effects, image sensor design flow).

– Tuesday, October 13th:

• Introduction to software based (mutliple exposure) high dynamic range imaging, including algorithms and artifacts
• Specific CMOS image sensors for high dynamic range imaging, including control methods, pixel designs and artifacts
• Introduction to 3D imaging
• Introduction to the EMVA1288 standard
• Introduction to high speed and real time imaging

– Wednesday, October 14th:

• Introduction to image processing

The Training Tour path is:

• October 2015 – Spa, Belgium – minimum of 4 attendees per course
• Early December 2015 – Yokohama, Japan – minimum of 19 attendees per course
• Late January 2016 – San Diego, CA – minimum of 10 attendees per course
• Early February 2016 – San Francisco, CA (limited courses only as part of SPIE Photonics
• West and IS&T Electronic Imaging, separate symposium registration required)
• Early May 2016 – Boston, MA – minimum of 7 attendees per course
• July 2016 – Seoul, South Korea – minimum of 11 attendees per course
• November 2016 – Stuttgart, Germany – minimum of 8 attendees per course

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I've received TI announcement of a nice 3D ToF camera estimator tool: "TI aims to develop an ecosystem around 3D Time-of-Flight technology that enables many applications apart from the most obvious gesture recognition applications. 3D ToF systems require a lot of collateral support. Some of the obvious questions that comes to a system designer's mind are - How do I know if 3D ToF can solve my problem? What would be the power required to get 'r' mm resolution at 'D' distance at 'F' framerate? What kind of lens would be needed? How does sunlight affect the performance? Do I have sufficient dynamic range or I get saturation with objects at close distance? etc.
To answer all of these questions, TI now provides an internally developed simulation tool here - 3D ToF System Estimator Tool:"

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Business Insider quotes BI Intelligence forecasting 3 million self-driving cars on road in 2020:


The previous BI report predicted 10 million cars with elements of self-driving in 2020:

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Canon develops an APS-H-size (approx. 29.2 x 20.2 mm) CMOS sensor with approximately 250MP (19,580 x 12,600 pixels), said to be the world's highest number of pixels for a CMOS sensor smaller than the size of a 35 mm full-frame sensor. The new sensor achieves a readout speed of 1.25 Giga-pixels per second and can capture a full resolution video at a speed of 5fps. For comparison, modern mobile sensors having 20MP resolution at 30fps frame rate achieve 0.6 Giga-pixel per second speed in a mobile phone form factor.

Canon is considering the application of this technology in specialized surveillance and crime prevention tools, ultra-high-resolution measuring instruments and other industrial equipment, and the field of visual expression.

TechOn publishes a high resolution picture of the new sensor:

Canon 250MP sensor

BBC publishes fairly critical report on Canon announcement.

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The Society for Imaging Science and Technology (IS&T) and Image Engineering GmbH & Co. KG announce that the 2015 Image Engineering Innovation Award (IEIA) is given to Javier Garcia-Monreal, Alex Kipman, Alexander Shpunt, and Zeev Zalevsky for the development of Breakthrough 3-D Sensing Technologies and Products. The award recognizes the innovation in 3-D image sensing developed by PrimeSense and Microsoft and incorporated in the Microsoft Kinect sensor for the Xbox 360 game console. This breakthrough enabled users to control games by gestures and actions.

“This award recognizes four talented innovators, from four different organizations, who pioneered the image depth acquisition hardware and software used in the Microsoft Kinect sensor,” says Ken Parulski, chair of the IEIA award committee. “Their creativity and teamwork enabled Kinect to become the first successful mass-market 3D camera, and the fastest-selling new consumer electronics product ever created.”

3-D images are sensed by an Infrared CMOS image sensor, which captures images of a speckle pattern created using a low-power IR laser and a diffraction grating. The reflected pattern is captured by the IR sensor and correlated with a reference pattern, to produce a depth map of the objects in the color video image.

The Kinect sensor sold 8 million units within the first 60 days of its introduction, making it the most successful 3-D camera. It uses depth sensing technology developed by Zeev Zalevsky at Bar Ilan University, Javier Garcia-Monreal at the University of Valencia, and Alexander Shpunt and his colleagues at PrimeSense in Israel, as well as gesture and face recognition software developed by Alex Kipman and his colleagues at Microsoft.

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Bloomberg reports that Sony is "focusing on sensors that take photos at least 10 times faster than the human eye can see. The company is working with Nissan Motor Co. and a Tokyo University professor on affordable technology that can process 1,000 images a second.

<...>The high-speed sensors could help driverless cars avoid road hazards or allow industrial robots to speed up manufacturing. <...>Chips that capture 1,000 frames per second do exist, but their cost and size make them impractical for mass-market uses. For example, cameras with that kind of speed run $1,000 to $100,000 from companies including Sony and Vision Research Inc. The challenge is to shrink that power into a module small enough to fit in a car’s rear-view mirror and cheap enough for devices such as wearables. <...>the company has been able to achieve 900 frames per second with prototypes.

<...> “Until now, Sony has been very focused on designing image sensors that deliver beautiful photos,” said Shinichi Yoshimura, a Sony manager in charge of combining hardware and software for emerging technologies. “The images for sensing require a different kind of chip, and the challenge is converting technologies that make beautiful photos to new uses.”

“High-speed image sensors are a niche industry, but Sony has the power to take it mainstream,” [Masatoshi Ishikawa, University of Tokyo professor of engineering and robotics, said.] “And that may be just two years away.”

“As smartphone demand matures, at some point other Sony competitors will catch up in this technology,” said Yu Okazaki, an analyst at Nomura Securities Co. in Tokyo. “It is important to diversify applications to robots, cars, et cetera.” <...> the company expects its sales to climb as much as 62 percent to 1.5 trillion yen in three years."

SeekingAlpha quotes Sony CEO, Kaz Hirai, saying that the company "plans to invest €1.5B ($1.7B) in its image sensor ops in FY16 (ends March '16) - 5x what it invested in FY15."

A University of Tokyo spin-off Exvision, lead by Masatoshi Ishikawa, works on high speed image sensor applications:

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re/code, Fortune: AR startup Magic Leap known by a high profile Google investment at a valuation of $2 billion, managed to publish 115 patent applications in just 2 weeks from Aug. 20 to Sept 3. None of these patents relates to image sensors, but Magic Leap's product uses cameras and gesture recognition quite extensively, as shown in the company's Youtube video:

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IISS announces it is preparing a special issue of the journal SENSORS on Photon-Counting Image Sensors to be published in Spring 2016. The issue will contain all invited papers and all will be open-access. Invited authors (up to 20 due to budget) will not be charged any publication fee, open-access fee, or page charges for this special issue, which is sponsored by SENSORS and IISS. The Guest-Editor-in-Chief for the special issue is Eric Fossum (Dartmouth) with guest editors Albert Theuwissen (Delft and Harvest Imaging) and Nobu Teranishi (Univ. Hyogo and Shizuoka University). While there is already a list of potential invited speakers, there may be room for a few more and anyone wishing to be considered for an invited paper should contact Eric Fossum: fossum at imagesensors.org with a very brief proposal as soon as possible. Interest is in deep sub-electron read noise (less than 0 .5e-) devices and readout circuits, including low capacitance devices, devices with avalanche gain, multiple-sampling devices, low temperature devices, high energy photon counting devices as well as image formation algorithms and applications.

The IEEE Transactions on Electron Devices Special Issue on Solid-State Image Sensors (also coordinated by IISS, with Albert Theuwissen as Guest-Editor-in-Chief) is scheduled for publication in February 2016. Many of the 25+ IEEE TED SI papers are already available via early access on-line at IEEE Xplore, but only some are open-access.

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gestigon GmbH, a startup based in Lübeck, Germany, has announced that it closed a third financing round (Series A) in July 2015. The lead investor is nbr technology ventures GmbH, with additional investments from Vorwerk Direct Selling Ventures and High-Tech-Gründerfonds. According to CEO Moritz v. Grotthuss, the amount raised in this round was “several million” USD.

The company will use the funds to accelerate growth in its business, which is focused on licensing its gesture control and skeleton tracking middleware to key corporates in the automotive (where it has assumed global market leadership), consumer electronics, and augmented/virtual reality industries. It now has plans to expand into the rapidly growing field of augmented- and virtual reality solutions, including head mounted devices.

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As ADAS becomes a bigger and more important market for image sensor, Videantis publishes a list of ADAS-related acronyms helping you to navigate in the automotive world. Few examples of this new parlance showing how broad the car camera applications are:

• ANV – Automotive Night Vision. Also known as Night View Assist.
• APS – Automatic Parking System
• BSD – Blind Spot Detection
• BSM – Blind Spot Monitoring
• BSW – Blind Spot Warning
• BOP – Back-over Protection, Back-over Prevention
• CIB – Crash Imminent Braking, Collision Imminent Braking
• CDW – Collision Detection Warning
• CAS – Collision Avoidance System
• CMS – Camera Monitor System
• CTA – Cross-Traffic Alert
• DDW – Drowsy Driver Warning
• DFW – Driver Fatigue Warning
• DDD – Driver Drowsiness Detection
• DMS – Driver Monitoring System
• EDA – Emergency Driver Assistant
• FCA – Forward Collision Avoidance
• FCW – Forward Collision Warning
• GFHB – Glare-free High Beam
• HLA – Head Lamp Assist
• ISA – Intelligent Speed Adaptation, Intelligent Speed Advice
• LCA – Lane Change Assist, Lane Centering Assist
• LD – Lane Detection
• LDW – Lane Departure Warning
• LKA – Lane Keeping Assist
• RVC – Rear view camera
• SVC – Surround View Camera
• WWDA – Wrong-Way Driving Alert
• WWDW – Wrong-Way Driving Warning

There are many more of them on Videantis site, accompanied by the nice explanations.

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