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Imec article on 3D bonding technology by Eric Beyne, imec fellow & program director 3D system integration presents solutions that are supposed to reach 100nm contact pitch:Visual Industry Guide
Image Sensors World Go to the original article...
Imec article on 3D bonding technology by Eric Beyne, imec fellow & program director 3D system integration presents solutions that are supposed to reach 100nm contact pitch:
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