Archives for December 2019

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ALA News: Isorg will demonstrate its full-screen Fingerprint-on-Display (FoD) module for improved multi-finger smartphone authentication at CES 2020. It supports up to four fingers simultaneously touching a smartphone display.

Currently available solutions are restricted to single finger identification within a surface area of less than 10mm x 10mm. In contrast, Isorg’s FoD module supports one- to four-finger authentication across the entire dimensions of the 6-inch smartphone display (or even larger). In addition, the module is very thin, less than 0.3mm thick, so integration into smartphones is made easy for OEMs.

“Isorg is excited to demonstrate what could be the future in multi-fingerprint-on-display security to strengthen authentication on smartphones and wearable devices,” said Jean-Yves Gomez, CEO at Isorg. “Our Fingerprint-on-Display module provides OEMs with a complete solution. In addition to the image sensor, it includes other hardware: optimized thin film optical filters developed in-house and driving electronics, as well as software from our industrial partners covering the interface with smartphone OS and the matching algorithm. Isorg has achieved a significant milestone in designing a scalable FoD solution that provides excellent performance results, it is compatible with foldable displays and easier to implement than existing technologies.”

Smartphone OEMs will be able to sample Isorg’s Fingerprint-on-Display module on spring 2020.

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China Money Network: "As reported previously, the current CIS is mainly divided into mobile phones and security. Among them, mobile phones are basically manufactured using a 12-inch 55nm process, and security chips are manufactured using a 0.11um eight-inch process. In terms of domestic wafer foundries, SMIC, Huahong Grace and XMC are among the big players. Recently, the newly established 12-inch factory, Guangzhou-based Cansemi Technology, has also won the favor of large local customers in CIS, and the company is introducing related product production.

According to a reporter from the Semiinsight who learned from friends in the relevant supply chain, with the tight production capacity of these fabs, the wafer delivery date of related CIS chips has been extended to four months, and the time required for packaging increases two to three weeks.

In addition, the popularity of under-screen optical fingerprint solutions using the same process as CIS has exacerbated this phenomenon. "Because the Die Size of the under-screen optical sensor is relatively large, the number of Dies that are originally cut per wafer is limited. The increasing demand makes the supply of CIS more stretched". "To today’s CIS manufacturer, who has the factory capacity, who is the boss," a supply chain insider said to Semiinsight reporter in an interview."

Espros announces ToF Developers Conference to be held in San Francisco on January 28–30, 2020:

"Over the past four conferences, we have trained more than 130 engineers to successfully design TOF camera systems. Due to the high demand, we have decided to continue our TOF Developer Conference.

There is, at least to our knowledge, no engineering school which addresses TOF and LiDAR as an own discipline. We at ESPROS decided to fill the gap with a training program called TOF Developer Conference. The objective is to provide a solid theoretical background, a guideline to working implementations based on examples and practical work with TOF systems. Thus, the TOF Developer Conference shall become the enabler for electronics engineers (BS and MS in EE engineering) to design working TOF systems. It is ideally for engineers who are or will be, involved in the design of TOF system. We hope that our initiative helps to close the gap between the desire of TOF sensors to massively deployed TOF applications."


PRNewswire: Artilux unveils world's first GeSi wide spectrum ToF sensor at CES 2020. The demo, being shown live for the first time, will include a RGB-D camera for logistics applications and robot vision, and a 3D camera system that can operate at a longer wavelength. The sensor is projected to enter mass production in Q1 2020 and targets applications such as mobile devices, automotive LiDAR, and machine vision.

In contrast to existing 3D sensors, which typically operate at 850nm or 940nm, the GeSi sensor can cover the range from 850nm to 1550nm. By utilizing this capability, the new Explore Series sensor substantially reduces the potential risk of eye damage. According to the most recent findings, the power of the laser can safely be at least 10 times greater at 1200-1400nm than at 940nm, which improves performance without compromising on safety for long range and highly accurate 3D imaging; it also means that the safe minimum distance of the laser from the eye can be further reduced to sub-centimeter, following the international standards IEC 60825-1:2007 and IEC 60825-1:2014.

The use of longer NIR wavelengths also minimizes interference from sunlight and enables better performance in outdoor environments. All the breakthroughs are brought about by a new GeSi technology platform developed by Artilux in cooperation with TSMC, enabling it to be the first CMOS-based ToF solution to work with light wavelengths up to 1.55µm. A paper that addresses the sensor design based on a GeSi platform has recently been accepted by ISSCC 2020. Artilux has also updated its last year Arxiv.org paper with more recent data.

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TSMC, French Atomique Energie Commission, and Institut supérieur de l’aéronautique et de l’espace, Toulouse, publish a joint MDPI paper "Random Telegraph Noises from the Source Follower, the Photodiode Dark Current, and the Gate-Induced Sense Node Leakage in CMOS Image Sensors" by Calvin Yi-Ping Chao, Shang-Fu Yeh, Meng-Hsu Wu, Kuo-Yu Chou, Honyih Tu, Chih-Lin Lee, Chin Yin, Philippe Paillet, and Vincent Goiffon. The paper is a part of MDPI Special issue on the 2019 International Image Sensor Workshop (IISW2019).

"In this paper we present a systematic approach to sort out different types of random telegraph noises (RTN) in CMOS image sensors (CIS) by examining their dependencies on the transfer gate off-voltage, the reset gate off-voltage, the photodiode integration time, and the sense node charge retention time. Besides the well-known source follower RTN, we have identified the RTN caused by varying photodiode dark current, transfer-gate and reset-gate induced sense node leakage. These four types of RTN and the dark signal shot noises dominate the noise distribution tails of CIS and non-CIS chips under test, either with or without X-ray irradiation. The effect of correlated multiple sampling (CMS) on noise reduction is studied and a theoretical model is developed to account for the measurement results."


"Continued improvement of RTN is essential for enhancing CIS performance when the pixel scales down to 0.7 um pitch and beyond. Understanding the RTN behavior and classification of the RTN pixels into different types are the necessary first step in order to reduce RTN through pixel design and minimizing process-induced damage (PID). In this paper, we identified the SF-RTN, the DC-RTN, the TG GIDL-RTN, and the RST GIDL-RTN in active pixels according to their dependence on the PD integration time, the SN charge retention time, the ??? across the TG device, and the ??? across the RST device, in CIS and non-CIS chips, with and without X-ray irradiation.

We further studied the effect of CMS as a useful technique for RTN reduction through circuit design. A theoretical model was presented to account for the time-dependence of the effectiveness of CMS, which explained the measured data reasonably well. The process nodes used to manufacture the pixel-array and the ASIC layers in stacked CIS are expected to move down the path of the Moore’s Law gradually. Extending the study of RTN to highK metal gate and FinFET technologies is an important goal for our future investigation."

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SMPTE publishes NHK presentation "8K Camera Recorder using Organic-photoconductive CMOS Image Sensor & High-quality Codec" by Shingo Sato:

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Digitimes reports that TSMC received CIS orders from Sony "and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan." TSMC has placed equipment orders for additional 40nm process capacity at the fab to fulfill CIS Sony's orders. The new equipment is to be installed in Q2 2020 with pilot runs slated for August next year.

Taiwan TechNews adds: "in the case of Sony's current insufficient production capacity, Sony released the first order to TSMC for OEM production, which not only added orders for 5G related products to TSMC, but also boosted revenue momentum for its high-end image sensor supply chain.

...although Sony and TSMC had a cooperative relationship in the past, it was limited to the manufacturing of logic products and did not place an order for TSMC on high-end image sensors. This time, due to insufficient production capacity, the first release of orders also made TSMC actively prepare. This batch of orders is also expected to be built in the TSMC 14a factory with a 40-nanometer process. It is expected that after the expansion of TSMC's production line, mass production will occur in 2021, reaching a scale of 20,000 pieces per month. In the future, it will not even rule out that it will reach 28. Cooperate with processes below nanometer. In this regard, TSMC did not comment and explain."

SeekingAlpha publishes Third Point response on Sony refusal to spin-off its CIS business:

"Most investors expected that following a lengthy review, Sony would share some meaningful plans to close the yawning gap between its share price and intrinsic value.... While we did not expect that all our requests, such as the separation of the image sensor business, would be addressed immediately, we did expect that the Company would make some recommendations to address the structural impediments to long‐term value creation for Sony's shareholders.

Instead, Sony revealed that the review's conclusion was to maintain the status quo with no concrete proposals to improve the business. As students and practitioners of Japanese business principles like kaizen, it is difficult for us to imagine that a company of Sony's size and complexity could not find a single concrete action to improve its business and valuation.

We are committed to a continued constructive dialogue with the Company and to creating long‐term value at Sony for all stakeholders. Discussions are ongoing, guided by our view that Sony remains one of the most undervalued large capitalization stocks in the world."


Sony publishes an interview "Will Sony's automotive CMOS image sensor be a key to autonomous driving?" with its automotive image sensor designers Yuichi Motohashi, Satoko Iida, and Naoya Sato. Few interesting quotes:

"...automotive cameras are difficult to compare and evaluate. Although the performance is good, there is no method established to evaluate them and we can't emphasize our advantages. So, we always consider how we can create a yardstick to prove our superiority.

The image sensor development cycle is two to three years, but it takes longer than other applications for those image sensors to be actually integrated into cars in the market. In fact, the negotiations we're having right now are for cars that will hit the market in five years.

While we emphasize the "low illumination characteristics," the core competence Sony has cultivated over many years, we have developed Sony's original pixel architecture based on the "dynamic range expansion technology with single exposure," which is strongly demanded for automotive image sensors. I think this technology is unbeatable.

...process technologies have become commoditized today, and it has become difficult to differentiate them. It is necessary to make differentiation through pixel architecture and show superior characteristics."

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Digitimes reports that TSMC received CIS orders from Sony "and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan." TSMC has placed equipment orders for additional 40nm process capacity at the fab to fulfill CIS Sony's orders. The new equipment is to be installed in Q2 2020 with pilot runs slated for August next year.

Taiwan TechNews adds: "in the case of Sony's current insufficient production capacity, Sony released the first order to TSMC for OEM production, which not only added orders for 5G related products to TSMC, but also boosted revenue momentum for its high-end image sensor supply chain.

...although Sony and TSMC had a cooperative relationship in the past, it was limited to the manufacturing of logic products and did not place an order for TSMC on high-end image sensors. This time, due to insufficient production capacity, the first release of orders also made TSMC actively prepare. This batch of orders is also expected to be built in the TSMC 14a factory with a 40-nanometer process. It is expected that after the expansion of TSMC's production line, mass production will occur in 2021, reaching a scale of 20,000 pieces per month. In the future, it will not even rule out that it will reach 28. Cooperate with processes below nanometer. In this regard, TSMC did not comment and explain."

SeekingAlpha publishes Third Point response on Sony refusal to spin-off its CIS business:

"Most investors expected that following a lengthy review, Sony would share some meaningful plans to close the yawning gap between its share price and intrinsic value.... While we did not expect that all our requests, such as the separation of the image sensor business, would be addressed immediately, we did expect that the Company would make some recommendations to address the structural impediments to long‐term value creation for Sony's shareholders.

Instead, Sony revealed that the review's conclusion was to maintain the status quo with no concrete proposals to improve the business. As students and practitioners of Japanese business principles like kaizen, it is difficult for us to imagine that a company of Sony's size and complexity could not find a single concrete action to improve its business and valuation.

We are committed to a continued constructive dialogue with the Company and to creating long‐term value at Sony for all stakeholders. Discussions are ongoing, guided by our view that Sony remains one of the most undervalued large capitalization stocks in the world."


Sony publishes an interview "Will Sony's automotive CMOS image sensor be a key to autonomous driving?" with its automotive image sensor designers Yuichi Motohashi, Satoko Iida, and Naoya Sato. Few interesting quotes:

"...automotive cameras are difficult to compare and evaluate. Although the performance is good, there is no method established to evaluate them and we can't emphasize our advantages. So, we always consider how we can create a yardstick to prove our superiority.

The image sensor development cycle is two to three years, but it takes longer than other applications for those image sensors to be actually integrated into cars in the market. In fact, the negotiations we're having right now are for cars that will hit the market in five years.

While we emphasize the "low illumination characteristics," the core competence Sony has cultivated over many years, we have developed Sony's original pixel architecture based on the "dynamic range expansion technology with single exposure," which is strongly demanded for automotive image sensors. I think this technology is unbeatable.

...process technologies have become commoditized today, and it has become difficult to differentiate them. It is necessary to make differentiation through pixel architecture and show superior characteristics."

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SonyAlphaRumors: Sony presents 2x2 On-Chip Lens (OCL) technology for high-speed focus, high-resolution, high-sensitivity, and HDR:


"In conventional technologies, the variance in sensitivity per pixel caused by the structure (described below), which places an on-chip lens that spans four pixels, was a major issue. However, we have successfully developed a high-performance image sensor with high image quality through optimization of the device structure and the development of a new signal processing technology."

The main features of the Sony lens structure:

• Phase differences can be detected across all pixels
• Improved phase difference detection performance (focus performance)
• Focus performance at low light intensity
• Focus performance that does not depend on the object shape or pattern
• Real-time HDR output

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As mentioned in comments, Zurich-based event-based sensor startup Insightness is a part of Sony Semiconductor Solutions Group now:


Few slides about Insightness:

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CnTechPost noticed Xiaomi patent application US20190369422 "Display Structure and Electronic Equipment" by Zhihui Zeng, Anyu Liu, Lei Tang, Zhongsheng Jiang, Shaoxing Hu, and Chengfang Sun.

"...there is provided a display structure, which includes: a light adjusting component, where an operating state of the light adjusting component includes a light transmitting state and a polarization state, and the light adjusting component includes a first region and a second region which are independently controllable; and a display screen including a plurality of independently controllable pixels. The light adjusting component is located at a light emitting side of the display screen, and when the first region is in the light transmitting state, the pixels that are in the display screen and correspond to the first region are disabled to allow light emitted from the first region to penetrate through the display screen."

On the figures below,

• the reference numeral 1 indicates a display structure;
• the reference numeral 11 indicates a display screen;
• the reference numeral 12 indicates a light adjusting component;
• the reference numeral 2 indicates a lens.

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Yole Development report "Disposable image sensors: a revolution for microscopy and next-generation sequencing" states the image sensor market for microscopy & NGS will show an impressive growth: +18% CAGR between 2018-2024 (in volume).

“Microscopy & NGS markets are undergoing enormous technological changes”, announces Marjorie Villien, Technology & Market Analyst at Yole Développement (Yole).“These innovations are opening the way for new business opportunities, especially within the camera image sensors industry.”

Indeed, one of the most remarkable changes is the introduction of disposable image sensors within the cameras for microscopy & NGS. Cameras are key elements in the microscopy and NGS space.

“The main trend in optical microscopy is to attain higher resolution, as well as faster acquisition and higher sensitivity for quicker and better diagnostics, and real time imaging of living organisms,” explains Marjorie Villien from Yole. “CCD is the main image sensor technology used today, but CMOS is gaining market share due to an increasing need for high-speed image acquisition.”

However, this trend towards better imaging is counterbalanced by another trend – one that leans towards portability and use of microscopy at the point of care. These systems are sleeker and cheaper, and deliver microscopy results directly to the caregiver.

This is also the case for NGS. Two very different trends are discernable, one towards higher throughput with very expensive, bulky equipment; and another that is lower throughput, with cheaper equipment offering lower footprint and wide availability
.
Illumina, the optical NGS market leader with more than 80% market share is a good example. The company has a diverse product portfolio of mid- to high-end systems, but recently launched a more affordable, lower-throughput system – the iSeq100. This follows the trend towards commoditization of NGS. The iSeq100 does not integrate optical systems in the instrument anymore, but uses a disposable image sensor directly inside the flow cell, which is a game-changer in the NGS market. Indeed, this makes the instrument much more affordable, enabling Illumina to place more systems and therefore sell more consumables, which they can make cheaper because of increased volumes.
This trend is also seen with BGI, Illumina’s Chinese competitor, which recently announced a benchtop, optics-free NGS instrument running CMOS chips.

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PRNewswire: OmniVision announced the first two members of its new automotive sensor platform—the 8MP, front-view OX08A and OX08B. The high-resolution OX08A features HDR, while the pinout-compatible OX08B adds a LED flicker mitigation (LFM), enabled by the sensor’s on-chip HALE (HDR and LFM engine) combination algorithm. The new platform also integrates ASIL-C features.

“These new image sensors utilize OmniVision’s dual conversion gain (DCG) technology to achieve 82dB dynamic range on the first exposure, whereas competitors’ image sensors only provide a dynamic range of 60dB or less. Unlike DCG, the competing method, known as staggered HDR, relies on additional passes that introduce motion artifacts and diminish range, especially in low light,” said Celine Baron, staff automotive product marketing manager at OmniVision. “Additionally, OmniVision’s 3D stacking technology allowed us to integrate our unique HALE algorithm into the OX08B. The result is that this sensor platform provides an industry-leading 140dB HDR, along with the best LFM performance and high 8MP resolution for superior front-view captures, regardless of external lighting conditions.”

The new 1/1.8” optical format sensors have a 2.1um pixel with its 4-cell LFM technology in PureCel Plus-S stacked architecture. The OX08A and OX08B image sensors are both planned to be AEC-Q100 Grade 2 certified.

“Yole Développement’s recent technology and market research ‘Imaging for Automotive 2019’ confirms the accelerated market pull for viewing and ADAS applications at a 13.7% CAGR between 2018 and 2024,” asserted Pierre Cambou, principal analyst at Yole. “OmniVision’s new automotive CIS platform includes key features such as HDR and LFM, and is enabled by a stacked semiconductor approach. Introducing such exciting technology to its automotive lineup allows for on-chip integration that reduces BOM costs while providing a high level of performance and features in a very compact package, indeed much in sync with current market expectations.”

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IFNews quotes Sigmaintell forecast saying that mobile CIS market starts to shrink after the peaking in 2021:


"With the continuous innovation and upgrading of technology and the promotion of 5G networks, multi-camera 2020 will increase the function of video shooting. It is expected that starting from the second half of 2020, the multi-camera + ToF ranging technology will slowly start to enhance the effect of background blur. In addition, post-shooting ToF combined with AI algorithms has the opportunity to improve the accuracy of indoor navigation, which is also a key focus of technological development. Therefore , Sigmaintell believes that the mainstream rear camera in the future will develop in the direction of main camera wide angle + video shooting + large telephoto + ToF.

The upgrade of 48M and above pixels accelerated, with a market share of about 9% in the third quarter. Among them, Sony accounts for approximately 41%, Samsung accounts for approximately 56%, and OV accounts for approximately 3%. Due to the accelerated replacement of 48M and the insufficient production capacity of high-resolution camera sensor wafers, Sigmaintell expects supply shortages from Q4 to Q1 2019.

According to Sigmaintell data , global shipments of 48M camera sensors will exceed 450 million units in 2020."

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IFNews quotes Mynavi review of Sony invited presentation at 2019 AEC/APC Symposium Asia on "The manufacturing and future of Sony CMOS Image Sensor."

"Sony aims to become a smart factory and is working on the following seven projects.

1. Intelligent manufacturing equipment (utilization of edge computing) = Monitors the sensor output of all manufacturing equipment, automatically detects small fluctuations by machine learning, and performs feedback forward.
2. Value chain (market submission survey, demand forecast, customer information collection) factory production management based on information)
3. Intelligent MES (Manufacturing Execution System)
4. Innovative energy system
5. Integrated IT system
6. Smart purchasing activities for parts and materials
7. Smart engineering system (use of big data)

...a number of low-priced surveillance cameras are installed in the manufacturing process, and in combination with AI, efforts are being made to monitor process abnormalities in real time."


The same Symposium also published 2015 Sony paper on Vth variations.

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Tech2 publishes photos from Qualcomm Summit held on Dec. 3-5, 2019 in Maui, Hawaii. Few interesting pictures, more are in Judd Heape, Qualcomm camera products manager, presentation:

Snapdragon 865 ISP development took 3 years:


Not sure what kind of lower than 1mW power image processing it can perform:


Now, Spectra ISP supports quad CFA processing at the hardware level. No need to convert it to the Bayer pattern:


Few other slides:


Qualcomm also announces Snapdragon XR2 AR/VR Platform supporting 7 cameras on a headset:

"With XR, for the first time a user can be virtually teleported to a new environment. To do this accurately and efficiently, the Snapdragon XR2 introduces support for seven (7) concurrent cameras and a custom computer vision processor. Multiple concurrent cameras enable real-time and highly accurate tracking of the head, lips and eyes together with 26-point skeletal hand tracking. Computer vision provides highly efficient scene understanding and 3D reconstruction. Together, these features allow users to be transported to new environments where they can intuitively interact within a digital world."


Even 7c and 8c compute platforms have quite impressive camera specs:


Qualcomm's competitor Mediatek announced its 5G platform Dimensity. The platform utilizes big-little processing approach featuring "the world’s first 5 core ISP in a unique 3 big plus 2 small design. It offers the best performance to power efficiency index by matching the right size sensor to the most appropriate ISP."

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US Army Combat Capabilities Development Command's Army Research Laboratory and Polaris Sensor Technologies propose to use polarization sensitive thermal camera to find targets camouflaged in natural clutter.

A camera displays the targets (in green) using conventional LWIR thermal imagery (left), raw polarimetric imagery (center), and the combined thermal and polarimetric imagery (right):

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Brookman publishes a demo video captured by its High Sensitivity BT200C CMOS sensor evaluation board.

• Sensor : BT200C
• Optical format : 2/3 Type
• Pixel size : 5um x 5um
• Active pixel area : 1920x1080
• ADC resolution : 19-bit ADC (BT FI-Cyclic type)

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Paxnet publishes Samsung business overview with interesting data on the company's image sensor operation (DDI stands for Display Driver IC, AP - Application Processor):

• Samsung's Non-Memory Division revenue breakdown by product: Foundry 41%, CIS 19%, DDI 15%, AP 23%
• Cumulative growth since 2010: Foundry + 1,053%, CIS +457%, DDI 60%, AP +229%
• Samsung's Non-memory Growth Engine: Foundry and CIS.
  Cumulative growth forecast for 2018-2021: Foundry +63%, CIS +87%, DDI -3%, AP +14%
• CIS Division Sales KRW 453.2 billion in 2010 → KRW 2.5 trillion in 2018 → 4.1 trillion KRW in 2021
• Samsung CIS Capacity starts to approach Sony
• Samsung is currently producing low and mid-priced CIS on its 8-inch line
• In addition to the existing 12-inch plant, the company is expanding its market share by expanding the S4, a CIS-only plant.
• Manufacturing process technology is similar to DRAM, so CIS expansion will continue using aging DRAM equipment
• Expected to deploy CIS conversion of Line 11 in 2018 and Line 13 in 2020
• SK Hynix is too expected to expand 12-inch CIS lines in its domestic plants

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Qualcomm announces Snapdragon 865 mobile platform with upgraded camera features:

"Gigapixel Speed ISP: The Snapdragon 865’s ISP operates at staggering speeds of up to 2 gigapixels per second and provides brand-new camera features and capabilities. You can capture in 4K HDR with over a billion shades of color, capture 8K video, or snap massive 200-megapixel photos [Old Snapdragon 845 announced in 2017, as well as the newer 855 and 855+ platforms already supported 192MP]. You can also take advantage of the gigapixel speeds to slow things down and capture every millisecond of detail with unlimited high-definition slow-motion video capture at 960 fps. And now, for the first time ever on a mobile platform, Dolby Vision for video capture creates brilliant HDR footage that’s primed and ready for the big screen. In tandem with the 5th generation Qualcomm AI Engine, the gigapixel speed ISP can quickly and intelligently identify different backgrounds, people, and objects, so they can be treated individually for a truly customized photo."




Qualcomm also announces a mid-range Snapdragon 765 platform with somewhat weaker but still impressive camera support:

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PMD and Infineon are going to unveil their 5um ToF pixel sensor at CES 2020:

"Our new VGA 3D imager IRS2877C is the highest resolution, most flexible and robust depth sensor we have ever developed. With our new 5µm pmd pixel core, we offer VGA resolution to give your applications more detailed 3D data – e.g. for secure FaceID, AR applications, or enhanced photography. We also have incorporated additional on-chip functionalities to enable smaller and cheaper 3D modules."


Thanks to RW for the link!

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ON Semi reports that it has won the Innovative Product of the Year award in the sensor category of the World Electronics Achievement Awards (WEAA) 2019 for its recently announced ARX3A0 CMOS sensor.

The 0.3MP sensor features:

• 1/10th-inch Optical Format
• Super-Low Power Mode and Motion Detection Function with Smart Wake
• High Frame Rate of 360fps
• Ultra-Fast Electronic Rolling Shutter
• Small Die Size 3.35 mm x 3.40 mm
• 560 (H) x 560 (V) [1:1] VGA resolution in a square format
• 2.2 µm BSI non-stacked pixel
• Monochrome with NIR+ implementation
• Low Power consumption:
  less than 19 mW at 30fps
  less than 82 mW at 120fps
  less than 140 mW at 360fps
  less than 3.2 mW standby
• Smart wake motion detection function

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