Archives for March 2020

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Autosens: "After extensive consultation with our key stakeholders, it is clear it would be impossible to run a successful face-to-face conference in Detroit this May. As such, we have decided to postpone the AutoSens in Detroit conference & exhibition until 17-19 November 2020. We’ve had overwhelming support from the community for this change. You will notice the new dates are indeed the original dates for our launch of AutoSens in Hong Kong – we will be moving the Hong Kong event into 2021 and will send out further information on this change as we have it.

On current estimates, travel restrictions will not impact the event on these new dates, and we plan to run AutoSens in Detroit in full, as originally planned.

It is important to make clear that AutoSens in Brussels, on 15-17 September, will go ahead as planned, I’m sure we’ll all be glad to be getting back to normal by then."

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Multiple news sties quote Korean message board Clien post saying (Bing Translation):

"Xiaomi, Oppo, Vivo large sensor adoption

From Taiwan.

Currently, all three companies on samsung have already requested samples since December of last year, and it appears that the contract has recently been completed.

The 200 million-pixel-class sensor yield sought by our partners cannot be delivered at the desired time.

Switch order to 150 million retroactive sensors

The 1-inch Nonacell sensor is larger than the current 108MP-class sensor, and the 1-inch-large sensor is said to have a similar rear design for three manufacturers, Xiaomi and Oppo Vivo.

However, this model is barely yielding, so it seems that all companies will be limited to flagship pro models.

Xiaomi is developing with the goal of adopting it in the fourth quarter of this year, and Oppo and Vivo are said to be developing a combination of snapdragon 875 in the first quarter of next year."

Yanta Securities report compares Samsung and Sony market shares in terms of units and revenues (Bing Translation):

"Samsung Electronics' CIS sales are estimated to have grown from 1.8 trillion won in 2014 to 3.3 trillion won in 2019.

#1 Global Sony and CIS Quantity Standards: The share difference is only 2%, while the share difference by sales is 27%. So, Samsung will have to increase its revenue share with a high-end sensor strategy."

On the charts below, blue bar is Samsung, grey is Sony. The left chart depicts units market shares, while the right one is revenue shares:

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Ams publishes a video of its imaging technologies at CES 2020:



Valeo shows a demo of in-cabin monitoring camera capabilities:

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MDPI paper "Event Density Based Denoising Method for Dynamic Vision Sensor" by Yang Feng, Hengyi Lv, Hailong Liu, Yisa Zhang, Yuyao Xiao, and Chengshan Han from Chinese Academy of Sciences discusses noise problems in event-based image sensors:

"Dynamic vision sensors are very different from traditional image sensors in terms of pixel principle and output data. Background activity (BA) in the data will affect image quality, but there is currently no unified indicator to evaluate the image quality of event streams. This paper proposes a method to eliminate background activity, and proposes a method and performance index for evaluating filter performance: noise in real (NIR) and real in noise (RIN). The lower the value, the better the filter. This evaluation method does not require fixed pattern generation equipment, and can also evaluate filter performance using natural images. Through comparative experiments of the three filters, the comprehensive performance of the method in this paper is optimal. This method reduces the bandwidth required for DVS data transmission, reduces the computational cost of target extraction, and provides the possibility for the application of DVS in more fields."

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Singapore Nanyang Technological University publishes 2019 PhD Thesis "On-Chip Spectrometer: Design, Fabrication, and Experiment" by Date Zheng Shaonan:

"This doctorate thesis focuses on the design, fabrication and experimental characterization of novel on-chip spectrometers based on the photonic integrated circuits platform. Specifically, two different types of on-chip spectrometer have been demonstrated. Fabrication processes based on nano-silicon-photonic fabrication (NSP) technology are developed. The first part reports a pre-dispersed spectrometer with both high resolution (0.1 nm) and large spectral range (27 nm) using thermally tunable microring resonator (MRR) array. The second part of the thesis focuses on a microring resonator-assisted Fourier-transform (RAFT) spectrometer, achieving high resolution (0.47 nm) and large bandwidth (90 nm). The models of MRR and MZI thermal modulation exploiting thermo-optic (TO) effect are built and theoretically analysed. The third part of the thesis focuses on the development of core technology of the NSP fabrication processes, including waveguide structures, titanium nitride (TiN) heaters, thermal isolation trenches, and a waveguide-coupled Ge-on-SOI photodetector (PD)."

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PCWorld reports that its Editor's Choice Garmin Dash Cam Tandem uses Brillincs BRV0500 HDR sensor. This appears to be the first high-profile design win for the startup company:

"I’ve never seen the captures of a Brillnics BRV0500 sensor before. They differ from the Sony sensors we most often see, and are somewhat closer to the Omnivision sensors we sometimes come upon, in that they capture detail with decent color and little headlight flare. Pumping up the brightness in post-production will reveal even more detail. Note that this was with my headlights on, though I was parked."

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Twitter Engineering channel posts a nice demo of rolling shutter and aliasing artifacts:

An example of how a cameras capture rate changes due to the amount of light being let into the camera: pic.twitter.com/njppV40UX1

— Engineering (@engineeringvids) March 15, 2020

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Entropix publishes a video of how the its CVP improves computer vision and extreme resolution video applications:

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Velodyne publishes a video by Mircea Gradu, its SVP Product & Quality, explaining its proposed Diamond Rating System:

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TrinamiX announces consumer NIR spectrometer:

"trinamiX has developed proprietary and patented infrared detectors which can see light in a wavelength range of up to 3 μm – a highly relevant region in the infrared spectrum. trinamiX IR sensors are very small and have a high detectivity and as such enable the creation of a powerful, miniaturized NIR spectrometer: a ‘lab in the pocket’.

trinamiX is bringing this mobile spectroscopy solution to the market, making advanced technology accessible to people outside a laboratory. With our technology, a sample is no longer sent to the laboratory, but the laboratory instead comes to the sample."

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Image Sensors Europe 2020 conference has been held in London, UK, this week. Amid the worldwide coronavirus pandemy, many, possibly most, speakers have presented remotely (thanks to Ronald Mueller and Vision Markets for the pictures!):


Image Sensor Europe 2020 Award winners have been announced:

• Best Academic Research Team: FBK IRIS, Italy
• Best Up-and-Coming Company: Gigajot Technology, USA
• Biggest Breakthrough Technology: Artilux, Taiwan
• Most Innovative Team of the Year: STMicro, France
• CEO of the year: Avi Bakal, Trieye, Israel

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Samsung Strategy & Innovation Center publishes a number of invited presentations, some of them about imaging technologies:

Tom Wik from US SICK product management team in the LIDAR, Vision, Measurement and Identification product lines, presents "Innovations in 3D Vision–Adding Depth to Vision Inspection"



Arka Majumdar, Assistant Professor, Electrical and Computer Engineering and Physics at the University of Washington, Seattle, presents "Nanophotonic Computational Image Sensor"

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SeekingAlpha: Hyundai Motor Securities publish a research and forecast on Korean smartphone component manufacturers:

The ongoing multi-camera trend will see the birth of even penta-camera phones in 2020 with up to five cameras on the back. By brand, we expect the maximum number of cameras to be installed on the back of a smartphone to be five for Samsung (the Galaxy S20), four for Apple, five for Huawei, and five for Xiaomi. For the models with these cameras, the number of camera modules will have increased by one vs. their predecessors debuted in 2019, meaning that 2020 will be characterized by the year for triple- or quadruple-cameras.

According to industry data, the percentage of smartphones with three or more cameras in total global shipments was 15% in 2019 but the number looks likely to grow to 50% by 2021. In the case of Samsung, we estimate the proportion of multi-camera modules will increase from 55% (or 870mn units) in 2019 to 69% (or 180mn units) in 2020.

We expect Korean and Chinese smartphone names to move to increase the use of penta-cameras in their smartphones in 2020.


The market for 3D sensing cameras is expected to continue growing. According to Trendforce, the 3D sensing camera market is forecast to expand to USD5.96bn with 20% of smartphones adopting 3D sensing cameras. Indeed, smartphone markers' use of ToF is steadily rising. Samsung first introduced ToF in 2019 through the Galaxy S10 5G model, and Apple is expected to start adopting ToF cameras with its new 2020 models.

The greater numbers of cameras per device mean the wider use of cameras. Currently, multi-cameras in smartphones not only include a viewing camera for taking pictures or videos but also a 3D sensing camera for space recognition. 3D sensing technology in smartphones has gained attention since Apple introduced Face ID through the iPhone X after forfeiting the home button and fingerprint recognition. Now, most smartphone brands have begun to adopt 3D sensing cameras.

ToF is a 3D sensing camera that calculates the time of flight from the laser from a projector to the receiver. The previous structured light (SL) method is a system that receives and analyzes the surface curvature of objects using infrared rays. Requiring a processor for analysis, the method's weakness is long distance and variable factors that might happen externally. Now, ToF calculates the time of return, hence there is no need for a separate processor. It also consumes less power, responds more rapidly, and recognizes longer distances using a laser vs. the previous SL method.

As the use of ToF increases, ToF suppliers should continue to benefit in 2020. In particular, LG Innotek is slated to enjoy larger sales and profits as it supplies Apple's ToF cameras. In 2020, we believe even mid- and low-end models will start to adopt ToF cameras, as the prices are expected to decline vs. 2019 with more suppliers beginning to supply ToF cameras.


According to an industry source, the image sensor market is forecast to grow 69.8% by 2024 to form a USD20.9bn market. The autofocus (AF) function became the norm in smartphone cameras, and the advancement in actuators such as optical image stabilization (OIS) or folded zoom has also helped boost camera module ASP.

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ST demos a short-range LiDAR design based on its VL53L1X ToF sensors:

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Phys.org reports that OSA paper "Extreme-depth-of-focus imaging with a flat lens" by Sourangsu Banerji, Monjurul Meem, Apratim Majumder, Berardi Sensale-Rodriguez, and Rajesh Menon from University of Utah, Salt Lake City, proposes a flat lens with extended depth of focus:

"The new lens eliminates the need for focusing and allows any camera to keep all the objects in focus simultaneously," said research team leader Rajesh Menon. "Conventional cameras also use multiple lenses to keep different colors of light in focus simultaneously. Since our design is very general, we can also use it to create a single flat lens that focuses all colors of light, drastically simplifying cameras even further."

"Our flat lenses can drastically reduce the weight, complexity and cost of cameras and other imaging systems, while increasing their functionality," said Menon. "Such optics could enable thinner smartphone cameras, improved and smaller cameras for biomedical imaging such as endoscopy, and more compact cameras for automobiles."

"A lens performs an approximately one-to-one mapping from the object to the image plane. This mapping in the image plane is maintained within a depth of field (or referred to as depth of focus, if the object is at infinity). This necessitates refocusing of the lens when the images are separated by distances larger than the depth of field. Such refocusing mechanisms can increase the cost, complexity, and weight of imaging systems. Here we show that by judicious design of a multi-level diffractive lens (MDL) it is possible to drastically enhance the depth of focus by over 4 orders of magnitude. Using such a lens, we are able to maintain focus for objects that are separated by as large a distance as ∼6m in our experiments. Specifically, when illuminated by collimated light at ?=0.85µm, the MDL produced a beam, which remained in focus from 5 to 1200 mm. The measured full width at half-maximum of the focused beam varied from 6.6 µm (5 mm away from the MDL) to 524 µm (1200 mm away from the MDL). Since the side lobes were well suppressed and the main lobe was close to the diffraction limit, imaging with a horizontal × vertical field of view of 40∘×30∘ over the entire focal range was possible. This demonstration opens up a new direction for lens design, where by treating the phase in the focal plane as a free parameter, extreme-depth-of-focus imaging becomes possible."

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BusinessWire: Lucid Vision Labs launches Helios Flex 3D ToF module based on Sony’s DepthSense IMX556PLR BSI ToF sensor and four 850nm VCSEL laser diodes:

“Featuring Sony’s advanced depth sensing technology, the Helios Flex module allows users to leverage a high-performance 3D Time-of-Flight camera on a cost-effective, compact embedded system,” says Rod Barman, Founder and President at LUCID Vision Labs. “The module is the first-to-market with Sony’s new DepthSense Time-of-Flight sensor which enables OEMs to build their own embedded 3D system using the latest ToF technology.”

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BusinessWire: Lucid Vision Labs launches Helios Flex 3D ToF module based on Sony’s DepthSense IMX556PLR BSI ToF sensor and four 850nm VCSEL laser diodes:

“Featuring Sony’s advanced depth sensing technology, the Helios Flex module allows users to leverage a high-performance 3D Time-of-Flight camera on a cost-effective, compact embedded system,” says Rod Barman, Founder and President at LUCID Vision Labs. “The module is the first-to-market with Sony’s new DepthSense Time-of-Flight sensor which enables OEMs to build their own embedded 3D system using the latest ToF technology.”

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IOP Physics and Engineering in Medicine Journal publishes a large review paper "The silicon-photomultiplier: fundamentals and applications of a modern solid-state photon detector" by Stefan Gundacker and Arjan Heering from CERN, Geneva, Switzerland and University of Notre Dame, Indiana, USA respectively.

"The silicon-photomultiplier (SiPM) is an established device of choice for a variety of applications, e.g. in time of flight positron emission tomography (TOF-PET), lifetime fluorescence spectroscopy, distance measurements in LIDAR applications, astrophysics, quantum-cryptography and related applications as well as in high energy physics (HEP). To fully utilize the exceptional performances of the SiPM, in particular its sensitivity down to single photon detection, the dynamic range and its intrinsically fast timing properties, a qualitative description and understanding of the main SiPM parameters and properties is necessary. These analyses consider the structure and the electrical model of a single photon avalanche diode (SPAD) and the integration in an array of SPADs, i.e. the SiPM. The discussion will include the front-end readout and the comparison between analog-SiPMs, where the array of SPADs is connected in parallel, and the digital SiPM, where each SPAD is read out and digitized by its own electronic channel. For several applications a further complete phenomenological view on SiPMs is necessary, defining several SiPM intrinsic parameters, i.e. gain fluctuation, afterpulsing, excess noise, dark count rate, prompt and delayed optical crosstalk, single photon time resolution (SPTR), photon detection effieciency (PDE) etc. These qualities of SiPMs influence directly and indirectly the time and energy resolution, for example in PET and HEP. This complete overview of all parameters allows one to draw solid conclusions on how best performances can be achieved for the various needs of the different applications."

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Chinese camera module maker Q Technology presentation gives the company's view on CCM market:

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Pressebox: Elmos presents an E527.31 3D ToF imager for applications in the vehicle interior and exterior. The new 3D imager is certified according to the automotive standard AEC-Q 100 and is characterized by its optimized power consumption: In addition to the normal operating mode, it also has a sleep mode in which power consumption is reduced to an absolute minimum.

The E527.31 3D imager is designed for HMI use making possible object detection in the near field of the vehicle as well as gesture detection in the exterior or interior.

Typical applications in the interior of vehicles are the gesture-controlled infotainment system or the monitoring of the number of people in the car. Outside, automatic tailgates and doors controlled by gestures are possible areas of application. If the imager is integrated into the B-pillar, collisions with moving and static obstacles such as bicyclists, curbs or marking posts can also be prevented. The precise detection of steps or objects and the generation of a realistic 3D image of the environment also allow the use in self-propelled robots.

The E527.31 has 32x32 active pixels and is built into a standard QFN44L7 package. It is supplied with an optical bandpass filter for 850 nm. Customer specific adjustments of the optical filter in the range of 850 nm to 940 nm are possible. The device controls the light source to be used (LED, VCSEL, laser) to optimize the light pulses and thus the object illumination for the application. An integrated temperature sensor enables precise compensation to prevent distance shift due to temperature changes. The distance information is read from the digital data supplied by the sensor by using an external controller with implemented software algorithms. The 3D ToF Imager provides perfect operation in all lighting conditions and in difficult weather conditions.

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The Optical Society (OSA) and the Society for Imaging Science and Technology (IS&T) name Eric R. Fossum, Thayer School of Engineering at Dartmouth, USA, the 2020 Edwin H. Land Medal winner. Fossum is recognized for the invention and commercialization of advanced CMOS optical sensor imaging technology and the Quanta Image Sensor, and for university entrepreneurial and national young inventor training activities.

“As the inventor of the CMOS image sensor as well as an entrepreneur and educator, Eric Fossum truly deserves recognition as this year’s Edwin Land Medalist,” said 2020 OSA President Stephen D. Fantone, founder and president of Optikos Corporation. “CMOS image sensors are now found in nearly all camera phones and other electronic imaging devices—making it an enabling ground-breaking contribution to digital imaging technology.”

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Digitimes reports that Taiwan-based Tong Hsing backend services for CIS saw its January-February revenues rise 19.22% YoY despite coronavirus outbreak. The newspaper's sources attributed the revenue growth partly to expanded shipments to its major client OmniVision. Also, the sources said that many enterprises are expanding their teleconferences facilities instead of in-person meetings while security surveillance systems have been increasingly installed as part of anti-virus measures.

Tong Hsing's chairman Pierre Chen has announced plans to double the company's production capacity by the end of 2020 to meet high CIS packaging demand. OmniVision is said to receive large 48+ MP sensor orders from many first-tier Chinese handset manufacturers.

OminVision plans to raise prices by 15-30% in 2020 due to the tight supply on the CIS market. Other Taiwan's CIS companies PixArt and Silicon Optronics are expected to raise prices too.

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It was brought to my attention there is a new book "Optical Imaging and Photography: Introduction to Science and Technology of Optics, Sensors and Systems" by Ulrich Teubner and Hans Brückner from Hochschule Emden/Leer - University of Applied Sciences, Germany.

Ulrich Teubner, one of the authors, writes in an email to me: "...the sensor part covers a large fraction of the book. It reviews all the sensors and related technology relevant for imaging, in particular, for photography.

Moreover, the book shows the strong relations between the optics and the sensor. This is really important, as an independent view on sensor system and optical system is not sufficient for a good camera performance (see also the article "Pixels for Geeks: A peek inside Nikon’s super-secret sensor design lab" in your blog).

Furthermore, after talking with people at Zeiss, I became aware that this statement is even more relevant than I thought before. Mostly sensor people do not know much about optics and optics community does not have much knowledge on sensors. This book fills the gap (the only other book which at least linked both parts together at some extend, is that edited by Nakamura)."

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PRNewswire: OmniVision announced Nyxel 2 — the second generation of its NIR technology. Despite launching the first generation more than two years ago, competing mass-produced CMOS image sensors are said to be still failing to achieve comparable NIR performance. Meanwhile, OmniVision’s R&D team has continued to refine its pixel architectures and processes to achieve new records in QE, with Nyxel 2 now providing a 25% improvement in the 940nm NIR light spectrum and a 17% bump at 850nm wavelength.

“Nyxel 2 technology further extends OmniVision’s leadership in NIR image sensing,” said Lindsay Grant, SVP of process engineering at OmniVision. “Pushing the envelope of NIR performance opens new possibilities for applications that operate in near or total darkness, including more accurate driver-state monitoring, better surveillance capabilities for security systems and new under-display sensing applications for mobile devices.”

Competing CMOS approaches for NIR image sensing continue to rely solely on thick silicon to improve NIR sensitivity. However, this results in cross-talk and impacts MTF. Attempts to overcome this by introducing DTI often lead to defects that corrupt the dark area of the image.

With Nyxel 2, OmniVision has further refined its approach to NIR imaging that combines thick-silicon pixel architectures with careful management of wafer surface texture to improve QE, along with extended DTI to retain the MTF levels of the first generation without affecting the sensor’s dark current.

With these refinements, OmniVision’s Nyxel 2 can now achieve 50% QE at 940nm — a 25% improvement over the first generation, as measured using data from a 2.9um pixel. At the 850nm NIR wavelength, Nyxel 2 can provide 70% QE, which is not only a 17% improvement over the first generation, but it is now on par with the QE levels of top RGB sensors that operate with visible light.

OmniVision’s first image sensors with Nyxel 2 technology are expected to be available during the second half of 2020.


For comparison, the first generation Nyxel announced in 2017 had a QE below:

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Inivation launches the DVXplorer Lite providing the high performance of iniVation’s neuromorphic vision technology at a lower price point for education and research. It is fully compatible with DV, iniVation’s open-source SDK.

The DVXplorer Lite contains the same patented core technology as all other iniVation DVXplorer and DAVIS products, enabling seamless future upgrades without software rewrites. The key specifications of the DVXplorer Lite include:

• QVGA resolution
• Extremely low latency (<1 ms)
• High dynamic range (>110 dB)
• High output rates (up to 5k event-frames per second)
• Built-in hardware sync for multi-camera or connection to external devices
• High-speed USB3 interface

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Don-Uk Choi's old twit from 2018 predicts 4 stage of under-display fingerprint sensors which quite nicely fits today's market state:


According to the same source, both Goodix and Egis are developing ToF-based iris-recognition cameras for smartphones: "Both Goodix and EgisTech are expected to prepare Iris-facial recognition solution using ToF sensor. They are expected to be developing using ML, DL, and computer vision algorithms."

IHS Markit publishes its analysis of the optical fingerprint market:

"Major smartphone brands, except Apple, have been increasing their FoD adoptions since the first quarter of 2019. As a result, there were more than 40 smartphone models equipped with FoD solutions. Thanks to the technical maturity and the FoD module ASP dropping from $8 (the first quarter) to $5 (the third quarter) in 2019, its take-off growth increased from 30 million units (2018) to more than 200 million units (2019). Additionally, tier-one smartphones received even better offers that were lower than $5 toward the end of 2019.

After comparing it to 3D facial recognition, which has issues with its algorithm, module stability, and supply chain in the non-Apple camp, smartphone brands excluding Apple chose to adopt FoD instead of 3D facial recognition in 2019. Smartphone brands upgraded their biometric ID with cost-effective and stable FoD solutions rather than 3D facial recognition.

CIS optical imaging solutions accounted for more than 75% of the shipments in 2019, while the remaining share went to ultrasonic solutions. The optical lens type of CIS optical imaging replaced the pinhole type in the first quarter of 2018 and later became the most popular technology in 2019. Despite having a module thickness of more than 3.5 mm, the optical lens type was generally adopted since the second quarter of 2019 because of its affordability. The microlens type was proposed in the third quarter of 2019 to improve the module thickness to 0.5–0.6 mm."

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EI 2020 paper "An over 120dB dynamic range linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors" by Yasuyuki Fujihara, Maasa Murata, Shota Nakayama, Rihito Kuroda, and Shigetoshi Sugawa from Tohoku University, Japan, achieves 70dB SNR in 16um pixel:

"This paper presents a prototype linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors (LOFITreCs) exhibiting over 120dB dynamic range with 11.4Me- full well capacity (FWC) and maximum signal-to-noise ratio (SNR) of 70dB. The measured SNR at all switching points were over 35dB thanks to the proposed two-stage LOFITreCs."

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EI 2020 paper "An over 120dB dynamic range linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors" by Yasuyuki Fujihara, Maasa Murata, Shota Nakayama, Rihito Kuroda, and Shigetoshi Sugawa from Tohoku University, Japan, achieves 70dB SNR in 16um pixel:

"This paper presents a prototype linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors (LOFITreCs) exhibiting over 120dB dynamic range with 11.4Me- full well capacity (FWC) and maximum signal-to-noise ratio (SNR) of 70dB. The measured SNR at all switching points were over 35dB thanks to the proposed two-stage LOFITreCs."

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