Archives for September 2020

Image Sensors World        Go to the original article...

IEEE Access publishes an open access paper "Explosive Growth of Image Sensors in Smart Government Technology and Economic Scale" by Zijiang Zhu, Bochen Fu, Sheng Zhou, and Weihuang Dai from Guangdong University of Foreign Studies, Wuhan Donghu University (China), and Hitotsubashi University (Japan). The abstract says:

"CMOS image sensor is a rapidly developing image sensor product in the past decade. Relying on the advantages of process compatibility with standard CMOS process, CMOS image sensor integrates analog photoelectric photosensitive circuit and digital signal processing circuit to become a small and powerful system on chip. This article mainly studies the explosive growth of image sensors in smart government technology and economic scale. The main purpose of this article is to study the technical application of image sensors, reduce the administrative cost of social governance, improve the level of government governance, benefit the public, and realize the requirements of smart government affairs and rapid economic development of the city.

This study tested the static performance of the analog-to-digital conversion circuit by inputting a limited number of sampling points, and its integral nonlinearity and differential nonlinearity were both less than 1LSB. The bandgap reference circuit provides a reference level for the entire system. It uses two PNP-type bipolar transistors parasitic in the CMOS process to achieve a temperature and voltage-independent bandgap reference voltage through the feedback of the operational amplifier. It is ideal for use In the case of resistance simulation, its accuracy reaches 16.6ppm. The scanning method of the pixel array uses multi-sampling technology to increase the dynamic range of the sensor by 2N times. The correlated sub-sampling technology eliminates the fixed pattern noise between pixel units. The use of pipelined analog-to-digital converters can achieve good resolution, speed and area compromise.Through the realization and simulation of transistor-level circuits, the performance of each part of the system meets the requirements of design and application."

The authors are mostly specializing in economics, HR, and management. Only one of them has a degree in software engineering. I was unable to understand what the authors are trying to say. To me, it looks like an AI experiment to assemble a number of meaningless sentences optimized to go through the IEEE paper selection system.

Go to the original article...

Image Sensors World        Go to the original article...

First Sensor presentation talks about challenges in LiDAR sensors design:

Go to the original article...

Image Sensors World        Go to the original article...

ALA, EENewsEurope: TiHive, Grenoble, France, raises €8.6M ($10M) for its THz imager, including equity funding from an fund run by the European Commission.

“The really cool thing is the EC has funded academic organisation or SMEs via grants but now have seen they go beyond that, so €2.3m is a grant and €6.3m is in equity as a partners and we will be attracting other investors,” says Hani Sherry, CEO and co-founder of TiHive. “They won’t be a majority shareholder, it’s like a Series A and will own a part of the company, so it is actually a pretty big round but we are phasing it. This development is capital intensive so we need cash and Europe would like to boost strategic technologies in Europe and they have identified us as the leader in the technology. They would like to behave like VCs with a return on investment and the idea is to continue investing.”

“We operate from a few hundred GHz to 1THz and we have demonstrated chips at 2 and 3THz but for the applications we have found the unexplored applications range from 300 to 600GHz, that’s a major area,” says Sherry. “We have tried multiple nodes, including 28FD-SOI, and we have mastered the different technologies. 65nm is a sweet spot for us, it has fantastic performance and a good cost at large scale and it has the libraries available.”

TiHive, now in its third year, initially struggled to pick a market focus as its THz imager presented such a broad array of opportunities across different industries, from luxury goods and pharmaceuticals to performance materials. Although the company continues to explore opportunities with partners in these fields, it has adopted a strategic focus on the hygiene and personal care markets. TiHive estimates a €10 billion opportunity in potential material savings and quality improvements for manufacturers of personal care products, which it claims generate a combined €150 billion in sales each year.

Go to the original article...

Image Sensors World        Go to the original article...

University of Washington, Seattle, webinar by Arka Majumdar presents the concept of Metaphotonic Computational Image Sensor:

Go to the original article...

Image Sensors World        Go to the original article...

Arxiv.org paper "Monte Carlo Modeling and Design of Photon Energy Attenuation Layers (PALs) for 10-30x Quantum Yield Enhancement in Si-based Hard X-ray Detectors" by Eldred Lee, Michael R. James, Kaitlin M. Anagnost, Zhehui Wang, Eric R. Fossum, and Jifeng Liu from Dartmouth College and Los Alamos National Laboratory proposes photon downconversion layer:

"High-energy (>20keV) X-ray photon detection at high quantum yield, high spatial resolution and short response time has long been an important area of study in physics. Scintillation is a prevalent method but limited in various ways. Directly detecting high-energy X-ray photons has been a challenge to this day, mainly due to low photon-to-photoelectron conversion efficiencies. Commercially available state-of-the-art Si direct detection products such as the Si charge-coupled device (CCD) are inefficient for >10keV photons. Here, we present Monte Carlo simulation results and analyses to introduce a highly effective yet simple high-energy X-ray detection concept with significantly enhanced photon-to-electron conversion efficiencies composed of two layers: a top high-Z photon energy attenuator layer (PAL) and a bottom Si detector. We use the principle of photon energy down conversion, where high-energy X-ray photon energies are attenuated down to and below 10keV via inelastic scattering suitable for efficient photoelectric absorption by Si. Our Monte Carlo simulation results demonstrate that 10-30x increase in quantum yield can be achieved using PbTe PAL on Si, potentially advancing high-resolution, high-efficiency X-ray detection using PAL-enhanced Si CMOS image sensors."

"While the overall underlying principle of photon energy down conversion could be somewhat similar to scintillator-based methods, it should be emphasized that this approach is distinctive in that the attenuated photons still remain in the X-ray spectral regime as opposed to the UV and visible regime. Unlike scintillators, the down conversion primarily relies on inelastic scattering with high-Z atoms, therefore no exotic and expensive bulk crystals (as in the case of scintillators) are needed for the PAL layers. In fact, the PAL layers can be polycrystalline or even amorphous thin films, which are much easier to fabricate than bulk crystal scintillators. The response time is also no longer limited by the optical spontaneous emission lifetime in scintillators, potentially allowing for ultrafast response since X-ray photon energy down conversion time via X-ray fluorescence and/or inelastic scattering is typically much shorter than the optical fluorescence time in scintillators. This conceptual design may also offer integration capabilities to Si CIS- or QIS-based devices for high resolution X-ray imaging."

Go to the original article...

Image Sensors World        Go to the original article...

Sony publishes its presentations at on-line 2020 European Conference on Computer Vision.

Seigo Hirakawa from Sony, Atsugi, Japan, presents previously announced image sensors with a stacked AI processor:



Andreas Kuhn from Sony R&D Center Europe in Stuttgart, Germany, unveils a new Sony AI Vision Sensing Processor, the CXD5620GG:




Peter Dürr from Sony AI in Zürich, Switzerland, presents the future AI ideas that Sony works on:

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: Nordson has acquired vivaMOS which designs, develops and fabricates large-area X-ray CMOS sensors. vivaMOS was established in 2015 as a spinoff from the U.K.’s Science and Technology Facilities Council (STFC) with the aim of commercializing its X-ray image sensors. Its latest generation sensor offers a unique combination of speed, resolution and low-noise performance, enabling a wide range of X-ray applications.

“We have been collaborating closely with vivaMOS for several years, and we are excited about furthering our relationship and welcoming vivaMOS employees to the Nordson family. This acquisition gives Nordson differentiated and leading-edge X-ray sensor technology that will substantially enhance our product offerings across multiple end markets. Large panel CMOS sensors represent a critical technology for X-ray imaging. We look forward to further integrating the industry-leading sensor technology and expertise while developing new test and inspection innovations to offer our customers,” said Jeff Pembroke, EVP, Advanced Technology Solutions.

The terms of the deal are not disclosed. vivaMOS will become part of the Test and Inspection division within Nordson’s Advanced Technology Solutions segment.

Go to the original article...

Image Sensors World        Go to the original article...

Sony publishes a video suggesting few use cases for its DepthSense products:

Go to the original article...

Image Sensors World        Go to the original article...

ResearchInChina publishes "ADAS and AD Industry Chain Report, 2019-2020 -- LiDAR" report."

Go to the original article...

Image Sensors World        Go to the original article...

Metrology.news: The National Institute of Standards and Technology (NIST) in the US, together with standards body ASTM Committee E57, have released proceedings of a workshop, held in 2019, to define standards for 3D imaging systems for robots in manufacturing.

Intel talks about the 3D image accuracy in its Realsense active stereo cameras:


Airy3D publishes its take of the 3D imaging standards.

Go to the original article...

Image Sensors World        Go to the original article...

Nuvoton announces that the acquisition of semiconductor business of Panasonic has been completed. Following the completion of the Transfer, the business will be renamed as Nuvoton Technology Corporation Japan.

In the long term, Nuvoton is expected to enhance the technology capabilities, diversify the product line, enlarge its business scopes as well as revenue growth, gain additional market shares and therefore increase its visibility in both Japan and the global market.

In the short term, the acquisition may have a negative impact on Nuvoton's profitability, as per Digitimes quote of Arthur Chiao, chairman for Nuvoton and Winbond.

Go to the original article...

Image Sensors World        Go to the original article...

LIPS designs ToF calibration machine for smartphone ToF modules:

Go to the original article...

Image Sensors World        Go to the original article...

BusinessWire: SmartSens announces two automotive CMOS sensors—SC100AT and SC410GS. The SC100AT and SC410GS are the first offerings in the SmartSens Automotive Series with AEC-Q100 certification and an HDR of up to 140dB. SmartSens’ proprietary PixGain HDR® technology also gives the SC100AT the ability to produce readout noise levels as low as 0.58e-, resulting in clear and detailed night vision in low-light environments. The sensor’s primary use cases include blind spot monitoring, side-view mirror replacement, parking assistance, driving recording, back-up monitoring, and vehicle surround view.

The SC410GS features 4MP resolution, BSI global shutter pixels, and HDR that processes up to 12000mV/Lux-s, to resolve overexposures of signal lights at night.

“Recent growth in the construction and development of intelligent transportation systems around the world are creating new demand for image sensors that can empower smart cars and intelligent traffic management. Our SC100AT and SC410GS combine our CMOS sensor leadership with automotive-specific design that delivers the next level of reliability and performance required for tomorrow’s driving experiences,” said James Ouyang, Deputy GM of SmartSens.

SmartSens SC100AT and the SC410GS image sensors are available for testing immediately.

Go to the original article...