Archives for March 2021

Nikon is developing the Nikon Z 9 full-frame flagship mirrorless camera

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Omnivision Beats its Own Guinness World Record

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BusinessWire: OmniVision announces the OH0TA OVMed medical image sensor—with a package size of just 0.55mm x 0.55mm, featuring a 1.0um pixel and a 1/31” optical format—smaller than the Guinness World Record held by its predecessor for the “Smallest Commercially Available Image Sensor.” The OH0TA also quadruples the RGB image resolution to 400x400, or 160 K Pixels, at 30 fps while reducing the power consumption by 20% to 20mW. This allows designers to add ultra-compact visualization to single-use and reusable endoscopes, as well as catheters and guidewires, with a small outer diameter of 1-2mm. Alternatively, this sensor’s uniquely small size gives medical device OEMs the flexibility to create a larger-diameter scope with a larger working channel.

The trend toward minimally invasive procedures continues to grow, due to their greater success rates and shorter patient recovery times. However, for the narrowest areas of the anatomy, particularly in neuro and cardiac surgeries, previous sensors did not have the necessary combination of high resolution and extremely small size,” said Ehsan Ayar, medical product marketing manager at OmniVision. “The OH0TA is the world’s first sensor to offer this combination, enabling significant endoscope improvements, especially in comparison to traditional videoscopes made with optical fibers, which have limited resolution, poor imager quality and high cost.

To achieve this increase in resolution, along with a smaller pixel size and optical format, the OH0TA is built on PureCel Plus-S stacked die technology. This pixel also provides sensitivity of 3600 mV/lux-sec, along with a SNR of 37.5dB. Additionally, PureCel Plus-S enables the OH0TA’s higher FWC, zero blooming and lower power consumption.

Other key features include a 15.5 degree CRA, enabling the use of lenses with high fields of view and short focus distances. It also supports a 4-wire interface, as well as raw analog data output, both of which can transmit via cables as long as 4 meters with minimal signal noise. For backward compatibility and easy adoption, this sensor interfaces with OmniVision’s existing OV426 ADC bridge chip. Additionally, it is autoclavable for reusable endoscope sterilization.

Samples of the OH0TA are available now, in OmniVision’s hCSP chip scale package with 100 micron thick cover glass and an anti-reflective coating.

BusinessWire: OmniVision also announces the OVMed OCHTA camera module based on the new sensor.

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Rumor: Apple AR Headset to Include 15 Cameras

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i-Micronews and AppleInsider quote analyst Ming-Chi Kuo saying that Apple rumored AR/MR headset is to be presented to the world in 2022 and will include 15 integrated cameras:

"Eight camera modules, supplied mainly by Largan, are expected to be placed around the wearable "helmet" to facilitate pass-through VR, a technology that allows users to "see through" the enclosed device by feeding exterior images onto interior screens. Apple's product is said to utilize high-resolution MicroOLED displays.

Along with the eight cameras dedicated to pass-through VR, six modules will feed "innovative biometrics," Kuo says. It is unclear if the analyst is referencing user security biometrics — like Face ID — or the ability to capture facial features and body movements of others nearby for inclusion in a simulated experience.

Finally, a single camera module will be installed for environmental detection purposes."

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Sony Announces Large Format 127.68MP Global Shutter Sensor

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PRNewswireSony announces the upcoming release of a large format 56.73mm diagonal CMOS sensor "IMX661" for industrial equipment with a global shutter and the industry's highest effective pixel count of 127.68MP. Its optical size nearly 10 times larger than the common 1.1-type image sensor corresponded to the C mount for industrial equipment. It also features global shutter "Pregius" pixel and high-speed readout at a data rate nearly four times faster than conventional products. The sampling of the new IMX661 sensor is planned for April 2021.

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ON Semi Lays-off 740 Employees

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PhoenixBusinessJournal: ON Semiconductor plans to lay off approximately 740 employees across the company and its subsidiaries during the first half of 2021. The company said these terminations are part of its ongoing efforts to refocus on growth drivers and streamline operations.

Here is an official company's SEC disclosure:

"On March 4, 2021, as part of its ongoing efforts to realign its investments to focus on growth drivers and key markets and streamline its operations, ON Semiconductor Corporation (the “Company”) plans to implement certain employee terminations during the first half of 2021 (the “Employment Separations”). The Employment Separations will impact approximately 740 of the Company’s and its subsidiaries’ employees globally. The Company estimates that it will incur between $58 million and $62 million in aggregate costs during the first half of 2021.

The Company plans to reinvest a substantial portion of the savings generated from the Employment Separations into its continuing workforce and certain business initiatives and opportunities. Consequently, the restructuring may not result in a material reduction in the Company’s future operating expenses. The Company intends to continue to evaluate measures to realign its investments to achieve the Company’s strategic and transformational goals."

In December 2020, an activist investor group, NY-based Starboard Value LP, placed two of its preferred directors on the board in an effort to enhance shareholder value.

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Isorg Organic Photodiode-Based Fingerprint Sensor Gets FBI Certification

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ALANews, BusinessWire: Isorg Fingerprint Acquisition Profile (FAP) 10 module has received FBI certification, the first in this category of organic photodiode (OPD) based optical sensors. The FAP 10 biometrics module is now approved for use in security applications, in particular in mobile device identification for access control at airports and other facilities where the highest security levels are needed.

FAP 10 is manufactured by printing organic photodiode on a TFT backplane. Isorg is the only manufacturer in the world commissioned to mass produce OPD sensors; it is ready for ramp-up to industrial batches at its state-of-the-art plant in Limoges, France.

This FBI certification confirms Isorg’s capacity to deliver biometrics modules based on organic electronics that rise to the challenges of the security market and meet its stringent requirements,” said Jean-Yves Gomez, CEO at Isorg. “We are the very first to gain security approval of an OPD fingerprint sensor that assures the high-level image quality, accuracy and robustness that customers need in border control, access control, voter identification, etc. The security market will continue to benefit from our ongoing developments to achieve certification on higher form factors (up to FAP 60) based on the same scalable OPD technology.

FAP 10 is a complete solution, incorporating an image sensor, dedicated light source, optical filters and driving electronics. To support customer product development, Isorg will provide a reference design with its latest integrated ROIC and software processing for image quality enhancement that is optimized with Isorg’s OPD sensor technology.

The module is a flat, slim design (less than 2mm thick) and robust enough for all outdoor conditions. Isorg offers a roadmap of up to four-finger authentication for a FAP 60 module with scalability for even larger palm-sized surface areas. Anti-spoofing features can also be easily integrated into the hardware and software.

Isorg’s FAP 10 is approved for one finger authentication, with a surface area of 0.5” to 0.65” (1.27 – 1.65cm). The company is planning for FBI certification of larger area biometrics modules, up to four fingers (FAP 60) offering very significant cost advantages for large areas.

Isorg also provides smartphone makers with the slimmest complete solution for large area Fingerprint on Display (FoD) applications. It enables the entire area of the smartphone screen to function as a digital fingerprint scanner.

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Rode Wireless Go II review

Cameralabs        Go to the original article...

The Rode Wireless Go II is a compact wireless microphone system that supports two transmitters, internal recording and USB connections to cameras, phones and computers. This makes it one of the most flexible microphone systems around from podcast interviews to upgrading your Zoom audio. Here’s my full review!…

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Assorted Videos: Optasensor, ST, Ouster, NASA

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Optasensor publishes a company presentation video:


ST publishes a gesture recognition use case for its ToF sensors:


Ouster publishes a short video explaining its "Digital LiDAR" technology:


NASA publishes "From Pixels to Products: An Overview of Satellite Remote Sensing" video:

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TechInsights on Small Pixels

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TechInsights has held an excellent webinar on image sensor trends and comparisons on March 3, 2021. The webinar is available for on-demand access now. There is a lot of interesting information there. This is a second post about small pixels:

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Nikon 17.8MP 1,000fps Sensor – English Version

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Nikon publishes an English version of its February 17th announcement of the 17.8MP 1,000fps stacked sensor presented at ISSCC 2021.

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Vision Research Unveils 76,000fps @ 1MP Camera

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Ametek Vision Research introduces the Phantom TMX Series, its first high-speed cameras that use BSI sensors to achieve up to 75 Gpx/sec speed and improve light sensitivity. 

The Phantom TMX Series consists of two models, TMX 7510 and TMX 6410. TMX 7510 achieves 76,000 fps at full 1MP resolution of 1280 x 800, over 300,000 fps at 1280 x 192 resolution, and over 770,000 fps at smaller resolutions. With the export-controlled FAST option, TMX 7510 reaches a 1.75 Million fps and 95ns minimum exposure time, eliminating motion blur.

We’re excited to introduce this new class of high-speed performance to the market,” says Jay Stepleton, VP and GM of Vision Research. “In bringing BSI technology to high-speed applications in a new, cutting-edge sensor, we continue to advance high-speed capabilities through innovation. We designed the TMX cameras for speed, to support the very high frame rate requirements we see in many new and cutting-edge applications.



Thanks to TL for the pointer!

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iToF Multipath Reduction Thesis

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Jonas Gutknecht kindly sent me a video presentation of his MSc Thesis “Multi-Layer-ToF: 3D-ToF-Camera with multiple object distances" from Institute for Signal Processing and Wireless Communications of ZHAW school of engineering in Winterthur, Switzerland, in cooperation with ESPROS Photonics.

Abstract:

"For the three-dimensional acquisition of a scene, 3D cameras based on the Time of Flight (ToF) method have proven themselves for many applications. However, Multi Path Interference (MPI) is widely spread in practice and represents a significant source of error for the ToF method with CW and PN modulation. The aim of this work is not only to suppress this error, but also to separate the individual signal components of real measurements and further determine the distances of the different signal paths.

In a first step a simulation tool was developed with which CW and PN based ToF measurements can be approximated. The simulation takes into account the main properties of a real 3D ToF System and provides reproducible data for any scene. In a second step, besides a closed form method, the two iterative algorithms OMP and PSO were implemented to separate the different signal paths. These three methods are based on a CW modulation and several measurements with variable modulation frequency. By means of different simulations and measurements the suitability of these algorithms for practical use was tested and the performance was compared.

With the three implemented methods the MPI influence can be greatly reduced and the individual signal paths separated. However, the closed form method has a high sensitivity to measurement noise. The PSO method is computationally intensive compared to the other methods and the results show a considerable amount of noise. In contrast, the OMP method has proven itself in practice and has prevailed over the other methods. With an application based on the OMP method, the process can be demonstrated in real time.

With this thesis it could be shown that MP separation for ToF measurements is possible in practice and the influence of MPI can be suppressed. For example, errors caused by stray light can be corrected or the contrast of the distance image can be increased. In addition, several distances per pixel can be resolved and thus semi-transparent objects can be measured. The presented method provides reliable data in difficult conditions and extends the application range of the 3D ToF method."

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ISOCELL 2.0 Technology Explained

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When Samsung announced its 0.7um pixel in September 2020, the PR mentioned that "the new 0.7μm lineup will adopt enhanced pixel technology with boosted light sensitivity, ISOCELL 2.0, later this year." By that time, ISOCELL 2.0 was said to increase the light sensitivity by 12%.

Now, Samsung explains how ISOCEL 2.0 is different from the previous generations:

"Samsung has now introduced next-level ISOCELL 2.0, which further refines the technology by replacing the metallic grid between color filters with a new material. In the first generation ISOCELL pixels, slight optical loss occurred when the metallic grid between the color filters absorbed small portions of the incoming light.

To solve this problem, ISOCELL 2.0 began with the establishment of ISOCELL Plus, the first phase of ISOCELL 2.0’s development. ISOCELL Plus replaced the metal barriers with an optimized new material. However, the barriers still contained some metal that caused the lower parts of the color filter barriers to absorb light, resulting in some optical loss.

Now, the second phase of ISOCELL 2.0 replaced the lower portion of the color filter barriers with a more reflective material. It further reduces optical loss in each pixel and drastically improves light sensitivity, allowing smartphones to produce even more vivid pictures with reduced noise.

By delivering enhanced light sensitivity, ISOCELL 2.0 allows even smaller pixels in the sensor to absorb more light, giving the sensor the tools it needs to produce photographs that are made up of a greater number of pixels. This enables the production of images with very fine detail without compromising the sensor’s vivid color reproduction."

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Melexis Gets Exclusive Rights to Use Chronoptics Technology of ToF Multipath and Linearity Errors Correction in Automotive Applications

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Melexis enters into a license agreement with Chronoptics. The agreement grants Melexis exclusive rights of use of Chronoptics’ multipath and linearity error correction technologies in automotive applications. This includes ADAS for autonomous vehicles, and interior monitoring and safety systems.

Multipath interference in ToF cameras can lead to inaccurate depth measurements under specific conditions, such as when a wide FoV is used, or when the scene contains highly reflective objects. It is typically caused by stray light and scattering due to bright reflections in the scene. Chronoptics’ patented multipath correction technology recovers the correct depth values to produce accurate and robust point clouds even in the most challenging scenarios. With future vehicle applications set to demand an even wider FoV, the technology enables Melexis’ customers to address and mitigate potential challenges in advance.

Damien Macq, VP & General Manager Sense and Light business Unit, Melexis, commented: “These new IPs will be available for evaluation in our Time-of-Flight reference design. Our third-generation ToF sensors are a breakthrough in terms of sensor performance, and this innovative technology along with other Melexis’ IPs will further enhance system level performance.

Richard Conroy, CEO, Chronoptics, said: “We are excited to partner with Melexis to deliver robust depth sensing solutions for the automotive industry. We are experts in tailoring fit-for-purpose 3D cameras that leverage our patented depth pipeline technologies and know-how to deliver clean and accurate 3D data for any application.


Chronoptics patent application WO2020130855 gives few more details about the company's approach:

"Binary sequences have been used instead of the pure sinusoidal signals described in the above equations. They have demonstrated the capacity to image through smoke, resolve multi-path interference and enable multiple camera operation with minimum interference. A configurable time of flight camera system and associated data processing system is required to allow for the selection and use of such an arbitrary binary sequence."

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Hynix to Unveil 0.7um Pixel by the End of 2021

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Korea Economic Daily reports that SK Hynix is is developing a 0.7um 64MP image sensor for smartphones and plans to bring it to market by the end of 2021. Hynix also plans to unveil new image sensors for security cameras and biological applications.

With a variety of products we’re considering, our company aims to raise our presence in the global image sensor market,” said an unnamed SK Hynix official.

SK Hynix’s image sensor market share rose to an estimated 3.2% in 2020 from 2.6% 2019. Its revenue from the image sensor business has increased by 33.6% to $582.2M from $435.8M in the same period.

SK Hynix is making image sensors at two of its semiconductor plants in Icheon, Gyeonggi Province – its M10 chip plant, where the company uses 12-inch wafers, and its foundry affiliate SK Hynix System IC Inc., which uses 8-inch wafers.

Due to a booming DRAM demand, it might be hard for Hynix to allocate enough capacity to imahe sensor production. “It may not be easy for us to switch our DRAM chip fabrication lines to boost production of image sensors. But we’ll make the right decision in accordance with the market situation,” said SK Hynix executive.

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TSR: Market Share Gap Between Sony and Samsung to Shrink to 10% in 2021

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BusinessKorea, Aju.news: Korean media quote an interesting data from the recent TSR market report:
  • In 2020, Sony market share was 45.1%, while Samsung's - 19.8%
  • The 2020 gap has shrunk by 5.1-5.2% in comparison with 2019
  • TSR expects this gap to shrink further to 10% in 2021
  • Aju.news: The global image sensor market is forecasted to increase by 22.1% from $20.4B this year to $24.9B in 2024
  • BusinessKorea: The global image sensor market is forecasted to increase by 11.4% annually from $17.9B this year to $24.8B in 2024
  • Goodix has emerged as a major image sensor market player with a share of 3.6% in 2020

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French Government Invests in SWIR Sensors Development

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NIT and the French National Research Institute at Sorbonne University have entered into a research partnership, with the aim of producing SWIR sensors using HgTe quantum dot materials deposited on ROIC.

The Institute of Nano Sciences from Sorbonne University is currently researching and producing quantum dot materials of HgTe sensitive in the SWIR to MWIR wavelength range. Preliminary tests of QCD deposition on NIT ROIC’s have shown impressive results.

This strategy is promising to design low-cost and small pixel pitch focal plane array, as well as to expand the spectral range of the SWIR camera up to 2.5 µm.

This collaborative program is funded by the French National Research Agency. 

After 10 years of researching infrared imaging nanocrystal films we have been able to obtain impressive SWIR images when coupled to a NIT ROIC. Through this project, we now enter into a new step of collaboration to bring this proof of concept to a SWIR commercially available camera“ says Emmanuel Lhuillier – CNRS researcher and NITQuantum project principal investigator.

This is a major breakthrough in the life of NIT as this partnership will allow us to offer a full line of SWIR sensors and cameras in large volumes and at low price. This technology benefits from the overall imaging sensor market as it shares its common manufacturing platforms. No doubt this novel sensor technology will become the standard in SWIR sensors in 3 to 5 years,” says Pierre Potet, CEO, New Imaging Technologies (NIT).


ALA News: Lynred announces an investment of 2.8M euros in a project aiming to develop a new generation of infrared detectors. This project was selected among the winners of the Call for Projects (AAP) Recovery Plan for Industry - Strategic Sectors launched on August 31, 2020. The State must pay a subsidy of € 900,000 for this 24-month project. .

The Lynred project aims to develop a new French sector of near infrared detectors with small pixel pitch. This new sector will make it possible to meet the needs of the infrared imaging markets for applications in industrial control and spectral imaging, for example the sorting of plastics.

In addition to developing around twenty jobs, this project will reduce the level of dependence on imports by relocating part of the development and production activity in France, previously subcontracted abroad - one of the strong axes of the Recovery Plan.

"We are proud that our project is one of the winners of this initiative for the resilience of the economy," welcomes Jean-François Delepau, President of Lynred. “Lynred's raison d'être is to supply state-of-the-art infrared detectors worldwide and to guarantee the sustainability of an autonomous and sovereign French infrared sector. The investment made within the framework of the project meets this ambition for the near infrared, and is therefore fully in line with the resilience objective pursued by the French State in the Recovery Plan for the strategic sector of infrared detectors."

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Report: Price of 13MP Mobile Sensors Falls to $1.55

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News.hqew.com quotes MoneyDJ Nikkei report that mobile CIS sensor prices decline for the last 3 quarters. Specifically, 13MP sensors wholesale price declined by 3% to $1.55.

Other than Huawei sanctions, the reason for decline is said to be the attempts to reduce the price of 5G phones by simplifying camera modules.

Another version of this report appears on OFweek site:

"[Samsung and Sony start a price war: CMOS image sensor prices have fallen for three consecutive quarters]

According to the news on March 2nd, according to the Nikkei Shimbun’s report on the same day, the block transaction price of CMOS image sensors from January to March dropped by about 3% from October to December 2020. Recently, the two giants in the field of CMOS image sensor, Samsung and Sony, have become more and more fierce in the price war, and the price of CMOS image sensor has fallen for three consecutive quarters.

At present, among the many products of CMOS image sensors, the representative product is 13 million pixels (sensor size 1/3 inch). Prices for the quarter (October-December 2020) fell by 3%."

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TechInsights on Voltage-Domain Global Shutter Pixels

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TechInsights has held an excellent webinar on image sensor trends and comparisons yesterday. The webinar is available for on-demand access now. There is too much interesting information for one post. I'd start from Smartsens and Omnivision voltage domain global shutters (Microsoft Azure, Sony, and Samsung pixels have charge domain shutters):

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Nikon releases NX Studio, a new software that enables the seamless viewing and editing of still images and video

Nikon | Imaging Products        Go to the original article...

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Assorted Videos: Photon Force, NIT, ST, Brookman

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 Photon Force publishes a video of its PF32 32 x 32 SPAD array with 55ps time resolution:

New Imaging Technologies (NIT) publishes the company's introductory video:

ST publishes a demo of its GS sensor in driving monitoring applications:


Brookman publishes a demo of its high-speed ToF sensing:

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Ouster’s Digital LiDAR Pitch for Investors

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Ouster publishes its Investor Day presentation dated by Feb. 22, 2021, explaining advantages of its digital LiDAR:

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Ouster’s Digital LiDAR Pitch for Investors

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Ouster publishes its Investor Day presentation dated by Feb. 22, 2021, explaining advantages of its digital LiDAR:

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Ams Establishes Consumer Imaging Center of Excellence in Rochester, NY

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ams is establishing an imaging center of excellence producing state-of-the-art consumer image sensors and product validation to support key US customers from the Riverwood Tech Campus in Rochester, New York, USA.

Rochester is the perfect choice for ams to expand its research and development in the trans-formative fields of consumer imaging and photonics, to create design innovations that make an impact on our world. We look forward to collaborating with institutions such as the NYS American Institute for Manufacturing for Integrated Photonics, and renowned local universities and institutes,” said David Sackett, Senior R&D Director, Consumer Image Sensors at ams and the site manager.

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DJI FPV review

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The FPV is DJI's first drone designed for 'first-person-view' racing with goggles, while also sporting reasonable camera capabilities. Can DJI take-on a racing market dominated by DIY drones? Find out in Adam's review!…

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Senseeker Engineering Acquires SE-IR Corporation

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ROIC company Senseeker Engineering acquired SE-IR Corporation, a cryogenic test equipment and electronics developer. The combination of Senseeker's digital ROIC and SE-IR's industry standard test Dewars and electronics is a highly complementary amalgam that will enable FPA makers to expedite their development and evaluation process.

The terms of the acquisition are undisclosed. Both Senseeker and SE-IR were privately held companies prior to the acquisition and Senseeker remains a 100% privately held company after this transaction. SE-IR's business and products are being integrated as seamlessly as possible into the Senseeker organization. The SEIR brand name shall be retained for Senseeker's product line of electronics and cryogenic equipment and modified as Senseeker Engineering Infrared.

"Senseeker builds solutions that help our customers create higher performance sensors and get them into production faster," said Kenton Veeder, President at Senseeker Engineering. "Our continued commitment not to sell infrared FPAs is aligned with SE-IR, who has been a strong ecosystem partner to Senseeker and the infrared community for many years. Together we accelerate our customers' capabilities through expanded stand-alone and combined solutions incorporating integrated circuits, Dewars, electronics and software. We will heighten our customers technology and bring their solutions to market faster."

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ON Semi Launches World’s First Automotive Qualified SiPM Array for LiDAR Applications

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i-Micronews, EEJournal: ON Semi announces the new RDM-Series silicon photomultiplier (SiPM) array for LiDARs. The RDM-0112A20-QFN is said to be the first automotive qualified SiPM product in the market. The ArrayRDM-0112A20-QFN is AEC-Q102 qualified and developed in accordance with IATF 16949.

The ArrayRDM-0112A20-QFN is a 1×12 array of SiPM pixels based on the company’s RDM process, which enables 18.5% photon detection efficiency (PDE) at 905 nm. This PDE is measured at typical operating voltage and 21°C. The PDE increases to >25% at 905 nm at elevated temperature. 

The high-resolution depth data provided by LiDAR enables instantaneous and accurate object identification in challenging low light conditions. As the first automotive qualified SiPM, the ArrayRDM-0112A20-QFN will enable long range, cost-effective LiDAR solutions for the next level of safety and autonomy,” commented Wade Appelman, senior director, Automotive Sensing Division at ON Semiconductor. “We are continuously enhancing our sensor portfolio by offering diverse and complementary sensing modalities that pave the way to higher levels of ADAS and autonomous driving.

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Technavio Forecasts CIS Market to Grow by $10.80B during 2021-2025

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PRNewsWire: According to Technavio, the CMOS image sensors market is expected to grow by $10.80B during 2021-2025, expanding at a CAGR of almost 10%.

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Hyperspectral Imaging Applications

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Stemmer Imaging publishes European Imaging Academy webinar on hyperspectral imaging use cases:

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