Archives for November 2021

Omnivision to Qualify Medical-Grade 8MP 60fps RGB-IR Sensor for Endoscopes

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BusinessWire: OmniVision and Diaspective Vision GmbH announce their partnership in the development of a new type of endoscopic camera, the MALYNA system, which is based on multispectral imaging technology.

The MALYNA camera uses OmniVision’s OH08B CMOS sensor. Diaspective Vision will be adding a second OH08B sensor to the MALYNA and the sensors will be synchronized to provide a 3D stereoscopy image. The OH08B is the first 8MP medical-grade image sensor to use OmniVision’s Nyxel NIR technology. The 1/1.8” optical format, 2.0µm PureCel Plus-S pixel image sensor offers 4K2K resolution at 60 fps and supports HDR.

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Canon announces Naotatsu Kaku as the Grand Prize winner for its New Cosmos of Photography 2021 (44th edition) photo competition

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Infineon Forecasts ToF Market Growth

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Infineon investor presentation shows the company's view on ToF market size and its products:

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Yet Another Color Router Paper

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 InterDigital publish a MDPI paper "Optical Efficiency Enhancement of Nanojet-Based Dielectric Double-Material Color Splitters for Image Sensor Applications" by Oksana Shramkova, Valter Drazic, Bobin Varghese, Laurent Blondé, and Valerie Allié.

"We propose a new type of color splitter, which guides a selected bandwidth of incident light towards the proper photosensitive area of the image sensor by exploiting the nanojet (NJ) beam phenomenon. Such splitting can be performed as an alternative to filtering out part of the received light on each color subpixel. We propose to split the incoming light thanks to a new type of NJ-based near-field focusing double-material element with an insert. To suppress crosstalk, we use a Deep-Trench Isolation (DTI) structure. We demonstrate that the use of a dielectric insert block allows for reduction in the size of the color splitting element. By changing the position of the DTI, the functionality of separating blue, green and red light can be improved."

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Interview with CEO of Ruisi Zhixin (AlpsenTek)

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Sohu publishes an interview with Deng Jian, CEO of Ruisi Zhixin, english name AlpsenTek, a developer of hybrid of event-driven with regular sensor. Few quotes in Google translation:

"The "Hybrid Vision" technology of RISZ is independently developed by our team. This technology integrates the team's understanding and accumulation of various advanced visual sensing technologies and event camera technologies in the past 15 years, and is formed by fusing some advanced visual sensing technologies with bionic event camera technologies at the sensor pixel level. At present, our first chip ALPIX-Pilatus based on "Hybrid Vision" technology has been successfully taped out, which also verifies the feasibility of our technology. Our success at the first tapeout is also due to the team’s past experience in the field of chip design.

We currently have applied for more than 30 domestic, PCT and other countries or regions patents around the "Hybrid Vision" technology, and are still applying for it.

Our chip has three main advantages:

(1) Compared with the existing bionic event camera chip that requires a dual-camera solution with a traditional image sensor in most scenarios, one chip of the ALPIX series can replace two chip functions, which not only has a system cost advantage, but also has more data. Rich.

(2) Solve the problem of dual-camera heterogeneous registration. In the dual-camera system of event camera chip + traditional image sensor, due to the difference in viewing angles of the two cameras, real-time registration of event camera data and image data is required. Event data and image data are two completely different types of data, and spatial registration is difficult, which brings great difficulties to the realization of the underlying fusion algorithm. The ALPIX series chips naturally solve the problem of difficult spatial registration because the two types of fusion signals are generated by the same pixel.

(3) ALPIX can output image signals and is compatible with existing image processing algorithms and architectures.

Most of the current event camera field is based on the core architecture design of Professor Tobi Delbruck of ETH. It has the advantage of ultra-low latency. The chip can reach an equivalent frame rate of 100,000 frames per second. Therefore, It has advantages in some high-end special scenes such as industry. However, it is also difficult to output high-quality traditional image signals.

We mainly follow the technical route of integration. The goal is that the chip can output two channels of event stream signals and high-quality traditional image signals to meet application scenarios that require two types of signals, mostly consumer electronics. Therefore, our application goals and technical logic are quite different."

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Counterpoint: Smartphone Rear Cameras Resolution Grows, Front Resolution Stays Flat

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Counterpoint publishes a report on smartphone camera resolution trends:

"Despite supply shortages, smartphone rear cameras are increasingly adopting high-resolution image sensors, which continue to penetrate lower-end smartphone segments. According to the latest research from Counterpoint Smartphone Camera Tracker, smartphones featuring rear main cameras powered by 48MP and above megapixels accounted for 43% of total sales in Q2 2021, rising significantly from 38.7% in Q1 2021. The share of 64MP alone increased 3.5% QoQ to 14% in Q2 2021.

Commenting on this high-resolution advance, Senior Analyst Ethan Qi said, “48MP and 64MP have become the mainstream for models priced between $200 and $400, while flagship smartphones resort to large-area sensors to deliver a DSLR-like professional performance, of which 50MP is the most adopted. Although the share of 108MP fell to 3.1% in Q2 2021, the more affordable 0.7µm-based 108MP sensors continue to spread to mid-range models from OEMs such as Redmi and realme.”

On the other hand, low-resolution sensors continue to suffer from the demand-supply imbalance, with the price increasing sharply. For instance, 5MP sensors have experienced more than a 10% increase in cost since the beginning of this year.

Nevertheless, entry-level smartphones (wholesale price below $100) continue to upgrade their rear primary cameras from 8MP and below resolutions to 12MP or 13MP. Therefore, the collective share of the 8MP and below cameras shrunk to 5.9% in Q2 2021.

In front main cameras, the collective share of 20MP and above resolutions almost stayed flat QoQ in Q2 2021 due to the decline in sales of high-end models. However, we expect the resolution of the front-facing camera to continue to improve with more high-end smartphones adopting 32MP and even 48MP image sensors.

Meanwhile, the share of 8MP and below resolutions further increased to 45.2%, with 5MP and 8MP together accounting for 41.7% on strong demand for low-end smartphones in Q2.
"

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Gigajot CTO Gets EDS Early Career Award

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IEEE Electron Design Society presents 2021 Early Career Award to Gigajon CTO and co-founder Jiaju Ma:

Jiaju Ma is a pioneering inventor and entrepreneur in the field of CMOS image sensor and Quanta Image Sensor. Ma is the co-inventor and designer of the first CMOS image sensor pixel devices with deep sub-electron read noise that enables photon counting and photon-number resolution without using electron multiplication, generally referred to as a Quanta Image Sensor (QIS). 

The low-noise photon-counting pixel device that Ma co-invented and developed is being commercialized at Gigajot Technology (Pasadena, CA), a startup co-founded by Ma. Because of its superior low-light imaging capability, high resolution and high dynamic range performance, this technology is considered an enabling technology for advanced scientific, space, and defense applications.

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Black Phosphorus Vision Sensor

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University of Washington, Seattle, publishes an Arxiv.org paper "Programmable black phosphorus image sensor for broadband optoelectronic edge computing" by Seokhyeong Lee, Ruoming Peng, Changming Wu, and Mo Li.
"Image sensors with internal computing capability enable in-sensor computing that can significantly reduce the communication latency and power consumption for machine vision in distributed systems and robotics. Two-dimensional semiconductors are uniquely advantageous in realizing such intelligent visionary sensors because of their tunable electrical and optical properties and amenability for heterogeneous integration. Here, we report a multifunctional infrared image sensor based on an array of black phosphorous programmable phototransistors (bP-PPT). By controlling the stored charges in the gate dielectric layers electrically and optically, the bP-PPT's electrical conductance and photoresponsivity can be locally or remotely programmed with high precision to implement an in-sensor convolutional neural network (CNN). The sensor array can receive optical images transmitted over a broad spectral range in the infrared and perform inference computation to process and recognize the images with 92% accuracy. The demonstrated multispectral infrared imaging and in-sensor computing with the black phosphorous optoelectronic sensor array can be scaled up to build a more complex visionary neural network, which will find many promising applications for distributed and remote multispectral sensing."

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SWIR Sensor Startup Trieye Raises $74M, Total $96M in 4 Years

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EETimes-Europe, i-Micronews, PRNewsWire: Israeli CMOS-based SWIR sensor sturtup Trieye raises $74M in a new financing round rringing its total raised capital to $96M in 4 years. The new investment will be used to commercialize SEDAR (Spectrum-Enhanced Detection And Ranging) sensor for ADAS and AV. SEDAR generates a 3D point cloud using pulsed illumination methodology.

SWIR is unique in that, from a physics standpoint, most materials exhibit their spectral differences primarily in the SWIR range – in other words, SWIR cameras can sense the differences between various materials and make them visible,” says Avi Bakal, CEO and co-founder of TriEye. “This is because every material has a unique spectral response, or signature, defined by its chemical composition and physical characteristics, impacting how wavelengths are absorbed or reflected. By comparing the relative reflection of light between different materials in carefully chosen spectral bands, a distinction between materials is easily revealed. Simply put, SWIR reveals critical sensing information which simply does not exist in other wavelengths.

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Forza Reports Mastering BSI Process for its High Speed Imagers

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BusinessWire: While BSI sensors have been available for more than 10 years in many cellphones and standard digital cameras, the manufacturing process is inherently more difficult than comparable FSI sensors as it requires additional manufacturing steps. The realities of semiconductor economics have also made it difficult to transfer the technology from the high production volumes of standard cameras to the lower volumes of high-speed imaging sensors.

Overcoming these issues, Forza Silicon leveraged its Integrated Production Services (IPS) capabilities to optimize the manufacturing process for BSI sensors and achieve practical yields.

These in-house services include prototype and wafer probe development, qualification services, yield optimization, and production test and delivery,” says Loc Duc Truong, VP of Engineering, Forza Silicon. “Together, these capabilities have enabled us to overcome the manufacturing challenges associated with BSI sensors.

The high-speed BSI sensor design is the result of a collaboration between Forza Silicon and Vision Research.

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OmniVision Unveils Its First RGBC Sensor With Always-on Capability for Selfie Cameras

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BusinessWire: OmniVision announces the OV32C, a RGBC 32MP image sensor in a 1/3.2-inch optical format for front-facing mobile phone “selfie” cameras.  The OV32C’s low power modes can help enable “always-on” user experiences by facilitating AI processing to automate many of the common tasks of the camera, such as face detection, QR code scans, etc.

Image sensors for front facing ‘selfie’ cameras are expected to grow 4.7% CAGR over the next five years, with smartphone front camera image sensor revenues reaching US$4.4 billion by 2026,” says Pierre Cambou, principal analyst, Imaging at Yole Développement. “Stacking technology is giving more degree of freedom to image sensor designers to embed advanced pre-ISP algorithms; this could be a game changer for RGBC sensors by solving the difficulties of their non-Bayer arrangement. Adding ‘always-on’ smart capabilities to phone cameras will bring a new level of ergonomics and performance to the phone’s user interface.

The OV32C is our first sensor for the mobile phone market to feature RGBC―providing a 50% boost in overall sensitivity to enhance low-light image quality. Additionally, we’ve reduced design complexity for OEMs with an on-chip RGBC-to-Bayer fusion algorithm, therefore, a separate RGBC processing unit isn’t required,” says Arun Jayaseelan, staff marketing manager at OmniVision.

The OV32C is built on 0.7µm PureCel Plus-S pixel. RGBC technology uses a 4-cell color filter pattern with clear pixels and on-chip RGBC-to-Bayer fusion. It supports CPHY and DPHY interfaces and can output 15 fps at 32MP, or 30 fps at 8MP with on-chip fusion, for premium video and image quality. The OV32C also offers dual DOVDD support at 1.8 and 1.2 volts.

Samples of the OV32C are available now.

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Tower Semi Updates on its Imaging Business

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SeekingAlpha: Tower Semi Q3 earnings call gives an update on the company's imaging business:

"Our imaging business represented more than 15% of our revenues. We continue to see very strong demand in the industrial and machine vision markets, as well as the medical and dental X-ray markets. Our customers in these areas are highly interested in securing capacity for the coming years, seeing long-term market demand.

We recently partnered with the University of Southern California to announce a breakthrough development in LiDAR IC technology designed for advanced driver assistance systems, and ultimately self-driving cars.

Our stitch field sensors is very high margin. Overall the imaging margins are very strong. Even non-stitch field imaging margins are very strong..."

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It’s Official Now: TSMC-Sony Fab in Japan

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Sony and TSMC jointly announce: TSMC and Sony Semiconductor Solutions Corporation (“SSS”)  jointly announce that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.

Construction of JASM’s fab in Japan is scheduled to begin in the 2022 calendar year with production targeted to begin by the end of 2024. The fab is expected to directly create about 1,500 high-tech professional jobs and to have a monthly production capacity of 45,000 12-inch wafers. The initial capital expenditure is estimated to be approximately US$7 billion with strong support from the Japanese government.

Under definitive agreements reached between TSMC and SSS, SSS plans to make an equity investment in JASM of approximately US$0.5 billion, which will represent a less than 20% equity stake in JASM. The closing of the transaction between TSMC and SSS is subject to customary closing conditions.

While the global semiconductor shortage is expected to be prolonged, we expect partnership with TSMC to contribute to securing a stable supply of logic wafers, not only for us but also for the overall industry. We believe that further strengthening and deepening our partnership with TSMC, which has the world’s leading semiconductor production technology, is extremely meaningful for the Sony Group,” says Terushi Shimizu, President and CEO of Sony Semiconductor Solutions.

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Pixart Expects Lower Sales

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Digitimes: PixArt Imaging expects to post sequential revenue decreases through December due mainly to uneven inventories across different chip types and tight foundry capacity supply, but is guardedly optimistic about its business prospects.

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Image Sensors Contribute 19% to Axcelis Revenue

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Axcelis reports that ion implanters for image sensor manufacturing contribute 19% to its 2020 revenue:

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Fight for Velodyne Control Continues

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BusinessWire: David Hall, Velodyne founder and the owner of 42.9% of the common stock, issued a statement:

"While we welcome the news of Brad Culkin's retirement from the Board, it does not remedy the fact that we believe Chairman Michael Dee continues to lead Velodyne Lidar down the path of financial ruin. During Mr. Dee’s tenure, Velodyne Lidar has fallen from its position as a global leader in lidar technology and innovation, and the Board has undertaken a series of anti-stockholder actions that has, in our view, resulted in insular corporate governance, troubling underperformance and strategic incompetency."

BusinessWire: Meanwhile, Velodyne announces a new CEO, Theodore “Ted” L. Tewksbury, instead of Anand Gopalan who has been heavily criticized by David Hall:

"Dr. Tewksbury is a proven technology executive with more than 30 years of leadership experience across a series of public and private companies. Dr. Tewksbury most recently served as Chief Executive Officer of Eta Compute, a leading provider of ultra-low power AI vision systems. Prior to Eta Compute, he held several chief executive and board positions at leading high-technology companies, including Entropic Communications and Integrated Device Technology. Dr. Tewksbury is an accomplished engineer, with a Ph.D. in electrical engineering from MIT. He has held a variety of engineering and management positions in his career, including introducing over 180 innovative new product families during his time at Maxim Integrated Products."


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Microsoft-China and Sony-Shanghai Partner on AI Camera Solutions

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Microsoft China and Sony Semiconductor Solutions (Shanghai) Ltd. announce a Partner Enablement Program to encourage China local qualified independent software vendors (ISV) and system integrators (SI) partners creating commercial AI camera-driven solutions, which combines Sony’s IMX500 AI-enabled sensor with Microsoft Azure’s AI technology capabilities to achieve AI processing on edge. As part of the partnership, Microsoft and Sony jointly launched Co-Innovation Labs in China for partners and enterprise customers in the areas of computer vision and video analytics, which offers access and facilities to build, develop, prototype and test solutions for partners and customers.


BusinessWire: Hanshow has announced a commercial AI camera-driven retail solution, developed through a collaboration with Microsoft and Sony. In a busy retail setting, staff are often unable to complete timely and accurate monitoring of product shelf status. This results in products being out-of-stock, improperly arranged, lost sales, unsatisfied customers, and unattractive store appearance. Meanwhile, customer flow analysis is crucial for retailers to better understand customer behavior in their stores including traffic, visited areas, customer paths, dwell time and loyalty.

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Nikon COOLPIX 300 retro review

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Launched in 1996, the Nikon COOLPIX 300 was more than just a digital camera. Sure it could capture 0.3 MP images, but also let you jot notes or record voice memos. In this retro review, I tried out the COOLPIX 300, 25 years after its launch!…

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Image Sensors Measure Water and Oil Quality

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Image sensors find use in quite unusual decices such as water quality meter and oil breakdown meter:

Theelec: Pixelplus develops a sensor for water quality measurement with Thewavetalk. Water quality measurement devices use lasers to measure whether there are unwanted particles inside the liquid. Pixelplus is developing a 3 level stacked chip that combines an image sensor, a water quality signal processor and a memory.


University of Las Palmas de Gran Canaria, Spain, publish an MDPI paper "Characterization of Dielectric Oil with a Low-Cost CMOS Imaging Sensor and a New Electric Permittivity Matrix Using the 3D Cell Method" by José Miguel Monzón-Verona, Pablo Ignacio González-Domínguez, Santiago García-Alonso, and Jenifer Vaswani Reboso.

"In this paper, a new method for characterizing the dielectric breakdown voltage of dielectric oils is presented, based on the IEC 60156 international standard. In this standard, the effective value of the dielectric breakdown voltage is obtained, but information is not provided on the distribution of Kelvin forces an instant before the dynamic behavior of the arc begins or the state of the gases that are produced an instant after the moment of appearance of the electric arc in the oil. In this paper, the behavior of the oil before and after the appearance of the electric arc is characterized by combining a low-cost CMOS imaging sensor and a new matrix of electrical permittivity associated with the dielectric oil, using the 3D cell method. In this way, we also predict the electric field before and after the electric rupture. The error compared to the finite element method is less than 0.36%. In addition, a new method is proposed to measure the kinematic viscosity of dielectric oils."

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David Stoppa and Matteo Perenzoni to Lead Sony Technology Center in Italy

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As reported earlier, Sony opens a new Technology Development Center in Trento, Italy. The LinkedIn records reveal that leaders of the new center are SPAD experts David Stoppa and Matteo Perenzoni:

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TSMC Publishes Noise Data for Pixel-Level Stacked Circuits

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TSMC publishes an IEEE Journal on Electron Device Society paper "Statistical Analysis of Random Telegraph Noises of MOSFET Subthreshold Currents Using a 1M Array Test Chip in a 40 nm Process" by Calvin Yi-Ping Chao; Meng-Hsu Wu; Shang-Fu Yeh; Chin-Hao Chang; Chi-Lin Lee; Chin Yin; Kuo-Yu Chou; Honyih Tu that has an interesting noise data for pixel-stacked circuits that operate at pA currents per pixel:

"It is difficult to measure the random telegraph noises (RTN) of MOSFET subthreshold currents at the sub-pA level directly and accurately. In this work, we used a charge integration method similar to the operation of the CMOS image sensors (CIS) to characterize the RTN of subthreshold currents approximately from 1 fA to 1 nA, using a test chip of 1M cell array in a 40 nm process. We found that each RTN trap was active only within a specific window of gate voltages. The trap became less active or inactive outside the corresponding window of operations. We showed that the sets of RTN-active devices under different gate voltages were different. Furthermore, the choice of sampling frequency in measuring RTN and the number of sampled data points determined the observable range of RTN emission and capture time constants. For the data measured by sampling periods of 3.82 s, 299 ms, and 372 μs , different sets of RTN traps were observed with different spans of time constants. The combined time constants range was about 7 orders of magnitude. For single-trap RTN, we found and verified a relation between the probability of trap occupancy (PTO) and the ratio of root-mean-square random noise (RN) versus the RTN amplitude."

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Tsuzuri Project to donate high-resolution facsimile of The Wind and Thunder Gods screens to Kenninji Temple in Kyoto Prefecture

Newsroom | Canon Global        Go to the original article...

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Yole on Thermal Imaging Market

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Yole Developpement: In 2020, thermal imaging and sensing took center stage in the fight against COVID-19. After an Elevated Body/Surface Temperature (EBT/EST) camera sales gold-rush for a great many manufacturers, the demand finally fell in late 2020 and is returning to normal through 2021. The overall thermal imaging market is expected to decrease from $6.6B in 2020 to $6.2B in 2021, settling at a higher revenue point than prepandemic levels. However, a 7.2% CAGR from 2021 to 2026 could make the market climb to $8.8B.

In 2020, Chinese thermal imager manufacturers supplied thermal imagers en masse, mainly due to the EBT/EST applications, and more than doubled their shipment market share in going from 18% in 2019 to 39% in 2020. The market had grown significantly YoY 2019-2020, with every stakeholder profiting. Chinese players reaped more fruit due to their technology ramp-up in the last few years in conjunction with the strong appetite for fever detection cameras, especially in the domestic market, which was more widely accepted than in western countries.

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Eric Fossum, ON Semi, and Kodak Receive Emmy Award for Inventing and Pioneering the Intra-Pixel Charge Transfer CMOS Sensor

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Dartmouth, ON Semi, Yahoo: At the 72nd Annual Technology & Engineering Emmy Awards today, Eric Fossum, ON Semi, and Kodak will be honored for inventing and pioneering the intra-pixel charge transfer CMOS image sensor.

Eric Fossum invented the CMOS active pixel sensor with intra-pixel charge transfer while working at the JPL at Caltech. The technology was further developed by spinoff Photobit and Photobit's partner, Eastman Kodak. Both Eastman Kodak and ON Semiconductor, which acquired yet another spinoff of the Photobit technology via Aptina, will also be honored.

"I am very happy to see the Emmy on my shelf because it reminds me of how new technology can take unexpected turns, and how much the CMOS image sensor technology has benefitted society," said Fossum, who already received his statuette in the mail. "I want to recognize my team members at JPL and at Photobit, and the efforts of thousands of engineers around the world that further improved the technology, although the early JPL inventions remain the basis of the six billion CMOS image sensors made each year."

"One other surprise was learning about the 70-plus year-old design of the statuette. The name 'Emmy' invokes the nickname 'Immy' for old image orthicon vacuum-tube cameras, while the figure represents the arts and its muse, and the atom she holds represents the electrons of television technology. What an exquisite way to express the creative symbiosis of the arts and technology," adds Eric Fossum.

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Canon’s Cinema EOS System celebrated 10-year anniversary

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Omnivision Improves Resolution of its Sensor for Endoscopes

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BusinessWire: OmniVision announces the OVMed OH0FA image sensor and OAH0428 bridge chip for endoscopes and catheters. The OH0FA sensor provides 720x720 resolution at 30 fps, said to be the highest available resolution for ENT, cardiac, arthro, OB-GYN and utero-renal endoscopes.

The OH0FA’s resolution of 720x720 represents a dramatic increase over the previous generation sensor, the OVM6946, at 400x400. The OH0FA area is a 0.93x0.93 mm in a 1/18 inch optical format. Its 1.008 µm pixel size is built on OmniVision’s PureCel Plus-S pixel technology. This next-generation pixel technology also provides the high color fidelity and signal-to-noise ratio of 37.5 dB for crisper images. Additionally, PureCel Plus-S enables the OH0FA’s high full-well capacity, zero blooming and lower power consumption. A version of the OCHFA, based on OmniVision’s CameraCubeChip technology, will be launched soon for single use endoscopes.

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Assorted Videos: GPixel, National Tsing Hua University, Hort-Eye

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GPixel CMO Wim Wuyts talks about the company's solutions for 3D imaging:


IEEE Sensors publishes a 2012 presentation "Linear CMOS Image Sensor with Time-Delay Integration and Interlaced Super-Resolution Pixel" by Jui-Hsin Chang, Kuo-Wei Cheng, Chih-Cheng Hsieh, Wen-Hsu Chang, Hann-Huei Tsai, and Chin-Fong Chiu from National Tsing Hua University, Taiwan:


University of Melbourne and Hort-Eye Pte. publish a video "Multispectral Image Sensors using Metasurfaces" by Ranjith Unnithan:

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Fujifilm INSTAX Link Wide review

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The Fujifilm INSTAX Wide Link is a portable instant photo printer that connects to your phone over Bluetooth and prints any picture onto the largest INSTAX Wide paper. Find out if it's the best instant photo printer in my review!…

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ON Semi on 1.1um Pixel Spatial Resolution Measurements

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ON Semi presents at Conference: Electronic Imaging 2018, Burlingame, CA, "Characterization of Image Sensor Resolution by Single Pixel illumination" by Victor Lenchenkov, Orit Skorka, Robert Gravelle, Ulrich Boettiger, and Radu Ispasoiu. Few slides:

"Illumination single 1.1 um pixel provide information for image sensor PSF and MTF and can be used for image processing and simulation calibration. Measurements PSF across image plane could result in image correction as function of image height."


One can see that microlens layer gives quite a marginal MTF improvement in 1.1um pixel measurements:

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Microsoft iToF Camera Model

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Microsoft publishes an Optics Express paper "Time-of-flight camera characterization with functional modeling for synthetic scene generation" by Sergio Ortiz, Mukhil Azhagan Mallaiyan Sathiaseelan, and Augustine Cha.

"In this manuscript, we design, describe, and present a functional model of Time-of-Flight (ToF) cameras. The model can be used to generate randomized scenes that incorporate depth scenarios with various objects at various depths with varied orientations and illumination intensity. In addition to the potential to generate any random depth scenario, the camera, pixels, and binning are modelled incorporating radial distortion based on camera intrinsic and extrinsic. The model also includes ToF artifacts such as Signal Noise, Crosstalk and Multipath. We measured experimentally the Noise in Time-of-Flight. We experimentally fitted, and simulated with state-of-the art Simulator the Crosstalk effect, and characterized multipath according with the existing literature. Our work can be used to generate as many images as needed for neural network (NN) training and testing. The proposed approach can also be used to benchmark and evaluate both End-to-End ToF algorithms as well as specialized algorithms for denoising, unwrapping, crosstalk, and multipath correction."

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