Yet Another Auto-Generated Image Sensor Paper

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MDPI publishes a paper "Human Body-Related Disease Diagnosis Systems Using CMOS Image Sensors: A Systematic Review" by Suparshya Babu Sukhavasi, Susrutha Babu Sukhavasi, Khaled Elleithy, Shakour Abuzneid, and Abdelrahman Elleithy from University of Bridgeport, CT, and William Paterson University, NJ. This time, the authors are pretty open about the process of the paper creation:

"This systematic review used PRISMA workflow for study selection methodology, and the parameter-based evaluation is performed on disease diagnosis systems related to the human body’s organs. The corresponding CIS models used in systems are mapped organ-wise, and the data collected over the last decade are tabulated."

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Yet Another Auto-Generated Image Sensor Paper

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MDPI publishes a paper "Human Body-Related Disease Diagnosis Systems Using CMOS Image Sensors: A Systematic Review" by Suparshya Babu Sukhavasi, Susrutha Babu Sukhavasi, Khaled Elleithy, Shakour Abuzneid, and Abdelrahman Elleithy from University of Bridgeport, CT, and William Paterson University, NJ. This time, the authors were pretty open about the process how this paper has been generated:

"This systematic review used PRISMA workflow for study selection methodology, and the parameter-based evaluation is performed on disease diagnosis systems related to the human body’s organs. The corresponding CIS models used in systems are mapped organ-wise, and the data collected over the last decade are tabulated."

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ISSCC 2021 Presentations On-Line: Mojo Vision’s Augmented-Reality Smart Contact Lens

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One of the most inspiring presentations at ISSCC 2021 is Mojo Visions "34.2 - A 21pJ/frame/pixel Imager and 34pJ/frame/pixel Image Processor for a Low-Vision Augmented-Reality Smart Contact Lens." 

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Strategy Analytics: Market Share Gap between Sony and Others is Shrinking

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BusinessWire. Strategy Analytics publishes the  report “Smartphone Image Sensor Market Share Q4 2020: Sony Takes Top Spot But Sees Drop in Share:”

"The global smartphone Image sensor market recorded total revenue of $15 billion in CY 2020.

The overall smartphone image sensor market experienced a revenue growth of 13 percent year-over-year in 2020. Sony managed to take the first position in the smartphone image sensor market with 46 percent revenue share followed by Samsung System LSI and OmniVision Technologies in CY 2020. The top-three vendors captured almost 85 percent revenue share in the global smartphone image sensor market in 2020. The major CIS vendors drove the sales of high-resolution image sensors to customers.

Jeffrey Mathews, Senior Analyst at Strategy Analytics says, “The pandemic did little to dent the image sensor market growth as CIS vendors observed strong demand from smartphone OEMs who aggressively adopted high-resolution sensors and higher sensor count across smartphone tiers in 2020. Samsung, OmniVision and SK Hynix continued to take share from Sony as the vendor lost key business owing to sanctions on Huawei. We expect Sony’s market dominance will be increasingly threatened by the rising competition in the smartphone image sensor market.

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Unispectral Announces IR Spectral Camera

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Unispectral launches its new Monarch spectral IR camera. Monarch is said to be the first low-SWaP (size, weight & power) spectral camera on the market, suitable for immediate use or by integration in OEM platforms or application developers. 

The low-cost Monarch simplifies spectral imaging and eliminates the need for expensive, bulky, complicated and sensitive equipment, or limited spectrometers. Monarch consists of the Unispectral proprietary tunable Fabry–Pérot filter (μFPF), integrated with a miniature IR camera module, all fit into a slim 60x40x14.5mm, 30gr camera. For operation, controls and display. The camera captures and immediately outputs multiple detailed, single-band, NIR images within the 680nm-940nm wavelengths spectral range.

Ariel Raz, CEO of Unispectral said, “Today we rollout the first mass-market spectral camera. With the Monarch, Unispectral creates a brand-new market segment of spectral IR imaging for agriculture and other industries. The 30-gram camera works anywhere, in conjunction with Android Smartphones or PC.

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Smartsens Unveils 4MP 2.9um Pixel Sensor from AI Family

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SmartSens launches a 4MP sensor in its Advanced Imaging (AI) Series - 1/1.8-inch SC450AI featuring 2.9um pixel. The sensor is aimed to security cameras with embedded intelligence:

"According to the latest forecast report of the well-known market research company Omdia, although only 16% of cameras are equipped with AI-related technologies in 2020, it is expected that the number of AI cameras for security surveillance alone will surge by 58% by 2024, based on AI technology in the future The all-weather intelligent vision IoT system will do a lot.

Smartsens SC450AI using innovative process excellent high temperature can significantly improve the imaging performance of the CIS, in a high temperature environment of 80 deg. C, the resulting dark current with the specifications of other products than 51% reduction , while reducing 82% of the white point , so that The all-weather IoT AI camera smart vision device can continuously operate in a high temperature environment with better imaging status."

The new sensor is sampling now.

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Mass Market SWIR Spectroscopy is Coming?

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TI publishes a video showing the difference in SWIR spectra between different foods:


TrinamiX publishes a couple of videos demoing its SWIR spectrometer capabilities and applications:

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Quantum Dot Phototransistor for Neuromorphic Sensor

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Nature publishes a paper "A flexible ultrasensitive optoelectronic sensor array for neuromorphic vision systems" by Qian-Bing Zhu, Bo Li, Dan-Dan Yang, Chi Liu, Shun Feng, Mao-Lin Chen, Yun Sun, Ya-Nan Tian, Xin Su, Xiao-Mu Wang, Song Qiu, Qing-Wen Li, Xiao-Ming Li, Hai-Bo Zeng, Hui-Ming Cheng & Dong-Ming Sun from Institute of Metal Research, Chinese Academy of Sciences, Hefei University of Science and Technology of China, Nanjing University of Science and Technology, ShanghaiTech University, Shenyang Northeastern University, Nanjing University, Suzhou Institute of Nano-Tech and Nano-Bionics, and Tsinghua University.

"The challenges of developing neuromorphic vision systems inspired by the human eye come not only from how to recreate the flexibility, sophistication, and adaptability of animal systems, but also how to do so with computational efficiency and elegance. Similar to biological systems, these neuromorphic circuits integrate functions of image sensing, memory and processing into the device, and process continuous analog brightness signal in real-time. High-integration, flexibility and ultra-sensitivity are essential for practical artificial vision systems that attempt to emulate biological processing. Here, we present a flexible optoelectronic sensor array of 1024 pixels using a combination of carbon nanotubes and perovskite quantum dots as active materials for an efficient neuromorphic vision system. The device has an extraordinary sensitivity to light with a responsivity of 5.1e7 A/W and a specific detectivity of 2e16 Jones, and demonstrates neuromorphic reinforcement learning by training the sensor array with a weak light pulse of 1 μW/cm2."

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ISSCC 2021 Presentations On-Line: Sony FF Sensor with Sigma-Delta ADC

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It appears that all ISSCC 2021 videos, slides, and demos are available at underline.io site after a free registration. According to ISSCC, the presentation at Underline site are available till the end of March.

The slides below are from the presentation of Sony full-frame sensor with sigma-delta ADC and kTC noise reduction: "7.6 - A High-Speed Back-Illuminated Stacked CMOS Image Sensor with Column-Parallel kT/C-Cancelling S&H and Delta-Sigma ADC" by Chihiro Okada.

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IISW 2021 Announces the First Invited Paper

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International Image Sensor Workshop 2021 announces a name of the first invited paper: “Sensor Design Parameters Affecting Automotive Machine Vision” by Gabriel Bowers, Image Path Architect and Strategy at Mobileye.

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Almalence Extends its Superresolution Mode to Video

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Almalence publishes a demo of its SuperResolution and SNR boost in real-time at video frame rates:

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Ametek 1MP 76,000fps Sensor Whitepaper

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Ametek Vision Research publishes a white paper "Understanding How A BSI Sensor Has Advanced High-Speed Imaging" about 1280x720 pixel 76,000fps device powering TMX series of cameras. Few quotes:

"Embedding analog-to-digital converters (ADC) on CMOS image sensors is standard practice, but the BSI sensor’s speed required a massive increase in the amount of ADC. While modern CMOS image sensors typically have between 1,000 and 10,000 embedded ADC, the new BSI high-speed sensor has 40,000 ADC, each converting every 523 ns and generating a large amount of data to off-load from the sensor. To accomplish this task, it incorporates 160 high-speed serial outputs operating at greater than 5 Gbps. This technology is common on CPUs and FPGAs but new on a high-speed imaging sensor.

The density of ADC on the new sensor did create power management and electrical crosstalk challenges, which were solved with the help of our design and integrated production partner, Forza Silicon.

...testing of early designs revealed a higher level of ADC crosstalk in both normal imaging and binning modes than our simulation tools had predicted, causing noticeable artifacts in the images. Forza engineers discovered that the crosstalk exhibited predictable patterns and developed modeling techniques that helped us eliminate the crosstalk altogether, which in turn mitigated imaging artifacts.
"

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Ametek 1MP 76,000fps Sensor Whitepaper

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Ametek Vision Research publishes a white paper "Understanding How A BSI Sensor Has Advanced High-Speed Imaging" about 1280x720 pixel 76,000fps device powering TMX series of cameras. Few quotes:

"Embedding analog-to-digital converters (ADC) on CMOS image sensors is standard practice, but the BSI sensor’s speed required a massive increase in the amount of ADC. While modern CMOS image sensors typically have between 1,000 and 10,000 embedded ADC, the new BSI high-speed sensor has 40,000 ADC, each converting every 523 ns and generating a large amount of data to off-load from the sensor. To accomplish this task, it incorporates 160 high-speed serial outputs operating at greater than 5 Gbps. This technology is common on CPUs and FPGAs but new on a high-speed imaging sensor.

The density of ADC on the new sensor did create power management and electrical crosstalk challenges, which were solved with the help of our design and integrated production partner, Forza Silicon.

...testing of early designs revealed a higher level of ADC crosstalk in both normal imaging and binning modes than our simulation tools had predicted, causing noticeable artifacts in the images. Forza engineers discovered that the crosstalk exhibited predictable patterns and developed modeling techniques that helped us eliminate the crosstalk altogether, which in turn mitigated imaging artifacts.
"

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Photon Pressure Detector Array

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Science Advances publishes a paper "On-chip torsion balances with femtonewton force resolution at room temperature enabled by carbon nanotube and graphene" by Lin Cong, Zi Yuan, Zaiqiao Bai, Xinhe Wang, Wei Zhao, Xinyu Gao, Xiaopeng Hu, Peng Liu, Wanlin Guo, Qunqing Li, Shoushan Fan, and Kaili Jiang from Tsinghua University, Beijing Normal University, Beihang University, No. 58th Research Institute of China Electronics Technology Research Group Corporation, Frontier Science Center for Quantum Information, and Nanjing University of Aeronautics and Astronautics. The paper presents a 4 x 4 array detecting photon pressure:

"The torsion balance, consisting of a rigid balance beam suspended by a fine thread, is an ancient scientific instrument, yet it is still a very sensitive force sensor to date. As the force sensitivity is proportional to the lengths of the beam and thread, but inversely proportional to the fourth power of the diameter of the thread, nanomaterials should be ideal building blocks for torsion balances. Here, we report a torsional balance array on a chip with the highest sensitivity level enabled by using a carbon nanotube as the thread and a monolayer graphene coated with Al nanofilms as the beam and mirror. It is demonstrated that the femtonewton force exerted by a weak laser can be easily measured. The balances on the chip should serve as an ideal platform for investigating fundamental interactions up to zeptonewton in accuracy in the near future."

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LiDAR News: Elmos, Ommatidia, Intel, Valeo, Scantinel, Luminar

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Elmos presents its solutions for LiDAR, including laser driver and SPAD imager:


Elmos 2019 presentation shows the company's SPAD sensor:

Ommatidia presents its lightfield sensor for high-resolution long-range 3D imaging:


EPIC meeting on LiDAR applications features a presentation about Intel FMCW LiDAR:


Valeo presents its short range wide VFoV AMCW LiDAR:


Scantinel presents its prototype FMCW product:


Luminar announces a strategic partnership with SAIC Motor, the largest automaker in China. Luminar is set to power the autonomous capabilities and advanced safety features in SAIC’s new R brand vehicles for series production. The R brand program is expected to begin series production with Luminar starting in 2022, with the parties’ longer-term goal being widespread standardization across all vehicle lines.

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TI Presents a Simplistic ToF System

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TI publishes a video "Intro to high speed comparators: ToF distance measurements with LVDS comparator" presenting an ultra-simple ToF system:

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Quantum Dot Galore

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SID Display Week 2021 has a special session devoted to quantum dot imagers:
  • 66.1 - High Resolution Quantum Dot Global Shutter Imagers
    Jonathan Steckel, Eric Mazaleyrat, Krysten Rochereau - ST Microelectronics Grenoble France
    Andras Pattantyus-Abraham - ST Microelectronics Santa Clara CA US
    Emmanuel Josse - ST Microelectronics Crolles France
    QD imagers cover visible to SWIR wavelengths at high resolution, high efficiency, and low dark currents.   They promise to significantly increase the now small SWIR-imaging market by means of 100-1000X lower prices.  Market opportunities include mobile devices, single point spectrometry, hyperspectral imaging, machine vision, and advanced driver assistance systems.
  • 66.2 - Invited Paper: QD-Based Sensors for Infrared Imaging
    Pawel Malinowski, Jiwon Lee, Epimitheas Georgitzikis, Vladimir Pejovic, Itai Lieberman, TungHuei Ke, Yunlong Li, Tom Verschooten, Steven Thijs, David Cheyns
    imec Leuven Belgium
    Quantum dot absorbers promise efficient photodetector components with sensitivity peak tunability. We describe monolithic integration of quantum dot stacks into infrared imagers with pixel pitch smaller than 2 um and sensitivity in the short-wavelength infrared (SWIR). This approach enables very high pixel densities leading to compact and accessible infrared camera systems.
  • 66.3 - Invited Paper: Colloidal QD Photodetectors for Large Format NIR, SWIR, and Extended SWIR Sensor Arrays
    Ethan Klem, Christopher Gregory, Jeffery Hilton
    SWIR Vision Systems Durham NC US
    An overview of our approach to fabricating QD focal plane arrays, will describe recent results achieving Vis-SWIR and extended wavelength SWIR sensitivity with spectral response from 350 nm to 2100 nm at HDTV resolutions of 1920x1080.  Imaging demonstrations of these sensors in a variety of applications are presented.
  • 66.4 - Invited Paper: Graphene Enhanced QD Image Sensor Technology
    Tapani Ryhänen - Emberion CTO Espoo Finland
    Mark Allen - Emberion Director Cambridge United Kingdom
    Alexander Bessonov - Emberion Chief Scientist Cambridge United Kingdom
    Combining colloidal quantum dots and graphene along with optimization of the measurement principles using CMOS read-out integrated-circuits according to the requirements of these nanomaterials achieves imaging devices with photoresponse from 400 nm to 2100 nm, having low noise at high frame rates.
  • 66.5 - Invited Paper: Colloidal Quantum Dots: A Material Platform for Highly Sensitive Photodetectors and High Quantum Efficiency Light Emitters in the SWIR
    Gerasimos Konstantatos
    ICFO Castelldefels Spain
    High performance SWIR photodetectors are achieved based on the synergism of colloidal quantum dots and 2D materials, including graphene and TMD semiconductors.  Also high efficiency infrared QD-LEDs with high radiance and exceptional stability were developed.  Finally measured tunable stimulated emission at high gains paves the way towards infrared QD lasers.
Thanks to PM for the link!

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ST ToF PC User Detection

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ST keeps finding creative use cases for its ToF sensors:

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Toshiba Announces New CCD

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BusinessWire: Toshiba reminds that CCDs are still alive with the new linear CCD announcement. The company launches TCD2726DG, a lens reduction type CCD linear image sensor that achieves high-speed scanning for A3 multifunction printers. Shipments of engineering samples have started on March 16.

There is growing demand for A3 multifunction printers with higher scanning speeds. TCD2726DG meets the demand by improving the performance with a faster operating clock rate: a 100MHz (50MHz x 2ch) data rate, against the 70MHz (35MHz x 2ch) data rate of Toshiba’s current sensor.

To prevent increased electromagnetic interference (EMI), a negative side effect of a faster clock rate, the new sensor incorporates a timing generator circuit and has a lower CCD driver pin count. This reduces EMI- and timing-adjustment work for customers, and the number of peripheral parts, contributing to easier system development.

Key Features:
  • 100MHz (50MHz x 2ch) data rate, CCD linear image sensor
  • Built-in Timing Generator circuit and CCD driver, facilitating system development
  • Low power consumption: 10V power supply voltage for amplifier circuit lowered to 3.3V (10V power supply is used partially. Dual power supply of 3.3V and 10V.)


A company video explains the differentiation of the new CCD:

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Sony Explains Advantages of its Polarization Sensors for Traffic Cameras

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Sony Intelligent Transport Systems (ITS) page has been updated to explain the advantages of its PolarSens sensors for face recognition on the roads:


Sony also publishes a video demo showing the improvement (and another one):

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Terranet and Mercedes-Benz Presents Quick Reacting Event-Based Camera System

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GlobeNewswireTerranet AB presents its ultra-fast VoxelFlow sensor technology in a joint presentation with Mercedes-Benz at STARTUP AUTOBAHN. VoxelFlow uses high-speed sensor technology so that autonomous driving (AD) and ADAS can quickly and accurately understand and decipher what's in front of them, enhancing existing radar, lidar, and camera systems that particularly struggle within 30 to 40 meters, when an accident is most likely to take place. 

VoxelFlow consists of three event cameras and a continuous laser scanner, whose simultaneous observations use triangulation to generate a 3D image within a matter of nanoseconds. The system is able to detect, track and trace that 3D image, in addition to specifying velocity, speed, direction and position. Unmatched in its field, VoxelFlow will generate the best way to perceive the motion of 3D objects in space, creating a new way of seeing within the automotive industry. The system cuts the reaction distance from six meters to twelve centimeters and will be 50 times faster than other existing technology. By significantly cutting down response time and generating an authentic view of the world around the vehicle, VoxelFlow will help ensure the safety of all those on the roadways.

At 250,000 voxels per second, VoxelFlow is already matching competitors in point density. Where current camera/laser technology is subject to delays in latency or deficiencies in image quality, VoxelFlow creates high-resolution, low latency images, moving beyond pixels to reimagine the world in voxels. Sensor technology designed specifically with AD/ADAS vehicles in mind, VoxelFlow’s low latency caters to object detection within 30-40 meters, it shortens the braking distance for the vehicle. Further, the hybrid event-based camera and laser approach, allows VoxelFlow to work across all forms of weather and during every time of day.


Terranet publishes a video about its event-based camera scanner technology:

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Mitsubishi to Launch 80×60 pixel Thermal Diode Infrared Sensor

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Mitsubishi Electric announces that its Mitsubishi Electric Diode InfraRed (MelDIR) sensor lineup will introduce on July 1, 2021 a new thermal sensor featuring a wide FoV and 80x60 pixel resolution for applications including security, heating, ventilation and air conditioning (HVAC), people counting, smart buildings and thermal scanners. The new MelDIR sensor accurately distinguishes between humans and other heat sources and enables the identification of specific human behavior, such as walking, running or raising hands.

This is the second generation of the MeIDIR sensors. The first one was announced in 2019.

The new sensor features:
  1. Wide field of view and high-pixel resolution
    Wide FoV (78°x53°) and high pixel (80x60) resolution support accurate processing of infrared data.
    Compared to the previous generation 80x32 pixel MelDIR, detection area is 2-4 times larger and thermal resolution of 100mK, or 0.1°C, is similar.
    Small pixel size of thermal diode infrared sensor achieves same package size as conventional 80x32 pixel MelDIR.
  2. Superior images achieved with faster frame rate and optimized sensitivity correction
    Compared to the previous generation 80x32 pixel MelDIR, frame rate is double and sensitivity correction is optimized for surrounding area for superior thermal images.
    Accurate identification of fast-moving heat sources supports crime prevention, people counting, animal detection, etc.
  3. User-support tools shorten development time
    Customers can use application samples, evaluation kit, reference codes and application-specific reference designs to support sample evaluations, product planning and product development.

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Omnivision’s Early Years

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SinaFinance publishes a biography of Datong Chen, Omnivision's Chairman, including the early ears on the company:

"In 1995, a coincidental opportunity came. A friend of Chen Datong wanted to start a company to develop image sensors using CMOS technology. He wanted to invite Chen Datong to be the co-founder. Chen Datong has never learned this technology. The other party even asked him to be the co-founder and take care of the most critical technology. This seems very incredible.

Later, Chen Datong thought that it should be because of two things:

One is that this friend had asked him for technical consultation before, and he got through and solved the problem in two or three weeks for the technology he hadn't touched, which proved his ability. The second is that he helped the other party a lot, and he didn't ask for it when they were paid.

In this way, in 1995, Omnivision Technology was established in Silicon Valley, USA, and Chen Datong became the co-founder, passively starting his first business venture in his life.

"At that time there were probably 20 or 30 companies like this in the world doing the same thing, but since they are all on this boat, do it hard."

In Omnivision's team, 80% of the engineers are Chinese, 80% of the Chinese are foreign students, and 80% of the foreign students are Tsinghua [University] graduates. The team is extremely creative and works very hard. Finally, they became the first company in the world to turn CMOS technology into a product.

This company has triggered an industrial revolution: through the commercialization of CMOS technology, the power consumption of image sensors has been reduced by several hundred times, making mobile phones usable as cameras.

In 2000, Omnivision Technology was listed on NASDAQ and successfully listed."

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Chronoptics Demos its ToF Multipath Reduction

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Chronoptics publishes a demo of its multipath reduction ToF camera:

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Thesis on Current-Assisted Photonic Demodulator for ToF Sensor

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Hong Kong University of Science and Technology (HKUST) publishes a MSc thesis "Compact modeling of current-assisted photonic demodulator (CAPD) for time-of-flight CMOS image sensor" by Cristine Jin Delos Santos Estrada.

"A widely popular ToF sensor implementation is the current-assisted photonic demodulator (CAPD). While CAPD has been being used in ToF systems, its operation characteristics are difficult to predict because of a lack of a compact model describing its output current as a result of the incident light and modulating voltages. This problem further poses difficulty in establishing design considerations to achieve a good tradeoff in sensitivity, power, speed, and efficiency for such photonic demodulator.

In this work, a compact model for CAPD describing both the static and dynamic behavior of the device is proposed. An analytical expression relating the optical photogenerated current to the input bias and incident light intensity is derived by solving the continuity and drift-diffusion equations along the optical window of CAPD. The model has been extensively verified with numerical simulations, as well as with published experimental data."

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LiDAR News: Robosense, Aeye, Light.co, Ouster

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BusinessWire: Robosense shows its First Automotive-grade LiDAR Production Line in China:



BusinessWireAeye reports the independent validation of performance of its camera-LiDAR combo named iDAR:
  1. the AEye sensor was able to detect targets with a substantial number of points at a distance exceeding 1000 meters without compromising frame rate
  2. AEye’s sensor produced over 175 points on an 18% target at a distance of 200m, achieving the metric with 1600 points per degree squared
  3. iDAR achieved over 200Hz scan rate for full frame and field of view (FOV)
  4. the iDAR sensor works effectively behind a first-surface made of windshield glass material at a nominal thickness at various angles of incidence.
It's not clear what part of this performance comes from camera and what's from LiDAR part of the combo - everything is fused.


Light.co publishes a webinar of its Clarity comparing multi-camera setup with LiDAR:



An IP analytics blog LexisNexis believes that Ouster has the best quality of its LiDAR patents:

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PixelPlus Turns a Profit in 2020 for the First Time since 2015

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TheElec reports that "Pixelplus recorded 39 billion won in sales in 2020, a 10.6% increase from 2019. It recorded operating income of 800 million won, its first profit since 2015. China accounted for 55% of its sales, followed 25% from Taiwan."

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Curve Offers its Technology to Major Smartphone and Camera Brands

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French site Les Echos Entrepreneours publishes an interview with Emmanuel and Sébastien Hugot , tow brothers-founders of Curve startup in Marseille:

"It took ten years for Emmanuel Hugot to develop an industrial process for bending standard sensors. The technique is inspired by that of the manufacture of mirrors for astronomical telescopes , his original profession.

The patent , which originally belonged to the CNRS, was taken over by the company Curve . “Our approach works at over 96%, which considerably limits rejects,” explains Emmanuel Hugot. He claims to have already been approached by the main suppliers of cameras, the major brands of smartphones, as well as the players in the autonomous car market: camera manufacturers, car manufacturers… who also need better quality images."

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Nikkei: Huaian Imaging Device Manufacturer Corp. Collapsed?

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Nikkei Asian Review reports that "Huaian Imaging Device Manufacturer, which invested 12 billion yuan in a bid to make CMOS sensors for smartphone cameras" is "said to have essentially collapsed."

Huaian Imaging Device Manufacturer (HIDM) web site responds with "Error 403 - Forbidden." The company has been established in 2016 and signed a licensing agreement with ON Semi to manufacture consumer image sensors, such as 13MP AR1337:


A WIPO query PA:"HUAIAN IMAGING DEVICE MANUFACTURER CORPORATION" brings 1,224 patents and patent applications filed by the company, quite impressive number for any 4 year-old organization:


China Business Network newspaper tells the HiDM (德淮 or Dehuai) story. The project has been started by Li Ruiwei who also invested in Nanjing Dekema, another failed CIS fab:

"Dehuai Semiconductor was established in 2016 in Huaiyin District, with a total investment of 45 billion yuan, of which 12 billion yuan was invested in the first phase, covering an area of ​​257 acres, and planning to build an annual output of 240,000 12-inch CIS wafer fabs.

Zeng determined to "be China's No. 1 and No. 2 in the world, and pursue his dream to become a semiconductor manufacturer like Samsung."

However, after the project started, Li Ruiwei was "cleaned up" because he could not contribute funds, and the legal representative was changed to Xia Shaozeng.

According to the reporter's understanding, in order to make the project really land as soon as possible, Xia Shao once launched a fierce money offensive against party and government leaders such as Liu Zeyu, Sang Shaohuai, and Dong Huaichen in Huaiyin District, Huai'an City.

It is reported that before the Mid-Autumn Festival of 2017 and before the Spring Festival of 2019, Sang Shaohuai, a member of the Party Working Committee and Deputy Director of the Management Committee of Huai'an High-tech Zone, used his position to provide government investment, project approval and construction, incentives and tax rebates. Dehuai Semiconductor sought profit and received RMB 200,000 from Xia Shaozeng. Moreover, he took bribes in the Office of the Administrative Committee of Huai'an High-tech Zone.

In October 2019, Liu Zeyu was also subject to disciplinary inspection and supervision and investigation for suspected serious violations of discipline and law. At the end of 2019, Dong Huaichen, a director representing the government on the Dehuai Semiconductor Board of Directors, was also investigated. It is worth noting that Dong Huaichen was the person in charge of two state-owned enterprises, Huai'an Yuanxing Investment and Huaiyin City Assets, the main investment entity of the Huaiyin District Government.

It is reported that of the 4.6 billion yuan actually invested in the Dehuai project, 3.5 billion yuan is funded by the Huaiyin district government. The 1 billion yuan subscribed by the management of Dehuai Semiconductor is only 41 million yuan in place, and the 1 billion yuan for an employee shareholding platform is not in place.

Dehuai Semiconductor has also become lonely. In April 2020, the local Huaiyin District Government has dispatched a working group.According to Xu Yuquan, deputy director of the Dehuai Semiconductor Working Group Office, the company had nearly 1,000 employees, and currently only 78 are left behind. Currently, 57 sets of equipment are entering the site, and 154 sets of equipment have not entered the site. The chairman and general manager of Xia Shaozeng, and the deputy general manager in charge of finance have stayed in Taiwan, China for a long time and have not come back.

Xu Yuquan said that from the government level, he still wants to save the company. At present, the completion rate of the Dehuai Semiconductor project has reached 90%, and it is only a step away. You can find some projects with mature and stable technology in the market to start the project first."

The China Business Network article also mentions Zhongjing Aerospace Semiconductor founded in 2017:

"Jiangsu Zhongjing Aerospace once painted a beautiful blueprint for the Xuyi County government, planning two 8-inch CIS wafer fabs with an annual output of 240,000 pieces, integrating elements such as semiconductor towns, supply chain bases, and application education bases. The technical team mainly comes from the technical teams of famous semiconductor companies in Japan and Taiwan.

The reporter entered the plant of the project and found that the former plant had long been vacant, and only the plant on the east side still had some equipment. However, the above-mentioned people familiar with the matter said that these devices have been mortgaged to the bank and can't be moved even if they want to."

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Toppan Acquires Brookman to Enter ToF Sensing Market

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Toppan Printing acquires 89.1% of the outstanding stock of Brookman Technology, Inc., a venture company originating from Shizuoka University and engaged in the development and sales of CMOS image sensors. Brookman Technology is scheduled to be made a subsidiary of Toppan by the end of March this year.

Toppan entered into a capital and business tie-up with Brookman Technology in 2017, and the two companies have subsequently collaborated on research and development in the field of 3D image sensing. By making Brookman Technology a subsidiary, Toppan aims to bolster joint efforts and enable a full-scale entry into the growing 3D image sensing market.

Synergies will be generated by bringing together Brookman Technology’s track record in image sensor development and ToF sensor design technology with Toppan’s semiconductor circuit design capabilities. Obstacles to expansion of the use of 3D sensors include image lag and difficulties associated with outdoor use. Toppan aims to overcome these challenges and develop sensors suitable for practical application by taking advantage of Brookman Technology’s unique ToF sensor design capabilities for high-speed imaging, long-distance measurement, and disturbance tolerance.

Targeting prompt commercialization, the two companies will accelerate current joint research on 3D image sensing for autonomous robots and the game and augmented reality fields. The technology is also vitally important for generating data that maps the real world as part of Toppan’s digital transformation (DX) initiatives. It will therefore also be leveraged to drive existing DX operations and create new businesses centered on the use of ToF sensors.

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