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Sony publishes a white paper promoting its InGaAs SWIR sensors:
MIPI CSE Adds Functional Safety to Automotive Image Sensor Interface
December 5, 2021 By Leave a Comment
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MIPI Alliance has recently released the Camera Service Extensions (MIPI CSESM) v1.0 specification, which enhances the MIPI Camera Serial Interface 2 (MIPI CSI-2) image sensor interface with end-to-end functional safety and other features for automotive applications:
- A cyclic redundancy check (CRC-32) to detect data transmission errors, ensuring the image data captured by the sensor is accurate when received at the ECU
- A frame counter to detect frame loss or duplication, with its accuracy verified by the CRC, ensuring the continuity of video streams from cameras to ECU
- A message counter that can be used as a timeout checker to detect any loss of data caused by a stopped or stuck transmission between an image sensor and ECU
- Service Extension Packet (SEP) functionality is implemented over the entire PHY link, which provides packetization and uniform delivery of image data.
While the initial release of CSE provides the functional safety enabling features described above, the next version is already under development. CSE v2.0 will add security features to CSE_i and CSE_c, and will work with the upcoming MIPI Security specification to bring end-to-end security to the MASS framework. Version 2.0 is expected to be completed in mid-2022.
Pixart Unveils Distance Sensors
December 5, 2021 By Leave a Comment
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EETimes: Pixart launches Single-Axis Distance Sensor (SAS) product line based on the optical-geometric technology. There are two sensors in the new product line: PAC7088J1 is a middle-range version and PAC7088J2 is s short range one.
Photon Counting Camera Use Cases
December 4, 2021 By Leave a Comment
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Hamamatsu publishes a new flyer for its Orca-Quest qCMOS camera with example applications for its photon resolving capability:
Image Sensors and AI Processors
December 3, 2021 By Leave a Comment
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PRNewswire: Xailient announces face recognition AI for Sony's intelligent vision sensor IMX500 with 97.8% accuracy up to 3 meters distance. On the IMX500, Xailient claims to provide the world's most power-efficient Face Recognition AI.Shivy Yohanandan, Chief Scientist and co-founder of Xailient, says, "The IMX500 is a game-changer for the smart camera market. Delivering the image sensor and AI processing on a single chip has dramatic power efficiency benefits, which is important to extending battery life."
Ray Edwards, Xailient's VP of Market Development, says, "This should sell like hotcakes! Anyone building a smart camera system would be nuts not to consider the IMX500. This is the new standard."
SynSense and Prophesee announced a partnership. The two companies leverage their respective expertise in sensing and processing to develop ultra-low-power solutions for implementing intelligence on the edge for event-based vision applications.
The partnership combines in one single chip SynSense’s low-power vision SNN processor DYNAP-CNN with Prophesee’s event-based Metavision sensors, and is focused on developing a line of cost-efficient modules that can be manufactured at high volume.
“As IoT applications in smart homes, offices, industries and cities proliferate, there is an increasing need for more intelligence on the edge. Our experience in implementing neuromorphic enabled vision sensing with smart pixel methods complements SynSense’s expertise in neuromorphic processing to make implementing high performance vision more practical. Together we can drive the development of highly efficient, lower cost products that provide more visibility, safety and productivity in a wide range of use cases.” said Luca Verre, CEO and co-founder of Prophesee.
Image Sensors at ISSCC 2022
December 2, 2021 By Leave a Comment
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ISSCC publishes its 2022 Agenda. There are 13 image sensor-related papers:
- Charge-Domain Signal Compression in Ultra-High-Speed CMOS Image Sensors
Keiichiro Kagawa,
Shizuoka University, Hamamatsu, Japan - A 0.37W 143dB-Dynamic-Range 1Mpixel Backside-Illuminated Charge-Focusing SPAD Image Sensor with Pixel-Wise Exposure Control and Adaptive Clocked Recharging
Y. Ota, K. Morimoto, T. Sasago, M. Shinohara, Y. Kuroda, W. Endo, Y. Maehashi, S. Maekawa, H. Tsuchiya, A. Abdelghafar, S. Hikosaka, M. Motoyama, K. Tojima, K. Uehira, J. Iwata, F. Inui, Y. Matsuno, K. Sakurai, T. Ichikawa,
Canon, Kanagawa, Japan - A 64×64-Pixel Flash LiDAR SPAD Imager with Distributed Pixel-to-Pixel Correlation for Background Rejection, Tunable Automatic Pixel Sensitivity and First-Last Event Detection Strategies for Space Applications
E. Manuzzato, A. Tontini, A. Seljak, M. Perenzoni
Fondazione Bruno Kessler, Trento, Italy; Jozef Stefan Institute, Ljubljana, Slovenia - An 80×60 Flash LiDAR Sensor with In-Pixel Histogramming TDC Based on Quaternary Search and Time-Gated Δ-Intensity Phase Detection for 45m Detectable Range and Background Light Cancellation
S. Park, B. Kim, J. Cho, J-H. Chun, J. Choi, S-J. Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea; SolidVue, Suwon, Korea, Sungkyunkwan University, Suwon, Korea - A 38μm Range Precision Time-of-Flight CMOS Range Line Imager with Gating Driver Jitter Reduction Using Charge-Injection Pseudo Photocurrent Reference
K. Yasutomi, T. Furuhashi, K. Sagawa, T. Takasawa, K. Kagawa, S. Kawahito
Shizuoka University, Hamamatsu, Japan - A 1/1.57-inch 50Mpixel CMOS Image Sensor with 1.0μm All-Directional Dual Pixel by 0.5μm-Pitch Full-Depth Deep-Trench Isolation Technology
T. Jung, M. Fujita, J. Cho, K. Lee, D. Seol, S. An, C. Lee, Y. Jeong, M. Jung, S. Park, S. Baek, S. Jung, S. Lee, J. Yun, E. S. Shim, H. Han, E. Park, H. Sul, S. Kang, K. Lee, J. Ahn, D. Chang
Samsung Electronics, Hwasung, Korea - A 4.9Mpixel Programmable-Resolution Multi-Purpose CMOS Image Sensor for Computer Vision
H. Murakami, E. Bohannon, J. Childs, G. Gui, E. Moule, K. Hanzawa, T. Koda, C. Takano, T. Shimizu, Y. Takizawa, A. Basavalingappa, R. Childs, C. Cziesler, R. Jarnot, K. Nishimura, S. Rogerson, Y. Nitta,
Sony - A Fully Digital Time-Mode CMOS Image Sensor with 22.9pJ/frame∙pixel and 92dB Dynamic Range
S. Kim, T. Kim, K. Seo, G. Han,
Yonsei University, Seoul, Korea - A 64Mpixel CMOS Image Sensor with 0.56μm Unit Pixels Separated by Front Deep-Trench Isolation
S. Park, C. Lee, S. Park, H. Park, T. Lee, D. Park, M. Heo, I. Park, H. Yeo, Y. Lee, J. Lee, B. Lee, D-C. Lee, J. Kim, B. Kim, J. Pyo, S. Quan, S. You, I. Ro, S. Choi, S-I. Kim, I-S. Joe, J. Park, C-H. Koo, J-H. Kim, C. K. Chang, T. Kim, J. Kim, J. Lee, H. Kim, C-R. Moon, H-S. Kim,
Samsung Electronics, Hwaseong, Korea - A 200 x 256 Image Sensor Heterogeneously Integrating a 2D Nanomaterial-Based Photo-FET Array and CMOS Time-to-Digital Converters
H. Hinton, H. Jang, W. Wu, M-H. Lee, M. Seol, H-J. Shin, S. Park, D. Ham
Harvard University, Cambridge, MA; Samsung Advanced Institute of Technology, Suwon, Korea - A 0.8V Intelligent Vision Sensor with Tiny Convolutional Neural Network and Programmable Weights Using Mixed-Mode Processing-in-Sensor Technique for Image Classification
T-H. Hsu, G-C. Chen, Y-R. Chen, C-C. Lo, R-S. Liu, M-F. Chang, K-T. Tang, C-C. Hsieh
National Tsing Hua University, Hsinchu, Taiwan - Augmented Reality – The Next Frontier of Image Sensors and Compute Systems
C. Liu, S. Chen, T-H. Tsai, B. De Salvo, J. Gomez
Meta Reality Labs, Redmond, WA - Concepts, Architectures and Circuits for Sub-THz Sensing and Imaging
A. Stelzer,
Linz University, Linz, Austria
EDoF-ToF Paper
December 2, 2021 By Leave a Comment
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Rice University publishes an OSA Optica paper "EDoF-ToF: extended depth of field time-of-flight imaging" by Jasper Tan, Vivek Boominathan, Richard Baraniuk, and Ashok Veeraraghavan."Conventional continuous-wave amplitude-modulated time-of-flight (CWAM ToF) cameras suffer from a fundamental trade-off between light throughput and depth of field (DoF): a larger lens aperture allows more light collection but suffers from significantly lower DoF. However, both high light throughput, which increases signal-to-noise ratio, and a wide DoF, which enlarges the system’s applicable depth range, are valuable for CWAM ToF applications. In this work, we propose EDoF-ToF, an algorithmic method to extend the DoF of large-aperture CWAM ToF cameras by using a neural network to deblur objects outside of the lens’s narrow focal region and thus produce an all-in-focus measurement. A key component of our work is the proposed large-aperture ToF training data simulator, which models the depth-dependent blurs and partial occlusions caused by such apertures. Contrary to conventional image deblurring where the blur model is typically linear, ToF depth maps are nonlinear functions of scene intensities, resulting in a nonlinear blur model that we also derive for our simulator. Unlike extended DoF for conventional photography where depth information needs to be encoded (or made depth-invariant) using additional hardware (phase masks, focal sweeping, etc.), ToF sensor measurements naturally encode depth information, allowing a completely software solution to extended DoF. We experimentally demonstrate EDoF-ToF increasing the DoF of a conventional ToF system by 3.6 ×, effectively achieving the DoF of a smaller lens aperture that allows 22.1 × less light. Ultimately, EDoF-ToF enables CWAM ToF cameras to enjoy the benefits of both high light throughput and a wide DoF."
Sony – Qualcomm Joint Lab to Work on Image Sensor and Processing Optimizations
December 2, 2021 By Leave a Comment
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During the recent Qualcomm's mobile processor announcements, there was a part on establishing a joint lab with Sony in San Diego working on image sensor and processor co-optimization:
BAE Presents 12MP 240fps APS-C Sensor
December 1, 2021 By Leave a Comment
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BAE (Fairchild Imaging) presents 12MP 240fps APS-C sensor LTN4625A with global and rolling shutter modes:
Advantest Speeds Up its CIS Production Tester
December 1, 2021 By Leave a Comment
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GlobeNewswire: Advantest has begun shipping the fourth generation of its high-speed image-processing engine that applies heterogeneous computing technology to detect defects in the data output from CMOS image sensors. When integrated on the proven T2000 ISS platform, the new T2000 IP Engine 4 (Image Processing Engine 4) system provides the means of evaluating the latest high-resolution, high-speed CIS devices used in advanced smart phone cameras.The new T2000 IP Engine 4 features enhanced computing power to handle huge volumes of imaging data while also reducing test times and the cost of test. Used along with Advantest’s 4.8GICAP image capture module, the new tester can perform high-volume, at-speed testing of the most advanced mobile CIS including 3.5-Gsps C-PHY and 4.8-Gbps D-PHY devices. Image-processing accelerators enable fast testing of high-resolution CIS with more than 200MP.
Qualcomm Snapdragon 8 Gen 1 Camera Features
December 1, 2021 By Leave a Comment
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Qualcomm announces its next generation mobile processor Snapdragon 8 Gen 1:"Snapdragon Sight Technology includes the first commercial 18-bit mobile ISP, capturing over 4000x more camera data than its predecessor for extreme dynamic range, color, and sharpness at staggering speeds up to 3.2 gigapixels per second. This is also the first 8K HDR video capture in a mobile platform and it’s capable of capturing in the premium HDR10+ format that’s loaded with over a billion shades of color. Video will look even more stunning thanks to the new Bokeh Engine which adds beautiful soft backgrounds to videos; it’s like Portrait Mode for video capture. Snapdragon 8 also includes a fourth separate ISP, the new Always-On ISP, which allows the camera to run with extremely low power consumption so users can experience always-on face unlocking and locking if your face isn’t present for heightened privacy."
Tyrafos Raises "Hundreds of Millions of RMB" in Round A+
November 30, 2021 By Leave a Comment
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iNews, Lieyunwang, iFeng: Guangzhou Tyrafos (Chinese name Guangzhou Yinxin Semiconductor Technology Co., Ltd.) announces the A+ round of financing led by Yunqi Capital. By the end of this round of financing, Yinxin Semiconductor is expected to receive hundreds of millions of yuan in the near future.
Tyrafos also announces announced the release of "the world's first non-single photon dToF" (possibly, they mean dToF that is not based on SPADs) and ELISA molecular biological detection solution basedon image sensors.
"The world's first non-single-photon dToF released by Yinxin Semiconductor is the world's first technical solution to achieve direct ToF using CMOS process. Not only the accuracy and resolution are several times higher than the existing SPAD (Single Photon Avalanche Diode) solution. In addition, the overall power consumption of the laser light source at the transmitting end and the sensor at the receiving end has been reduced by 90%, catching up with the core technology of foreign manufacturers such as Apple and STMicroelectronics in this field, and the underlying architecture and circuit IP are independently developed by Yinxin Semiconductor, it solves the technical problem of the neck stuck in the field of 3D perception, and is a milestone breakthrough in the field of 3D perception."
"In the field of fingerprints under the optical screen, Yinxin Semiconductor adopts the innovative design of pixel architecture level to break through the area and cost limits. The chip area is 30%~50% smaller than that of competing products, and the module volume is more than half smaller than that of competing products. It has an ultra-high cost performance. Competitive advantage, in 2019, through cooperation with customers, it became the first optical under-screen fingerprint recognition solution certified by South Korea's Samsung mobile phone. At present, Yinxin Semiconductor has reached an agreement with 4-5 global leading fingerprint solution providers to purchase under-screen fingerprint chips. Intentional orders are expected to contribute hundreds of millions of yuan in revenue."
"The world's first digital ELISA molecular biological detection solution released by Yinxin Semiconductor is the world's first digital solution that directly performs molecular biological detection on the surface of an image sensor. Enzyme Linked Immunosorbent Assay (Enzyme Linked Immunosorbent Assay, abbreviated ELISA or ELASA) refers to a qualitative and quantitative detection method that combines soluble antigens or antibodies on solid-phase carriers such as polystyrene, and uses antigen-antibody specific binding for immunoreaction. . Taking advantage of the company's advantages in high-speed and high-sensitivity image sensors, Yinxin Semiconductor has created a complete set of micro-molecular biological detection equipment based on ELISA standards, achieving a zero breakthrough in this field, and surpassing the United States in detection accuracy and speed. NASDAQ listed company Quanterix (the core technology comes from the Harvard University technical team, the technology founder David Walt is an academician of the American Academy of Engineering and the Medical School, and is also the scientific founder of Illumina) SiMoA (Single-molecule Array) system, and Yinxin Semiconductor In terms of equipment cost and consumables cost, the digital ELISA technology of the company has a significant improvement over Quanterix's SiMoA system technology. The sensitivity of the digital ELISA technology is more than 1000 times higher than that of the traditional ELISA. Its appearance brings protein detection technology directly into the era of single-molecule and digital detection, becoming the true king in the field of fg-level ultra-low abundance protein detection. The optimization of detection accuracy, speed and cost is more conducive to application promotion. In the future, it will have great application potential in the fields of coronavirus detection, influenza virus detection, and early cancer screening."
Tyrafos has been established in May 2019 and its core team coming from TI, Omnivision, Samsung, Himax, TSMC, Mediatek, ASE, Foxconn, and Chi Mei. The company has >90 full-time R&D and operations employees. The core members of the team have 15-20 years experience in the semiconductor industry. The company names Sony and Samsung as its strategic partners, and TSMC, Samsung, and Tower as its foundries.
Sony Automotive Sensor Explained
November 30, 2021 By Leave a Comment
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Lucid Vision Labs publish an explanatory video about Sony IMX490 5.4MP automotive sensor:
Lucid Vision Labs also publishes a measured EMVA1288 performance of the sensor:
SWIR Quantum Dot Triodes
November 29, 2021 By Leave a Comment
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Nature paper "Silicon: quantum dot photovoltage triodes" by Wen Zhou, Li Zheng, Zhijun Ning, Xinhong Cheng, Fang Wang, Kaimin Xu, Rui Xu, Zhongyu Liu, Man Luo, Weida Hu, Huijun Guo, Wenjia Zhou & Yuehui Yu from Chinese Academy of Sciences and ShanghaiTech University presents a concept of 1550nm photodetector with internal gain:"Silicon is widespread in modern electronics, but its electronic bandgap prevents the detection of infrared radiation at wavelengths above 1,100 nanometers, which limits its applications in multiple fields such as night vision, health monitoring and space navigation systems. It is therefore of interest to integrate silicon with infrared-sensitive materials to broaden its detection wavelength. Here we demonstrate a photovoltage triode that can use silicon as the emitter but is also sensitive to infrared spectra owing to the heterointegrated quantum dot light absorber. The photovoltage generated at the quantum dot base region, attracting holes from silicon, leads to high responsivity (exceeding 410 A·W−1 with Vbias of −1.5 V), and a widely self-tunable spectral response. Our device has the maximal specific detectivity (4.73 × 1013 Jones with Vbias of −0.4 V) at 1,550 nm among the infrared sensitized silicon detectors, which opens a new path towards infrared and visible imaging in one chip with silicon technology compatibility."
SOL Presents its Lens-Free Sensor Solutions
November 29, 2021 By Leave a Comment
Actlight CEO Considers Selling the Company
November 28, 2021 By Leave a Comment
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Verve.vc publishes an interview with Serguei Okhonin, Actlight CEO and co-founder. Few quotes:
Q: So how does an IP company such as ActLight actually work?
A: We started with an idea and developed it up to the point where we could file patents. The goal, of course, is to license the technology to big semiconductor companies that integrate it into their offering, which they can eventually sell to the big consumer brands we all know. What we do is research and refine our technology to the point that we can provide potential customers with prototypes that should, ideally, convince them of the merits of our sensor. When we achieve this, our job is done. We then basically just provide support.
Q: Let me guess: Convincing big semiconductor companies isn’t that easy.
A: Our potential customers are global market leaders, they have tens of thousands of employees and decades of experience in their field. Now imagine that a small startup from Lausanne comes up to them and says: Look guys, our detector performs better than what you have developed. The first thing they tell you is: That’s impossible. It takes many meetings and a lot of time to convince them otherwise. And then, they do a very thorough due diligence. They will spend more than a year to ascertain the merits of new technology, it is a long process. But once they have done that, and decide to move forward, these companies move very quickly. They have the manpower, the infrastructure, the sales organization, the relationships with their customers… they can bring a product to the mass market at a speed that no startup can match.
Q: Where do you stand in the process you just described?
A: For an IP company like ActLight, the most important achievement is what I call the industrial proof of technology, which means, that a mass-market product incorporates the technology we have developed. We have achieved this milestone now. We licensed our technology to a semiconductor company, the number 1 worldwide, which is building a heart-rate monitor for hearable devices. Thanks to our invention, power consumption is drastically reduced and a high level of miniaturization is achieved. Working samples are already at end customers and, in 2022, mass production starts.
Q: With a use case that will hit the market soon and others that sound promising, ActLight must have appeared on the radar of tech companies by now.
A: After 10 years, we need to think about the future of the company, and there are basically two options. Do we want to grow and pursue more projects, or do we want to sell the company? Recently, we have started to get approached by potential buyers. Of course, such approaches out of the blue need to be examined very well, but it doesn’t surprise me that this happens now.
Q: Because of the traction or what you called industrial proof of technology?
A: Not only that, the M&A activity in the semiconductor industry is incredibly intense at the moment. The sector is red hot. Hardware stocks have reached new highs, and the shortage of semiconductors is talked about a lot. There is an urgency to invest that I haven’t seen in the past 3 decades, it’s insane.
TheBusinessTime publishes an article about Actlight in-ear vital signs monitoring solution.
Free Ebook: The Latest Development Trends in CMOS Image Sensors
November 27, 2021 By Leave a Comment
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Techinsights releases a free ebook "The latest development trends in CMOS Image Sensors." This is a recap of a presentation given by Ziad Shukri at IISW 2021:- the latest analysis and trends of CMOS image sensors - resolution, pixel pitch, chip stacking and die configuration
- active silicon thickness and pixel aspect ratio trends
- trends and comparative analysis on ToF sensors, including both Front- and Back-illuminated, as well as recent NIR-optimized sensors
- CIS trends for emerging applications and future challenges
Sony 32MP Sensor Uses 22nm Process
November 26, 2021 By Leave a Comment
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Sony IMX709 sensor used in the new Oppo Reno 7 smartphone front camera is claimed to be Sony's first sensor based on 22nm process:
Atomic Layer Deposition in Image Sensor Manufacturing
November 26, 2021 By Leave a Comment
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Yole Developpement report "ALD equipment market surging with 12% CAGR to reach $680M in 2026, penetrating all More-than-Moore applications" states that CIS is by far the largest market for Atomic Layer Deposition systems:
Samsung to Adopt CSP for Low Resolution Sensors
November 25, 2021 By Leave a Comment
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TheElec: Samsung is to use chip-scale packaging (CSP) to reduce the cost of its low resolution image sensors starting 2022, according to TheElec sources. Currently, Samsung uses chip on board (COB) approach for all sensors.
CSP is done at the wafer level, unlike COB, resulting in increased productivity and lower assembly clean room requirements.
The downside of CSP can only be done in lower resolution image sensors. Most higher resolution image sensors are manufactured with COB. TheElec sources say that CSP can support up to 2MP resolution at as of now.
Large Format 288MP Global Shutter Sensor
November 25, 2021 By Leave a Comment
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Korea-based company Syncron presents its first CIS product - 288MP sensor with 3.5um global shutter pixels. Syncron started a long time ago as a spin-off from Kodak Korea and specializes in high-speed and high-resolution industrial digital cameras. The company has been in machine vision camera distribution business, and the new DCS288M sensor appears to be its first CIS product.
Thanks to TL for the link!
Hynix Presents All-Directional PDAF Pixel
November 24, 2021 By Leave a Comment
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EETimes: SK Hynix presents A4C quad pixel PDAF technology:"The structure of the A4C sensor is shown in figure 1. Similar to the conventional Quad sensor, it has a photodiode that converts light into an electric current and a color filter that selectively absorbs certain light wavelength. Unlike the Quad sensor, however, its structure is made up of one micro lens on each group of four of the same color of pixels in the top left (TL), top right (TR), bottom left (BL), and bottom right (BR) corners.
Compared to existing PDAF technology, the A4C sensor can calculate disparity at every pixel. It means accuracy is high and that it can secure more than 10 times the accuracy in low-light environment of less than 10 lux. Unlike conventional PDAF technology, which leverages binocular disparity, the A4C sensor leverages the disparity of four pixels on the top and bottom and the left and right corners under the micro lens. Therefore, its focus detection performance of subjects of horizontal or vertical directions is outstanding. Video demonstrates the performance gap between a conventional AF and A4C AF."
Smartphone DxOMark Score vs Silicon Area
November 23, 2021 By Leave a Comment
Entropy-Based Anti-Noise Method
November 23, 2021 By Leave a Comment
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Harbin Institute of Technology, China, publishes MDPI paper "An Entropy-Based Anti-Noise Method for Reducing Ranging Error in Photon Counting Lidar" by Mingwei Huang, Zijing Zhang, Jiaheng Xie, Jiahuan Li, and Yuan Zhao."Photon counting lidar for long-range detection faces the problem of declining ranging performance caused by background noise. Current anti-noise methods are not robust enough in the case of weak signal and strong background noise, resulting in poor ranging error. In this work, based on the characteristics of the uncertainty of echo signal and noise in photon counting lidar, an entropy-based anti-noise method is proposed to reduce the ranging error under high background noise. Firstly, the photon counting entropy, which is considered as the feature to distinguish signal from noise, is defined to quantify the uncertainty of fluctuation among photon events responding to the Geiger mode avalanche photodiode. Then, the photon counting entropy is combined with a windowing operation to enhance the difference between signal and noise, so as to mitigate the effect of background noise and estimate the time of flight of the laser pulses. Simulation and experimental analysis show that the proposed method improves the anti-noise performance well, and experimental results demonstrate that the proposed method effectively mitigates the effect of background noise to reduce ranging error despite high background noise."
Review of Ge-on-Si SPADs for SWIR LiDAR
November 22, 2021 By Leave a Comment
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Heriot-Watt University and University of Glasgow publish Journal of Physics paper "Ge-on-Si single-photon avalanche diode detectors for short-wave infrared wavelengths" by Fiona Thorburn, Xin Yi, Zoe Greener, Jaroslaw Kirkoda, Ross Millar, Laura Huddleston, Douglas J Paul, and Gerald S Buller."Germanium-on-Silicon (Ge-on-Si) based single-photon avalanche diodes (SPADs) have recently emerged as a promising detector candidate for ultra-sensitive and picosecond resolution timing measurement of short-wave infrared (SWIR) photons. Many applications benefit from operating in the SWIR spectral range, such as long distance Light Detection and Ranging (LiDAR), however, there are few single-photon detectors exhibiting the high-performance levels obtained by all-silicon SPADs commonly used for single-photon detection at wavelengths < 1 μm. This paper first details the advantages of operating at SWIR wavelengths, the current technologies, and associated issues, and describes the potential of Ge-on-Si SPADs as a single-photon detector technology for this wavelength region. The working principles, fabrication and characterisation processes of such devices are subsequently detailed. We review the research in these single-photon detectors and detail the state-of-the-art performance. Finally, the challenges and future opportunities offered by Ge-on-Si SPAD detectors are discussed."
Adaptive Multiple Non-Destructive Readout for CCD
November 22, 2021 By Leave a Comment
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Universidad Nacional del Sur (Argentina), Fermi Lab (USA) and Tel Aviv University (Israel) publish an Arxiv.org paper "Smart readout of nondestructive image sensors with single-photon sensitivity" by Fernando Chierchie, Guillermo Fernandez Moroni, Leandro Stefanazzi, Eduardo Paolini, Javier Tiffenberg, Juan Estrada, Gustavo Cancelo, and Sho Uemura."Image sensors with nondestructive charge readout provide single-photon or single-electron sensitivity, but at the cost of long readout times. We present a smart readout technique to allow the use of these sensors in visible-light and other applications that require faster readout times. The method optimizes the readout noise and time by changing the number of times pixels are read out either statically, by defining an arbitrary number of regions of interest (ROI) in the array, or dynamically, depending on the charge or energy of interest (EOI) in the pixel. This technique is tested in a Skipper CCD showing that it is possible to obtain deep sub-electron noise, and therefore, high resolution of quantized charge, while dynamically changing the readout noise of the sensor. These faster, low noise readout techniques show that the skipper CCD is a competitive technology even where other technologies such as Electron Multiplier Charge Coupled Devices (EMCCD), silicon photo multipliers, etc. are currently used. This technique could allow skipper CCDs to benefit new astronomical instruments, quantum imaging, exoplanet search and study, and quantum metrology."
Facebook Files for a Patent on Polarization Sensor for AR Glasses
November 21, 2021 By Leave a Comment
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Facebook-Meta patent application US20210360132 "Stacked Image Sensor with Polarization Sensing Pixel Array" by Manoj Bikumandla, John Enders Robertson, and Andrew Matthew Bardagjy unveils the company's ideas for the sensor for its upcoming AR glasses:
InfiRay Announces World’s First 8um Pixel Microbolometer Sensor
November 20, 2021 By Leave a Comment
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A&S Magazine: InfiRay (former IRay, Chinese name Rui Chuang Wei Na) subsidiary Arrow presents a surveillance camera featuring world's first 2MP 8um pixel InfiRay microbolometer thermal camera combined with 4MP visible one. The 8um thermal sensor has been first announced in April 2021 and is integrated into a production camera now.
Counterpoint: Average 2021 Smartphone has More than 4 Cameras
November 19, 2021 By Leave a Comment
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Counterpoint Research reports that CIS content per smartphone will expand to an average of 4.1. Despite the global components crunch, CIS growth is expected to grow by double digits to reach almost 6bn units in 2021.
“A big driver has been triple-and-above main camera setups, which accounted for two-thirds of all smartphones sold during the first half,” notes Tarun Pathak, Counterpoint’s director of smartphone research. “What’s really interesting is where a lot of that growth is coming from – Africa, Latin America, India and other emerging markets. As we move through post-COVID upgrade cycles, especially in Android heavy markets, we’re seeing OEMs offer increasingly sophisticated camera hardware to their customers across all segments.”
“High-resolution has also been an area of focus, with 48MP-plus becoming standard. Again, we’re seeing emerging markets lead in growth; and 64MP is starting to become a major segment too. High-res is very important for what is the most hotly contested price band globally – the wholesale $100-$399 category. During the second quarter, two-thirds of devices were high-res and we expect further share increases for the full year.”
“If you’re a product manager today delivering a quad cam device, then you’re probably thinking of configuring wide + ultrawide + macro + depth. But the playing field changes quickly, and we’re likely to see macro and ultrawide merge, leaving room for even more options like telephoto or time-of-flight. Increasing choice and complexity is why algorithm development has become such a critical factor in the success of camera systems,” states Ethan Qi, Counterpoint’s lead camera components analyst.
Mediatek Dimensity 9000 Supports 320MP Sensors
November 19, 2021 By Leave a Comment
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TalkAndroid, GSMArena: Mediatek presents a 4nm Dimensity 9000 application processor for future smartphones with quite impressive imaging features:
