OmniVision three-layer stacked sensor

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From Businesswire --- "OMNIVISION Announces World’s Smallest Global Shutter Image Sensor for AR/VR/MR and Metaverse".

OmniVision has announced the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor. The OG0TB is the world’s smallest image sensor for eye and face tracking in AR/VR/MR and Metaverse consumer devices, with a package size of just 1.64mm x 1.64mm, it has a 2.2µm pixel in a 1/14.46-inch optical format (OF). The CMOS image sensor features 400×400 resolution and ultra-low power consumption, ideal for some of the smallest and lightest battery-powered wearables, such as eye goggles and glasses. Ultra-low power consumption is critical for these battery-powered devices, which can have 10 or more cameras per system. Their OG0TB BSI GS image sensor consumes less than 7.2mW at 30 frames per second (fps).



SANTA CLARA, Calif.--(BUSINESS WIRE)--OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor. The OG0TB is the world’s smallest image sensor for eye and face tracking in AR/VR/MR and Metaverse consumer devices, with a package size of just 1.64mm x 1.64mm, it has a 2.2µm pixel in a 1/14.46-inch optical format (OF). The CMOS image sensor features 400x400 resolution and ultra-low power consumption, ideal for some of the smallest and lightest battery-powered wearables, such as eye goggles and glasses.

“OMNIVISION is leading the industry by developing the world’s first three-layer stacked global shutter pixel technology and implementing it in the smallest GS image sensor with uncompromising performance,” said David Shin, staff product marketing manager – IoT/Emerging at OMNIVISION. “We pack all of these features and functions into the world’s smallest ‘ready-to-go’ image sensor, which provides design flexibility to put the camera in the most ideal placement on some of the smallest and slimmest wearable devices.” Shin adds, “Ultra-low power consumption is critical for these battery-powered devices, which can have 10 or more cameras per system. Our OG0TB BSI GS image sensor consumes less than 7.2mW at 30 frames per second (fps).”

The worldwide market for AR/VR headsets grew 92.1% year over year in 2021, with shipments reaching 11.2 million units, according to new data from the International Data Corporation (IDC) Worldwide Quarterly AR/VR Headset Tracker1. New entrants as well as broader adoption from the commercial sector will propel the market further as headset shipments are forecast to grow 46.9% year over year in 2022. In fact, IDC expects this market to experience double-digit growth through 2026 as global shipments of AR/VR headsets surpass 50 million units by the end of the forecast, with a 35.1% compounded annual growth rate (CAGR).

OMNIVISION is supporting the growing market for AR/VR headsets by introducing new products such as the OG0TB GS image sensor, which features the company’s most advanced technology:

 It is built on OMNIVISION’s PureCel®Plus-S stacked-die technology.

 It features a three-layer stacked sensor with pixel size at 2.2µm in a 1/14.46-inch OF to achieve 400x400 resolution.

 Nyxel® technology enables the best quantum efficiency (QE) at the 940nm NIR wavelength for sharp, accurate images of moving objects.

 The sensor’s high modulation transfer function (MTF) enables sharper images with greater contrast and more detail, which is especially important for enhancing decision-making processes in machine vision applications.

 The sensor supports a flexible interface, including MIPI with multi-drop, CPHY, SPI, etc.

The OG0TB GS image sensor will be available for sampling in Q3 2022 and in mass production in the 2H 2023.


PS: It is worth noting that Sony made a claim for "world's first 3 layer stacked CIS" back in 2017 after their ISSCC paper titled "A 1/2.3inch 20Mpixel 3-layer stacked CMOS Image Sensor with DRAM" (DOI: 10.1109/ISSCC.2017.7870268). The three layers consisted of photodiodes, DRAM memory, and mixed-signal ISP. But that was a rolling shutter sensor, whereas this one from OmniVision is a global shutter sensor. 

PPS: Readers of blog who know of any journal or conference publication about OmniVision's new design please share them in the comments below! 


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STMicro and trinamiX collaboration on face authentication

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https://www.yolegroup.com/industry-news/stmicroelectronics-and-trinamix-collaborate-on-behind-oled-face-authentication-solution-to-be-showcased-live-at-ifa-2022/

STMicroelectronics and trinamiX collaborate on behind-OLED face-authentication solution to be showcased live at IFA 2022

  • Companies will demonstrate full facial authentication solution for smartphone integration and for applications behind OLED screens
  • Solution combines high-performance near-infrared global-shutter image sensor from ST and sophisticated trinamiX algorithm
  • Certified for use in mobile payments according to IIFAA, AndroidTM, and FIDO standards


STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and trinamiX, a wholly owned subsidiary of BASF SE and pioneer of new biometric technologies, today announced their collaboration on a reference design for face authentication. The solution performs behind an OLED screen and on the security level required for mobile payments. A demonstration of this system will be first presented live at IFA 2022 in Berlin on September 2-6.

The joint development and reference design for smartphone OEMs is a full system implementation that integrates illumination, a camera module that combines ST’s global-shutter image sensor with enhanced near-infrared (NIR) sensitivity (VD56G3), and trinamiX’s patent-protected algorithms running on the processor. The system offers a contactless, fast, and reliable authentication method for integration into smartphones and other products requiring user authentication. The solution’s strength lies in a unique technology, which uses skin detection to verify a user’s liveness. In addition to verifying the user’s identity, it effectively differentiates between skin and other materials, to recognize fake presentations like photos, hyper-realistic masks, and deepfakes.

"The collaboration with ST provides us with very small, high-performance image sensors at a competitive price point. This is particularly important for our products in the consumer electronics sector," said Stefan Metz, Head of Smartphone Business Asia at trinamiX. “Furthermore, trinamiX Face Authentication can fully operate behind OLED while maintaining the highest security levels. If required, the high NIR sensitivity of ST’s image sensors supports the easy integration of our solution behind display.” According to Metz, smartphone manufacturers are thus offered a powerful, attractive package: “During the development of our smartphone reference design, we focused on particularly compact hardware sizes without compromising the performance.”

"ST’s advanced image sensors use the company’s process technologies that enable class-leading pixel size while offering both high sensitivity and low crosstalk, delivering significant improvements in performance, size, and system integration. The collaboration with trinamiX provides ST with additional opportunities to extend our support to technologies, use cases, and ecosystems addressing the thriving under-display market in Personal Electronics and beyond," said David Maucotel, Head of the Personal Electronics, Industrial and Mass Market Product Business Line at ST’s Imaging Sub-Group.

In 2021, trinamiX Face Authentication was approved for Android integration and certified according to the high biometric security requirements of Android Biometric Class 3, IIFAA Biometric Face Security Test Requirement, and FIDO Level C – the FIDO alliance’s soon-to-be top standard.

A demonstration of the joint system for face authentication will debut at IFA 2022, taking place in Berlin, Germany on September 2-6. Customer presentations as well as appointments during the fair can be requested at info@trinamiX.de.

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Fujifilm XH2 review

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The Fujifilm X-H2 is a high-end mirrorless camera with a new 40 Megapixel APSC sensor and 8k video. Check out my hands-on review so far!…

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Yole interview with OmniVision’s marketing director

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https://www.yolegroup.com/player-interviews/security-imaging-industry-omnivision-delivers-state-of-the-art-performance-products/

Security has become the largest CMOS image sensor market segment after mobile and computing devices. From 2021 to 2027, according to Yole Intelligence’s latest report, Imaging for Security 2022, revenue is expected to increase from $2.1 billion to $3.6 billion at a 9% Compound Annual Growth Rate (CAGR). 2020 and 2021 were exceptional years for the security CIS segment, and IP security cameras still provide a major growth opportunity. 



Security imaging is sustained by the growing need for security everywhere: in consumer, commercial, and infrastructure monitoring applications, driven by the increasing adoption of home Internet of Things (IoT) solutions, the demand for video analytics in retail and monitored buildings, the need for more touchless access control solutions, the development of public surveillance in cities and for critical infrastructure. The rise of video analytics, edge computing, and the development of AI vision processors enable a wider range of products.



Florian Domengie, Senior Analyst in the Imaging team at Yole Intelligence, had the opportunity to discuss with Devang Patel, Marketing Director of IoT/Emerging Segment at OMNIVISION, about the recent activities of the company and the current trends in the field of security imaging.

Florian Domengie (FD): Please introduce yourself and OMNIVISION to our readers.

Devang Patel (DP): I am OMNIVISION’s Marketing Director and have a long history in the semiconductor industry in various roles. My missions were dedicated to product management/planning, strategic marketing, and partnerships.
OMNIVISION is a global fabless semiconductor organization that develops advanced digital imaging, analog, and touch & display solutions for multiple applications and industries, including mobile phones; security and surveillance; automotive; computing; medical; and emerging applications. Its award-winning innovative technologies enable a smoother human/machine interface in many of today’s commercial devices.

FD: What new products has OMNIVISION released recently? Which applications are you targeting with these new products?
 

DP: From the security side, our company continues to be at the leading edge in providing discreet, energy-efficient power management solutions as well as the best interface protection products on the market. Indeed, thanks to the emergence of the Internet of Things (IoT), surveillance cameras are no longer limited to enterprise applications such as airports, train stations, banks, and office buildings. Instead, they have become an integral part of retail establishments, smart cities, and smart homes for the purpose of gathering and analyzing Big Data.
Here are a few examples of products developed by our experts:
 OMNIVISION’s OS03B10 CMOS image sensor brings high-quality digital images and high-definition (HD) video to security surveillance, IP, and HD analog cameras in a 3-megapixel (MP) 1/2.7-inch optical format (OF). The OS03B10 image sensor features a 2.5 micron (µm) pixel based on OMNIVISION’s OmniPixel®3-HS technology. The high-performance, cost-effective solution uses high-sensitivity frontside illumination (FSI) to detect objects better than the human eye for true-to-life color reproduction in bright and dark conditions.
 OMNIVISION’s OS02H10 is a 2.9µm, 1080p image sensor that provides a high-value option for adding the premium near-infrared (NIR) and ultra-low light performance of its Nyxel® and PureCel®Plus technologies to mainstream surveillance cameras. This sensor also offers multiple high dynamic range (HDR) options for the best quality 1080p still and video captures of fast-moving objects at 60 frames per second (fps). The OS02H10 provides a high-value option for adding premium near-infrared (NIR), ultra-low light, and HDR performance to high-volume, mainstream security systems with AI functionality. It also offers an ultra-low power mode that consumes 97.7% less power than the normal mode to support long battery life.
 OMNIVISION’s OS04C10 is a 2.0µm pixel, 4 MP resolution image sensor for both IoT and home security cameras. When paired with the designer’s selected platform, the OS04C10 can enable a system’s ultra-low power mode for battery-powered cameras with AI functionality. Additionally, it provides a high 2688 x 1520 resolution with a 16:9 aspect ratio while adding the premium NIR and ultra-low light, SNR1 performance of its Nyxel® and PureCel®Plus technologies. This sensor also offers multiple HDR options for the highest quality 4MP still and video captures of fast-moving objects at 60fps. The OS04C10 is built on the PureCel®Plus pixel architecture to achieve a superior low-noise design, providing an SNR1 that is 150% better than OMNIVISION’s prior-generation OV4689 4MP mainstream security sensor.


FD: There has been very significant growth in CMOS imaging products for the security market these last two years. How do you explain this evolution? What benefits do these bring to this market specifically?

DP: There are many factors. We see that the home security market is growing, including DIY battery-powered types of cameras. You can basically install them by yourself. The number of companies getting into this specific product line is growing.
The second factor is infrastructure. Lots of cities worldwide are adding artificial intelligence to their surveillance. For example, looking at intersections, train stations, and airports, we have seen that the city surveillance infrastructure needs growth supported by government initiatives.
The third factor is AI, which is the big thing that brings higher-resolution cameras into this market.
At Yole Intelligence, part of Yole Group, we have noticed increasing opportunities in all the security imaging market segments: consumer, commercial, and infrastructure.

FD: Which types of applications are becoming popular, and what will sustain growth in the security market in the years to come?

DP: I think commercial, and infrastructure are steadier markets, and we expect them to continue to grow. If you look at the CAGR, infrastructure has slowed down a little during the pandemic. On the consumer side, the need for “smart home” has increased. We have seen a CAGR of about 20% for “smart home”, while the traditional consumer commercial security CAGR is about 11%. As a result, we expect both security imaging market segments, commercial and infrastructure, will continue to grow in the coming years.

FD: Have you seen an increasing penetration of 3D sensing into surveillance and security applications?

DP: So far, it has not been huge. We have seen 3D sensing mentioned for some authentication use cases, but it’s mainly applied to indoor access.

FD: As a leading supplier of CMOS image sensors for security imaging, how do you see the competitive landscape and market demand develop? Is there any geographic differentiation between Europe, America, and Asia?

DP: On the overall landscape, we see that the 1080p resolution market is very competitive and is essentially replacing 720p, which used to be the low end. If you look at the product portfolio from OMNIVISION, as well as our competitors, you will see that more and more 1080p cost-sensitive products are being brought into the market.
In terms of geographical differentiation, 1080p seems to be the norm across the globe. Some applications like doorbells and smart home cameras are looking for higher resolution. Some applications like doorbells and smart home cameras are focusing on higher resolution so that they can deploy AI. To better enable AI, Some applications at the very high end would even deploy 4K2K resolutions. When it comes to city or street surveillance, high resolution is needed for counting the number of people or vehicles or for zooming in for detail. However, that market is small compared to 1080p.
While the race for smaller pixels and increased resolution is still ongoing for mobile, it seems less important for security applications where image quality is preferred.

FD: What is the trend in sensor resolution for security applications? What are the most critical performance parameters?

DP: As we mentioned previously, the resolution trend is not as severe in security compared to the smartphone market. The three key buckets we see in security are firstly the 1080p, which is roughly 2MP. Then the next bucket is 4 or 5MP, and at the high end is the 4K2K. From a volume point of view, the 1080p is by far the lion’s share. The 4 and 5MP would be the next, and then 4K2K are very high-end in terms of critical performance.
The key parameter in security is still low light sensitivity: in low light, how good is your camera? So typically, a larger pixel is used in the market. So, in the security market today, the smallest pixel we see is 1.45μm. Slowly, the smaller pixels are being deployed in security, but the majority are still large pixels.
Lower power consumption is critical for numerous applications, particularly battery-powered consumer security cameras.

FD: How can you address this with your products?

DP: To enable longer battery power, we have a unique solution called always-on architecture. Essentially, we provide a total system approach that involves a sensor with our own video processor that enables very low-power system solutions. We are taking our low-power architecture to a new level with a product we will launch later this year.

FD: There is a trend to bring more video analytics and Artificial Intelligence into security camera products. What is OMNIVISION’s view on this?

DP: Video analytics and AI are hot topics in the industry. We expect video analytics and AI technology, which used to be only at the high end a few years ago, to come down to mid-range or entry-level.
One of the key requirements on the sensor side is providing higher resolution so that you can do video analytics and AI functions simultaneously. To address this need, we have a portfolio of 4 and 5MP image sensors, all the way up to 4K2K, for our customers.

FD: Is there any other message you would like to share with our readers and the industry?

DP: In summary, we see 1080p as the dominant resolution for the foreseeable future. A higher resolution is needed for video analytics and AI applications. Always-on is one of the key features demanded for low-power battery cameras.
Low-light pixel performance is still one of the key criteria for security cameras. At OMNIVISION, we have a product line that addresses low light performance that goes from 1080p all the way to 4K2K. We also provide low-power video processors enabling a long-lasting battery solution.

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Viltrox AF 35mm f1.8 review

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The AF 35mm f1.8 from Viltrox is a mild wide prime lens designed for mirrorless full-frame cameras with Nikon Z-mount or Sony E-mount. Is it a good alternative to Nikon's and Sony's 35mm f1.8 lenses? Find out in my in-depth review!…

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CineD tests ARRI ALEXA 35 cinematography sensor

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In June, this blog shared the announcement of ARRI's new cinematography sensor ALEXA 35. 

Last week CineD published a "lab test" of this sensor. CineD is an independent website that reviews latest advances in cinematography technology,

https://www.cined.com/arri-alexa-35-lab-test-rolling-shutter-dynamic-range-and-latitude-plus-video/






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Canon announces “Lithography Plus” solution platform offering Canon’s support know-how to help maximize productivity for semiconductor lithography systems

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EETimes Europe article on emergence of consumer and automotive SWIR imaging

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An article in EETimes Europe from August 24, 2022 argues that huge changes are happening in the consumer and automotive SWIR imaging industry. Some excerpts below.

https://www.eetimes.eu/how-smartphones-will-disrupt-the-swir-imaging-industry

How Smartphones Will Disrupt the SWIR Imaging Industry

August 24, 2022 Axel Clouet and Eric Mounier

Sensing SWIR radiation requires imagers based on other materials, making them orders of magnitude more expensive than silicon-based imagers. Therefore, SWIR’s use today is limited to specific applications in defense, industry, or research.

... [A] pull from the consumer market is inspiring unprecedented changes in the SWIR industry, with the emergence of new technologies and the entrance of game-changing players who may enable market and technology disruption.

A newer technology, based on quantum dots (QDs), is emerging as a lower-cost alternative to InGaAs. ... with a manufacturing process that is compatible with CMOS, allowing cost reductions by orders of magnitude.

QD technology is still emerging, with the first commercial products released in 2018 for the industry by SWIR Vision Systems.

SWIR’s technology development will be accelerated by the entrance of game-changing players: Sony released its first commercial SWIR imager in 2020, and in 2021, STMicroelectronics announced the development of SWIR imagers based on QDs. ... [both are] leading companies in the consumer and automotive silicon-based imaging industry. Sony introduced a manufacturing method based on copper-to-copper bonding, inherited from its know-how in silicon-based imaging, to make InGaAs SWIR imagers. STMicroelectronics published initial results for its SWIR imagers based on QD technology ... demonstrated high sensitivity, optimized at about 1.4 µm.

[Yole Intelligence] expect[s] the number of industrial cameras to increase significantly in the coming years, thanks to price decreases linked to QD technology penetration and the introduction of new manufacturing processes for InGaAs. These segments could represent a US$828 million market in 2027 at the camera level.

[Since] an artificial SWIR source needs to be used in combination with the imaging system. The SWIR source market should therefore benefit from the growth of the SWIR imaging market. SWIR edge-emitting diode lasers (EELs) are widely used today in the telecommunications market, ... SWIR vertical-cavity surface-emitting lasers (VCSELs) should strongly benefit from the emerging consumer and automotive SWIR markets.





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Gpixel announces new global shutter GSPRINT 4502 sensor

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Gpixel press release on August 17, 2022:

Gpixel expands high-speed GSPRINT image sensor series with a 2/3” 2.5 MP 3460 fps global shutter GSPRINT4502


Gpixel announces a high-speed global shutter image sensor, GSPRINT4502, a new member of the GSPRINT series taking high speed imaging to another level.


GSPRINT4502 is a 2.5 Megapixel (2048 x 1216), 2/3” (φ10.7 mm), high speed image sensor designed with the latest 4.5 µm charge domain global shutter pixel. It achieves more than 30 ke- charge capacity and less than 4 e- rms read noise, with dynamic range of 68 dB which can be expanded using a multi-slope HDR feature. Utilizing an advanced 65 nm CIS process with light pipe and micro lens technology, the sensor achieves >65% quantum efficiency and < -92 dB parasitic light sensitivity.

GSPRINT4502 can achieve extremely high frame rates up to 3460 fps in 8-bit mode, 1780 fps in 10-bit mode or 850 fps in 12-bit mode, all at full resolution. With 2×2 on-chip charge binning, full well capacity can be further increased to 120 ke- and frame rate to 10,200 fps. GSPRINT4502 supports vertical and horizontal regions of interest for higher frame rates. GSPRINT4502 is perfect for high-speed applications including 3D laser profiling, industrial inspection, high speed video and motion analysis.

Data output from GSPRINT4502 is through 64 pairs sub-LVDS channels running 1.2 Gbps each. Flexible output channel multiplex modes make it possible to reduce frame and data rate to make the sensor compatible with all available camera interface options. GSPRINT4502 is packaged in a 255-pin uPGA ceramic package and will be offered in sealed and removable glass lid versions.

“The market reaction to the GSPRINT high-speed image sensor family provides evidence that a growing number of applications require higher frame rates,” said Wim Wuyts, Chief Commercial Officer of Gpixel. “We are excited to continue to expand the portfolio to bring these high frame rates to more applications.”

GSPRINT4502 engineering samples can be ordered today for delivery in October, 2022. 

About the GSPRINT sensor family

The GSPRINT series is Gpixel’s high-speed global shutter product family, including the 21 MP GSPRINT4521, 10 MP GSPRINT4510 and 2.5 MP GSPRINT4502. The GSPRINT technology will be used to expand the sizes and resolutions available in the family in the future. To learn more about the GSPRINT series, please contact us at: info@gpixel.com
 

About Gpixel

Gpixel provides high-end customized and off-the-shelf CMOS image sensors for industrial, professional, medical, and scientific applications. Gpixel’s standard products include the GMAX and GSPRINT global shutter, fast frame rate sensors, the GSENSE and GLUX high-end scientific CMOS image sensor series, the GL series of line scan imagers, the GLT series of TDI line scan imagers and the GTOF series of iTOF imagers. Gpixel’s broad portfolio of products utilizes the latest technologies to meet the ever-growing demands of the professional imaging market.

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Nikon D1 retro review

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In 1999, Nikon launched the D1, the first DSLR the company entirely designed by itself. 23 years later I take this 2.7 Megapixel classic out for a retro review!…

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Sigma 24mm f1.4 DG DN Art review

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The 24mm f1.4 DG DN Art from Sigma is a wide-angle prime lens designed for mirrorless full-frame cameras with L-mount or Sony E-mount. Is it a good alternative to Sony's FE 24mm f1.4 GM lens? Find out in my in-depth review!…

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2023 International Image Sensors Workshop – Call for Papers

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The 2023 International Image Sensors Workshop (IISW) will be held in Scotland from 22-25 May 2023. The first call for papers is now available at this link: 2023 IISW CFP.



FIRST CALL FOR PAPERS

ABSTRACTS DUE DEC 9, 2022
 

2023 International Image Sensor Workshop

Crieff Hydro Hotel, Scotland, UK

22-25 May, 2023


The 2023 International Image Sensor Workshop (IISW) provides a biennial opportunity to present innovative work in the area of solid-state image sensors and share new results with the image sensor community. Now in its 35th year, the workshop will return to an in-person format. The event is intended for image sensor technologists; in order to encourage attendee interaction and a shared experience, attendance is limited, with strong acceptance preference given to workshop presenters. As is the tradition, the 2023 workshop will emphasize an open exchange of information among participants in an informal, secluded setting beside the Scottish town of Crieff. The scope of the workshop includes all aspects of electronic image sensor design and development. In addition to regular oral and poster papers, the workshop will include invited talks and announcement of International Image Sensors Society (IISS) Award winners.

Papers on the following topics are solicited:

Image Sensor Design and Performance
CMOS imagers, CCD imagers, SPAD sensors
New and disruptive architectures
Global shutter image sensors
Low noise readout circuitry, ADC designs
Single photon sensitivity sensors
High frame rate image sensors
High dynamic range sensors
Low voltage and low power imagers
High image quality; Low noise; High sensitivity
Improved color reproduction
Non-standard color patterns with special digital processing
Imaging system-on-a-chip, On-chip image processing

Pixels and Image Sensor Device Physics
New devices and pixel structures
Advanced materials
Ultra miniaturized pixels development, testing, and characterization
New device physics and phenomena
Electron multiplication pixels and imagers
Techniques for increasing QE, well capacity, reducing crosstalk, and improving angular response
Front side illuminated, back side illuminated, and stacked pixels and pixel arrays
Pixel simulation: Optical and electrical simulation, 2D and 3D, CAD for design and simulation, improved models

Application Specific Imagers
Image sensors and pixels for range sensing: LIDAR, TOF,
RGBZ, Structured light, Stereo imaging, etc.
Image sensors with enhanced spectral sensitivity (NIR, UV, IR)
Sensors for DSC, DSLR, mobile, digital video cameras and mirror-less cameras
Array imagers and sensors for multi-aperture imaging,
computational imaging, and machine learning
Sensors for medical applications, microbiology, genome sequencing
High energy photon and particle sensors (X-ray, radiation)
Line arrays, TDI, Very large format imagers
Multi and hyperspectral imagers
Polarization sensitive imagers

Image sensor manufacturing and testing
New manufacturing techniques
Backside thinning
New characterization methods
Defects & leakage current

On-chip optics and imaging process technology
Advanced optical path, Color filters, Microlens, Light guides
Nanotechnologies for Imaging
Wafer level cameras
Packaging and testing: Reliability, Yield, Cost
Stacked imagers, 3D integration
Radiation damage and radiation hard imager



ORGANIZING COMMITTEE

General Workshop Co-Chairs
Robert Henderson – The University of Edinburgh
Guy Meynants – Photolitics and KU Leuven

Technical Program Chair
Neale Dutton – ST Microelectronics

Technical Program Committee
Jan Bogaerts - GPixel, Belgium
Calvin Yi-Ping Chao - TSMC, Taiwan
Edoardo Charbon - EPFL, Switzerland
Bart Dierickx - Caeleste, Belgium
Amos Fenigstein - TowerJazz, Israel
Manylun Ha -  DB Hitek, South Korea
Vladimir Korobov - ON Semiconductor, USA
Bumsuk Kim - Samsung, South Korea
Alex Krymski - Alexima, USA
Jiaju Ma - Gigajot, USA
Pierre Magnan - ISAE, France
Robert Daniel McGrath - Goodix Technology, US 
Preethi Padmanabhan - AMS-Osram, Austria
Francois Roy - STMicroelectronics, France
Andreas Suess - Omnivision Technologies, USA

IISS Board of Directors
Boyd Fowler – OmniVision
Michael Guidash – R.M. Guidash Consulting
Robert Henderson – The University of Edinburgh
Shoji Kawahito – Shizuoka University and Brookman Technology
Vladimir Koifman – Analog Value
Rihito Kuroda – Tohoku University
Guy Meynants – Photolitics
Junichi Nakamura – Brillnics
Yusuke Oike – Sony (Japan)
Johannes Solhusvik – Sony (Norway)
Daniel Van Blerkom – Forza Silicon-Ametek
Yibing Michelle Wang – Samsung Semiconductor

ISS Governance Advisory Committee:
Eric Fossum - Thayer School of Engineering at Dartmouth, USA
Nobukazu Teranishi - University of Hyogo, Japan
Albert Theuwissen - Harvest Imaging, Belgium / Delft University of Technology, The Netherlands

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Tamron 50-400mm f4.5-6.3 Di III VC review

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The Tamron 50-400mm f4.5-6.3 is a zoom lens for Sony’s Alpha mirrorless cameras sporting a huge 8x range from standard to long telephoto. Find out how it compares in my full review!…

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Surprises of Single Photon Imaging

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[This is an invited blog post by Prof. Andreas Velten from University of Wisconsin-Madison.]

When we started working on single photon imaging we were anticipating having to do away with many established concepts in computational imaging and photography. Concepts like exposure time, well depth, motion blur, and many others don’t make sense for single photon sensors. Despite this expectation we still encountered several unexpected surprises.

Our first surprise was that SPAD cameras, which typically are touted for low light applications, have an exceptionally large dynamic range and therefore outperform conventional sensors not only in dark, but also in very bright scenes. Due to their hold off time, SPADs reject a growing number of photons at higher flux levels resulting in a nonlinear response curve. The classical light flux is usually estimated by counting photons over a certain time interval. One can instead measure the time between photons or the time a sensor pixel waits for a photon in the active state. This further increases dynamic range so that the saturation flux level is above the safe operating range of the detector pixel and far above eye safety levels. The camera does not saturate. [1][2][3]

The second surprise was that single photon cameras, without further computational improvements, are of limited use in low light imaging situations. In most imaging applications motion of the scene or camera demands short exposure times well below 1 second to avoid motion blur. At light levels low enough to present a challenge to current CMOS sensors results in low photon counts even for a perfect camera. The image looks noisy not because of a problem introduced by the sensor, but because of Poisson noise due to light quantization. The low light capabilities of SPADs only come to bear when long exposure times are used or when motion can be compensated for. Luckily motion compensation strategies inspired by burst photography and event cameras work exceptionally well for SPADs due to the absence of readout noise and inherent motion blur. [4][5][6]

Finally, we assumed early on that single photon sensors have an inherent disadvantage due to larger energy consumption. They either need internal amplification like the SPAD or high frame rates like QIS and qCMOS both of which result in higher power consumption. We learned that the internal amplification process in SPADs makes up a small and decreasing portion of the overall energy consumption of a SPAD. The lions share is spent in transferring and storing the large data volumes resulting from individually processing every single photon. To address the power consumption of SPAD cameras we therefore need to find better ways to compress photon data close to the pixel and be more selective about which photons to process and which to ignore. Even the operation of a conventional CMOS camera can be thought of as a type of compression. Photons are accumulated over an exposure time and only the total is read out after each frame. The challenge for SPAD cameras is to use their access to every single photon and combine it with more sophisticated ways of data compression implemented close to the pixel. [7]

As we transition imaging to widely available high resolution single photon cameras, we are likely in for more surprises. Light is made up of photons. Light detection is a Poisson process. Light and light intensity are derived quantities that are based on ensemble averages over a large number of photons. It is reasonable to assume that detection and processing methods that are based on the classical concept of flux are sub-optimal. The full potential of single photon capture and processing is therefore not yet known. I am hoping for more positive surprises.

References 

[1] Ingle, A., Velten, A., & Gupta, M. (2019). High flux passive imaging with single-photon sensors. In Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition (pp. 6760-6769). [Project Page]

[2] Ingle, A., Seets, T., Buttafava, M., Gupta, S., Tosi, A., Gupta, M., & Velten, A. (2021). Passive inter-photon imaging. In Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition (pp. 8585-8595). [Project Page]

[3] Liu, Y., Gutierrez-Barragan, F., Ingle, A., Gupta, M., & Velten, A. (2022). Single-photon camera guided extreme dynamic range imaging. In Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision (pp. 1575-1585). [Project Page]

[4] Seets, T., Ingle, A., Laurenzis, M., & Velten, A. (2021). Motion adaptive deblurring with single-photon cameras. In Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision (pp. 1945-1954). [Interactive Visualization]

[5] Ma, S., Gupta, S., Ulku, A. C., Bruschini, C., Charbon, E., & Gupta, M. (2020). Quanta burst photography. ACM Transactions on Graphics (TOG), 39(4), 79-1. [Project Page]

[6] Laurenzis, M., Seets, T., Bacher, E., Ingle, A., & Velten, A. (2022). Comparison of super-resolution and noise reduction for passive single-photon imaging. Journal of Electronic Imaging, 31(3), 033042.

[7] Gutierrez-Barragan, F., Ingle, A., Seets, T., Gupta, M., & Velten, A. (2022). Compressive Single-Photon 3D Cameras. In Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition (pp. 17854-17864). [Project Page]

 

About the author:

Andreas Velten is Assistant Professor at the Department of Biostatistics and Medical Informatics and the department of Electrical and Computer Engineering at the University of Wisconsin-Madison and directs the Computational Optics Group. He obtained his PhD with Prof. Jean-Claude Diels in Physics at the University of New Mexico in Albuquerque and was a postdoctoral associate of the Camera Culture Group at the MIT Media Lab. He has included in the MIT TR35 list of the world's top innovators under the age of 35 and is a senior member of NAI, OSA, and SPIE as well as a member of Sigma Xi. He is co-Founder of OnLume, a company that develops surgical imaging systems, and Ubicept, a company developing single photon imaging solutions.



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amsOSRAM announces new sensor Mira220

Image Sensors World        Go to the original article...

  • New Mira220 image sensor’s high quantum efficiency enables operation with low-power emitter and in dim lighting conditions
  • Stacked chip design uses ams OSRAM back side illumination technology to shrink package footprint to just 5.3mm x 5.3mm, giving greater design flexibility to manufacturers of smart glasses and other space-constrained products
  • Low-power operation and ultra-small size make the Mira220 ideal for active stereo vision or structured lighting 3D systems in drones, robots and smart door locks, as well as mobile and wearable devices

Press Release: https://ams-osram.com/news/press-releases/mira220

Premstaetten, Austria (14th July 2022) -- ams OSRAM (SIX: AMS), a global leader in optical solutions, has launched a 2.2Mpixel global shutter visible and near infrared (NIR) image sensor which offers the low-power characteristics and small size required in the latest 2D and 3D sensing systems for virtual reality (VR) headsets, smart glasses, drones and other consumer and industrial applications.

The new Mira220 is the latest product in the Mira family of pipelined high-sensitivity global shutter image sensors. ams OSRAM uses back side illumination (BSI) technology in the Mira220 to implement a stacked chip design, with the sensor layer on top of the digital/readout layer. This allows it to produce the Mira220 in a chip-scale package with a footprint of just 5.3mm x 5.3mm, giving manufacturers greater freedom to optimize the design of space-constrained products such as smart glasses and VR headsets.

The sensor combines excellent optical performance with very low-power operation. The Mira220 offers a high signal-to-noise-ratio as well as high quantum efficiency of up to 38% as per internal tests at the 940nm NIR wavelength used in many 2D or 3D sensing systems. 3D sensing technologies such as structured light or active stereo vision, which require an NIR image sensor, enable functions such as eye and hand tracking, object detection and depth mapping. The Mira220 will support 2D or 3D sensing implementations in augmented reality and virtual reality products, in industrial applications such as drones, robots and automated vehicles, as well as in consumer devices such as smart door locks.

The Mira220’s high quantum efficiency allows device manufacturers to reduce the output power of the NIR illuminators used alongside the image sensor in 2D and 3D sensing systems, reducing total power consumption. The Mira220 features very low power consumption at only 4mW in sleep mode, 40mW in idle mode and at full resolution and 90fps the sensor has a power consumption of 350mW. By providing for low system power consumption, the Mira220 enables wearable and portable device manufacturers to save space by specifying a smaller battery, or to extend run-time between charges.

“Growing demand in emerging markets for VR and augmented reality equipment depends on manufacturers’ ability to make products such as smart glasses smaller, lighter, less obtrusive and more comfortable to wear. This is where the Mira220 brings new value to the market, providing not only a reduction in the size of the sensor itself, but also giving manufacturers the option to shrink the battery, thanks to the sensor’s very low power consumption and high sensitivity at 940nm,” said Brian Lenkowski, strategic marketing director for CMOS image sensors at ams OSRAM.

Superior pixel technology

The Mira220’s advanced back-side illumination (BSI) technology gives the sensor very high sensitivity and quantum efficiency with a pixel size of 2.79μm. Effective resolution is 1600px x 1400px and maximum bit depth is 12 bits. The sensor is supplied in a 1/2.7” optical format.

The sensor supports on-chip operations including external triggering, windowing, and horizontal or vertical mirroring. The MIPI CSI-2 interface allows for easy interfacing with a processor or FPGA. On-chip registers can be accessed via an I2C interface for easy configuration of the sensor.

Digital correlated double sampling (CDS) and row noise correction result in excellent noise performance.

ams OSRAM will continue to innovate and extend the Mira family of solutions, offering customers a choice of resolution and size options to fit various application requirements.

The Mira220 NIR image sensor is available for sampling. More information about Mira220.


Mira220 image sensor achieves high quantum efficiency at 940nm to allow for lower power illumination in 2D and 3D sensing systems
Image: ams

The miniature Mira220 gives extra design flexibility in space-constrained applications such as smart glasses and VR headsets
Image: OSRAM



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Sigma 20mm f1.4 DG DN Art review

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The 20mm f1.4 DG DN Art from Sigma is an ultra-wide prime lens designed for mirrorless full-frame cameras with L-mount or Sony E-mount. Is it a worthy alternative to Sony's FE 20mm f1.8 G lens? Find out in my in-depth review!…

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Gigajot article in Nature Scientific Reports

Image Sensors World        Go to the original article...

Jiaju Ma et al. of Gigajot Technology, Inc. have published a new article titled "Ultra‑high‑resolution quanta image sensor with reliable photon‑number‑resolving and high dynamic range capabilities" in Nature Scientific Reports.

Abstract:

Superior low‑light and high dynamic range (HDR) imaging performance with ultra‑high pixel resolution are widely sought after in the imaging world. The quanta image sensor (QIS) concept was proposed in 2005 as the next paradigm in solid‑state image sensors after charge coupled devices (CCD)and complementary metal oxide semiconductor (CMOS) active pixel sensors. This next‑generation image sensor would contain hundreds of millions to billions of small pixels with photon‑number‑resolving and HDR capabilities, providing superior imaging performance over CCD and conventional CMOS sensors. In this article, we present a 163 megapixel QIS that enables both reliable photon‑number‑resolving and high dynamic range imaging in a single device. This is the highest pixel resolution ever reported among low‑noise image sensors with photon‑number‑resolving capability. This QIS was fabricated with a standard, state‑of‑the‑art CMOS process with 2‑layer wafer stacking and backside illumination. Reliable photon‑number‑resolving is demonstrated with an average read noise of 0.35 e‑ rms at room temperature operation, enabling industry leading low‑light imaging performance. Additionally, a dynamic range of 95 dB is realized due to the extremely low noise floor and an extended full‑well capacity of 20k e‑. The design, operating principles, experimental results, and imaging performance of this QIS device are discussed.








Ma, J., Zhang, D., Robledo, D. et al. Ultra-high-resolution quanta image sensor with reliable photon-number-resolving and high dynamic range capabilities. Sci Rep 12, 13869 (2022).

This is an open access article: https://www.nature.com/articles/s41598-022-17952-z.epdf

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Four Nikon products, including the Nikon Z 9 mirrorless camera, honored with EISA Awards

Nikon | Imaging Products        Go to the original article...

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New understanding of color perception theory

Image Sensors World        Go to the original article...

From phys.org a news article about a recent paper that casts doubt on the traditional understanding of how human color perception works: "Math error: A new study overturns 100-year-old understanding of color perception":

A new study corrects an important error in the 3D mathematical space developed by the Nobel Prize-winning physicist Erwin Schrödinger and others, and used by scientists and industry for more than 100 years to describe how your eye distinguishes one color from another. The research has the potential to boost scientific data visualizations, improve TVs and recalibrate the textile and paint industries.

The full paper appears in the Proceedings of the National Academy of Sciences vol. 119 no. 18 (2022). It is titled "The non-Riemannian nature of perceptual color space" authored by Dr. Roxana Bujack and colleagues at Los Alamos National Lab.

The scientific community generally agrees on the theory, introduced by Riemann and furthered by Helmholtz and Schrödinger, that perceived color space is not Euclidean but rather, a three-dimensional Riemannian space. We show that the principle of diminishing returns applies to human color perception. This means that large color differences cannot be derived by adding a series of small steps, and therefore, perceptual color space cannot be described by a Riemannian geometry. This finding is inconsistent with the current approaches to modeling perceptual color space. Therefore, the assumed shape of color space requires a paradigm shift. Consequences of this apply to color metrics that are currently used in image and video processing, color mapping, and the paint and textile industries. These metrics are valid only for small differences. Rethinking them outside of a Riemannian setting could provide a path to extending them to large differences. This finding further hints at the existence of a second-order Weber–Fechner law describing perceived differences.

 


The key observation that this paper rests on is the concept of "diminishing returns". Statistical analysis of experimental data collected in this paper suggests that the perceived difference between pairs of colors A, B and C that lie along a single shortest path (geodesic) do not satisfy the additive equality.

A commentary by Dr. David Brainard (U. Penn.) about this paper was published in PNAS and is available here: https://color2.psych.upenn.edu/brainard/papers/2022-BrainardPNASCommentary.pdf

Some of the caveats noted in this commentary piece:

First, the authors make a first principles assumption that the achromatic locus is a geodesic and use this in their choice of stimuli. This assumption is intuitively appealing in that it would be surprising that the shortest path in color space between two achromatic stimuli would involve a detour through a chromatic stimulus and back. However, the achromatic locus as a geodesic was not empirically established, and more work could be considered to shore up this aspect of the argument. Second, the data were collected using online methods and combined across subjects prior to the analysis. This raises the question of whether the aggregate performance analyzed could be non-Riemannian even when the performance of each individual subject was itself Riemannian. Although it is not immediately obvious whether this could occur, it might be further considered as a possibility.

Phys.org press release: https://phys.org/news/2022-08-math-error-overturns-year-old-perception.html

LANL press release: https://discover.lanl.gov/news/0810-color-perception

PNAS paper: https://www.pnas.org/doi/10.1073/pnas.2119753119

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Voigtlander 35mm f2 APO-Lanthar review

Cameralabs        Go to the original article...

The Voigtländer 35mm f2 APO-Lanthar is a mild wide-angle prime lens designed for mirrorless full-frame cameras from Sony and Nikon. Find out whether it's worth considering although it is manual focus only in my full review!…

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Direct ToF Single-Photon Imaging (IEEE TED June 2022)

Image Sensors World        Go to the original article...

The June 2022 issue of IEEE Trans. Electron. Devices has an invited paper titled Direct Time-of-Flight Single-Photon Imaging by Istvan Gyongy et al. from University of Edinburgh and STMicroelectronics. 

This is a comprehensive tutorial-style article on single-photon 3D imaging which includes a description of the image formation model starting from first principles and practical system design considerations such as photon budget and power requirements.

Abstract: This article provides a tutorial introduction to the direct Time-of-Flight (dToF) signal chain and typical artifacts introduced due to detector and processing electronic limitations. We outline the memory requirements of embedded histograms related to desired precision and detectability, which are often the limiting factor in the array resolution. A survey of integrated CMOS dToF arrays is provided highlighting future prospects to further scaling through process optimization or smart embedded processing.



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Canon RF 100mm f2.8L Macro IS USM review

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The Canon RF 100mm f2.8L IS USM is a high-end macro lens for Canon’s EOS R mirrorless system that’s capable of 1.4x magnification on a full-frame body. In my review I’ll compare it against the highly-regarded EF version.…

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How to backup photos

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In this article I’ll show you how I backup my photos, videos and other precious files, using a combination of portable drives and cloud storage.…

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CFP: International Workshop on Image Sensors and Imaging Systems 2022

Image Sensors World        Go to the original article...

The 5th International Workshop on Image Sensors and Imaging Systems (IWISS2022) will be held in December 2022 in Japan. This workshop is co-sponsored by IISS.


-Frontiers in image sensors based on conceptual breakthroughs inspired by applications-

Date: December 12 (Mon) and 13 (Tue), 2022

Venue: Sanaru Hall, Hamamatsu Campus, Shizuoka University 

Access: see https://www.eng.shizuoka.ac.jp/en_other/access/

Address: 3-5-1 Johoku, Nakaku, Hamamatsu, 432-8561 JAPAN

Official language: English


Overview

In this workshop, people from various research fields, such as image sensing, imaging systems, optics, photonics, computer vision, and computational photography/imaging, come together to discuss the future and frontiers of image sensor technologies in order to explore the continuous progress and diversity in image sensors engineering and state-of-the-art and emerging imaging systems technologies. The workshop is composed of invited talks and a poster session. We are accepting approximately 20 poster papers, whose submission starts in August, with deadline on October 14 (Fri), 2022. A Poster Presentation Award will be given to the selected excellent paper. We encourage everyone to submit the latest original work. Every participant is required to register online by December 5 (Mon), 2022. On-site registration is NOT accepted. Since the workshop is operated by a limited number of volunteers, we can offer only minimal service; therefore, no invitation letters for visa applications to enter Japan can be issued.

Latest Information: Call for Paper, Advance Program
http://www.i-photonics.jp/meetings.html#20221212IWISS

Poster Session
Submit a paper: https://www.ite.or.jp/ken/form/index.php?tgs_regid=faf9bc5bde5e430962d98b110ccac65c5ddc6ca5718edb7c80089461c48b9cfa&tgid=ITE-IST&lang=eng&now=20220719133618
Submission deadline: Oct. 14(Fri), 2022 (Only title, authors, and short abstract are required)
Please use the above English page. DO NOT follow the Japanese instructions at the bottom of the page.
Notification of acceptance: by Oct. 21 (Fri)

Manuscript submission deadline: Nov. 21 (Mon), 2022 (2-page English proceeding is required)
One excellent poster will be awarded.

Plenary and Invited Speakers

[Plenary] 

“Deep sensing - Jointly optimize imaging and processing –“ by
Hajime Nagahara (Osaka University, Japan)


[Invited Talks]
- Image Sensors
“InGaAs/InP and Ge-on-Si SPADs for SWIR applications” by Alberto Tosi (Politecnico di Milano, Italy)
“CMOS SPAD-Based LiDAR Sensors with Zoom Histogramming TDC Architectures” by Seong-Jin Kim et al. (UNIST, Korea)
"TBD" by Min-Sun Keel (Samsung Electronics, Korea)
“Modeling and verification of a photon-counting LiDAR” by Sheng-Di Lin (National Yang Ming Chiao Tung Univ., Taiwan)
- Computational Photography/Imaging and applications “Computational lensless imaging by coded optics” by Tomoya Nakamura (Osaka Univ., Japan)
“TBD” by Miguel H. Conde (Siegen Univ.) “TBD” by TBD (Toronto Univ.)
 

- Optics and Photonics
“Optical system integrated time-of-flight and optical coherence tomography for high-dynamic range distance measurement” by Yoshio Hayasaki et al. (Utsunomiya Univ., Japan)
“High-speed/ultrafast holographic imaging using an image sensor” by Yasuhiro Awatsuji et al. (Kyoto Institute of Technology, Japan)
“Near-infrared sensitivity improvement by plasmonic diffraction technology” by Nobukazu Teranishi et al. (Shizuoka Univ, Japan)


Scope
- Image sensor technologies: fabrication process, circuitry, architectures
- Imaging systems and image sensor applications
- Optics and photonics: nanophotonics, plasmonics, microscopy, spectroscopy
- Computational photography/ imaging
- Applications and related topics on image sensors and imaging systems: e.g., multi-spectral imaging, ultrafast imaging, biomedical imaging, IoT, VR/AR, deep learning, ...

Online Registration for Audience
Registration is necessary due to the limited number of available seats.
Registration deadline is Dec. 5 (Mon).
Register and pay online from the following website: <to appear>

Registration Fee
Regular and student: approximately 2,000-yen (~15 USD)
Note: This price is for purchasing the online proceeding of IWISS2022 through the ITE. If you cannot join the workshop due to any reason, no refund will be provided.

Collaboration with MDPI Sensors Special Issue
Special Issue on "Recent Advances in CMOS Image Sensor"
Special issue editor: Dr. De Xing Lioe
Paper submission deadline: Feb. 25 (Sat), 2023
https://www.mdpi.com/journal/sensors/special_issues/CMOS_image_sensor
The poster presenters are encouraged to submit a paper to this special issue!
Note-1: Those who do not give a presentation in the IWISS2022 poster session are also welcome to submit a paper!
Note-2: Sensors is an open access journal, the article processing charges (APC) will be applied to accepted papers.
Note-3: For poster presenters of IWISS2022, please satisfy the following conditions.

The submitted extended papers to the special issue should have more than 50% new data and/or extended content to make it a real and complete journal paper. It will be much better if the Title and Abstract are different with that of conference paper so that they can be differentiated in various databases. Authors are asked to disclose that it is conference paper in their cover letter and include a statement on what has been changed compared to the original conference paper.
 


Sponsored by Technical Group on Information Sensing Technologies (IST),
the Institute of Image Information and Television Engineers (ITE)
Co-sponsored by International Image Sensor Society (IISS), Group of
Information Photonics (IPG) +CMOS Working Group, the Optical Society of
Japan, and innovative Photonics Evolution Research Center (iPERC)
[General Chair] Keiichiro Kagawa (Shizuoka Univ., Japan)
[Technical Program Committee (alphabetical order)]
Chih-Cheng Hsieh (National Tsing Hua Univ., Taiwan)
Keiichiro Kagawa (Shizuoka Univ., Japan)
Takashi Komuro (Saitama Univ., Japan)
De Xing Lioe (Shizuoka Univ., Japan)
Hajime Nagahara (Osaka Univ., Japan)
Atushi Ono (Shizuoka Univ., Japan)
Min-Woong Seo (Samsung Electronics, Korea)
Hiroyuki Suzuki (Gunma Univ., Japan)
Hisayuki Taruki (Toshiba Electronic Devices & Storage Corporation, Japan)
Franco Zappa (Politecnico di Milano, Italy)

Contact for any question about IWISS2022
E-mail: iwiss2022@idl.rie.shizuoka.ac.jp
(Keiichiro Kagawa, Shizuoka Univ., Japan)

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Nikon 500mm f5.6E PF VR review

Cameralabs        Go to the original article...

Nikon's AF-S 500mm f5.6E VR S was introduced in 2018. Does it still hold up to Nikon's newest long telephoto lenses for their Z system? Find out in my in-depth review!…

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Sigma Foveon sensor will be ready in 2022

Image Sensors World        Go to the original article...

From PetaPixel:

Sigma’s CEO Kazuto Yamaki has revealed that the company’s efforts in making a full-frame Foveon sensor are on track to be finished by the end of the year. 


Sigma’s Foveon sensors use a proprietary three-layer structure in which red, green, and blue pixels each have their own full layer. In traditional sensors, the three pixels share a single layer in a mosaic arrangement and the camera “fills in” missing colors by examining neighboring pixels.

Since each pixel of a photo is recorded in three colors, the resulting photo should be sharper with better color accuracy and fewer artifacts.


The release had been delayed on at least two occasions in the past due to technical challenges, once in 2020 and again in 2021. The initial announcement about this sensor was made back in 2018. In February 2022, Yamaki indicated that the company was in stage 2 of testing, and the final third stage will involve mass-production testing.

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Canon’s activities lead to the removal of 956 listings from Amazon in Germany, Italy, Spain, the United Kingdom, France and The Netherlands

Newsroom | Canon Global        Go to the original article...

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46 listings removed from Amazon in Canada, Mexico and the United States of America after Canon files infringement reports

Newsroom | Canon Global        Go to the original article...

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Viltrox AF 24mm f1.8 review

Cameralabs        Go to the original article...

The Viltrox AF 24mm f1.8 is an affordable wide-angle prime lens with autofocus for Nikon Z and Sony mirrorless cameras with full-frame sensors. Find out if it's a worthy alternative in our in-depth review!…

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Prophesee interview in EETimes

Image Sensors World        Go to the original article...

EETimes has published an interview with CEO of Prophesee about their event sensor technology. Some excerpts below.

 
Prophesee collaborated with Sony on creating the IMX636 event sensor chip.

 

Meaning of "neuromorphic"

Most companies doing neuromorphic sensing and computing have a similar vision in mind, but implementations and strategies will be different based on varying product, market, and investment constraints. ...

... there is a fundamental belief that the biological model has superior characteristics compared to the conventional ...

Markets targeted

... the sector closest to commercial adoption of this technology is industrial machine vision. ...

The second key market for the IMX 636 is consumer technologies, ... the event–based camera is used alongside a full–frame camera, detecting motion ... correct any blur.

Prophesee is also working with a customer on automotive driver monitoring solutions... Applications here include eye blinking detection, tracking or face tracking, and micro–expression detection. 

Commercialization strategy

The company recently released a new evaluation kit (EVK4) for the IMX 636. Metavision (simulator) SDK for event–based vision has also recently been open–sourced ...

 

Future Directions

Prophesee plans to continue development of both hardware and software, alongside new evaluation kits, development kits, and reference designs.

Two future directions... 

further reduction of pixel size (pixel pitch) and overall reduction of the sensor to make it suitable for compact consumer applications such as wearables. 

... facilitating the integration of event–based sensing with conventional SoC platforms.

“The closer you get to the acquisition of the information, the better off you are in terms of efficiency and low latency. You also avoid the need to encode and transmit the data. So this is something that we are pursuing.”

“The ultimate goal of neuromorphic technology is to have both the sensing and processing neuromorphic or event–based, but we are not yet there in terms of maturity of this type of solution,”

Full article here: https://www.eetimes.com/neuromorphic-sensing-coming-soon-to-consumer-products/?

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